CN107331638A - A kind of wafer cleaning equipment for Electronic products manufacturing - Google Patents
A kind of wafer cleaning equipment for Electronic products manufacturing Download PDFInfo
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- CN107331638A CN107331638A CN201710698392.7A CN201710698392A CN107331638A CN 107331638 A CN107331638 A CN 107331638A CN 201710698392 A CN201710698392 A CN 201710698392A CN 107331638 A CN107331638 A CN 107331638A
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- motor
- rotating shaft
- frame
- plate
- bearing seat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to a kind of cleaning equipment, more particularly to a kind of wafer cleaning equipment for Electronic products manufacturing.The technical problem to be solved in the present invention is to provide one kind cleaning efficiently, the high wafer cleaning equipment for Electronic products manufacturing of security performance.In order to solve the above-mentioned technical problem, the invention provides such a wafer cleaning equipment for Electronic products manufacturing, bottom plate, pole, cleaning frame, drain pipe, valve, support frame, top plate, elevating mechanism etc. are included；Bottom plate crown center is symmetrical to be provided with pole, pole top is connected with cleaning frame, rotating mechanism is connected between cleaning frame and bottom plate, cleaning frame left wall bottom is connected with drain pipe, drain pipe is provided with left and right ends at the top of valve, bottom plate and is equipped with support frame, and support frame top is provided with top plate, elevating mechanism is installed, elevating mechanism bottom is connected with placing frame in the middle of top plate bottom.Simple, the safe effect invention achieves operating process.
Description
Technical field
The present invention relates to a kind of cleaning equipment, more particularly to a kind of wafer cleaning equipment for Electronic products manufacturing.
Background technology
Wafer refers to the silicon wafer used in silicon semiconductor production of integrated circuits, because it is shaped as circle, therefore referred to as wafer；
Various circuit component structures can be manufactured on silicon, and as the IC products for having specific electrical functionality.The original of wafer
Beginning material is silicon, and there is nexhaustible silica on earth's crust surface.Silica ore is refined via electric arc furnaces, hydrochloric acid chlorine
Change, and after distillation, the polysilicon of high-purity has been made, its high purity 99.999999999%.
Crystal column surface adheres to about 2um Al2O3 and glycerine mixed liquor protective layer, and chemical etching must be carried out before making
And surface clean, current wafer cleaning process is complicated, and chemical substance is than relatively hazardous, therefore it is efficient to need a kind of cleaning of research and development badly,
The high wafer cleaning equipment for Electronic products manufacturing of security performance.
The content of the invention
(1) technical problem to be solved
The present invention is in order to overcome current wafer cleaning process complicated, and chemical substance is than relatively hazardous shortcoming, and the present invention will
The technical problem of solution is to provide a kind of cleaning efficiently, the high wafer cleaning equipment for Electronic products manufacturing of security performance.
(2) technical scheme
In order to solve the above-mentioned technical problem, set the invention provides such a wafer cleaning for Electronic products manufacturing
It is standby, include bottom plate, pole, cleaning frame, drain pipe, valve, support frame, top plate, elevating mechanism, placing frame, jube, air-dry machine
Structure and rotating mechanism, bottom plate crown center is symmetrical to be provided with pole, and pole top is connected with cleaning frame, cleaning frame and bottom plate it
Between be connected with rotating mechanism, cleaning frame left wall bottom is connected with drain pipe, and drain pipe is provided with left and right ends at the top of valve, bottom plate
Support frame is equipped with, support frame top, which is provided with the middle of top plate, top plate bottom, is provided with elevating mechanism, the connection of elevating mechanism bottom
Have and air-dried mechanism is installed in the middle of being provided with placing frame, placing frame on the inside of jube, support frame.
Preferably, elevating mechanism includes guide plate, the first motor, first rotating shaft, first bearing seat, spool, second
Bearing block and bracing wire, top plate bottom left, which is provided with guide plate, guide plate, is provided with the first motor, is installed in the middle of top plate bottom
There is first bearing seat, top plate bottom right is provided with second bearing seat, and first bearing seat and second bearing seat are provided with first turn
It is connected with spool in axle, first rotating shaft left end and the first motor connection, first rotating shaft, spool is located at first bearing seat and the
Between two bearing bracket, bracing wire is wound with spool, is provided with pilot hole on the right side of guide plate, is drawstring through pilot hole, and be connected with and put
Put frame.
Preferably, air-dried mechanism includes the first fix bar, endless glide, sliding block, mounting seat, connecting rod, blower fan, second
Fix bar, fix bar end are mounted in the middle of on the inside of motor, the second rotating shaft, gear, ring gear and fix bar, left and right sidesing supporting frame
It is connected with slidingtype in endless glide, endless glide and is connected with sliding block, sliding block inner side is connected with the inside of mounting seat, mounting seat and connected
There is connecting rod, mounting seat the inner, which is connected with the top of blower fan, mounting seat, is connected with the second motor, and second is connected with the top of the second motor
It is connected with rotating shaft, the second rotating shaft at the top of gear, endless glide and is connected with ring gear, ring gear is engaged with gear.
Preferably, rotating mechanism includes the 3rd motor, the 3rd rotating shaft, 3rd bearing seat, rotating vane, web plate and sealing
Circle, bottom plate top right side is provided with the 3rd motor, and the 3rd motor is located between two poles, and the 3rd is provided with the middle of cleaning frame bottom
Bearing block, 3rd bearing seat is provided with the 3rd rotating shaft, the 3rd rotating shaft bottom and the 3rd motor connection, and the 3rd rotating shaft top is connected with
Rotating vane, cleaning frame inner wall lower is provided with web plate, and web plate is located at rotating vane top, and 3rd bearing seat top is provided with sealing
Circle.
Preferably, the first motor and the second motor are servomotor.
Preferably, rotating vane is stainless steel.
Operation principle：When the wafer of Electronic products manufacturing needs cleaning, wafer is placed on the jube in placing frame, work
People is put into cleaning inframe by controlling elevating mechanism by placing frame, pours into cleaning fluid toward cleaning inframe, then control rotating mechanism to stir
The cleaning fluid cleaning wafer of dynamic cleaning inframe, after cleaning up to standard, workman's control rotating mechanism is stopped, and controls lift
Placing frame is slowly drawn high and leaves cleaning frame by structure, during drawing high, and control air-dries mechanism and enters sector-style to the wafer cleaned
Dry, the wafer after air-drying can just take out, and operating process is simple, safe.
Because elevating mechanism includes guide plate, the first motor, first rotating shaft, first bearing seat, spool, second bearing
Seat and bracing wire, top plate bottom left, which is provided with guide plate, guide plate, is provided with the first motor, and the is provided with the middle of top plate bottom
One bearing block, top plate bottom right is provided with second bearing seat, and first bearing seat and second bearing seat are provided with first rotating shaft, the
Spool is connected with one rotating shaft left end and the first motor connection, first rotating shaft, spool is located at first bearing seat and the second axle
Between bearing, bracing wire is wound with spool, pilot hole is provided with the right side of guide plate, be drawstring through pilot hole, and be connected with placing frame,
When the wafer of Electronic products manufacturing needs cleaning, wafer is placed on the jube in placing frame, workman controls the first motor suitable
Hour hands are rotated, and the first motor drives first rotating shaft to rotate clockwise, and first rotating shaft drives spool to rotate clockwise, and spool turns
Dynamic to put down bracing wire, placing frame is moved downward due to the effect of gravity, when placing frame is completely into cleaning inframe, the electricity of control first
Machine is stopped operating, when wafer cleaning is up to standard, and the first motor of control is rotated counterclockwise, and the first motor drives first rotating shaft counterclockwise
Rotate, first rotating shaft drives spool to rotate counterclockwise, spool rolls bracing wire, bracing wire drives placing frame to move upwards, until
Air-dried mechanism air-dry it is up to standard, workman control the first motor be stopped.
Because air-drying mechanism includes the first fix bar, endless glide, sliding block, mounting seat, connecting rod, blower fan, the second electricity
Fix bar is mounted in the middle of on the inside of machine, the second rotating shaft, gear, ring gear and fix bar, left and right sidesing supporting frame, fix bar end connects
It is connected to slidingtype in endless glide, endless glide and is connected with sliding block, sliding block inner side is connected with the inside of mounting seat, mounting seat and is connected with
Connecting rod, mounting seat the inner, which is connected with the top of blower fan, mounting seat, is connected with the second motor, and second turn is connected with the top of the second motor
It is connected with axle, the second rotating shaft at the top of gear, endless glide and is connected with ring gear, ring gear is engaged with gear, when experience cleaning
After finishing, workman controls the second motor to rotate, and the second motor driven gear is rotated, and gear is rotated along along ring gear, and gear drives
Blower fan is rotated along ring gear so that blower fan can air-dry all wafers, when wafer is air-dried it is up to standard when, stop the second motor rotate.
Because rotating mechanism includes the 3rd motor, the 3rd rotating shaft, 3rd bearing seat, rotating vane, web plate and sealing ring,
Bottom plate top right side is provided with the 3rd motor, and the 3rd motor is located between two poles, and the 3rd axle is provided with the middle of cleaning frame bottom
Bearing, 3rd bearing seat is provided with the 3rd rotating shaft, the 3rd rotating shaft bottom and the 3rd motor connection, and the 3rd rotating shaft top is connected with rotation
Rotating vane piece, cleaning frame inner wall lower is provided with web plate, and web plate is located at rotating vane top, and 3rd bearing seat top is provided with sealing
Circle, when placing frame is put into cleaning inframe, pours into cleaning fluid, the 3rd motor of control is rotated, and the 3rd motor drives the 3rd rotating shaft to turn
Dynamic, the 3rd rotating shaft drives rotating vane to rotate by 3rd bearing seat, rotating vane agitation cleaning fluid so that cleaning fluid is to wafer
Cleaned, sealing ring can prevent cleaning fluid from flowing into the 3rd motor, it is ensured that the safety of the 3rd motor.
Because the first motor and the second motor are servomotor, servomotor can provide stable rotating speed, be conducive to crystalline substance
Round lifting and air-dry.
Because the material of rotating vane is stainless steel, stainless steel is corrosion-resistant, extension device service life.
(3) beneficial effect
Simple, the safe effect invention achieves operating process.
Brief description of the drawings
Fig. 1 is main structure diagram of the invention.
Fig. 2 is the main structure diagram of elevating mechanism of the present invention.
Fig. 3 air-dries the main structure diagram of mechanism for the present invention.
Fig. 4 air-dries the vertical view structural scheme of mechanism of mechanism for the present invention.
Fig. 5 is the main structure diagram of rotating mechanism of the present invention.
Mark in accompanying drawing for：1- bottom plates, 2- poles, 3- cleaning frames, 4- drain pipes, 5- valves, 6- support frames, 7- tops
Plate, 8- elevating mechanisms, 81- guide plates, the motors of 82- first, 83- first rotating shafts, 84- first bearing seats, 85- spools, 86-
Two bearing bracket, 87- pilot holes, 88- bracing wires, 9- placing frames, 10- jubes, 11- air-dries mechanism, and 111- fix bars, 112- annulars are sliding
Rail, 113- sliding blocks, 114- mounting seats, 115- connecting rods, 116- blower fans, the motors of 117- second, the rotating shafts of 118- second, 119- teeth
Wheel, 1110- ring gears, 12- rotating mechanisms, the motors of 121- the 3rd, the rotating shafts of 122- the 3rd, 123- 3rd bearings seat, 124- rotations
Blade, 125- web plates, 126- sealing rings.
Embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples.
Embodiment 1
A kind of wafer cleaning equipment for Electronic products manufacturing, as Figure 1-5, includes bottom plate 1, pole 2, cleaning
Frame 3, drain pipe 4, valve 5, support frame 6, top plate 7, elevating mechanism 8, placing frame 9, jube 10, air-dried mechanism 11 and rotating mechanism
12, the crown center of bottom plate 1 is symmetrical to be provided with pole 2, and the top of pole 2 is connected with cleaning frame 3, connected between cleaning frame 3 and bottom plate 1
Rotating mechanism 12 is connected to, cleaning frame 3 left wall bottom is connected with drain pipe 4, and drain pipe 4 is provided with valve 5, the top of bottom plate 1 left and right
Two ends are equipped with support frame 6, and the top of support frame 6 is provided with top plate 7, and top plate 7 is provided with elevating mechanism 8, lift in the middle of bottom
The bottom of structure 8, which is connected with placing frame 9, placing frame 9, is provided with jube 10, and support frame 6 is provided with air-dried mechanism 11 in the middle of inner side.
Embodiment 2
A kind of wafer cleaning equipment for Electronic products manufacturing, as Figure 1-5, includes bottom plate 1, pole 2, cleaning
Frame 3, drain pipe 4, valve 5, support frame 6, top plate 7, elevating mechanism 8, placing frame 9, jube 10, air-dried mechanism 11 and rotating mechanism
12, the crown center of bottom plate 1 is symmetrical to be provided with pole 2, and the top of pole 2 is connected with cleaning frame 3, connected between cleaning frame 3 and bottom plate 1
Rotating mechanism 12 is connected to, cleaning frame 3 left wall bottom is connected with drain pipe 4, and drain pipe 4 is provided with valve 5, the top of bottom plate 1 left and right
Two ends are equipped with support frame 6, and the top of support frame 6 is provided with top plate 7, and top plate 7 is provided with elevating mechanism 8, lift in the middle of bottom
The bottom of structure 8, which is connected with placing frame 9, placing frame 9, is provided with jube 10, and support frame 6 is provided with air-dried mechanism 11 in the middle of inner side.
Elevating mechanism 8 include guide plate 81, the first motor 82, first rotating shaft 83, first bearing seat 84, spool 85,
Second bearing seat 86 and bracing wire 88, the bottom left of top plate 7, which is provided with guide plate 81, guide plate 81, is provided with the first motor 82,
First bearing seat 84 is installed, the bottom right of top plate 7 is provided with second bearing seat 86, first bearing seat 84 in the middle of the bottom of top plate 7
First rotating shaft 83 is provided with second bearing seat 86, the left end of first rotating shaft 83 is connected with the first motor 82, connected in first rotating shaft 83
Spool 85 is connected to, spool 85 is located between first bearing seat 84 and second bearing seat 86, and bracing wire 88 is wound with spool 85,
The right side of guide plate 81 is provided with pilot hole 87, and bracing wire 88 passes through pilot hole 87, and is connected with placing frame 9.
Embodiment 3
A kind of wafer cleaning equipment for Electronic products manufacturing, as Figure 1-5, includes bottom plate 1, pole 2, cleaning
Frame 3, drain pipe 4, valve 5, support frame 6, top plate 7, elevating mechanism 8, placing frame 9, jube 10, air-dried mechanism 11 and rotating mechanism
12, the crown center of bottom plate 1 is symmetrical to be provided with pole 2, and the top of pole 2 is connected with cleaning frame 3, connected between cleaning frame 3 and bottom plate 1
Rotating mechanism 12 is connected to, cleaning frame 3 left wall bottom is connected with drain pipe 4, and drain pipe 4 is provided with valve 5, the top of bottom plate 1 left and right
Two ends are equipped with support frame 6, and the top of support frame 6 is provided with top plate 7, and top plate 7 is provided with elevating mechanism 8, lift in the middle of bottom
The bottom of structure 8, which is connected with placing frame 9, placing frame 9, is provided with jube 10, and support frame 6 is provided with air-dried mechanism 11 in the middle of inner side.
Elevating mechanism 8 include guide plate 81, the first motor 82, first rotating shaft 83, first bearing seat 84, spool 85,
Second bearing seat 86 and bracing wire 88, the bottom left of top plate 7, which is provided with guide plate 81, guide plate 81, is provided with the first motor 82,
First bearing seat 84 is installed, the bottom right of top plate 7 is provided with second bearing seat 86, first bearing seat 84 in the middle of the bottom of top plate 7
First rotating shaft 83 is provided with second bearing seat 86, the left end of first rotating shaft 83 is connected with the first motor 82, connected in first rotating shaft 83
Spool 85 is connected to, spool 85 is located between first bearing seat 84 and second bearing seat 86, and bracing wire 88 is wound with spool 85,
The right side of guide plate 81 is provided with pilot hole 87, and bracing wire 88 passes through pilot hole 87, and is connected with placing frame 9.
Air-dry mechanism 11 and include the first fix bar 111, endless glide 112, sliding block 113, mounting seat 114, connecting rod
115th, blower fan 116, the second motor 117, the second rotating shaft 118, gear 119, ring gear 1110 and fix bar 111, left and right sidesing supporting frame 6
Fix bar 111 is mounted in the middle of inner side, the end of fix bar 111 is connected with slidingtype in endless glide 112, endless glide 112
Sliding block 113 is connected with, the inner side of sliding block 113 is connected with mounting seat 114, and the inner side of mounting seat 114 is connected with connecting rod 115, mounting seat
114 the inners are connected with blower fan 116, and the top of mounting seat 114 is connected with the second motor 117, and the top of the second motor 117 is connected with second
Gear 119 is connected with rotating shaft 118, the second rotating shaft 118, the top of endless glide 112 is connected with ring gear 1110, ring gear 1110
Engaged with gear 119.
Embodiment 4
A kind of wafer cleaning equipment for Electronic products manufacturing, as Figure 1-5, includes bottom plate 1, pole 2, cleaning
Frame 3, drain pipe 4, valve 5, support frame 6, top plate 7, elevating mechanism 8, placing frame 9, jube 10, air-dried mechanism 11 and rotating mechanism
12, the crown center of bottom plate 1 is symmetrical to be provided with pole 2, and the top of pole 2 is connected with cleaning frame 3, connected between cleaning frame 3 and bottom plate 1
Rotating mechanism 12 is connected to, cleaning frame 3 left wall bottom is connected with drain pipe 4, and drain pipe 4 is provided with valve 5, the top of bottom plate 1 left and right
Two ends are equipped with support frame 6, and the top of support frame 6 is provided with top plate 7, and top plate 7 is provided with elevating mechanism 8, lift in the middle of bottom
The bottom of structure 8, which is connected with placing frame 9, placing frame 9, is provided with jube 10, and support frame 6 is provided with air-dried mechanism 11 in the middle of inner side.
Elevating mechanism 8 include guide plate 81, the first motor 82, first rotating shaft 83, first bearing seat 84, spool 85,
Second bearing seat 86 and bracing wire 88, the bottom left of top plate 7, which is provided with guide plate 81, guide plate 81, is provided with the first motor 82,
First bearing seat 84 is installed, the bottom right of top plate 7 is provided with second bearing seat 86, first bearing seat 84 in the middle of the bottom of top plate 7
First rotating shaft 83 is provided with second bearing seat 86, the left end of first rotating shaft 83 is connected with the first motor 82, connected in first rotating shaft 83
Spool 85 is connected to, spool 85 is located between first bearing seat 84 and second bearing seat 86, and bracing wire 88 is wound with spool 85,
The right side of guide plate 81 is provided with pilot hole 87, and bracing wire 88 passes through pilot hole 87, and is connected with placing frame 9.
Air-dry mechanism 11 and include the first fix bar 111, endless glide 112, sliding block 113, mounting seat 114, connecting rod
115th, blower fan 116, the second motor 117, the second rotating shaft 118, gear 119, ring gear 1110 and fix bar 111, left and right sidesing supporting frame 6
Fix bar 111 is mounted in the middle of inner side, the end of fix bar 111 is connected with slidingtype in endless glide 112, endless glide 112
Sliding block 113 is connected with, the inner side of sliding block 113 is connected with mounting seat 114, and the inner side of mounting seat 114 is connected with connecting rod 115, mounting seat
114 the inners are connected with blower fan 116, and the top of mounting seat 114 is connected with the second motor 117, and the top of the second motor 117 is connected with second
Gear 119 is connected with rotating shaft 118, the second rotating shaft 118, the top of endless glide 112 is connected with ring gear 1110, ring gear 1110
Engaged with gear 119.
Rotating mechanism 12 includes the 3rd motor 121, the 3rd rotating shaft 122,3rd bearing seat 123, rotating vane 124, net
Plate 125 and sealing ring 126, the top right side of bottom plate 1 are provided with the 3rd motor 121, and the 3rd motor 121 is located between two poles 2,
Clean provided with 3rd bearing seat 123 in the middle of the bottom of frame 3,3rd bearing seat 123 is provided with the 3rd rotating shaft 122, the bottom of the 3rd rotating shaft 122
End is connected with the 3rd motor 121, and the top of the 3rd rotating shaft 122 is connected with rotating vane 124, and the cleaning inner wall lower of frame 3 is provided with net
Plate 125, web plate 125 is located at the top of rotating vane 124, and the top of 3rd bearing seat 123 is provided with sealing ring 126.
First motor 82 and the second motor 117 are servomotor.
Rotating vane 124 is stainless steel.
Operation principle：When the wafer of Electronic products manufacturing needs cleaning, wafer is placed on to the jube 10 in placing frame 9
On, workman pours into cleaning fluid, then control rotation by controlling elevating mechanism 8 that placing frame 9 is put into cleaning frame 3 toward cleaning in frame 3
Cleaning fluid cleaning wafer in the agitation cleaning frame 3 of rotation mechanism 12, after cleaning up to standard, workman's control rotating mechanism 12 stops work
Make, and control elevating mechanism 8 slowly to draw high placing frame 9 to leave cleaning frame 3, during drawing high, the air-dried mechanism 11 of control
The wafer cleaned is air-dried, the wafer after air-drying can just take out, operating process is simple, safe.
Because elevating mechanism 8 includes guide plate 81, the first motor 82, first rotating shaft 83, first bearing seat 84, spool
85th, second bearing seat 86 and bracing wire 88, the bottom left of top plate 7 are provided with guide plate 81, guide plate 81 and are provided with the first motor
82, first bearing seat 84 is installed in the middle of the bottom of top plate 7, the bottom right of top plate 7 is provided with second bearing seat 86, first bearing seat
84 and second bearing seat 86 be provided with first rotating shaft 83, the left end of first rotating shaft 83 is connected with the first motor 82, in first rotating shaft 83
Spool 85 is connected with, spool 85 is located between first bearing seat 84 and second bearing seat 86, and bracing wire is wound with spool 85
88, the right side of guide plate 81 is provided with pilot hole 87, and bracing wire 88 passes through pilot hole 87, and is connected with placing frame 9, works as Electronic products manufacturing
Wafer need cleaning when, wafer is placed on the jube 10 in placing frame 9, workman control the first motor 82 rotate clockwise,
First motor 82 drives first rotating shaft 83 to rotate clockwise, and first rotating shaft 83 drives spool 85 to rotate clockwise, spool 85
Bracing wire 88 is put down in rotation, and placing frame 9 is moved downward due to the effect of gravity, when placing frame 9 is completely into cleaning frame 3, control
Make the first motor 82 to stop operating, when wafer cleaning is up to standard, the first motor 82 of control is rotated counterclockwise, and the first motor 82 drives
First rotating shaft 83 is rotated counterclockwise, and first rotating shaft 83 drives spool 85 to rotate counterclockwise, and spool 85 rolls bracing wire 88, bracing wire
88 drive placing frames 9 upwards move, until air-dry mechanism 11 air-dry it is up to standard, workman control the first motor 82 be stopped.
Because air-drying mechanism 11 includes the first fix bar 111, endless glide 112, sliding block 113, mounting seat 114, connection
Bar 115, blower fan 116, the second motor 117, the second rotating shaft 118, gear 119, ring gear 1110 and fix bar 111, left and right support
Fix bar 111 is mounted in the middle of the inner side of frame 6, the end of fix bar 111 is connected with endless glide 112, endless glide 112 and slided
Formula is connected with sliding block 113, and the inner side of sliding block 113 is connected with mounting seat 114, and the inner side of mounting seat 114 is connected with connecting rod 115, installed
114 the inners of seat are connected with blower fan 116, and the top of mounting seat 114 is connected with the second motor 117, and the top of the second motor 117 is connected with the
Gear 119 is connected with two rotating shafts 118, the second rotating shaft 118, the top of endless glide 112 is connected with ring gear 1110, ring gear
1110 engage with gear 119, and after experience cleaning is finished, workman controls the second motor 117 to rotate, and the second motor 117 drives tooth
Wheel 119 is rotated, and gear 119 is rotated along along ring gear 1110, and gear 119 drives blower fan 116 to be rotated along ring gear 1110 so that wind
Machine 116 can air-dry all wafers, when wafer is air-dried it is up to standard when, stop the second motor 117 rotate.
Because rotating mechanism 12 includes the 3rd motor 121, the 3rd rotating shaft 122,3rd bearing seat 123, rotating vane
124th, web plate 125 and sealing ring 126, the top right side of bottom plate 1 are provided with the 3rd motor 121, and the 3rd motor 121 is located at two poles
Between 2, provided with 3rd bearing seat 123 in the middle of cleaning frame 3 bottom, 3rd bearing seat 123 is provided with the 3rd rotating shaft 122, the 3rd turn
The bottom of axle 122 is connected with the 3rd motor 121, and the top of the 3rd rotating shaft 122 is connected with rotating vane 124, cleaning frame 3 inner wall lower peace
Equipped with web plate 125, web plate 125 is located at the top of rotating vane 124, and the top of 3rd bearing seat 123 is provided with sealing ring 126, works as placement
When frame 9 is put into cleaning frame 3, cleaning fluid is poured into, the 3rd motor 121 of control is rotated, and the 3rd motor 121 drives the 3rd rotating shaft 122
Rotate, the 3rd rotating shaft 122 drives rotating vane 124 to rotate by 3rd bearing seat 123, the agitation cleaning fluid of rotating vane 124 makes
Obtain cleaning fluid to clean wafer, sealing ring 126 can prevent cleaning fluid from flowing into the 3rd motor 121, it is ensured that the 3rd motor 121
Safety.
Because the first motor 82 and the second motor 117 are servomotor, servomotor can provide stable rotating speed, favorably
In wafer lifting and air-dry.
Because the material of rotating vane 124 is stainless steel, stainless steel is corrosion-resistant, extension device service life.
Embodiment described above only expresses the preferred embodiment of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformations can also be made, improves and substitutes, these belong to this hair
Bright protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of wafer cleaning equipment for Electronic products manufacturing, it is characterised in that include bottom plate (1), pole (2), clear
Wash frame (3), drain pipe (4), valve (5), support frame (6), top plate (7), elevating mechanism (8), placing frame (9), jube (10), wind
Dry mechanism (11) and rotating mechanism (12), bottom plate (1) crown center is symmetrical to be provided with pole (2), and pole (2) top is connected with
Frame (3) is cleaned, rotating mechanism (12) is connected between cleaning frame (3) and bottom plate (1), cleaning frame (3) left wall bottom is connected with out
Liquid pipe (4), drain pipe (4) is provided with left and right ends at the top of valve (5), bottom plate (1) and is equipped with support frame (6), support frame (6) top
End, which is provided with the middle of top plate (7), top plate (7) bottom, is provided with elevating mechanism (8), and elevating mechanism (8) bottom is connected with placing frame
(9) air-dried mechanism (11) is installed in the middle of, being provided with placing frame (9) on the inside of jube (10), support frame (6).
2. a kind of wafer cleaning equipment for Electronic products manufacturing according to claim 1, it is characterised in that lift
Structure (8) includes guide plate (81), the first motor (82), first rotating shaft (83), first bearing seat (84), spool (85),
Two bearing bracket (86) and bracing wire (88), top plate (7) bottom left are provided with guide plate (81), and guide plate is provided with first on (81)
First bearing seat (84) is installed, top plate (7) bottom right is provided with second bearing seat in the middle of motor (82), top plate (7) bottom
(86), first bearing seat (84) and second bearing seat (86) are provided with first rotating shaft (83), first rotating shaft (83) left end and first
Motor (82) is connected, and is connected with spool (85) in first rotating shaft (83), and spool (85) is located at first bearing seat (84) and the
Between two bearing bracket (86), it is wound with spool (85) on the right side of bracing wire (88), guide plate (81) and is provided with pilot hole (87), bracing wire
(88) pilot hole (87) is passed through, and is connected with placing frame (9).
3. a kind of wafer cleaning equipment for Electronic products manufacturing according to claim 2, it is characterised in that air-dry machine
Structure (11) include the first fix bar (111), endless glide (112), sliding block (113), mounting seat (114), connecting rod (115),
Blower fan (116), the second motor (117), the second rotating shaft (118), gear (119), ring gear (1110) and fix bar (111), it is left
Fix bar (111) is mounted in the middle of on the inside of right support frame (6), fix bar (111) end is connected with endless glide (112), ring
Slidingtype is connected with the inside of sliding block (113), sliding block (113) and is connected with mounting seat (114), mounting seat (114) on shape slide rail (112)
Inner side is connected with connecting rod (115), and mounting seat (114) the inner, which is connected with the top of blower fan (116), mounting seat (114), is connected with the
The second rotating shaft (118) is connected with the top of two motors (117), the second motor (117), the second rotating shaft is connected with gear on (118)
(119) ring gear (1110), is connected with the top of endless glide (112), ring gear (1110) is engaged with gear (119).
4. a kind of wafer cleaning equipment for Electronic products manufacturing according to claim 3, it is characterised in that whirler
Structure (12) includes the 3rd motor (121), the 3rd rotating shaft (122), 3rd bearing seat (123), rotating vane (124), web plate
(125) and sealing ring (126), bottom plate (1) top right side is provided with the 3rd motor (121), and the 3rd motor (121) is located at two branch
Between bar (2), provided with 3rd bearing seat (123) in the middle of cleaning frame (3) bottom, 3rd bearing seat (123) is provided with the 3rd rotating shaft
(122), the 3rd rotating shaft (122) bottom is connected with the 3rd motor (121), and the 3rd rotating shaft (122) top is connected with rotating vane
(124), cleaning frame (3) inner wall lower is provided with web plate (125), and web plate (125) is located at rotating vane (124) top, the 3rd axle
Sealing ring (126) is provided with the top of bearing (123).
5. a kind of wafer cleaning equipment for Electronic products manufacturing according to claim 4, it is characterised in that the first electricity
Machine (82) and the second motor (117) are servomotor.
6. a kind of wafer cleaning equipment for Electronic products manufacturing according to claim 5, it is characterised in that pivoting leaf
Piece (124) is stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710698392.7A CN107331638A (en) | 2017-08-15 | 2017-08-15 | A kind of wafer cleaning equipment for Electronic products manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710698392.7A CN107331638A (en) | 2017-08-15 | 2017-08-15 | A kind of wafer cleaning equipment for Electronic products manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107331638A true CN107331638A (en) | 2017-11-07 |
Family
ID=60200981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710698392.7A Withdrawn CN107331638A (en) | 2017-08-15 | 2017-08-15 | A kind of wafer cleaning equipment for Electronic products manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107331638A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107981373A (en) * | 2017-11-08 | 2018-05-04 | 芜湖乐佳自动化机械有限公司 | A kind of horseshoe fruit cleaning device |
| CN108109945A (en) * | 2017-12-23 | 2018-06-01 | 南昌安润科技有限公司 | A kind of Electronic Components Manufacturing diode pickling equipment |
| CN110074697A (en) * | 2019-04-16 | 2019-08-02 | 江山市合硕文具有限公司 | A kind of vegetable baskets convenient for vegetable cleaning |
| CN112893296A (en) * | 2021-01-19 | 2021-06-04 | 李春珍 | Gynaecology and obstetrics uses surgical instruments cleaning equipment |
-
2017
- 2017-08-15 CN CN201710698392.7A patent/CN107331638A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107981373A (en) * | 2017-11-08 | 2018-05-04 | 芜湖乐佳自动化机械有限公司 | A kind of horseshoe fruit cleaning device |
| CN108109945A (en) * | 2017-12-23 | 2018-06-01 | 南昌安润科技有限公司 | A kind of Electronic Components Manufacturing diode pickling equipment |
| CN108109945B (en) * | 2017-12-23 | 2020-07-31 | 三门县宿果商贸有限公司 | Diode pickling device for electronic component production |
| CN110074697A (en) * | 2019-04-16 | 2019-08-02 | 江山市合硕文具有限公司 | A kind of vegetable baskets convenient for vegetable cleaning |
| CN112893296A (en) * | 2021-01-19 | 2021-06-04 | 李春珍 | Gynaecology and obstetrics uses surgical instruments cleaning equipment |
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Application publication date: 20171107 |
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