CN107263745A - Topping machanism - Google Patents
Topping machanism Download PDFInfo
- Publication number
- CN107263745A CN107263745A CN201710195993.6A CN201710195993A CN107263745A CN 107263745 A CN107263745 A CN 107263745A CN 201710195993 A CN201710195993 A CN 201710195993A CN 107263745 A CN107263745 A CN 107263745A
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- China
- Prior art keywords
- reference position
- light
- cutting member
- cutting
- light accepting
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
Topping machanism is provided, implements to cut the movement of the cutting member in direction of feed at high speed when setting.The control member of topping machanism is included：Variable quantity register, it is registered with the relation between the change of the light income of the amount of movement for the cutting tool for invading between illuminating part and light accepting part and being moved in incision direction of feed and the light accepting part changed corresponding to amount of movement；Stop signal sending part, it sends when the light income of light accepting part turns into threshold value makes to invade the stop signal that the incision feeding component of the cutting tool between illuminating part and light accepting part stops；Reference position calculating part, it extrapolates the distance that cutting member is out of the line according to the difference and variable quantity information of light income when cutting member is out of the line and stopped from the transmission of stop signal and threshold value, and the position of the cutting member according to distance to having stopped being corrected and calculated the reference position of the cutting member identified by position identification part；With reference position register, it is registered to reference position.
Description
Technical field
The present invention relates to the topping machanism cut machined objects such as chip, package substrate and ceramic substrates.
Background technology
The cut-out of semiconductor wafer etc. is typically implemented by being referred to as the topping machanism of dicing device.Dicing device passes through
The cutting tool of rotation is cut machined objects such as semiconductor wafers.The cutting tool is worn and torn because of use so as to its diameter
Reduce.
In topping machanism, in order to which the retaining surface for the chuck table that will be kept to machined object is used as reference position
(being highly 0) implements processing, and the position for implementing to be in contact to the lower end of cutting tool with retaining surface is calculated (set up：
Set) process.
The process is appropriately carried out with the consumption (abrasion) of cutting tool, but due to when using chuck table come
When implementing to set, use using cutting tool and conducting has been detected somewhat cutting the framework upper surface of chuck table
Structure, so every time set when framework upper surface can be caused damage, can also cutting tool front end produce block or grind
It is flat.
Therefore, it is proposed to be different from the setting carried out using chuck table, carried out using Tool monitoring mechanism
The structure that so-called noncontact is set (for example, referring to No. 4590058 publications of Japanese Patent Publication No.).In noncontact setting, set
Tool monitoring mechanism with illuminating part and light accepting part, utilizes incision direction of feed of the Tool monitoring mechanism to the blade tip of cutter
Position detected, the retaining surface position and the short transverse of the test position of Tool monitoring mechanism of chuck table (are cut
Enter direction) on difference be corrected and the reference position of cutting tool detected.
Patent document 1：No. 4590058 publications of Japanese Patent Publication No.
In the Tool monitoring mechanism, the height of the cutting member (cutting unit) during by the light income of light accepting part as threshold value
Degree is registered as reference position, but in order to make the mobile stopping in the incision direction of feed of cutting member according to threshold value,
Need to make cutting member with very slow speed decline.Accordingly, there exist following problem：The setting action suitably carried out is elongated, cuts
The disposal ability reduction of turning device.
The content of the invention
The present invention be in view of the point and complete, can be real at high speed when setting its object is to there is provided topping machanism
Apply the movement of the cutting member of incision direction of feed.
According to the present invention there is provided a kind of topping machanism, the topping machanism has following inscape：Chuck table, its
Machined object is kept；Cutting member, it is provided with what the machined object kept to the chuck table was cut
Cutting tool；Incision feeding component, it makes the cutting member be moved relative to the chuck table in incision direction of feed；Position
Identification part is put, position that the cutting member that component is moved is fed by the incision is identified for it；And cutter
Testing agency, it has illuminating part and light accepting part, and the Tool monitoring mechanism is in the incision direction of feed of the cutting tool
Front position is detected that the topping machanism also has control member, and the control member is controlled to each inscape
System, the topping machanism is characterised by that the control member has：Variable quantity register, is registered with the variable quantity register
The amount of movement for the cutting tool for invading between the illuminating part and the light accepting part and being moved in the incision direction of feed with it is right
Should be in the relation between the change of the light income for the light accepting part that the amount of movement changes；Stop signal sending part, when the light
When the light income in portion turns into threshold value, the stop signal sending part sends stop signal, and the stop signal makes to invade the illuminating part
The incision feeding component of the cutting tool between the light accepting part stops；Reference position calculating part, it is according to from the stopping
The light income and the difference of the threshold value and the variable quantity register when cutting member is out of the line and stopped from during the transmission of signal
The variable quantity information registered, extrapolates the distance that the cutting member is out of the line, and the cutting according to the distance to having stopped
The position of component is corrected and calculated the reference position of the cutting member identified by the position identification part；And benchmark
Location register portion, it is registered to the reference position calculated by the reference position calculating part, the light of the light accepting part
This that registered in the reference position register because invading the cutting tool between the illuminating part and the light accepting part is measured to cut
The reference position for cutting component is considered as the threshold value.
According to the present invention topping machanism, even if very at high speed implement set and cutting member exceed threshold value position and
It is out of the line, but because the relation between the light income to light accepting part and the distance being out of the line is registered in advance, so can be to being out of the line
Distance be corrected and calculating benchmark position and registered.Therefore, serving can implement to set and can carry at high speed
The effect of the disposal ability of high topping machanism.
Brief description of the drawings
Fig. 1 is the stereogram of topping machanism.
Fig. 2 is the face side stereogram for the semiconductor wafer that ring-shaped frame is supported on by dicing tape.
Fig. 3 is the side elevation in partial section of Tool monitoring mechanism and chuck table part.
Fig. 4 is the stereogram of the major part of Tool monitoring mechanism.
Fig. 5 is the block diagram of the Tool monitoring mechanism of embodiment of the present invention.
Fig. 6 is the output voltage for showing Tool monitoring mechanism corresponding with the position of the incision direction of feed of cutting tool
The chart of change.
Fig. 7 be the position identification part for showing to be registered in variable quantity register identification position and one of relation of voltage
Chart.
Label declaration
46：Cutting member (cutting unit)；50：Cutting tool；56：Tool monitoring component；58：Tool monitoring mechanism；62：
Cutter intrusion portion；64：Illuminating part；66：Light accepting part；84：Photoelectric conversion part；86：Reference voltage configuration part；88：Voltage comparing section；
90：Stop signal sending part；91：End position test section；94：Variable quantity register；96：Reference position calculating part；98：Benchmark
Location register portion.
Embodiment
Hereinafter, the topping machanism 2 of embodiment of the present invention is described in detail referring to the drawings.Fig. 1 shows cutting
The summary construction diagram of device 2.Topping machanism 2 includes a pair of guide rails 6 extended in the X-axis direction being mounted on static base station 4.
Label 8 is Workbench base (X-axis movable block), and Workbench base 8 passes through by ball-screw 10 and pulse motor
12 constitute X-axis feed mechanisms 14 and processing direction of feed be to be moved in X-direction.By cylinder on Workbench base 8
Shape supporting member 22 is equipped with chuck table 20.Being accommodated with cylindric supporting member 22 makes what chuck table 20 rotated
Motor.
Chuck table 20 is with the attracting holding portion 24 formed by porous ceramics etc. and around attracting holding portion 24
The framework 23 formed by metals such as SUS.The retaining surface in attracting holding portion 24 is formed as same plane with the upper surface of framework 23.
Be equipped with multiple (being in the present embodiment 4) fixtures 26 on chuck table 20, the fixture 26 to shown in Fig. 2 to ring-type
Framework F is clamped.Label 25 is bucker.
As shown in Fig. 2 having vertically formed the 1st on the front of the semiconductor wafer W of the processing object as topping machanism 2
Spacing track S1 and the 2nd spacing track S2, device is respectively formed with the region marked off by the 1st spacing track S1 and the 2nd spacing track S2
Part D.
Wafer W is pasted onto on the dicing tape T as adhesive tape, and dicing tape T peripheral part is pasted onto on ring-shaped frame F.By
This, wafer W turns into the state that ring-shaped frame F is supported on by dicing tape T, by the fixture 26 shown in Fig. 1 to ring-shaped frame F
Clamping is carried out to attract to be fixed on chuck table 20.
X-axis feed mechanism 14 is included：Linear scale 16, it is disposed on static base station 4 along guide rail 6；And read head
18, it is disposed on the lower surface of Workbench base 8, and the X-coordinate value to linear scale 16 is read out.Read head 18 and cutting
Controller (control member) connection of device 2.
The a pair of guide rails 28 extended in the Y-axis direction is further fixed on static base station 4.Y-axis movable block 30 is by by rolling
Y-axis feed mechanism (index feed mechanism) 36 that ballscrew 32 and pulse motor 34 are constituted and move in the Y-axis direction.
Although being not particularly illustrated, Y-axis feed mechanism 36 is included：Linear scale, it is disposed in static base station 4 along guide rail 28
On；And read head, it is disposed on the lower surface of Y-axis movable block 30, and the Y-coordinate value to the linear scale is read out, and is read
Head and the controller of topping machanism 2 is taken to be connected.
A pair of (the illustrate only one) guide rails 38 extended in the Z-axis direction are formed with Y-axis movable block 30.Z axis is moved
Motion block 40 by being moved in the Z-axis direction by the Z axis feed mechanism 44 that ball-screw (not shown) and pulse motor 42 are constituted
It is dynamic.Pulse motor 42 can also be replaced and servomotor is used.
Although especially not shown, Z axis feed mechanism 44 is included：Linear scale, it is disposed in Y-axis along guide rail 38 and moved
On block 30；And read head, it is disposed on Z axis movable block 40, the Z coordinate value of the linear scale is read out, read head
It is connected with the controller of topping machanism 2.
Label 46 is cutting unit (cutting member), and the main shaft shell 48 of cutting unit 46 is inserted into Z axis movable block 40
And supported by Z axis movable block 40.Main shaft 49 (reference picture 5) is accommodated with main shaft shell 48, the main shaft 49 is by air bearing branch
Hold to rotate.Main shaft 49 is driven in rotation, bite by the motor (not shown) being accommodated in main shaft shell 48
Tool 50 is arranged on the leading section of main shaft 49 in the way of it can assemble and disassemble.
Aligned units (alignment members) 52 are equipped with main shaft shell 48.Aligned units 52 have to being maintained at chuck work
Make the shooting unit (shooting component) 54 that the wafer W on platform 20 is shot.Cutting tool 50 and shooting unit 54 are in X-direction
On be arranged.
As shown in Figure 3 and Figure 4, the Tool monitoring component detected to the reference position of the incision direction of cutting tool 50
56 include：Vertical support members 78, it is erect from Workbench base 8 and set；Horizontal support member 72, it is fixed on vertical support
On part 78 and extend into from vertical support members 78 to the laterally projecting of chuck table 20；And Tool monitoring mechanism 58,
It is mounted in the leading section of horizontal support member 72.
As optimally being shown Fig. 4, horizontal support member 72 is fixed on vertical support portion by multiple screws 76
On part 78.As shown in figure 3, bucker 25 is fixed in vertical support members 78 by multiple screws 77.In chuck table
Sealing gasket 27 is equipped between 20 cylindric supporting member 22 and bucker 25.Label 80 is wrinkle, and figure is eliminated in Fig. 1
Show.
Tool monitoring mechanism 58 includes installing component 60, and the installing component 60 has horizontal part 60a and vertical component effect 60b.Peace
The front end for filling the vertical component effect 60b of part 60 is formed as dividing the U-shape in cutter intrusion portion 62, clip the cutter intrusion portion 62 and
It is equipped with illuminating part 64 and receives the light accepting part 66 for the light for carrying out self-luminescent part 64.As shown in figure 5, illuminating part 64 is via optical fiber 81
It is connected with light source 82, light accepting part 66 is connected via optical fiber 83 with photoelectric conversion part 84.
It is equipped on the horizontal part 60a of installing component 60：Rinse water provides nozzle 68a, 68b, and they are to illuminating part 64
The rinse water carried out after constant temperature adjustment is provided with the end face of light accepting part 66；And air provides nozzle 70a, 70b, they are to hair
The end face of light portion 64 and light accepting part 66 provides air.
Then, to make cutting tool 50 cut the chuck table 20 being made up of metal framework 23 and obtain conducting so as to
Detect the present invention of the origin position testing agency of the origin position of cutting tool 50 and the reference position of detection cutting tool 50
The effect of Tool monitoring mechanism 58 illustrate.
When carrying new chuck table 20, or chuck table 20 is decomposed and when assembling again after being cleaned
When, first, cutting tool 50 is cut the framework 23 of chuck table 20 using origin position testing agency and obtain
Conducting, so as to be detected to the origin position of the cutting tool 50 in incision direction of feed (Z-direction), and by the origin
Put and be stored in the memory of the controller of topping machanism 2.
Then, the benchmark of the incision direction of feed of the blade tip to cutting tool 50 carried out by Tool monitoring mechanism 56 is implemented
The reference position detection (noncontact setting) that position is detected.5 pairs of noncontacts of reference picture, which are set, to be illustrated.
When the noncontact of present embodiment is set, the pulse motor 42 of Z-direction feed mechanism 44 is driven
And cutting tool 50 is moved and invade the cutter intrusion portion 62 of Tool monitoring mechanism 58 at high speed in incision direction of feed
In.
In cutter intrusion portion 62, convey the light from light source 82 by optical fiber 81 and projected from illuminating part 64 in pencil.
Light accepting part 66 receives the light that illuminating part 64 is sent, and sends the light of the reception to control member (control via optical fiber 83
Device) 79 photoelectric conversion part 84.
Photoelectric conversion part 84 is by the corresponding voltage output of the light quantity of the light with being transmitted from light accepting part 66 to voltage comparing section 88.
On the other hand, input has the reference voltage (being, for example, 3V) set by reference voltage configuration part 86 in voltage comparing section 88.
Benchmark electricity set by output and reference voltage configuration part 86 of 88 pairs of the voltage comparing section from photoelectric conversion part 84
Pressure is compared, when the output from photoelectric conversion part 84 has reached reference voltage, by the signal output of the meaning to stopping
Signal transmission unit 90 and end position test section 91.
When being described in more detail, in cutting tool 50 completely not to being hidden between illuminating part 64 and light accepting part 66
In the case of gear, the light quantity that light accepting part 66 is received is maximum, and the output from photoelectric conversion part 84 corresponding with the light quantity is for example such as
5V is set to shown in Fig. 6.
As cutting tool 50 invades cutter intrusion portion 62 at high speed, projected due to 50 pairs of cutting tool from illuminating part 64
The amount increase that light beam is blocked, so the light quantity that light accepting part 66 is received is reduced, the output voltage from photoelectric conversion part 84 is such as
Reduced as label 92 is shown in figure 6.
Also, it is set to when cutting tool 50 reaches the position for being connected illuminating part 64 with the center of light accepting part 66,
Output voltage from photoelectric conversion part 84 is for example as 3V.Therefore, when the output voltage of photoelectric conversion part 84 is 3V, voltage
Comparing section 88 has reached the output voltage of photoelectric conversion part 84 signal output of the meaning of reference voltage is sent to stop signal
Portion 90 and end position test section 91.
The signal that stop signal sending part 90 will detect the meaning of reference position is sent to pulse motor 42, makes arteries and veins
The driving for rushing motor 42 stops immediately.However, in the present embodiment, because cutting tool 50 is moved at high speed, so cutting
Cutting knife tool 50 will not stop in reference position but defined distance of being out of the line stops again.
The light income that light accepting part 66 when cutting tool 50 is stopped by photoelectric conversion part 84 is received is converted into voltage
And input to end position test section 91.Light accepting part 66 when end position test section 91 will be out of the line and stop with cutting member
The corresponding voltage of light income and the difference of threshold value (3V) input to reference position calculating part 96.
The distance that cutting member is out of the line and stopped relative to reference position is with utilizing photoelectric conversion part 84 to the institute of light accepting part 66
The relation for the voltage that the light income of reception is converted is in the defined scope of incision direction of feed in the line shown in Fig. 7
The relation of property.
In the graph in figure 7, the maximum of voltage represents reference position, and with being out of the line, voltage linear is reduced, control member
Identification position that position identification part in 79 is recognized, distance of being out of the line increase.
Voltage and the variable quantity of identification position are pre-registered in variable quantity register 94.Because the variable quantity is according to every
Individual topping machanism and it is different, so in advance carry out noncontact setting test and be registered in variable quantity register 94.
The difference of light income and threshold value when cutting member 46 is out of the line and is stopped inputs to base from end position test section 91
Level puts calculating part 96, and inputs to reference position calculating part from variable quantity register 94 by the variable quantity information registered
96, the distance that cutting member 46 is out of the line is extrapolated in reference position calculating part 96, using the distance extrapolated to having stopped
The position of cutting member 46 be corrected and calculate reference position.
The reference position that reference position calculating part 96 is calculated is the light income for being considered as light accepting part 66 because invading illuminating part
Cutting tool 50 between 64 and light accepting part 66 and become threshold value (3V) reference position, the reference position calculated is registered
In reference position register 98.
The calculated example to the specific reference position in reference position calculating part 96 is illustrated below.For example, when will be by
When voltage when voltage when light quantity turns into threshold value is set to 3000mV, cutting member 46 is out of the line and stopped is set to 2900mV, end
What portion's position detection part 91 was detected is 100mV with the difference of threshold value.
It was found from the chart of the variable quantity shown in Fig. 7, when detecting 1mV, 0.1 μm of variable quantity, corrected value is 10 μm.
Therefore ,+10 μm of the position be out of the line and stopped is the reference position that reference position calculating part 96 is calculated.
The reference position being registered in reference position register 98 is benchmark position when implementing machining to machined object
Put, implement the cutting to machined objects such as semiconductor wafers according to the reference position.
In the topping machanism of above-mentioned present embodiment, noncontact setting can be implemented very much at high speed.Although at a high speed
Ground is implemented to set thus cutting member 46 exceedes the position of threshold value and is out of the line, but due to the light income shown in Fig. 7 and the pass of distance
System is pre-registered in variable quantity register 94, so school can be carried out using 96 pairs of positions being out of the line of reference position calculating part
Reference position is just calculated, and the reference position calculated is registered in reference position register 98.Therefore, it is possible at a high speed
Implement to set in ground, it is possible to increase the disposal ability of topping machanism.
Claims (2)
1. a kind of topping machanism, the topping machanism has following inscape：
Chuck table, it keeps to machined object；
Cutting member, it is provided with the cutting tool that the machined object kept to the chuck table is cut；
Incision feeding component, it makes the cutting member be moved relative to the chuck table in incision direction of feed；
Position identification part, position that the cutting member that component is moved is fed by the incision is identified for it；With
And
Tool monitoring mechanism, it has illuminating part and light accepting part, and the incision of the Tool monitoring mechanism to the cutting tool is fed
Front position on direction detected,
The topping machanism also has control member, and the control member is controlled to each inscape,
The topping machanism is characterised by,
The control member has：
Variable quantity register, is registered with the variable quantity register and invades between the illuminating part and the light accepting part and cut at this
Enter the amount of movement of the cutting tool moved in direction of feed and the light income of the light accepting part changed corresponding to the amount of movement
Change between relation；
Stop signal sending part, when the light income of the light accepting part turns into threshold value, the stop signal sending part sends stop signal,
The incision feeding component that the stop signal makes to invade the cutting tool between the illuminating part and the light accepting part stops；
Reference position calculating part, it is according to the light when cutting member is out of the line and stopped from the transmission of the stop signal
The difference and the variable quantity information registered of the variable quantity register of amount and the threshold value, extrapolate that the cutting member is out of the line away from
From, and the position of the cutting member according to the distance to having stopped being corrected and calculates and identified by the position identification part
The cutting member reference position；And
Reference position register, it is registered to the reference position calculated by the reference position calculating part,
The light income of the light accepting part is because invading the cutting tool between the illuminating part and the light accepting part in benchmark position
The reference position for putting the cutting member that register is registered is considered as the threshold value.
2. topping machanism according to claim 1, it is characterised in that
The light income is converted into voltage and is registered in the variable quantity register by the control member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-073879 | 2016-04-01 | ||
| JP2016073879A JP6746198B2 (en) | 2016-04-01 | 2016-04-01 | Cutting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107263745A true CN107263745A (en) | 2017-10-20 |
| CN107263745B CN107263745B (en) | 2020-12-22 |
Family
ID=60045265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710195993.6A Active CN107263745B (en) | 2016-04-01 | 2017-03-29 | Cutting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6746198B2 (en) |
| KR (1) | KR102241356B1 (en) |
| CN (1) | CN107263745B (en) |
| TW (1) | TWI719146B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111730475A (en) * | 2019-03-25 | 2020-10-02 | 株式会社迪思科 | Processing device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6990588B2 (en) * | 2018-01-05 | 2022-01-12 | 株式会社ディスコ | Cutting equipment |
| JP7126849B2 (en) * | 2018-04-13 | 2022-08-29 | 株式会社ディスコ | processing equipment |
| JP7354069B2 (en) * | 2020-08-26 | 2023-10-02 | Ｔｏｗａ株式会社 | Cutting device and method for manufacturing cut products |
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Also Published As
| Publication number | Publication date |
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| KR20170113404A (en) | 2017-10-12 |
| JP2017185552A (en) | 2017-10-12 |
| JP6746198B2 (en) | 2020-08-26 |
| KR102241356B1 (en) | 2021-04-15 |
| TWI719146B (en) | 2021-02-21 |
| TW201739590A (en) | 2017-11-16 |
| CN107263745B (en) | 2020-12-22 |
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