CN107331651A - Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment - Google Patents
Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment Download PDFInfo
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- CN107331651A CN107331651A CN201710595752.0A CN201710595752A CN107331651A CN 107331651 A CN107331651 A CN 107331651A CN 201710595752 A CN201710595752 A CN 201710595752A CN 107331651 A CN107331651 A CN 107331651A
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- heat
- electronic equipment
- layer
- sink material
- dissipation film
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Abstract
The present invention is applied to electronic equipment dissipating heat technical field, discloses heat sink material and preparation method, the electronic equipment and heat dissipating method of a kind of electronic equipment.Heat sink material includes being used for middle accumulation of heat slow release layer and heat dissipating layer, middle accumulation of heat slow release layer includes the paste mixture layer and heat dissipation film in paste, paste mixture layer includes graphite powder and paraffin powder, and the quality accounting of graphite powder is 20% to 50%, and the quality accounting of paraffin powder is 40% to 70%.There is above-mentioned heat sink material in electronic equipment.Heat dissipating method uses above-mentioned heat sink material.Preparation method, comprises the following steps：Cut heat dissipation film；The paste mixture that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70% is arranged in the heat-curable glue of heat dissipation film.Heat sink material and preparation method, the electronic equipment and heat dissipating method of a kind of electronic equipment provided by the present invention, it can make the operating temperature of electronic chip in limit value, and Consumer's Experience is good.
Description
Technical field
The invention belongs to electronic equipment dissipating heat technical field, more particularly to the heat sink material of a kind of electronic equipment and preparation side
Method, electronic equipment and heat dissipating method.
Background technology
The sinking path of current intelligent wrist-watch has 3 kinds of modes, is respectively：First, by setting radiating graphite or copper foil material
Material, is set at thermal source concentrated position, transmits between other objects to share heat；2nd, radiate；3rd, cross-ventilation.But for
Using 3G and the intelligent wrist-watch of the chip of the above, because complete machine area is small and more than 7 grades of classification of waterproof so that heat is difficult to lead to
Cross conduction, radiation and convection current to go out so that complete machine temperature rises, and Consumer's Experience sense is poor.
The content of the invention
It is an object of the invention to overcoming above-mentioned the deficiencies in the prior art there is provided the heat sink material of a kind of electronic equipment and
Preparation method, electronic equipment and heat dissipating method, its hot material have the effect of heat conduction, accumulation of heat, can be sustained heat, radiating effect
It is good, it can make the operating temperature of electronic chip in electronic equipment in limit value, reliability is high and Consumer's Experience is good.
The technical scheme is that：The heat sink material of a kind of electronic equipment, including for absorbing heat and discharging heat
Middle accumulation of heat slow release layer and be arranged at the heat dissipating layers of the middle accumulation of heat slow release layer upper and lower ends, the middle accumulation of heat slow release layer
Including the paste mixture layer in paste, the paste mixture layer includes graphite powder and paraffin powder, wherein, the graphite powder
Quality accounting is 20% to 50%, and the quality accounting of the paraffin powder is 40% to 70%, the middle accumulation of heat slow release layer
Also include the heat dissipation film for being affixed on the paste mixture layer upper and lower ends.
Specifically, the quality accounting of the graphite powder is 30% to 40%, the quality accounting of the paraffin powder for 50% to
60%.
Specifically, the heat dissipating layer is graphite film layer.
Specifically, the heat dissipation film is polyimide film.
Specifically, the thickness of the middle accumulation of heat slow release layer be 0.2mm to 0.5mm, or, the thickness of the heat dissipating layer
Spend for 0.05mm to 0.1mm.
Specifically, the thickness of the heat sink material is 0.3mm to 0.7mm.
Present invention also offers a kind of electronic equipment, it is provided with circuit board, the circuit board and sets in the electronic equipment
It is equipped with to be sticked on electronic chip, the electronic chip and has the heat sink material of above-mentioned electronic equipment.
Present invention also offers a kind of heat dissipating method of above-mentioned electronic equipment, comprise the following steps：
The heat that electronic chip is produced when working, heat is transmitted to the heat dissipating layer of heat sink material lower end, the heat dissipating layer of lower end
The heat dissipation film of lower end is transferred heat to, heat is transferred to paste mixture layer, paste mixture layer by the heat dissipation film of lower end again
Absorb heat and heat accumulation；The heat in paste mixture is discharged to the heat dissipation film of upper end simultaneously, and the heat dissipation film of upper end is transferred heat to
The heat dissipating layer of upper end, the heat dissipating layer of upper end transfers heat to the other structures part of complete machine.
Present invention also offers the preparation method of the heat sink material of a kind of electronic equipment, comprise the following steps：
Cut heat dissipation film；
In setting heat-curable glue on the heat dissipation film and carrying out precuring, the heat dissipation film with heat-curable glue is obtained；
By the cream that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70%
Shape mixture is arranged in the heat-curable glue of the heat dissipation film；
Another heat dissipation film with heat-curable glue is affixed on the paste mixture and pressing solidification is carried out, centre is obtained
Accumulation of heat slow release layer；
It is sticked heat dissipating layer in the both sides up and down of the middle accumulation of heat slow release layer.
Specifically, the heat dissipating layer is radiating graphite linings.
Heat sink material and preparation method, the electronic equipment and heat dissipating method of a kind of electronic equipment provided by the present invention, its
Heat sink material has heat conduction, accumulation of heat and the effect for being sustained heat, its excellent in heat dissipation effect to electronic chip, can make electronic chip
Operating temperature in limit value, so as to avoid electronic chip temperature too high and influence the function of product, life-span, reliability, enter
And improve Consumer's Experience.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below by using required in embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is the schematic cross-section of the heat sink material of a kind of electronic equipment provided in an embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
Only it is relative concept each other it should also be noted that, the orientation term such as left and right, upper and lower in the embodiment of the present invention
Or using the normal operating condition of product as reference, and should not be regarded as restrictive.
As shown in figure 1, the heat sink material (radiator structure) of a kind of electronic equipment provided in an embodiment of the present invention, including for
Absorb heat and discharge the middle accumulation of heat slow release layer of heat and be arranged at the heat dissipating layer of the middle accumulation of heat slow release layer upper and lower ends
11st, 12, the middle accumulation of heat slow release layer includes the paste mixture layer 3 in paste, and it has preferable heat storage performance, and paste is mixed
It has deformation performance to compound layer 3, can be attached at well on the heater members and structure of electronic equipment.The paste mixture
Layer 3 includes graphite powder and paraffin powder and paste binding agent, and graphite powder and paraffin powder can be mixed uniformly, wherein, the graphite powder
Quality accounting is 20% to 50%, and the quality accounting of the paraffin powder is 40% to 70%, paste mixture layer 3 can with heat accumulation and
Slow release heat.The specific heat of graphite powder is up to 720J/kg. DEG C, and thermal conductivity factor is up to 151W/mK；The specific heat of paraffin powder is reachable
2200J/kg. DEG C, thermal conductivity factor is up to 0.12W/mK, the paste mixture being made up of graphite powder and paraffin powder and auxiliary agents
Layer 3, its accumulation of heat effect is good.The middle accumulation of heat slow release layer also includes being affixed on 3 upper and lower ends of the paste mixture layer
Heat dissipation film 21,22, heat dissipation film 21,22 can play a part of heat conduction, and heat sink material can apply in the electronic equipment of closing,
The intelligent watch for example being had higher requirements to classification of waterproof.The heat that produces when electronic chip works in electronic equipment, heat to
The heat dissipating layer 12 of heat sink material lower end is transmitted, the heat dissipating layer 12 of lower end transfers heat to the heat dissipation film 22 of lower end, and lower end dissipates
Heat is transferred to paste mixture layer 3, the heat absorption of paste mixture layer 3 and heat accumulation by hotting mask 22 again；Simultaneously in paste mixture
Heat is discharged to the heat dissipation film 21 of upper end, and the heat dissipation film 21 of upper end transfers heat to the heat dissipating layer 11 of upper end, the radiating of upper end
Layer 11 transfers heat to the other structures part of complete machine, and the upper and lower ends of heat sink material can be affixed on electronic chip and shell respectively
Inwall or radiating seat etc., its excellent in heat dissipation effect to electronic chip, can make the operating temperature of electronic chip in limit value, from
And avoid electronic chip temperature too high and influence the function of product, life-span, reliability, and then improve Consumer's Experience.
Specifically, the quality accounting of the graphite powder can be 30% to 40%, and the quality accounting of the paraffin powder can be with
For 50% to 60%, remaining is auxiliary agents.
Specifically, the heat dissipating layer 11,12 can be not less than 700- for graphite film layer, its horizontal direction coefficient of heat transfer
1200W/m.K, vertical direction coefficient of heat transfer is not less than 25W/m.K.The chemical composition of graphite film layer is mainly single carbon (C) member
Element, is a kind of native element metal mineral, and it is thin that film high-molecular compound can obtain graphitization under HTHP chemically
Film, because carbon is nonmetalloid, but has the conduction of metal material, heat conductivility, also with as organic plastics one
The plasticity of sample, and also special hot property, chemical stability, lubrication and can be coated in the surface of solids etc. some are good
Good processing performance, its thermal resistance is lower than aluminium by 40%, lower than copper by 20%.
Specifically, the heat dissipation film 21,22 can be polyimide film, that is, be modified PI (polyimide film；PI
Film), heat dissipation film 21,22 is in vertical direction coefficient of heat transfer：≥5W/m.K.Polyimide film has excellent heat endurance, resistance to
Chemical corrosivity and mechanical performance.
Specifically, the both sides of middle accumulation of heat slow release layer or surrounding can be provided with packaging plastic 4, the upper and lower ends of packaging plastic 4
Can be connected sealing with heat dissipation film 21,22, to avoid middle accumulation of heat slow release layer from arbitrarily flowing, deform.
Specifically, the thickness of the middle accumulation of heat slow release layer can for 0.1mm to 2mm, or, the heat dissipating layer 11,
12 thickness can be 0.02mm to 0.2mm.
Preferably, specifically, the thickness of the middle accumulation of heat slow release layer can for 0.15mm to 1mm, or, it is described
The thickness of heat dissipating layer 11,12 can be 0.04mm to 0.15mm.
In the present embodiment, the thickness of the middle accumulation of heat slow release layer can be 0.2mm to 0.5mm, or, it is described scattered
The thickness of thermosphere 11,12 can be 0.05mm to 0.1mm.
In concrete application, the thickness of the heat sink material can be less than 1mm or 0.7mm, for example, the thickness of heat sink material can
Think 0.3mm to 0.7mm.Certainly, its thickness is it can also be provided that other suitable thickness.
The embodiment of the present invention additionally provides a kind of electronic equipment, and the electronic equipment includes being provided with electricity in housing, housing
It is provided with to be sticked on electronic chip, the electronic chip on road plate, the circuit board and has the heat sink material of above-mentioned electronic equipment
(radiator structure).Electronic chip can be communication chip, such as 3G communication chips.Electronic equipment can be intelligent watch, its volume
It is small, and product has that air vent can not be set on classification of waterproof requirement, housing.The lower end of heat sink material can directly be affixed on electronics
Chip.Or, being sticked on electronic chip has heat-conducting seat, and heat-conducting seat can be metalwork, and the lower end of heat sink material is affixed on heat-conducting seat.Dissipate
The upper end of hot material can be affixed with the inwall of housing or is affixed with other structures part.
The embodiment of the present invention additionally provides a kind of heat dissipating method of above-mentioned electronic equipment, comprises the following steps：
The heat that electronic chip is produced when working, particularly when electronic chip running at full capacity, produces substantial amounts of heat,
Heat is transmitted to the heat dissipating layer 12 of heat sink material lower end, and the heat dissipating layer 12 of lower end transfers heat to the heat dissipation film 22 of lower end, under
Heat is transferred to paste mixture layer 3, the heat absorption of paste mixture layer 3 and heat accumulation by the heat dissipation film 22 at end again；Paste mixing simultaneously
Heat in thing is discharged to the heat dissipation film 21 of upper end, and the heat dissipation film 21 of upper end transfers heat to the heat dissipating layer 11 of upper end, upper end
Heat dissipating layer 11 transfer heat to the other structures part of complete machine.Electronic chip can be wireless communications chips, such as 3G chips.
The heat dissipating layer 11,12 is graphite film layer, and its horizontal direction coefficient of heat transfer is not less than 700-1200W/m.K, vertical direction radiating
Coefficient is not less than 25W/m.K.The heat dissipation film 21,22 is polyimide film, that is, is modified PI (polyimide film；PI
Film), heat dissipation film 21,22 is in vertical direction coefficient of heat transfer：≥5W/m.K.
The embodiment of the present invention additionally provides the preparation method of the heat sink material of a kind of electronic equipment, above-mentioned available for preparing
Heat sink material, comprises the following steps：
Heat dissipation film 21,22 is cut, the heat dissipation film 21,22 is polyimide film, that is, is modified PI (polyimide film；
PI film), heat dissipation film 21,22 is in vertical direction coefficient of heat transfer：≥5W/m.K；
In setting heat-curable glue by way of silk-screen on the heat dissipation film 21,22 and carrying out precuring, obtain that there is heat
The heat dissipation film 21,22 of solidification glue；
By the cream that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70%
Shape mixture is arranged at by way of silk-screen in the heat-curable glue of the heat dissipation film 22, certainly, and the quality of the graphite powder is accounted for
Than that can also be 25% to 45%, the quality accounting of the paraffin powder can be 45% to 65%, and remaining is auxiliary agents；
Another heat dissipation film 21 with heat-curable glue is affixed on the paste mixture and pressing solidification is carried out, in obtaining
Between accumulation of heat slow release layer；
It is sticked heat dissipating layer 11,12 in the both sides up and down of the middle accumulation of heat slow release layer.The both sides of middle accumulation of heat slow release layer or
Surrounding can be provided with packaging plastic 4.
Specifically, the heat dissipating layer 11,12 can be radiating graphite linings (graphite film layer), and heat dissipation film 21,22 can be sub- for polyamides
Amine film (modified PI films).The graphite film layer, its horizontal direction coefficient of heat transfer is not less than 700-1200W/m.K, and vertical direction dissipates
Hot coefficient is not less than 25W/m.K.The polyimide film, that is, be modified PI (polyimide film；PI film), heat dissipation film 21,
22 in vertical direction coefficient of heat transfer：≥5W/m.K.
Heat sink material and preparation method, the electronic equipment and radiating side for a kind of electronic equipment that the embodiment of the present invention is provided
Method, its heat sink material has the effect of heat conduction, accumulation of heat, its excellent in heat dissipation effect to electronic chip, can make the work of electronic chip
Make temperature in limit value, so that avoid electronic chip temperature too high and influence the function of product, life-span, reliability, Jin Erti
High Consumer's Experience.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modification, equivalent substitution or improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. the heat sink material of a kind of electronic equipment, it is characterised in that including for absorbing heat and discharging the middle accumulation of heat of heat
Slow release layer and the heat dissipating layer for being arranged at the middle accumulation of heat slow release layer upper and lower ends, the middle accumulation of heat slow release layer include being in paste
Paste mixture layer, paste mixture layer includes graphite powder and paraffin powder, wherein, the quality accounting of the graphite powder is
20% to 50%, the quality accounting of the paraffin powder is 40% to 70%, and the middle accumulation of heat slow release layer also includes being affixed on
The heat dissipation film of the paste mixture layer upper and lower ends.
2. the heat sink material of a kind of electronic equipment as claimed in claim 1, it is characterised in that the quality accounting of the graphite powder
For 30% to 40%, the quality accounting of the paraffin powder is 50% to 60%.
3. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, it is characterised in that the heat dissipating layer is graphite
Film layer.
4. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, it is characterised in that the heat dissipation film is polyamides
Imines film.
5. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, it is characterised in that the middle accumulation of heat sustained release
The thickness of layer is 0.2mm to 0.5mm, or, the thickness of the heat dissipating layer is 0.05mm to 0.1mm.
6. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, it is characterised in that the thickness of the heat sink material
Spend for 0.3mm to 0.7mm.
7. a kind of electronic equipment, it is characterised in that be provided with the electronic equipment on circuit board, the circuit board and be provided with electricity
It is sticked on sub- chip, the electronic chip just like the heat sink material of the electronic equipment any one of claim 1 to 6.
8. a kind of heat dissipating method of electronic equipment as claimed in claim 7, it is characterised in that comprise the following steps：
The heat that produces when electronic chip works, heat is transmitted to the heat dissipating layer of heat sink material lower end, and the heat dissipating layer of lower end is by warm
Amount is transferred to the heat dissipation film of lower end, and heat is transferred to paste mixture layer, paste mixture layer heat absorption by the heat dissipation film of lower end again
And heat accumulation；The heat in paste mixture is discharged to the heat dissipation film of upper end simultaneously, and the heat dissipation film of upper end transfers heat to upper end
Heat dissipating layer, the heat dissipating layer of upper end transfers heat to the other structures part of complete machine.
9. the preparation method of the heat sink material of a kind of electronic equipment, it is characterised in that comprise the following steps：
Cut heat dissipation film；
In setting heat-curable glue on the heat dissipation film and carrying out precuring, the heat dissipation film with heat-curable glue is obtained；
The paste that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70% is mixed
Compound is arranged in the heat-curable glue of the heat dissipation film；
Another heat dissipation film with heat-curable glue is affixed on the paste mixture and pressing solidification is carried out, middle accumulation of heat is obtained
Slow release layer；
It is sticked heat dissipating layer in the both sides up and down of the middle accumulation of heat slow release layer.
10. the preparation method of the heat sink material of a kind of electronic equipment as claimed in claim 9, it is characterised in that the radiating
Layer is radiating graphite linings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710595752.0A CN107331651B (en) | 2017-07-20 | 2017-07-20 | Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710595752.0A CN107331651B (en) | 2017-07-20 | 2017-07-20 | Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN107331651A true CN107331651A (en) | 2017-11-07 |
| CN107331651B CN107331651B (en) | 2019-08-27 |
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| JP2007183746A (en) * | 2006-01-05 | 2007-07-19 | Elpida Memory Inc | Electronic component cooling device and personal computer equipped with the same |
| CN105348821A (en) * | 2015-11-06 | 2016-02-24 | 深圳德邦界面材料有限公司 | Phase change graphite heat conduction material with high thermal conductivity and preparation method |
| CN106243993A (en) * | 2016-07-29 | 2016-12-21 | 芜湖迈特电子科技有限公司 | A kind of composite heat-conducting graphite flake |
| CN106483177A (en) * | 2016-11-08 | 2017-03-08 | 哈尔滨师范大学 | A kind of preparation method of graphene oxide/EDTA decorating carbon paste electrode |
| CN106785190A (en) * | 2016-11-29 | 2017-05-31 | 重庆云天化瀚恩新材料开发有限公司 | Conductive structure for electrokinetic cell radiating and preparation method thereof |
-
2017
- 2017-07-20 CN CN201710595752.0A patent/CN107331651B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007183746A (en) * | 2006-01-05 | 2007-07-19 | Elpida Memory Inc | Electronic component cooling device and personal computer equipped with the same |
| CN105348821A (en) * | 2015-11-06 | 2016-02-24 | 深圳德邦界面材料有限公司 | Phase change graphite heat conduction material with high thermal conductivity and preparation method |
| CN106243993A (en) * | 2016-07-29 | 2016-12-21 | 芜湖迈特电子科技有限公司 | A kind of composite heat-conducting graphite flake |
| CN106483177A (en) * | 2016-11-08 | 2017-03-08 | 哈尔滨师范大学 | A kind of preparation method of graphene oxide/EDTA decorating carbon paste electrode |
| CN106785190A (en) * | 2016-11-29 | 2017-05-31 | 重庆云天化瀚恩新材料开发有限公司 | Conductive structure for electrokinetic cell radiating and preparation method thereof |
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| Publication number | Publication date |
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| CN107331651B (en) | 2019-08-27 |
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