CN107240633A - A kind of waterproof and heat dissipation LED package substrate - Google Patents
A kind of waterproof and heat dissipation LED package substrate Download PDFInfo
- Publication number
- CN107240633A CN107240633A CN201610180983.0A CN201610180983A CN107240633A CN 107240633 A CN107240633 A CN 107240633A CN 201610180983 A CN201610180983 A CN 201610180983A CN 107240633 A CN107240633 A CN 107240633A
- Authority
- CN
- China
- Prior art keywords
- substrate
- fixedly mounted
- catch basin
- heat dissipation
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 12
- 230000008595 infiltration Effects 0.000 claims abstract description 5
- 238000001764 infiltration Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of waterproof and heat dissipation LED package substrate, including substrate and LED chip, lens in one are fixedly mounted in the substrate lower end, the substrate, which is located on the outside of interior lens, is fixedly mounted an outer lens, a cavity is formed between the interior lens and outer lens, a catch basin is provided with the right side of the substrate upper surface, the catch basin is inclined to set, the catch basin upper end is communicated with the external world, a filter is fixedly mounted in the catch basin upper end, the catch basin lower end is provided with an apopore, an infiltration block is fixedly mounted in the apopore, the apopore lower end on the right side of cavity with communicating.The present invention is simple in construction, using reasonable, and financial cost is low, applied widely, and the heat that LED chip is sent is absorbed by way of current, the service life of LED chip is greatly added.
Description
Technical field
The present invention relates to a kind of waterproof and heat dissipation LED package substrate.
Background technology
Nowadays, continuing to develop with science and technology, LED lamp has used the every aspect in city, with using
The increase of amount, the requirement encapsulated to LED is also higher, with the high output of LED chips, the light and heat of the radiation of LED chips
Increase constantly increase, still, be installed on the external world LED lamp in order that water can not enter LED encapsulation in, typically all will
LED lamp is completely sealed, and is not added with its LED package cooling effect, so that the service life of LED chip shortens, and
If the lens that people's imprudence is encountered in LED may cause finger to scald.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of simple in construction, and it is reasonable to use, in extraneous LED lamp
The waterproof and heat dissipation LED package substrate of energy quick heat radiating and energy waterproof.
The present invention is achieved through the following technical solutions：A kind of waterproof and heat dissipation LED package substrate, including substrate
And LED chip, the substrate lower end is fixedly mounted lens in one, and the substrate, which is located on the outside of interior lens, to be fixedly mounted one and pass through inside
Mirror, forms on the right side of a cavity, the substrate upper surface between the interior lens and outer lens and is provided with a catch basin, the catch basin is in
It is obliquely installed, the catch basin upper end is communicated with the external world, a filter, the catch basin lower end is fixedly mounted in the catch basin upper end
Provided with an apopore, an infiltration block is fixedly mounted in the apopore, the apopore lower end on the right side of cavity with communicating.
As preferred technical scheme, set, be fixedly mounted on the substrate left side for incline structure on the left of the substrate
One baffle plate, the baffle plate is L-shaped to be set, provided with a mounting groove in the middle of the substrate left side, and it is micro- to be fixedly mounted one in the mounting groove
It is fixedly mounted a fan on type motor, the motor, the installation groove bottom is provided with a suction hole, the suction hole lower end and cavity
Left side is communicated, and the baffle plate lower end is provided with a water outlet plate, and the water outlet plate one end is connected with the lower surface of baffle plate, and the water outlet plate is another
End on the left of substrate with being connected, and the water outlet plate is provided with more than one delivery port.
As preferred technical scheme, it is provided with a deep-slotted chip breaker, the deep-slotted chip breaker and is fixedly mounted in the middle of the substrate lower surface
One circuit layer, the circuit layer is connected with LED chip.
As preferred technical scheme, the interior lens are made with outer lens by epoxide resin material.
As preferred technical scheme, the substrate is made up of metal material.
The beneficial effects of the invention are as follows：The present invention is simple in construction, using reasonable, and financial cost is low, applied widely, passes through
The mode of current absorbs the heat that LED chip is sent, and greatly adds the service life of LED chip.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is overall structure diagram of the invention.
Embodiment
All features disclosed in this specification, or disclosed all methods or during the step of, except mutually exclusive
Feature and/or step beyond, can combine in any way.
This specification（Including any accessory claim, summary and accompanying drawing）Disclosed in any feature, except non-specifically is chatted
State, can alternative features equivalent by other or with similar purpose replaced.I.e., unless specifically stated otherwise, each feature
It is an example in a series of equivalent or similar characteristics.
As shown in figure 1, a kind of waterproof and heat dissipation LED package substrate of the present invention, including substrate 6 and LED chip 16, institute
State the lower end of substrate 6 and lens 12 in one are fixedly mounted, the substrate 6 is located at the interior outside of lens 12 and an outer lens 11, institute are fixedly mounted
State and a cavity 13 is formed between interior lens 12 and outer lens 11, a catch basin 17, the retaining are provided with the right side of the upper surface of substrate 6
Groove 17 is inclined to set, and the upper end of catch basin 17 is communicated with the external world, and a filter 9, institute is fixedly mounted in the upper end of catch basin 17
The lower end of catch basin 17 is stated provided with an apopore 10, an infiltration block 15 is fixedly mounted in the apopore 10, the lower end of apopore 10 with
The right side of cavity 13 is communicated.
In the present embodiment, the left side of substrate 6 is set for incline structure, and a baffle plate is fixedly mounted on the left side of substrate 6
1, the baffle plate 1 is L-shaped to be set, provided with a mounting groove 5 in the middle of the left side of substrate 6, and it is miniature to be fixedly mounted one in the mounting groove 5
Motor（It is unmarked）, a fan 3 is fixedly mounted on the motor, the bottom surface of mounting groove 5 is provided with a suction hole 4, the suction hole 4
End is communicated with the left side of cavity 13, and the lower end of baffle plate 1 is provided with a water outlet plate 2, the one end of water outlet plate 2 and the lower surface of baffle plate 1
It is connected, the other end of water outlet plate 2 is connected with the left side of substrate 6, and the water outlet plate 2 is provided with more than one delivery port 14.
It is provided with the present embodiment, in the middle of the lower surface of substrate 6 in a deep-slotted chip breaker 7, the deep-slotted chip breaker 7 and a circuit is fixedly mounted
Layer 8, the circuit layer 8 is connected with LED chip 16；The interior lens 12 are made with outer lens 11 by epoxide resin material；Institute
Substrate 6 is stated to be made up of metal material.
Operation principle：On rainy day, rainwater can be infiltrated into catch basin by filter, then going out by catch basin lower end
Water hole enters in cavity between interior lens and outer lens, wherein, due to being mounted with infiltration block in apopore so that water can only one
In the entrance cavity of drop, after the temperature on interior lens and outer lens rises, the water in cavity will be evaporated, and be made in it thoroughly
Mirror is substantially reduced with the temperature on outer lens, then, by electric motor starting fan, takes vapor out of cavity, wherein, substrate is left
The baffle plate of side be in order to prevent the external world water be directly entered in cavity.
The beneficial effects of the invention are as follows：The present invention is simple in construction, using reasonable, and financial cost is low, applied widely, passes through
The mode of current absorbs the heat that LED chip is sent, and greatly adds the service life of LED chip.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
The change or replacement expected without creative work, should all be included within the scope of the present invention.Therefore, it is of the invention
Protection domain should be determined by the scope of protection defined in the claims.
Claims (5)
1. a kind of waterproof and heat dissipation LED package substrate, it is characterised in that：Including substrate and LED chip, the substrate lower end is consolidated
Dingan County fills lens in one, and the substrate, which is located on the outside of interior lens, is fixedly mounted an outer lens, between the interior lens and outer lens
Form a cavity, a catch basin be provided with the right side of the substrate upper surface, the catch basin is inclined to set, the catch basin upper end with it is outer
Boundary is communicated, and a filter is fixedly mounted in the catch basin upper end, and the catch basin lower end is provided with solid in an apopore, the apopore
Dingan County fills an infiltration block, and the apopore lower end on the right side of cavity with communicating.
2. waterproof according to claim 1 and heat dissipation LED package substrate, it is characterised in that：It is to incline on the left of the substrate
Biassed fabric is set, and a baffle plate is fixedly mounted on the substrate left side, and the baffle plate is L-shaped to be set, middle on the left of the substrate to set
There is a mounting groove, be fixedly mounted in the mounting groove on a micromachine, the motor and a fan, the installation groove bottom is fixedly mounted
Provided with a suction hole, the suction hole lower end on the left of cavity with communicating, and the baffle plate lower end is provided with a water outlet plate, the water outlet plate one
End is connected with the lower surface of baffle plate, and the water outlet plate other end on the left of substrate with being connected, and the water outlet plate is provided with more than one
Delivery port.
3. waterproof according to claim 1 and heat dissipation LED package substrate, it is characterised in that：In the substrate lower surface
Between be provided with a deep-slotted chip breaker, a circuit layer is fixedly mounted in the deep-slotted chip breaker, the circuit layer is connected with LED chip.
4. waterproof according to claim 1 and heat dissipation LED package substrate, it is characterised in that：The interior lens are with passing through inside
Mirror is made by epoxide resin material.
5. waterproof according to claim 1 and heat dissipation LED package substrate, it is characterised in that：The substrate is by metal material
Material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610180983.0A CN107240633A (en) | 2016-03-28 | 2016-03-28 | A kind of waterproof and heat dissipation LED package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610180983.0A CN107240633A (en) | 2016-03-28 | 2016-03-28 | A kind of waterproof and heat dissipation LED package substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107240633A true CN107240633A (en) | 2017-10-10 |
Family
ID=59983632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610180983.0A Pending CN107240633A (en) | 2016-03-28 | 2016-03-28 | A kind of waterproof and heat dissipation LED package substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107240633A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109324461A (en) * | 2018-11-23 | 2019-02-12 | 意诺科技有限公司 | A kind of radiator of night vision cam, method and night vision cam |
| CN112289783A (en) * | 2020-11-26 | 2021-01-29 | 江西瑞晟光电科技有限公司 | LED lamp and packaging process thereof |
| CN114335299A (en) * | 2021-12-27 | 2022-04-12 | 江西瑞晟光电科技有限公司 | Full-color SMD LED with enhanced water resistance |
-
2016
- 2016-03-28 CN CN201610180983.0A patent/CN107240633A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109324461A (en) * | 2018-11-23 | 2019-02-12 | 意诺科技有限公司 | A kind of radiator of night vision cam, method and night vision cam |
| CN112289783A (en) * | 2020-11-26 | 2021-01-29 | 江西瑞晟光电科技有限公司 | LED lamp and packaging process thereof |
| CN114335299A (en) * | 2021-12-27 | 2022-04-12 | 江西瑞晟光电科技有限公司 | Full-color SMD LED with enhanced water resistance |
| CN114335299B (en) * | 2021-12-27 | 2023-06-09 | 江西瑞晟光电科技有限公司 | Full-color SMD LED with enhanced waterproof performance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171010 |