CN107272352B - 目标处理单元 - Google Patents

目标处理单元 Download PDF

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Publication number
CN107272352B
CN107272352B CN201710637657.2A CN201710637657A CN107272352B CN 107272352 B CN107272352 B CN 107272352B CN 201710637657 A CN201710637657 A CN 201710637657A CN 107272352 B CN107272352 B CN 107272352B
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China
Prior art keywords
vacuum chamber
housing
processing unit
lines
target processing
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CN201710637657.2A
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English (en)
Chinese (zh)
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CN107272352A (zh
Inventor
J.J.科宁
D.J.范登伯根
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ASML Netherlands BV
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ASML Netherlands BV
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/023Means for mechanically adjusting components not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • H01J37/3007Electron or ion-optical systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975Assembly, maintenance, transport or storage of apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10Lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/20Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
CN201710637657.2A 2013-09-07 2014-09-08 目标处理单元 Active CN107272352B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361875016P 2013-09-07 2013-09-07
US61/875,016 2013-09-07
CN201480061165.8A CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480061165.8A Division CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元

Publications (2)

Publication Number Publication Date
CN107272352A CN107272352A (zh) 2017-10-20
CN107272352B true CN107272352B (zh) 2021-02-02

Family

ID=51492355

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201480061165.8A Active CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元
CN201710637657.2A Active CN107272352B (zh) 2013-09-07 2014-09-08 目标处理单元

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201480061165.8A Active CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元

Country Status (6)

Country Link
US (2) US9263234B2 (enExample)
JP (2) JP6224252B2 (enExample)
KR (2) KR101784752B1 (enExample)
CN (2) CN105745577B (enExample)
NL (2) NL2013437B1 (enExample)
WO (1) WO2015032955A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2014114517A (ru) * 2011-09-12 2015-10-20 МЭППЕР ЛИТОГРАФИ АйПи Б.В. Устройство обработки подложки
JP5853122B2 (ja) * 2013-05-10 2016-02-09 株式会社日立ハイテクノロジーズ 荷電粒子線装置
DE102016217285A1 (de) * 2016-09-12 2018-03-15 Carl Zeiss Smt Gmbh Vorrichtung zur übertragung von elektrischen signalen sowie lithographieanlage
US11106145B2 (en) * 2016-10-17 2021-08-31 Nikon Corporation Exposure system and lithography system
US10905025B1 (en) * 2019-06-12 2021-01-26 Facebook, Inc. Interconnection module and server rack
CN111239916B (zh) * 2020-02-12 2021-05-18 烽火通信科技股份有限公司 光纤背板上光纤连接器用的清洁工具及清洁方法
KR102467191B1 (ko) * 2020-03-11 2022-11-16 주식회사 포스코 광 점퍼 코드 안전 장치 및 그를 이용한 전력 계통 시스템
CN113495436B (zh) * 2021-07-13 2023-12-29 江门市和盈新材料科技有限公司 一种光电子元件智能制造的光刻机
EP4290550A1 (en) * 2022-06-10 2023-12-13 ASML Netherlands B.V. Electron-optical device
WO2025058838A1 (en) * 2023-09-12 2025-03-20 Lam Research Corporation Prevention of atmosphere exposure in gas delivery system

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250808A (en) * 1987-05-21 1993-10-05 Electroscan Corporation Integrated electron optical/differential pumping/imaging signal system for an environmental scanning electron microscope
US4831270A (en) * 1987-05-21 1989-05-16 Ion Implant Services Ion implantation apparatus
JP2000512397A (ja) 1996-06-10 2000-09-19 ホログラフィック リトグラフィー システムズ,インコーポレイティド 生産環境のためのホログラフィのパターン化の方法及び工具
US6714278B2 (en) * 1996-11-25 2004-03-30 Nikon Corporation Exposure apparatus
TWI220998B (en) * 2001-02-13 2004-09-11 Nikon Corp Exposure method, exposure apparatus and manufacture method of the same
US6756706B2 (en) 2002-01-18 2004-06-29 Nikon Corporation Method and apparatus for cooling power supply wires used to drive stages in electron beam lithography machines
JP2004055933A (ja) 2002-07-22 2004-02-19 Advantest Corp 電子ビーム露光装置、及び電子ビーム計測モジュール
JP2005106166A (ja) * 2003-09-30 2005-04-21 Nikon Corp アクティブ除振装置及び露光装置
JP2005209702A (ja) * 2004-01-20 2005-08-04 Fujitsu Access Ltd 電子機器用キャビネット
JP4405867B2 (ja) * 2004-06-29 2010-01-27 キヤノン株式会社 電子線露光装置、および、デバイス製造方法
JP2006079911A (ja) * 2004-09-09 2006-03-23 Hitachi High-Technologies Corp 電子ビーム電流計測方法、電子ビーム描画装置および電子ビーム検出器
EP2250660A1 (en) 2008-02-26 2010-11-17 Mapper Lithography IP B.V. Projection lens arrangement
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
NL1036912C2 (en) * 2009-04-29 2010-11-01 Mapper Lithography Ip Bv Charged particle optical system comprising an electrostatic deflector.
NL2003619C2 (en) * 2009-10-09 2011-04-12 Mapper Lithography Ip Bv Projection lens assembly.
US8362441B2 (en) * 2009-10-09 2013-01-29 Mapper Lithography Ip B.V. Enhanced integrity projection lens assembly
US8638109B2 (en) * 2009-12-31 2014-01-28 Mapper Lithography Ip B.V. Capacitive sensing system with differential pairs
KR101496878B1 (ko) 2010-02-23 2015-03-02 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US20120069317A1 (en) * 2010-09-20 2012-03-22 Jerry Peijster Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
US8895943B2 (en) * 2010-12-14 2014-11-25 Mapper Lithography Ip B.V. Lithography system and method of processing substrates in such a lithography system
JP6038882B2 (ja) * 2011-04-20 2016-12-07 マッパー・リソグラフィー・アイピー・ビー.ブイ. 光ファイバの構成体及びこのような構成体を形成する方法
NL2007392C2 (en) 2011-09-12 2013-03-13 Mapper Lithography Ip Bv Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly.
WO2013037802A1 (en) 2011-09-12 2013-03-21 Mapper Lithography Ip B.V. Vacuum chamber with base plate
RU2014114517A (ru) * 2011-09-12 2015-10-20 МЭППЕР ЛИТОГРАФИ АйПи Б.В. Устройство обработки подложки
JP5973061B2 (ja) * 2012-05-14 2016-08-23 マッパー・リソグラフィー・アイピー・ビー.ブイ. 荷電粒子マルチ小ビームリソグラフィシステム及び冷却装置製造方法
JP5936484B2 (ja) * 2012-08-20 2016-06-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び試料観察方法

Also Published As

Publication number Publication date
KR102124913B1 (ko) 2020-06-22
JP6580634B2 (ja) 2019-09-25
NL2013437B1 (en) 2016-05-18
CN105745577A (zh) 2016-07-06
WO2015032955A1 (en) 2015-03-12
US20150090895A1 (en) 2015-04-02
CN107272352A (zh) 2017-10-20
US9263234B2 (en) 2016-02-16
NL2013437A (en) 2015-03-10
JP2017224828A (ja) 2017-12-21
KR20160055852A (ko) 2016-05-18
KR20170087970A (ko) 2017-07-31
CN105745577B (zh) 2018-01-23
KR101784752B1 (ko) 2017-11-06
JP2016530728A (ja) 2016-09-29
NL2013438A (en) 2015-03-10
NL2013438B1 (en) 2016-05-18
US9941093B2 (en) 2018-04-10
US20160126055A1 (en) 2016-05-05
JP6224252B2 (ja) 2017-11-01

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Applicant before: Mapper Lithography IP B. V.

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