CN107331651B - Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment - Google Patents
Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment Download PDFInfo
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- CN107331651B CN107331651B CN201710595752.0A CN201710595752A CN107331651B CN 107331651 B CN107331651 B CN 107331651B CN 201710595752 A CN201710595752 A CN 201710595752A CN 107331651 B CN107331651 B CN 107331651B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention is suitable for electronic equipment dissipating heat technical field, discloses heat sink material and preparation method, the electronic equipment and heat dissipating method of a kind of electronic equipment.Heat sink material includes being used for intermediate accumulation of heat slow release layer and heat dissipating layer, intermediate accumulation of heat slow release layer includes in paste mixture layer paste and heat dissipation film, paste mixture layer includes graphite powder and paraffin powder, and the quality accounting of graphite powder is 20% to 50%, and the quality accounting of paraffin powder is 40% to 70%.There is above-mentioned heat sink material in electronic equipment.Heat dissipating method uses above-mentioned heat sink material.Preparation method, comprising the following steps: cut heat dissipation film；The paste mixture that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70% is set in the heat-curable glue of heat dissipation film.Heat sink material and preparation method, the electronic equipment and heat dissipating method of a kind of electronic equipment provided by the present invention, can make the operating temperature of electronic chip in limit value, user experience is good.
Description
Technical field
The invention belongs to the heat sink materials and preparation side of electronic equipment dissipating heat technical field more particularly to a kind of electronic equipment
Method, electronic equipment and heat dissipating method.
Background technique
The sinking path of current intelligent wrist-watch has 3 kinds of modes, is respectively as follows: one, by setting heat dissipation graphite or copper foil material
Material is arranged at heat source concentrated position, transmits between other objects to share heat；Two, it radiates；Three, cross-ventilation.But for
Using the intelligent wrist-watch of the chip of 3G or more, since complete machine area is small and 7 grades of waterproofing grade or more, so that heat is difficult to lead to
It crosses conduction, radiation and convection current to go out, so that complete machine temperature rises, user experience is poor.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, provide a kind of electronic equipment heat sink material and
Preparation method, electronic equipment and heat dissipating method, hot material have the function of thermally conductive, accumulation of heat, can be sustained heat, heat dissipation effect
It is good, it can make the operating temperature of the electronic chip in electronic equipment in limit value, high reliablity and user experience is good.
The technical scheme is that the heat sink material of a kind of electronic equipment, including for absorbing heat and discharging heat
Intermediate accumulation of heat slow release layer and be set to the heat dissipating layers of the intermediate accumulation of heat slow release layer upper and lower ends, the intermediate accumulation of heat slow release layer
Including being in paste mixture layer paste, the paste mixture layer includes graphite powder and paraffin powder, wherein the graphite powder
Quality accounting is 20% to 50%, and the quality accounting of the paraffin powder is 40% to 70%, and the intermediate accumulation of heat slow release layer also wraps
Include the heat dissipation film for being affixed on the paste mixture layer upper and lower ends；The intermediate accumulation of heat slow release layer with a thickness of 0.1mm to 2mm.
Specifically, the quality accounting of the graphite powder is 30% to 40%, the quality accounting of the paraffin powder be 50% to
60%.
Specifically, the heat dissipating layer is graphite film layer.
Specifically, the heat dissipation film is polyimide film.
Specifically, the intermediate accumulation of heat slow release layer with a thickness of 0.2mm to 0.5mm, or, the thickness of the heat dissipating layer
Degree is 0.05mm to 0.1mm.
Specifically, the heat sink material with a thickness of 0.3mm to 0.7mm.
The present invention also provides a kind of electronic equipment, it is provided with circuit board in the electronic equipment, is set on the circuit board
It is equipped with electronic chip, being sticked on the electronic chip has the heat sink material of above-mentioned electronic equipment.
The present invention also provides a kind of heat dissipating methods of above-mentioned electronic equipment, comprising the following steps:
The heat that electronic chip generates when working, heat are transmitted to the heat dissipating layer of heat sink material lower end, the heat dissipating layer of lower end
The heat dissipation film of lower end is transferred heat to, heat is transferred to paste mixture layer, paste mixture layer by the heat dissipation film of lower end again
Absorb heat simultaneously heat accumulation；The heat in paste mixture is discharged to the heat dissipation film of upper end simultaneously, and the heat dissipation film of upper end transfers heat to
The heat dissipating layer of upper end, the heat dissipating layer of upper end transfer heat to the other structures part of complete machine.
The present invention also provides the preparation methods of the heat sink material of a kind of electronic equipment, comprising the following steps:
Cut heat dissipation film；
In heat-curable glue is arranged on the heat dissipation film and carries out precuring, the heat dissipation film with heat-curable glue is obtained；
By the cream that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70%
Shape mixture is set in the heat-curable glue of the heat dissipation film；
Another heat dissipation film with heat-curable glue is affixed on the paste mixture and is carried out pressing solidification, obtains centre
Accumulation of heat slow release layer；
It is sticked heat dissipating layer in the two sides up and down of the intermediate accumulation of heat slow release layer.
Specifically, the heat dissipating layer is heat dissipation graphite linings.
Heat sink material and preparation method, the electronic equipment and heat dissipating method of a kind of electronic equipment provided by the present invention,
Heat sink material has the function of that thermally conductive, accumulation of heat and sustained release heat can make electronic chip to the excellent in heat dissipation effect of electronic chip
Operating temperature in limit value, to avoid electronic chip temperature excessively high and influence the function of product, service life, reliability, into
And improve user experience.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the schematic cross-section of the heat sink material of a kind of electronic equipment provided in an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
It is only relative concept each other it should also be noted that, the positional terms such as left and right, upper and lower in the embodiment of the present invention
It or is to refer to, and should not be regarded as restrictive with the normal operating condition of product.
As shown in Figure 1, the heat sink material (radiator structure) of a kind of electronic equipment provided in an embodiment of the present invention, including be used for
It absorbs heat and discharges the intermediate accumulation of heat slow release layer of heat and be set to the heat dissipating layer of the intermediate accumulation of heat slow release layer upper and lower ends
11,12, the intermediate accumulation of heat slow release layer includes in paste mixture layer 3 paste, and with preferable heat storage performance, paste is mixed
Closing nitride layer 3, it has deformation performance, can be attached at well on the heating device and structure of electronic equipment.The paste mixture
Layer 3 includes that graphite powder and paraffin powder and paste binder, graphite powder and paraffin powder can be mixed uniformly, wherein the graphite powder
Quality accounting is 20% to 50%, and the quality accounting of the paraffin powder is 40% to 70%, paste mixture layer 3 can with heat accumulation and
Slow release heat.The specific heat of graphite powder is up to 720J/kg. DEG C, and thermal coefficient is up to 151W/mK；The specific heat of paraffin powder is reachable
2200J/kg. DEG C, thermal coefficient is up to 0.12W/mK, the paste mixture being made of graphite powder and paraffin powder and auxiliary agents
Layer 3, accumulation of heat effect is good.The intermediate accumulation of heat slow release layer further includes being affixed on 3 upper and lower ends of paste mixture layer
Heat dissipation film 21,22, heat dissipation film 21,22 can play thermally conductive effect, and heat sink material can be applied in closed electronic equipment,
Such as to the smartwatch that waterproofing grade has higher requirements.The heat that generates when electronic chip works in electronic equipment, heat to
The heat dissipating layer 12 of heat sink material lower end transmits, and the heat dissipating layer 12 of lower end transfers heat to the heat dissipation film 22 of lower end, and lower end dissipates
Heat is transferred to paste mixture layer 3, the heat absorption of paste mixture layer 3 and heat accumulation by hotting mask 22 again；Simultaneously in paste mixture
Heat is discharged to the heat dissipation film 21 of upper end, and the heat dissipation film 21 of upper end transfers heat to the heat dissipating layer 11 of upper end, the heat dissipation of upper end
Layer 11 transfers heat to the other structures part of complete machine, and the upper and lower ends of heat sink material can be affixed on electronic chip and shell respectively
Inner wall or radiating seat etc. can make the operating temperature of electronic chip in limit value the excellent in heat dissipation effect of electronic chip, from
And it avoids electronic chip temperature excessively high and influences the function of product, service life, reliability, and then improve user experience.
Specifically, the quality accounting of the graphite powder can be 30% to 40%, and the quality accounting of the paraffin powder can be with
It is 50% to 60%, remaining is auxiliary agents.
Specifically, the heat dissipating layer 11,12 can be graphite film layer, and horizontal direction coefficient of heat transfer is not less than 700-
1200W/m.K, vertical direction coefficient of heat transfer are not less than 25W/m.K.The chemical component of graphite film layer is mainly single carbon (C) member
Element, is a kind of native element metal mineral, and film high-molecular compound can obtain being graphitized under high temperature and pressure thin chemically
Film also has as organic plastics one because carbon is nonmetalloid, but has the conduction of metal material, heating conduction
The plasticity of sample, and there are also special hot property, chemical stability, lubrication and can be coated in the surface of solids etc. it is some good
Good processing performance, thermal resistance lower than aluminium 40%, lower than copper 20%.
Specifically, the heat dissipation film 21,22 can be polyimide film, i.e., modified PI (polyimide film；PI
Film), heat dissipation film 21,22 is in vertical direction coefficient of heat transfer: >=5W/m.K.Polyimide film has excellent thermal stability, resistance to
Chemical corrosivity and mechanical performance.
Specifically, packaging plastic 4, the upper and lower ends of packaging plastic 4 have can be set in the two sides of intermediate accumulation of heat slow release layer or surrounding
Can connect sealing with heat dissipation film 21,22, arbitrarily flow, deform to avoid intermediate accumulation of heat slow release layer.
Specifically, the thickness of the intermediate accumulation of heat slow release layer can be 0.1mm to 2mm, or, the heat dissipating layer 11,
12 thickness can be 0.02mm to 0.2mm.
Preferably, specifically, the thickness of the intermediate accumulation of heat slow release layer can be 0.15mm to 1mm, or, it is described
The thickness of heat dissipating layer 11,12 can be 0.04mm to 0.15mm.
In the present embodiment, the thickness of the intermediate accumulation of heat slow release layer can be 0.2mm to 0.5mm, or, it is described to dissipate
The thickness of thermosphere 11,12 can be 0.05mm to 0.1mm.
In concrete application, the thickness of the heat sink material can be less than 1mm or 0.7mm, for example, the thickness of heat sink material can
Think 0.3mm to 0.7mm.Certainly, thickness may be set to be other suitable thickness.
The embodiment of the invention also provides a kind of electronic equipment, the electronic equipment includes shell, is provided with electricity in shell
Road plate is provided with electronic chip on the circuit board, and being sticked on the electronic chip has the heat sink material of above-mentioned electronic equipment
(radiator structure).Electronic chip can be communication chip, such as 3G communication chip etc..Electronic equipment can be smartwatch, volume
It is small, and product is required with waterproofing grade, and ventilation hole can not be arranged on shell.The lower end of heat sink material can directly be affixed on electronics
Chip.Alternatively, being sticked on electronic chip has heat-conducting seat, heat-conducting seat can be metalwork, and the lower end of heat sink material is affixed on heat-conducting seat.It dissipates
The upper end of hot material can be affixed with the inner wall of shell or be affixed with other structures part.
The embodiment of the invention also provides a kind of heat dissipating methods of above-mentioned electronic equipment, comprising the following steps:
The heat that electronic chip generates when working generates a large amount of heat especially when electronic chip running at full capacity,
Heat is transmitted to the heat dissipating layer 12 of heat sink material lower end, and the heat dissipating layer 12 of lower end transfers heat to the heat dissipation film 22 of lower end, under
Heat is transferred to paste mixture layer 3, the heat absorption of paste mixture layer 3 and heat accumulation by the heat dissipation film 22 at end again；Paste mixing simultaneously
Heat in object is discharged to the heat dissipation film 21 of upper end, and the heat dissipation film 21 of upper end transfers heat to the heat dissipating layer 11 of upper end, upper end
Heat dissipating layer 11 transfer heat to the other structures part of complete machine.Electronic chip can be wireless communications chips, such as 3G chip etc..
The heat dissipating layer 11,12 is graphite film layer, and horizontal direction coefficient of heat transfer is not less than 700-1200W/m.K, vertical direction heat dissipation
Coefficient is not less than 25W/m.K.The heat dissipation film 21,22 is polyimide film, i.e., modified PI (polyimide film；PI
Film), heat dissipation film 21,22 is in vertical direction coefficient of heat transfer: >=5W/m.K.
The embodiment of the invention also provides the preparation method of the heat sink material of a kind of electronic equipment, can be used for preparing above-mentioned
Heat sink material, comprising the following steps:
Heat dissipation film 21,22 is cut, the heat dissipation film 21,22 is polyimide film, i.e., modified PI (polyimide film；
PI film), heat dissipation film 21,22 is in vertical direction coefficient of heat transfer: >=5W/m.K；
In heat-curable glue is arranged on the heat dissipation film 21,22 by way of silk-screen and carries out precuring, obtain that there is heat
The heat dissipation film 21,22 of solidification glue；
By the cream that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70%
Shape mixture is set in the heat-curable glue of the heat dissipation film 22 by way of silk-screen, and certainly, the quality of the graphite powder accounts for
Than may be 25% to 45%, the quality accounting of the paraffin powder can be 45% to 65%, remaining is auxiliary agents；
Another heat dissipation film 21 with heat-curable glue is affixed on the paste mixture and carried out pressing solidification, is obtained
Between accumulation of heat slow release layer；
It is sticked heat dissipating layer 11,12 in the two sides up and down of the intermediate accumulation of heat slow release layer.The two sides of intermediate accumulation of heat slow release layer or
Packaging plastic 4 has can be set in surrounding.
Specifically, the heat dissipating layer 11,12 can be heat dissipation graphite linings (graphite film layer), and heat dissipation film 21,22 can be sub- for polyamides
Amine film (modified PI film).The graphite film layer, horizontal direction coefficient of heat transfer are not less than 700-1200W/m.K, and vertical direction dissipates
Hot coefficient is not less than 25W/m.K.The polyimide film, i.e., modified PI (polyimide film；PI film), heat dissipation film 21,
22 in vertical direction coefficient of heat transfer: >=5W/m.K.
Heat sink material and preparation method, the electronic equipment and heat dissipation side of a kind of electronic equipment provided by the embodiment of the present invention
Method, heat sink material have the function of thermally conductive, accumulation of heat, to the excellent in heat dissipation effect of electronic chip, can make the work of electronic chip
Make temperature in limit value, thus avoid electronic chip temperature excessively high and influence the function of product, service life, reliability, Jin Erti
High user experience.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modification, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. the heat sink material of a kind of electronic equipment, which is characterized in that including for absorbing heat and discharging the intermediate accumulation of heat of heat
Slow release layer and the heat dissipating layer for being set to the intermediate accumulation of heat slow release layer upper and lower ends, the intermediate accumulation of heat slow release layer include in paste
Paste mixture layer, the paste mixture layer includes graphite powder and paraffin powder, wherein the quality accounting of the graphite powder is
20% to 50%, the quality accounting of the paraffin powder is 40% to 70%, the intermediate accumulation of heat slow release layer further include be affixed on it is described
The heat dissipation film of paste mixture layer upper and lower ends；The intermediate accumulation of heat slow release layer with a thickness of 0.1mm to 2mm.
2. the heat sink material of a kind of electronic equipment as described in claim 1, which is characterized in that the quality accounting of the graphite powder
It is 30% to 40%, the quality accounting of the paraffin powder is 50% to 60%.
3. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, which is characterized in that the heat dissipating layer is graphite
Film layer.
4. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, which is characterized in that the heat dissipation film is polyamides
Imines film.
5. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, which is characterized in that the intermediate accumulation of heat sustained release
Layer with a thickness of 0.2mm to 0.5mm, or, the heat dissipating layer with a thickness of 0.05mm to 0.1mm.
6. the heat sink material of a kind of electronic equipment as claimed in claim 1 or 2, which is characterized in that the thickness of the heat sink material
Degree is 0.3mm to 0.7mm.
7. a kind of electronic equipment, which is characterized in that be provided with circuit board in the electronic equipment, be provided with electricity on the circuit board
Sub- chip is sticked just like the heat sink material of electronic equipment described in any one of claims 1 to 6 on the electronic chip.
8. a kind of heat dissipating method of electronic equipment as claimed in claim 7, which comprises the following steps:
The heat that electronic chip generates when working, heat are transmitted to the heat dissipating layer of heat sink material lower end, and the heat dissipating layer of lower end will be warm
Amount is transferred to the heat dissipation film of lower end, and heat is transferred to paste mixture layer, the heat absorption of paste mixture layer by the heat dissipation film of lower end again
And heat accumulation；The heat in paste mixture is discharged to the heat dissipation film of upper end simultaneously, and the heat dissipation film of upper end transfers heat to upper end
Heat dissipating layer, the heat dissipating layer of upper end transfers heat to the other structures part of complete machine.
9. the preparation method of the heat sink material of a kind of electronic equipment, which comprises the following steps:
Cut heat dissipation film；
In heat-curable glue is arranged on the heat dissipation film and carries out precuring, the heat dissipation film with heat-curable glue is obtained；
The paste that the quality accounting of graphitiferous powder is 20% to 50% and the quality accounting of the powder containing paraffin is 40% to 70% is mixed
Object is closed to be set in the heat-curable glue of the heat dissipation film；
Another heat dissipation film with heat-curable glue is affixed on the paste mixture and is carried out pressing solidification, obtains intermediate accumulation of heat
Slow release layer；
It is sticked heat dissipating layer in the two sides up and down of the intermediate accumulation of heat slow release layer.
10. the preparation method of the heat sink material of a kind of electronic equipment as claimed in claim 9, which is characterized in that the heat dissipation
Layer is heat dissipation graphite linings.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710595752.0A CN107331651B (en) | 2017-07-20 | 2017-07-20 | Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710595752.0A CN107331651B (en) | 2017-07-20 | 2017-07-20 | Heat sink material and preparation method, the electronic equipment and heat dissipating method of electronic equipment |
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| CN107331651A CN107331651A (en) | 2017-11-07 |
| CN107331651B true CN107331651B (en) | 2019-08-27 |
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| JP2007183746A (en) * | 2006-01-05 | 2007-07-19 | Elpida Memory Inc | Electronic component cooling device and personal computer equipped with the same |
| CN105348821A (en) * | 2015-11-06 | 2016-02-24 | 深圳德邦界面材料有限公司 | Phase change graphite heat conduction material with high thermal conductivity and preparation method |
| CN106243993A (en) * | 2016-07-29 | 2016-12-21 | 芜湖迈特电子科技有限公司 | A kind of composite heat-conducting graphite flake |
| CN106483177A (en) * | 2016-11-08 | 2017-03-08 | 哈尔滨师范大学 | A kind of preparation method of graphene oxide/EDTA decorating carbon paste electrode |
| CN106785190A (en) * | 2016-11-29 | 2017-05-31 | 重庆云天化瀚恩新材料开发有限公司 | Conductive structure for electrokinetic cell radiating and preparation method thereof |
-
2017
- 2017-07-20 CN CN201710595752.0A patent/CN107331651B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007183746A (en) * | 2006-01-05 | 2007-07-19 | Elpida Memory Inc | Electronic component cooling device and personal computer equipped with the same |
| CN105348821A (en) * | 2015-11-06 | 2016-02-24 | 深圳德邦界面材料有限公司 | Phase change graphite heat conduction material with high thermal conductivity and preparation method |
| CN106243993A (en) * | 2016-07-29 | 2016-12-21 | 芜湖迈特电子科技有限公司 | A kind of composite heat-conducting graphite flake |
| CN106483177A (en) * | 2016-11-08 | 2017-03-08 | 哈尔滨师范大学 | A kind of preparation method of graphene oxide/EDTA decorating carbon paste electrode |
| CN106785190A (en) * | 2016-11-29 | 2017-05-31 | 重庆云天化瀚恩新材料开发有限公司 | Conductive structure for electrokinetic cell radiating and preparation method thereof |
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| Publication number | Publication date |
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| CN107331651A (en) | 2017-11-07 |
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