CN107230656A - Base board delivery device and substrate carrying method - Google Patents

Base board delivery device and substrate carrying method Download PDF

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Publication number
CN107230656A
CN107230656A CN201710183530.8A CN201710183530A CN107230656A CN 107230656 A CN107230656 A CN 107230656A CN 201710183530 A CN201710183530 A CN 201710183530A CN 107230656 A CN107230656 A CN 107230656A
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CN
China
Prior art keywords
substrate
wafer
conveying
board holder
mounting portion
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Granted
Application number
CN201710183530.8A
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Chinese (zh)
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CN107230656B (en
Inventor
坂元直人
牧准之辅
梶原英树
森弘明
石丸和俊
绪方正彦
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN107230656A publication Critical patent/CN107230656A/en
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Publication of CN107230656B publication Critical patent/CN107230656B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a kind of base board delivery device and substrate carrying method.Attracting and in the base board delivery device of conveying substrate, accurately detecting the exception of the conveying of substrate.Base board delivery device is configured to possess：Board holder, it possesses the suction hole for attracting and keeping substrate；Travel mechanism, it is used to move the board holder；Pressure detecting portion, the pressure for the attraction path that its pair is connected with the suction hole is detected；And control unit, it detects the exception of conveying based on the differential value of the detected pressure value of the pressure detecting portion.By obtaining differential value like this, the change for the pressure for attracting path can be accurately grasped, therefore, it is possible to the exception for the conveying for accurately detecting substrate.

Description

Base board delivery device and substrate carrying method
Technical field
The present invention relates to a kind of base board delivery device of board holder for possessing attraction and conveying substrate and substrate conveying Method.
Background technology
In the semiconductor- fabricating device for manufacturing semiconductor equipment, multiple mountings that are used for are provided with as the half of substrate The component of semiconductor wafer (hereinafter referred to as wafer), is assembled with base board delivery device and is used as substrate carrying mechanism.Pass through the substrate Conveying mechanism will be input into the wafer of semiconductor- fabricating device to be accommodated in the state of bearing part and be taken out from the bearing part, and Conveyed between component.
As component, exist wafer is handled processing assembly, in order to be carried out to the handing-over between processing assembly in Then place the handing-over component of wafer temporarily, by by substrate carrying mechanism between these components it is brilliant with defined sequentially-fed Circle, defined a series of processing is carried out to wafer.Substrate carrying mechanism possesses the base station that can lift and with the base The maintaining part for being used to keep wafer that mode free to advance or retreat is set on platform.As Patent Document 1, set sometimes in maintaining part Suction hole for adsorbing wafer.In addition, being also shown for that crystalline substance is kept and conveyed by vacuum suction wafer in patent document 2 Round conveying mechanism.
Patent document 1：Japanese Unexamined Patent Publication 2014-36175 publications
Patent document 2：Japanese Unexamined Patent Publication 2005-277016 publications
The content of the invention
Problems to be solved by the invention
In addition, have studied following situation：By monitoring that conveying of the wafer in above-mentioned semiconductor- fabricating device is as good as Often, come the generation of the various problems such as the separation of fragments of wafer that prevents wafer from being dropped from maintaining part, rupture.In above-mentioned patent text Offer in 1, describe the following meaning：When the lifting action for detecting substrate carrying mechanism has without exception, by from pressure sensing Switched between the open and close of the data signal of device output, to detect that maintaining part keeps the timing of wafer, wherein, the pressure Force snesor is arranged at the blast pipe being connected with above-mentioned suction hole.
But, there are downstreams undamped, by multiple maintaining part common exhaust pipes according to the use electric power of unit feeding In the case of each maintaining part whether there is the absorption of wafer, the extraction flow of blast pipe changes.That is, from above-mentioned The data signal of pressure sensor can not reflect adsorbed state of the wafer in maintaining part exactly sometimes.Therefore, a kind of energy is sought Enough more precisely monitoring whether there is the abnormal technology of conveying.In patent document 2, describe to being used to adsorb wafer by being arranged at The detected value of pressure of pressure sensor detection of attraction path monitored the exception for carrying out detection means, but as invented As described in embodiment, contain noise contribution in this detected value, therefore, it is difficult to accurately detect the different of conveying Often.
The present invention is completed based on such situation, its object is to provide it is a kind of attract and conveying substrate base The abnormal technology of the conveying of substrate can be accurately detected in plate conveying device.
The solution used to solve the problem
The base board delivery device of the present invention is characterised by possessing：Board holder, it possesses for attracting and keeping base The suction hole of plate；Travel mechanism, it is used to move the board holder；Pressure detecting portion, its pair connects with the suction hole The pressure of logical attraction path is detected；And control unit, the differential of its detected pressure value based on the pressure detecting portion Value detects the exception of the conveying of the substrate.
The substrate carrying method of the present invention is characterised by, including following process：Using suction hole attract substrate by this Substrate is held in board holder；The board holder movement for making to remain the substrate using travel mechanism；Utilize pressure The pressure for the attraction path that power test section pair is connected with the suction hole is detected；And the pressure based on the pressure detecting portion The differential value of power detected value detects the exception of the conveying of the substrate.
The effect of invention
According to the present invention, conveying is detected based on the differential value of the detected pressure value of the attraction path connected with suction hole Abnormal, the suction hole is arranged at board holder, for attracting and keeping substrate.By obtaining differential value, Neng Gougao like this The change for the pressure for attracting path is grasped to precision, therefore, it is possible to the exception for the conveying for accurately detecting substrate.
Brief description of the drawings
Fig. 1 is the top view using coating of the invention and developing apparatus.
Fig. 2 is the rip cutting side view of the coating and developing apparatus.
Fig. 3 is disposed on the top view of the conveying arm involved in the present invention of the coating and developing apparatus.
Fig. 4 is the rip cutting side view of the conveying arm.
Fig. 5 is disposed on the top view of other conveying arms of the coating and developing apparatus.
Fig. 6 is disposed on the sketch structure figure of the foreign matter removal unit of the coating and developing apparatus.
Fig. 7 is the sketch structure figure of the foreign matter removal unit.
Fig. 8 is the sketch structure figure of the foreign matter removal unit.
Fig. 9 is the chart of the data of pressure at expulsion for representing to obtain during normal conveying.
Figure 10 is the explanation figure of the action of conveying arm when representing normal conveying.
Figure 11 is disposed on the structure chart of the control unit of the coating and developing apparatus.
Figure 12 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 13 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 14 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 15 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 16 is the chart of the data of the pressure at expulsion of blast pipe when representing abnormal conveying.
Figure 17 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 18 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 19 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 20 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 21 is the chart of the data of the pressure at expulsion of blast pipe when representing abnormal conveying.
Figure 22 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 23 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 24 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 25 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 26 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 27 is the chart of the data of the pressure at expulsion of blast pipe when representing abnormal conveying.
Figure 28 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 29 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 30 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 31 is the chart of the data of the pressure at expulsion of blast pipe when representing abnormal conveying.
Figure 32 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 33 is the chart of the data of the pressure at expulsion of blast pipe when representing abnormal conveying.
Figure 34 is the species for representing that estimation is abnormal and carries out the flow chart of the process of reply action.
Figure 35 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 36 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 37 is the explanation figure of the data obtained when representing abnormal conveying based on the pressure at expulsion.
Figure 38 is the explanation figure of the data obtained when representing normal conveying based on the pressure at expulsion.
Figure 39 is the sketch structure figure of other foreign matter removal units.
Figure 40 is the sketch structure figure of other foreign matter removal units.
Figure 41 is the stereogram of the conveying arm for the position detecting mechanism for possessing wafer.
Figure 42 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 43 is the explanation figure of the action of conveying arm when representing abnormal conveying.
Figure 44 is the curve map for the action for representing conveying arm.
Figure 45 is the curve map for the action for representing conveying arm.
Description of reference numerals
C1：Mounting portion；SCPL：Temperature adjusts component；W：Wafer；1：Coating and developing apparatus；2nd, 3, F1~F6：Conveying Arm；21：Base station；22：Fork；23：Pad；24：Suction hole；27：Exhaust gear；28：Back pressure transducer (pressure sensing Device)；4：Foreign matter removal unit；5：Control unit；51：Program.
Embodiment
(structure of coating and developing apparatus)
The top view of reference picture 1 and Fig. 2 summary rip cutting side view illustrate the base board delivery device for applying the present invention Coating and developing apparatus 1.The coating and developing apparatus 1 are by bearing part module D1, processing module D2 and interface module D3 Linearly connect and constitute.Interface module D3 is connected with exposure machine D4.Hereinafter, when being illustrated to each module D, Bearing part module D1 sides are set to front side, interface module D3 sides are set into rear side to illustrate.
The bearing part C for storing wafer W is conveyed to bearing part module D1 from the outside of coating and developing apparatus 1.This holds Holder module D1 possesses bearing part C mounting table 11, opening/closing portion 12 and for conveying wafer to bearing part C via opening/closing portion 12 W conveying arm 2.
Processing module D2 is the single-bit module E6 of the first single-bit module E1~the 6th by liquid handling is carried out to wafer W under Supreme stack gradually and constitute.E1 and E2 is mutually the same single-bit module, and E3 and E4 is mutually the same single-bit module, E5 It is mutually the same single-bit module with E6.Wafer W is transported to a single-bit module in two identical single-bit modules.
Here, in single-bit module typically figure 1 illustrates single-bit module E1 illustrate.Along the longitudinal direction Wafer W conveyor zones 13 are formed with, the side in the left side and right side of conveyor zones 13 is provided with antireflection film formation group Part 14, antireflection film formation component 14 is used to supply decoction to form antireflection film to wafer W.In the left side of conveyor zones 13 With the opposite side in right side, multiple heating components 15 are provided with the longitudinal direction along conveyor zones 13, the heating component 15 Possesses the hot plate heated to placed wafer W.In addition, being provided with above-mentioned conveyor zones 13 in single-bit module E1 Convey wafer W conveying arm F1.
Illustrate the difference with single-bit module E1, E2 for single-bit module E3~E6, single-bit module E3, E4 possess etchant resist Component is formed to replace antireflection film formation component 14.Etchant resist formation component is supplied resist as decoction to wafer W, with Etchant resist is formed on wafer W.Single-bit module E5, E6 possess developing device to replace antireflection film formation component 14.Development group Part is supplied developer solution as decoction to wafer W.Except the species of the decoction of the component for carrying out decoction supply like this is different In addition, single-bit module E1~E6 is similarly constituted each other.In fig. 2, by constituent parts module E2~E6 with conveying arm F1 phases When conveying arm be expressed as F2~F6, F1~F6 is similarly constituted each other.
The side by bearing part module D1 in processing module D2 is provided with pylon T1 and conveying arm 3, pylon T1 with Mode across constituent parts module E1~E6 is vertically extending, is made up of the multiple components being layered on top of each other, and the conveying arm 3 is used In the handing-over that substrate is carried out between each component for constituting pylon T1.In pylon T1, for example be provided with single-bit module E1~ Handing-over component TRS is provided with E6 each height and position.
In addition, being provided with silicic acid anhydride component 16 and multiple temperature adjustment component SCPL in pylon T1.At hydrophobization Reason component 16 possesses the hot plate for loading and heating wafer W in the same manner as heating component 15, to the wafer W for being placed in the hot plate Surface supply processing gas carry out silicic acid anhydride.Temperature adjustment component SCPL possesses mounting portion, and the mounting portion carries out temperature Degree is adjusted so that placed wafer W turns into such as 23 DEG C.Also, foreign matter removal unit 4 is provided with pylon T1.Rear Face describes the foreign matter removal unit 4 in detail.
Interface module D3 possesses vertically extending pylon T2, T3, T4 in the way of across single-bit module E1~E6, It is provided with the conveying arm 17 of handing-over for carrying out wafer W between pylon T2 and pylon T3, in pylon T2 and pylon T4 Between carry out wafer W handing-over conveying arm 18 and handing-over for carrying out between pylon T2 and exposure machine D4 wafer W Conveying arm 19.In pylon T2, the handing-over component TRS for joining wafer W for constituent parts module is provided with to stacking.In tower Component is also equipped with frame T3, T4, but omits the explanation on the component.
(structure of conveying arm)
Above-mentioned each conveying arm is the substrate conveying being assembled into as substrate carrying mechanism in coating and developing apparatus 1 Device.The top view of reference picture 3 and Fig. 4 rip cutting side view illustrate bearing part module D1 conveying arm 2, and conveying arm 2 possesses Base station 21 and the fork 22 being arranged on base station 21.Base station 21 can make fork 22 in the going-back position (position shown in Fig. 3, Fig. 4 Put) retreated between progressive position.Also, base station 21 is connected with drive mechanism (not shown), it is configured to carry out left and right Move, lift and around the rotation of vertical axis.The drive mechanism and base station 21, which are constituted, makes the fork 22 as board holder Mobile travel mechanism.
Fork 22 is formed as the horizontal tabular that two forks are extended in direction of advance side.The surface of fork 22 is provided with three Flat circular pad 23, suction hole 24 is offered on the surface of each pad 23.Carried in the way of sealing these suction holes 24 The wafer W on pad 23 is put to be attracted and be held in fork 22 by flatly absorption as represented with chain-dotted line in figure. In addition, being provided with exhaust channel 25 in fork 22.The upstream side branch of exhaust channel 25 is simultaneously connected with each suction hole 24, row The downstream of gas path 25 in the blast pipe 26 for being connected to fork 22 with being connected.Constitute the exhaust for attracting path (exhaust channel) The downstream of pipe 26 is connected with the exhaust gear 27 such as comprising valve, exhaust blower, can pass through the exhaust gear 27 To be switched between the state that is not attracted in the state attracted from suction hole 24 and from suction hole 24.
Moreover, being provided with back pressure transducer (pressure sensor) in the upstream side by exhaust gear 27 of blast pipe 26 28, the back pressure transducer (pressure sensor) 28 exports simulation letter corresponding with the pressure (pressure at expulsion) in blast pipe 26 Number.Control unit 5 shown in Fig. 3 is the computer in order to which coating and the action in each portion of developing apparatus 1 are controlled and set, Via the conversion for the output signal from the back pressure transducer 28 as pressure detecting portion to be converted to data signal Device (omit diagram) and for example repeat to obtain the output signal with 2.5 milliseconds of interval.The acquisition interval of the signal is not limited to this Example, but accurately detect abnormal in order to as described later, such as preferably less than 10 milliseconds of interval.Control is being described below The detailed construction in portion 5 processed.
Then, the top view of reference picture 5 illustrates conveying arm F1 and conveying arm 2 difference.Conveying arm F1 fork 22 It is configured to direction of advance side and extends two forks in the way of wafer W side week to be surrounded, is additionally provided with for loading as described above Four claws 29 of such besieged wafer W back side peripheral part.In conveying arm F1, in the surface (upper table of the claw 29 Face) it is provided with the pad 23 for possessing suction hole 24.
In addition, on conveying arm F (F1~F6) base station 21, two forks 22, these forks are provided with along the vertical direction 22 retreat on base station 21 independently of each other.In fig. 5 it is shown that a fork 22 is located at progressive position, another fork position In the state of going-back position.In addition to these differences, conveying arm F (F1~F6) is constituted in the same manner as conveying arm 2.In addition, Conveying arm 3 is constituted in addition to being only provided with a fork 22 in the same manner as conveying arm F (F1~F6).
(on component and bearing part)
In addition, component represents to possess the list in the coating and developing apparatus 1 of the mounting portion that wafer W is loaded using each conveying arm Member.The mounting portion for constituting each component is configured to the shape not interfered with the fork 22, enable to by it is described later enter The lifting action for going out the fork 22 of the conveying arm of the mounting portion carries out wafer W handing-over.In addition, bearing part C is also equipped with carrying Portion is put, so that wafer W handing-over can be carried out by the lifting action of fork 22, the mounting portion is expressed as C1 in figure 3.
(structure of foreign matter removal unit and action)
Then, reference picture 6 illustrates the foreign matter removal unit 4 as foreign matter removal portion for being arranged at above-mentioned pylon T1. The foreign matter removal unit 4 has following effect：It is being estimated as described later in the case that conveying arm 2 there occurs exception, will be attached The foreign matter P removals in the pad 23 of conveying arm 2.Foreign matter removal unit 4 is configured to comprising three vertical pins 41, supports each pin The support 42 of 41 lower end, make rotating mechanism 43 that support 42 rotates around vertical axis and the front end for being supported on each pin 41 Disk 44.Disk 44 is detachable relative to pin 41, is handed off to the pad 23 of conveying arm 2.For example it is provided with the back side of disk 44 Adhering substance, the foreign matter P adhered on 23 is padded to adsorb and remove when like this being joined.Specifically, example The resiniferous film layer of bag that such as multi-disc is made up of the adhering substance is arranged in the back side of disk 44, the film that the stacking is got up foldedly The film on top layer constitute bonding plane for adsorption of foreign matter P.In the feelings that have dropped the adherence of the film on top layer using disk 44 Under condition, the film can be peeled off and the film of lower floor is exposed as new bonding plane.
As shown in Figure 7, Figure 8, lifted base station 21 by being located in fork 22 in the state of progressive position, in fork The handing-over of multiple disk 44 is for example carried out between sub 22 pad 23 and the pin 41 of foreign matter removal unit 4.In addition, as shown in figure 8, In above-mentioned multiple handing-over, when disk 44 is received by pin 41, pin 41 is rotated by rotating mechanism 43.Thus, fork 22 is every It is secondary all with different towards take-up reel 44.That is, in each handing-over, the 23 different positions all from disk 44 of pad connect Touch, therefore can more reliably will attach to the foreign matter P of pad 23 and be adsorbed in disk 44 to remove foreign matter P.
(explanation of the transport path in coating and developing apparatus)
The transport path of wafer W in above-mentioned coating and developing apparatus 1 is illustrated, using conveying arm 2 by wafer W Pylon T1 handing-over component TRS0 is transported to from bearing part C, and wafer W is transported to using conveying arm 3 pylon T1 hydrophobization Processing assembly 16 carries out silicic acid anhydride.Afterwards, wafer W is transported to temperature adjustment component SCPL come after being cooled down, Distribution is conveyed to single-bit module E1, E2.For example, in the case where wafer W is handover into single-bit module E1, to pylon Handing-over component TRS1 corresponding with single-bit module E1 in T1 handing-over component TRS (can join wafer W's using conveying arm F1 Join component) handing-over wafer W.In addition, in the case where wafer W is handover into single-bit module E2, to pylon T1 handing-over group Handing-over component TRS2 handing-over wafer W corresponding with single-bit module E2 in part TRS.These wafers W friendship is carried out using conveying arm 3 Connect.
By the wafer W distributed like this by conveying arm F1 (F2) by TRS1 (TRS2) → antireflection film formation component 14 → 15 → TRS1 of heating component (TRS2) sequentially-fed, and pass through the distribution of conveying arm 3 to handing-over group corresponding with single-bit module E3 Part TRS3 and handing-over component TRS4 corresponding with single-bit module E4.The wafer W distributed like this to TRS3, TRS4 is passed through defeated Arm F3 (F4) is sent by TRS3 (TRS4) → etchant resist formation component → 15 → pylon of heating component T2 handing-over component TRS31 (TRS41) sequentially-fed.Then, wafer W is delivered to exposure machine D4 using conveying arm 17,19, will be formed in wafer W's The etchant resist on surface according to regulation pattern exposure.
Wafer W after exposure is conveyed between pylon T2, T4 by conveying arm 18,19, and is delivered to respectively and unit The corresponding pylon T2 of module E5 handing-over component TRS51 and pylon T2 corresponding with single-bit module E6 handing-over component TRS61. Then, wafer W is conveyed by the order of 15 → developing device of heating component, etchant resist is exposed according to by exposure machine D4 Obtained pattern is dissolved, to form corrosion-resisting pattern on wafer W.Then, wafer W is being transported to pylon T1 handing-over group After part TRS5 (TRS6), wafer W is set to return to bearing part C by conveying arm 2.
(explanation of the normal conveying action of conveying arm)
Reference picture 9, Figure 10 illustrate in above-mentioned transport path from bearing part C mounting portion C1 to handing-over component TRS0 Join wafer W when conveying arm 2 each portion action and in the handshaking by control unit 5 be based on from pressure at expulsion pass One of the time series data for the pressure at expulsion that the output signal that sensor 28 is sent is obtained.It is located in the explanation of Fig. 9, the Figure 10 Conveying in normally convey wafer W without occurring aftermentioned such abnormal.
Fig. 9 is the figure for illustrating above-mentioned time series data with sequential.The transverse axis of chart represents that setting base station 21 is located at It is the elapsed time (unit of 0 second at the time of during defined setting position for receiving wafer W：Millisecond).In addition, chart is vertical Axle represents the row as the detected pressure value for attracting path gone out based on the detection signal detection from back pressure transducer 28 Atmospheric pressure (unit：kPa).The arrow of A1~A7 in the chart represents each action of the arm represented in Figure 10 with A1~A7.This Outside, when handing-over of the wafer W between bearing part C mounting portion C1 and conveying arm 2 is represented in the Figure 10 and each figure described later, it is It is easy to diagram, the state observed for the mounting portion C1 fore-and-aft directions for being showing along device is showing along for conveying arm 2 The state that the left and right directions of device is observed.
First, in the state of the attraction that fork 22 is located at going-back position and is carried out from suction hole 24 stopped, fork 22 Progressive position is moved on the base station 21 positioned at above-mentioned setting position, so that fork 22, which is located at, is placed in mounting portion C1's Wafer W lower section (action A1).Then, start to be vented from suction hole 24 (t at the time of in chart1), the pressure at expulsion detected Fixation is essentially become after drastically declining.Then, fork 22 rises, be positioned on the pad 23 of fork 22 as wafer W and When sealing suction hole 24, pressure at expulsion further sharp declines (moment t2).Fork 22 continues to stop (action after rising A2), then, fork 22 is moved to going-back position (action A3).The decline of pressure at expulsion gradually becomes gentle, afterwards, exhaust pressure Power is substantially fixedly elapsed.
Then, base station 21 carries out transverse shifting and carries out lifting moving (action A4), when base station 21 is for wafer W to be handed over When being connected to static as the defined outgoing position for joining component TRS0 of wafer W conveying destination, it is moved to fork 22 Progressive position and positioned at handing-over component TRS0 top (action A5).Then, stop the exhaust in suction hole 24, so as to be vented Pressure rises (moment t3).Then, base station 21 declines, and wafer W is loaded (output) to handing-over component TRS0.Wafer W is defeated Go out after best friend's connected components TRS0 to continue to make fork 22 to decline (action A6), afterwards, stop the decline, move fork 22 To going-back position (action A7).
Representatively illustrate conveyings of the wafer W from bearing part C to component, but it is wafer W conveying between the components, brilliant Circle W from component to bearing part C conveying also can by carrying out above-mentioned A1~A7 by each conveying arm in illustrated action come Carry out.In addition, in the case where normally carrying out each conveying, the time sequence with pressure at expulsion illustrated in fig. 9 can be obtained The time series data of the same pressure at expulsion of column data.
(explanation of control unit 5)
In addition, the time series data for the pressure at expulsion that 5 pairs of control unit is got like this carries out calculation process, to obtain The time series data of differential value.Time series data to the differential value is illustrated, in the time series number of pressure at expulsion In, subtract what is got before 2.5 milliseconds of an elapsed time from the pressure at expulsion that an elapsed time gets Pressure at expulsion, the differential value in an elapsed time is set to by resulting value.That is, computing (is obtained in the arbitrary time The pressure at expulsion got)-(being close to the pressure at expulsion got before the arbitrary time), the value obtained by obtaining is used as micro- Score value.Each elapsed time by pressure at expulsion is got obtains the differential value.That is, obtaining exhaust every 2.5 milliseconds The differential value of pressure, these differential values is set to the time series data of differential value.
In fig .9, in order to illustrate and show the exhaust of the change for the pressure at expulsion being easily mastered in blast pipe 26 The example of the time series data of pressure, but the exhaust of conveying arm can be made by for example being changed to the use electric power of unit feeding The exhaust capacity of mechanism 27 becomes unstable, and thus the pressure at expulsion in blast pipe 26 changes, as a result, exhaust pressure It is possible in the waveform of the time series data of power containing noise.In this case, by obtain above-mentioned differential value when Between sequence data can also eliminate noise, the change of pressure in the blast pipe 26 of each time is grasped so as to accuracy highland. That is, the time series data of differential value accurately reflects the change of the pressure at expulsion in blast pipe 26.
Moreover, in the case where there occurs exception during conveying wafer W, the pressure at expulsion obtained by control unit 5 Time series data turns into the waveform different from the example shown in Fig. 9, and the time series data based on this pressure at expulsion is obtained The time series data of the differential value taken turns into time series data corresponding with abnormal species.Control unit 5 can be based on should The time series data of differential value detects the exception of conveying, and estimates the abnormal species that occurs.Also, 5 pairs of control unit The action of each conveying arm is controlled, and is acted with carrying out reply corresponding with estimated abnormal species.In addition, for example existing All the time acquisition and the time of differential value of the time series data of pressure are exhausted in the operation process of coating and developing apparatus 1 The acquisition of sequence data.
Figure 11 illustrates the structure of control unit 5.Control unit 5 possesses program 51.The program 51 is order (step group) Combined and constituted in the way of being able to carry out acting as follows, these actions are：Wafer W is defeated along above-mentioned transport path The acquisition of the output signal send, exported to wafer W processing, from back pressure transducer 28 in each component, based on output signal Pressure at expulsion time series data and the generation of time series data, the time series data based on differential value of differential value The abnormal species of conveying estimation and reply corresponding with estimated abnormal species action.Moreover, passing through the journey Sequence 51 sends control signal to each portion of coating and developing apparatus 1, thus control the coating and developing apparatus 1 each portion it is dynamic Make.State in program storage medium such as to be stored in hard disk, CD, magneto-optic disk or storage card, which is stored in, to be arranged at Acted in the program storage unit (not shown) of control unit 5.
In addition, being provided with memory 52 in control unit 5.The numbering of batch in memory 52 belonging to storage wafer W, The information such as numberings of the wafer W in batch, the information is used to be used as abnormal species in the exception for estimating wafer W described later In the case of determine abnormal wafer W is estimated as.Also, alarm output section 53 is connected with control unit 5.Alarm Output section 53 includes monitor, loudspeaker etc., receives control signal come image show, sound exports and is used as police as defined in carrying out Report.
Hereinafter, the state of wafer W when enumerating concrete example by the abnormal species of conveying to illustrate to occur exception, generation are abnormal When the time series data of pressure at expulsion, the time series data of differential value and reply action.
(abnormal species 1：Wafer is adhered to)
When conveying arm receives wafer W from the mounting portion of bearing part C or component, wafer W is due to being attached to wafer W sometimes The back side decoction, the mounting portion adhered to by attachments such as the films that is formed in the way of spreading to the wafer W back side.Also It is to say, the adhesion is that mountings of the wafer W in the mounting portion of delivery source is abnormal.
Illustrate to receive the wafer that adhering to like this from bearing part C mounting portion C1 using Figure 12~Figure 15 synoptic diagram The action of conveying arm 2 during W and received wafer W situation.
Make carrying out action A1, A2 illustrated in fig. 10 the pad 23 of fork 22 adsorb and lift wafer W so that After the suction hole 24 of pad 23 is closed by wafer W, the wafer W for adhering to mounting portion C1 leaves mounting portion C1.Wafer W is due to entering Row the separation produced by power and from pad 23 on upspring, the state as vibration.Wafer W turns into this state, thus pads 23 suction hole 24 is opened (Figure 12, Figure 13).
The time of the pressure at expulsion obtained in this case is represented in the curve map of Figure 16 upside using the waveform of solid line Sequence data.Transverse axis, the longitudinal axis of the curve map represent to be located at defined setting from base station 21 respectively in the same manner as Fig. 9 curve map Act the elapsed time passed through, detected pressure at expulsion in position.As described above wafer W be adsorbed on pad 23 after from Open rising after the pad 23, therefore pressure at expulsion decline.In addition, in order to be compared, in the curve map of Figure 16 upside The waveform of the time series data of the pressure at expulsion obtained during the normal conveying shown in Fig. 9 is represented by dashed line, exhaust is being shown In the curve map of each figure described later of the time series data of pressure, also dotted line is used in the same manner as the curve map of the upside of the Figure 16 Represent the waveform of the time series data of normal pressure at expulsion.
In the curve map of Figure 16 downside, represented with the waveform of solid line based on indicated by the solid line in the curve map of upside Pressure at expulsion time series data obtain differential value time series data.In the curve map of the downside of the Figure 16, Transverse axis represents the elapsed time in the same manner as the transverse axis of the curve map of upside, and the longitudinal axis represents above-mentioned differential value (unit：kPa).It is right The waveform is illustrated, and wafer W is adsorbed on pad 23 and pressure at expulsion declines, and thus differential value declines.Afterwards, pressure at expulsion Stabilize, thus differential value rises, and is substantially changed into 0 in the same manner as before the decline caused by absorption.Afterwards, due to upper The wafer W stated springing and the pressure in blast pipe 26 sharp rises, therefore differential value rise, occur in waveform than larger Crest.
In order to be compared, in the curve map of Figure 16 downside, the curve map of the upside based on Figure 16 is represented by dashed line In normal conveying when the obtained waveform of the time series data of differential value of the time series data of pressure at expulsion that obtains. In the time series data of the differential value obtained during the normal conveying, do not observe because absorption wafer W after differential value drastically on The crest for rising and producing.In addition, in the curve map of each figure described later of time series data of differential value is represented, also with the figure The differential that the time series data based on normal pressure at expulsion is obtained similarly is represented by dashed line out in the curve map of 16 downside The waveform of the time series data of value.
So, occur crest in waveform when occurring abnormal, therefore occur the above-mentioned period by presetting prediction And it is located at the scope of the maximum of the crest for the waveform that the period there occurs, can be according to time of acquired differential value Sequence data detection wafer W exception, and it is the exception occurred by above-mentioned adhesion that can be estimated as the exception.In addition, brilliant Circle W occurs as described above due to the adhesion, it can be said that the exception of the adhesion is that wafer W holding is kept by fork 22 The exception of state.In the graph, the period is expressed as TM1, is R1 by the Range Representation of the maximum of crest.
When being estimated as there occurs adhesion like this, acted as reply, carrying out Figure 10 action A3 (after fork 22 Move back) before, fork 22 and base station 21 are kept for the defined time with inactive state, and carry out the suction hole 24 from pad 23 Attraction stop.Thus, vibrations of the wafer W on fork 22 is gradually reduced (Figure 14), and wafer W is flatly supported on pad 23 (Figure 15).Then, restart the attraction that is carried out by suction hole 24 to adsorb wafer W, afterwards when normal in the same manner as perform Action A3~the A7 stated, wafer W is conveyed to handing-over component TRS0.By carrying out reply action as described above, Neng Goufang Only fork 22 retreats under wafer W unsure states and causes wafer W to be dropped from fork 22.Acted as the reply, Make execution act A2 after and start execution action A3 before fork 22 and base station 21 turn into inactive state time ratio it is normal Ground conveyed in the case of execution action A2 after and start execution action A3 before fork 22 and base station 21 turn into it is quiet Only the time of state is long.Time as inactive state in the case of normally being conveyed also is included as the situation of 0 second.
(abnormal species 2：Bonding wafer)
Although it is the phenomenon roughly the same with the adhesion illustrated as abnormal species 1 that wafer W, which pastes, with gluing Attached to compare, wafer W during stickup is higher for the cohesive of mounting portion.That is, the stickup is loads of the wafer W in delivery source The mounting put in portion is abnormal.Using Figure 17~Figure 20 synoptic diagram, by with coming centered on the difference of situation about being adhered to Illustrate from bearing part C mounting portion C1 receive the wafer W pasted like this when conveying arm 2 action and received The wafer W arrived situation.
Carry out action A1, A2 illustrated in fig. 10 to make base station 21 increase, the pad 23 of fork 22 is adsorbed wafer W. Keep due to being pasted on mounting portion C1 in wafer W and base station 21 is increased under the contiguous states of mounting portion C1, so that fork 22 bend (Figure 17).Afterwards, with the increase of amount of bow of fork 22, the restoring force of the fork 22 increases, thus wafer W leaves from mounting portion C1.Power when wafer W due to leaving like this and it is more urgent than situation about being adhered to from pad 23 Acute ground simultaneously turns into the state (Figure 18) vibrated on fork 22.
In the curve map of Figure 21 upside, represented in this case with the waveform of solid line in the same manner as Figure 16 curve map The time series data of the pressure at expulsion of acquisition.In the same manner as situation about being adhered to, wafer W be adsorbed on pad 23 it After leave pad 23, therefore pressure at expulsion rises after decline.But, in the case where there occurs the stickup, in base station 21 Wafer W leaves when being located relative to the high position in the position in the case of the mounting portion C1 position adhesion more above-mentioned than there occurs The timing in the case of pad 23, therefore the timing that begins to ramp up of the pressure at expulsion adhesion more above-mentioned than there occurs is late.
In the curve map of Figure 21 downside, represented with the waveform of solid line based on the pressure at expulsion got like this when Between sequence data computing differential value time series data.Due to above-mentioned wafer W's and pressure in blast pipe 26 very Sharp rise, therefore as shown in this graph, there occurs that very big crest occurs in this time.Thus, in wafer W In the case of there occurs adhesion and in the case where there occurs stickup, the maximum for predicting the period occurred and crest is different 's.Therefore, occur period because of caused by the stickup by presetting prediction and be located at what the period there occurs The scope of the maximum of crest, can be estimated as sending out when receiving wafer W according to the time series data of acquired differential value Stickup is given birth to.In the graph, the period is expressed as TM2, is R2 by the Range Representation of the maximum of crest.
When being estimated as there occurs stickup like this, acted as reply, decline base station 21 and make the row of pad 23 Gas stops.Wafer W is handed off to after mounting portion C1 again in the decline by the base station 21, make base station 21 stop decline and As inactive state (Figure 19).Then, the later actions of A2 are carried out.Attracted that is, starting again at using pad 23 And base station 21 is increased, to make fork 22 receive wafer W and convey wafer W (Figure 20) to handing-over component TRS0.
On carrying out wafer W like this again to mounting portion C1 mounting and the purpose received again, except being to prevent Beyond fork 22 retreats under wafer W unsure states and causes wafer W to be dropped from fork 22, also residing in makes mounting portion The adherence force of the attachment for turning into the reason for pasting on C1 weakens.That is, being positioned in by entering to be about to wafer W as viscous Make the action that wafer W leaves after on the mounting portion C1 of the reason for patch attachment, the adherence force having to make attachment weakens, To occur when avoiding the wafer W for finishing a series of processing in coating and developing apparatus 1 from being transported to mounting portion C1 again Paste.
(abnormal species 3：Foreign matter adheres to)
The back side of the foreign matter attachment comprising wafer W is attached with the situation of foreign matter and pads 23 situations for being attached with foreign matter.Such as It is aftermentioned like that, be estimated as the foreign matter attachment in the case of, it is first assumed that be these situations in wafer W the back side be attached with it is different The situation of thing carries out reply action.Then, according to the time series data of the differential value obtained when carrying out reply action, by vacation Surely it is modified to the situation that pad 23 is attached with foreign matter.In Figure 22~Figure 26, if being that the wafer W back side is attached with foreign matter P, show The action of conveying arm 2 when receiving wafer W from mounting portion C1.
First, carry out action A1, A2 rises base station 21, adsorbs the pad 23 of fork 22 and lifts wafer W (figures 22nd, Figure 23).Now, as there is foreign matter P state between pad 23 and the wafer W back side, so as to pad 23 suction hole 24 are not blocked by wafer W and keep unlimited state.Inframe in the front of Figure 23 dotted arrow enlargedly show the state Pad 23 rip cutting side, the air-flow to the unlimited inflow of suction hole 24 is represented with solid arrow.
In the curve map of Figure 27 upside, the pressure at expulsion for being represented to obtain in this case with the waveform of solid line when Between sequence data.Because suction hole 24 is unlimited as described above, even if therefore fork 22 receive wafer W, pressure at expulsion Slippage is also small, so that change drastically does not occur for pressure at expulsion.In the curve map of Figure 27 downside, with the waveform table of solid line Show the time series data for the differential value that the time series data based on the pressure at expulsion is obtained.Due to exhaust pressure as described above Change drastically do not occur for power, therefore the period for making fork 22 receive wafer W rising base station 21, and differential value is to compare Big value passage.That is, the minimum value of the differential value of the period is than larger.Thus, by presetting the period And the scope of the minimum value in the presence of abnormal differential value is estimated as, hair can be estimated as according to the time series data of differential value Foreign matter attachment is given birth to.In the graph, the period is expressed as TM3, is R3 by the Range Representation of the minimum value of differential value. This, estimated foreign matter attachment is that wafer W has foreign matter attachment as described above.
When being estimated as having foreign matter attachment on this wafer W, acted as reply, base station 21 is declined wafer W again It is secondary to be placed in mounting portion C1.Then, the decline of base station 21 is stopped (Figure 24), fork 22 is somewhat retreated (Figure 25), enter again Row A2 action (rising of base station 21).Thus, contact wafer W's when padding 23 with the wafer W back side with receiving before The mode of the different position contact in position receives wafer W.In the same manner as also judging when this is received again when with reception before Whether the minimum value of the differential value in the time series data of the differential value got in period TM3 is in scope R3. When being judged to being not in scope R3, if being that padding 23 like that has adsorbed wafer W with avoiding foreign matter P as shown in figure 26, schemed Action later A3 shown in 10 is by wafer W to handing-over component TRS0 conveyings.By carrying out this reply action, it can prevent Wafer W is conveyed with the state do not adsorbed fully.Thus, it is possible to prevent in course of conveying wafer W from fork 22 On come off or wafer W bounces and damaged on fork 22.
The feelings in scope R3 are in the minimum value of the above-mentioned differential value being also determined as in period TM3 when receiving again Under condition, decline base station 21 and reappose wafer W in mounting portion C1, after fork 22 is somewhat retreated, make base station 21 Rise to make fork 22 receive wafer W.That is, in the way of making pad 23 further be offset with the wafer W positions contacted Wafer W reception is carried out, is judged again in the time series data of differential value that is got in the reception in period TM3 Whether the minimum value of differential value is in scope R3.That is, determining whether to be adsorbed with avoiding foreign matter P.
Repeat by making fork 22 retreat the adjustment carried out to wafer W holding position, until being determined as avoiding different Untill being adsorbed thing P.But, the holding position for carrying out stipulated number adjustment but still be judged to not avoiding different In the case of being adsorbed, the back side for cancelling wafer W is attached with the such estimation of foreign matter, and progress pad 23 is attached with different thing P Thing is such to be estimated.Then, the decline of base station 21 is reapposed wafer W after mounting portion C1, acted as reply, Base station 21 is moved to foreign matter removal unit 4, carry out the removal action of Fig. 6~illustrated in fig. 8 foreign matter.In removal action After end, the action for carrying out A1~A7 conveys wafer W from mounting portion C1 to handing-over component TRS0.
(abnormal species 4：Wafer ruptures)
There is situations below：Due to that the wafer being heated by component W is delivered into other components is cold to carry out The reasons such as the thermal shock, the wafer W deteriorations that occur in the case of but, the wafer W for being placed in component ruptures.Use Figure 28~figure 30 illustrate that conveying arm 3 adjusts situation when component SCPL receives the wafer W ruptured as from temperature.
Carry out above-mentioned action A1, A2 to make base station 21 rise (Figure 28), the pad 23 of fork 22 is adsorbed and is lifted crystalline substance Circle W.Because wafer W is ruptured and causes the closing of suction hole 24 not exclusively and position hairs of the wafer W on pad 23 Raw skew, thus has a little air to flow into suction hole 24.In the curve map of Figure 31 upside, represented with the waveform of solid line at this In the case of the time series data of pressure at expulsion that obtains.There is air to flow into attraction as described above after wafer W is received Hole 24, thus pressure at expulsion somewhat rise after decline.
In the curve map of Figure 31 downside, represent that the time series data based on the pressure at expulsion is obtained with the waveform of solid line The time series data of the differential value taken.It is micro- because pressure at expulsion changes as described above, therefore after wafer W is received Score value rises and produces crest.Compared with when wafer W bounces because adhering to, pasting, the stream of air drastically can be suppressed Enter, therefore the peakedness ratio there occurs that the crest detected when adhesion, stickup is small.Thus, by the maximum for presetting the crest The scope of value, can estimate whether received wafer W there occurs brokenly according to the time series data of acquired differential value Split.In the graph, it is R4 by the Range Representation.
When being estimated as there occurs this wafer W rupture, acted as reply, base station 21 is declined wafer W again It is secondary to be placed in temperature adjustment component SCPL (Figure 30).After, when conveying follow-up wafer W from bearing part C, use multiple temperature Component in adjustment component SCPL, in addition to the temperature for loading the wafer W ruptured like this adjusts component SCPL. By the way that the wafer W ruptured is retained on component in advance, can prevent wafer W fragment dropped from fork 22 and It is scattered in device, and due to follow-up wafer W conveying can be proceeded using conveying arm 3, therefore painting need not be made Cloth and developing apparatus 1 shut down.
(abnormal species 5：The film of wafer is peeled off)
There is situations below：The wafer W upspring from fork 22 surface touches conveying arm, coating and developing apparatus 1 Other constructs and peel off the film on the surface, that is wafer W damage.Here, defeated to being carried out using conveying arm F1 The film occurred when sending is peeled off and illustrated.For example, carrying out action A1~A3 shown in Figure 10, the fork in the downside for making conveying arm F1 Son 22 is received after wafer W, moves base station 21 to convey wafer W to the component of rear class.That is, carry out action A4. During action A4 is carried out, such as due to making that the drive mechanism that base station 21 is moved occurs abnormal and the base station 21 is shaken It is dynamic, wafer W from pad 23 upspring and as shown in figure 32 like that with the collision friction of fork 22 of upside and occur film stripping.
In the curve map of Figure 33 upside, the time of pressure at expulsion obtained in this case is represented with the waveform of solid line Sequence data.Wafer W leaves pad 23, and the pressure at expulsion thus stably elapsed originally sharp rises.In Figure 33 downside Curve map in, the time series for the differential value that time series data based on the pressure at expulsion is obtained is represented with the waveform of solid line Data.Because pressure at expulsion changes as described above, therefore differential value sharp rises and produced than larger crest.Thus, , can be according to acquired by presetting for carrying out action A4 period and setting the scope of peak value when there occurs exception Differential value time series data to estimate whether there occurs stripping, i.e. whether wafer W hold mode abnormal.Set on this The scope of peak value when there occurs exception, is expressed as R5 in the graph.
When being estimated as there occurs stripping like this, acted as reply, will be used to know for wafer W by control unit 5 Not in wafer W data Cun Chudao memories 52.That is, wafer W is marked.Also, from alarm output section 53 Output represents that wafer W has abnormal alarm.
Above-mentioned various types of exception not only it is illustrated go out conveying arm occur, utilizing other conveying arms progress Can also occur in the case of conveying.Abnormal species occurs when being conveyed using conveying arm 2 that is, for example showing The example of 1 adhesion, but the adhesion is the exception also occurred when being conveyed using conveying arm 3.Moreover, other utilizing Conveying arm conveyed in the case of, also carried out in the same manner as shown example abnormal species estimation and reply action. In addition, though detailed description is eliminated, but in the case where being conveyed using the conveying arm for being arranged at interface module D3 Also the estimation and reply action of same abnormal species are carried out.Also, on foreign matter removal unit 4, show and be arranged at conveying The example for the position that arm 2 can be passed in and out, but foreign matter removal unit 4 can be for example equipped on to pylon T1, T2 each conveying arm Each height and position that can be passed in and out, to cause other conveying arms also to carry out the removal of foreign matter in the same manner as conveying arm 2.
Then, illustrate to be estimated as abnormal species 1~4 using Figure 34 flow chart and implement the process of each reply action One.First, action A1, A2 for showing is performed in Figure 10 conveying arm is received wafer W.With the reception concurrently row of acquisition The time series data of atmospheric pressure, and obtain the time series data (step S1) of differential value.Judge the time series data In differential value maximum whether in the scope R1 shown in Figure 16 and in period TM1 (step S2), be determined as In the case of in scope R1 and in period TM1, be estimated as wafer W there occurs Figure 12, adhesion illustrated in fig. 13. Then, as Figure 14, it is illustrated in fig. 15 as make conveying arm pad 23 attraction stop, and make conveying arm be in it is static State (step S3).Then, wafer W conveying (step S4) is proceeded.That is, carry out Figure 10 shown in action A3 with Each action afterwards.
In the case of being determined as that the maximum of differential value is not in scope R1 and period TM1 is interior in step s 2, Judge the maximum of the differential value whether in the scope R2 shown in Figure 21 and in period TM2 (step S5).Then, exist In the case of being determined as that the maximum of the differential value is in scope R2 and period TM2 is interior, it is estimated as wafer W and there occurs figure 17th, stickup illustrated in fig. 18, as Figure 19, it is illustrated in fig. 20 as, by wafer W be placed in again originally mounting wafer After W place, reuse conveying arm and receive wafer W (step S6).Then, above-mentioned step S4 is carried out.That is, proceed Wafer W conveying.
In the case of being determined as that the maximum of differential value is not in scope R2 and period TM2 is interior in step s 5, Judge whether the maximum of differential value is in scope R4 illustrated in Figure 31 (step S7).Then, it is being determined as the differential In the case that the maximum of value is in scope R4, it is estimated as wafer W and there occurs rupture illustrated in Figure 28, Figure 29, such as scheme As illustrated by 30, wafer W is placed in the place (step S8) of mounting wafer W originally again.Judge in the step s 7 For differential value maximum be not in scope R4 in the case of, the differential value in period TM3 shown in process decision chart 27 is most Whether small value is in (step S9) in scope R3.At the minimum value for the differential value being determined as in step S9 in period TM3 In the case of in scope R3, be estimated as Figure 22, it is illustrated in fig. 23 as have foreign matter attachment on wafer W, such as Figure 24~ As illustrated by Figure 26, conveying arm receives wafer W (steps again in the way of making the absorption position skew to wafer W S10)。
Determined whether to inhale with avoiding foreign matter according to the time series data of the differential value got when this is received again Attached wafer W.That is, judging the minimum value of the differential value in period TM3 whether in (step S11) in scope R3. In the case where being judged to being adsorbed with avoiding foreign matter, above-mentioned step S4 (conveying for proceeding wafer W) is carried out. The position for being judged to not adsorbed with avoiding foreign matter in step S11 and conveying arm being adsorbed into wafer W as described above becomes More defined number of times but continue to be determined as in the case of being adsorbed with not avoiding foreign matter, cancelling on wafer W has foreign matter The estimation of attachment, the pad 23 for being estimated as conveying arm there occurs that foreign matter adheres to.
Then, the conveying arm will so far be estimated as being attached with receiving before the wafer W of foreign matter is placed in again and be somebody's turn to do Wafer W place, carries out the removal action (step S12) of Fig. 6~Fig. 8 foreign matter.Step S4 is carried out afterwards, passes through above-mentioned A1 ~A7 action is estimated as the wafer W for being attached with foreign matter to convey.It is determined as the differential value in period TM3 in step s 9 Minimum value be not in scope R3 in the case of, be estimated as the exception not conveyed, proceed step S4 wafer W Conveying.
Then, to be estimated as abnormal species 5 and implement reply action process illustrate.Carry out illustrated in fig. 10 Action A4, i.e. carry out remain wafer W conveying arm base station 21 movement.Pressure at expulsion is concurrently obtained with the movement Time series data, and obtain the time series data of differential value.Judge the peak value in the time series data of the differential value Whether comprising in scope R5 illustrated in fig. 33.Peak value is not included in the feelings in scope R5 during execution acts A4 Under condition, the exception not conveyed is estimated as.In the case where peak value is included in scope R5, it is estimated as in course of conveying Wafer W there occurs that film is peeled off, and carry out the output of alarm and to the wafer W conveyed mark.
According to the coating and developing apparatus 1, loaded in the conveying arm for being attracted using suction hole 24 and keep wafer W from first During portion conveys wafer W to the second mounting portion, repeat to obtain the detection signal from pressure sensor 28, the pressure sensor 28 are used to detect the pressure at expulsion in the blast pipe 26 being connected with suction hole 24.Then, the acquisition of the detection signal is being carried out Period in, every the differential value of the acquisition interval calculation pressure at expulsion of signal, and generate time series data.During based on this Between sequence data detect the exception of conveying, therefore, it is possible to accurately carrying out abnormal detection.In addition, as differential value, and It is not limited to be set to the difference of pressure at expulsion continuously got as described above.For example, it is also possible to which some is obtained into time point The pressure at expulsion that pressure at expulsion is got with the acquisition time point after time points are obtained from some acquisition start time two it Between difference be set to differential value.
Then, the temperature adjustment component SCPL shown in Figure 35 is illustrated.The SCPL possesses the mounting as mounting portion Plate 45, the loading plate 45 enters trip temperature adjustment by being supplied to cooling water to placed wafer W, in the table of the loading plate 45 On face, suction hole 24 is offered in the same manner as conveying arm 2.Suction hole 24 of the suction hole 24 of the loading plate 45 also with conveying arm is same Sample, side is connected via blast pipe 26 with exhaust gear 27 downstream, is provided with and above-mentioned conveying arm in the blast pipe 26 The pressure sensor 28A that similarly constitutes of pressure sensor 28.Estimate when receiving wafer W from SCPL as described above In the case of there occurs rupture for wafer W, make the base of conveying arm 2 in the state of being attracted from the suction hole 24 of loading plate 45 Platform 21 declines, and as shown in figure 36 like that reapposes wafer W in loading plate 45.The conveying arm 2 is obtained by control unit 5 to decline The detection signal of pressure sensor 28A in journey.
Moreover, detection signal of the control unit 5 based on pressure sensor 28A, with obtaining detection signal from pressure sensor 28 Situation be equally generated the time series data of differential value.Acted as reply, time sequence of the control unit 5 based on the differential value Column data carries out the confirmation of wafer W ruptures.More specifically, each time for the detection signal for getting pressure sensor is calculated Differential value aggregate-value.The waveform for the aggregate-value that Figure 37 graphical representation is got as.Transverse axis is time (unit： Second), the longitudinal axis is aggregate-value (unit：kPa).Control unit 5 by shown in the waveform and Figure 38 of accessed aggregate-value in wafer W The waveform of the aggregate-value obtained in the case of not rupturing is compared, to confirm that wafer W has crack-free.
The waveform of the aggregate-value is illustrated, in the case where wafer W there occurs rupture, wafer W is being positioned over load Fragment is moved on loading plate 45 when putting on plate 45, so that the pressure at expulsion in blast pipe 26 changes.Thus, with wafer W Situation about not rupturing is different, occurs more sharp crest in the waveform of aggregate-value like that as shown in figure 37.Thus, By being compared as described above to waveform, it is able to confirm that wafer W has crack-free.In addition, in the component beyond SCPL, It can be similarly configured to that suction hole 24 and pressure sensor 28A can be set with the SCPL to confirm that wafer W ruptures.
In addition, such as handing-over component TRS can also be configured to possess mounting as Figure 35 temperature adjustment component SCPL Plate 45 is used as mounting portion, msy be also constructed to possess three vertical pins and is used as mounting portion and can be supported on wafer W On the pin.When the area overlapping with the wafer W back side of loading plate 45 is set into the first area, the back side of three pins and wafer W Overlapping area is less than the second area of the first area.The mutually different handing-over component TRS of these structures is arranged at coating With developing apparatus 1.Ruptured moreover, being estimated as wafer W when receiving wafer W from the loading plate 45 with the first area In the case of, act, as described above reappose wafer W in loading plate 45 as reply.From with second area Three pin joints are estimated as in the case that wafer W there occurs rupture, acting as reply, can also making conveying arm when receiving wafer W Action stop without reapposing wafer W.Thereby, it is possible to more reliably suppress wafer W separation of fragments.
, should when be estimated as reply action when wafer W has foreign matter attachment alternatively, it is also possible to set travel mechanism Travel mechanism moves the mounting portion of component, can be positioned in wafer W at the different positions of fork 22.That is, As long as can be so that the relative position of fork 22 and wafer W when estimating exception be with the fork 22 when being received again afterwards The modes different from wafer W relative position are joined.In addition, in above-mentioned example, having different being estimated as wafer W When thing adheres to, by wafer W mountings (interim to place) in wafer W reception source, received again using fork 22, but also may be used So that wafer W is positioned over into the component different from reception source or bearing part C mounting portion C1 temporarily, so that above-mentioned relative position is not Same mode receives wafer W again.But, in order to prevent make wafer W be moved to as described above be used for place temporarily Wafer W is dropped from fork 22 before place, and wafer W reception source is preferably positioned over temporarily.
Then, using with illustrate centered on the difference of above-mentioned foreign matter removal unit 4 shown in Figure 39 and Figure 40 as The 4A of other configuration examples of foreign matter removal unit.Foreign matter removal unit 4A possesses housing 40 and is arranged in housing 40 The rotating mechanism 46 at top, rotating mechanism 46 is connected with horizontally be arranged at the surface of the disk 44 in housing 40 via spring 47 Connect.Rotating mechanism 46 can be such that disk 44 is rotated around vertical axis.
The fork 22 that base station 21 is moved to the conveying arm 2 of progressive position from going-back position can be via being arranged at housing 40 Opening portion 48 and enter in housing 40.By making 21 liters of base station in the state of being entered in the fork 22 as in housing 40 Drop, can press the state that the pad 23 of fork 22 is brought into close contact therewith making the back side of disk 44 by the force of spring 47 The back side of (state shown in Figure 40) and disk 44 is switched between leaving the state (state shown in Figure 39) of pad 23.For example The lifting of the repeatedly base station 21 is carried out, when the state of pad 23 is left at the back side as disk 44, is changed using rotating mechanism 46 The direction of disk 44.Thus, when every time rising base station 21,23 diverse location all with disk 44 of pad is brought into close contact, therefore energy It is enough more reliably to remove the foreign matter for being attached to pad 23.
(abnormality detection and reply during the moving back and forth of fork)
Hereinafter, in the pressure at expulsion during the advance and retreat of the fork 22 for exporting or receiving wafer W in blast pipe 26 Action during decline is illustrated.When pressure at expulsion declines as, it is possible to occur wafer W and slided on fork 22 and brilliant The situation that circle W position shifts.Therefore, after exception is detected, carry out for suppress the position skew action, should The detection of position skew.Each substrate carrying mechanism is provided with wafer position test section 6, can detect that the position is offset.
Reference picture 41 illustrates the wafer position test section 6 for being typically arranged at conveying arm 2.Wafer position test section 6 Possess and four groups of light projector sensors 61 of base station 21 are respectively bearing on and by optical sensor 62 by support (not shown).Shape It is arranged into the light projector sensor 61 with group and by optical sensor 62, along the vertical direction by by the fork 22 positioned at going-back position The wafer W of supporting peripheral part is clipped in the middle, and the light irradiated upward from light projector sensor 61 a part by wafer W Block, another part is not blocked by wafer W and is irradiated to from wafer W side after by optical sensor 62.That is, It is respectively corresponding with wafer W Zhou Duan position by the size in the region of the light of optical sensor 62, will be with the light by optical sensor 62 The corresponding signal output of size in region is to control unit 5.
In addition, in top view, circumferencial direction of each group along wafer W is configured at spaced intervals, and control unit 5 is configured to Can be based on from respectively being calculated wafer W all end positions by the output signal of optical sensor 62 and then calculate wafer W center Position.Hereinafter, typically illustrate wafer W between conveying arm 2 and bearing part C mounting portion C1 using Figure 42, Figure 43 Handing-over.In these Figure 42, Tu43Zhong, the expression of wafer position test section 6 is eliminated.
(abnormal 1 during output)
In the state of base station 21 stops at mounting portion C1 nearby side, the fork 22 that remain wafer W starts from retrogressing (moment t10) is moved in position to the advanced position, and the time series data of differential value is obtained in the moving process, carries out time sequence Differential value and the comparison of defined a reference value in column data.When result of the comparison is that differential value exceedes a reference value, it is determined as In the presence of exception, fork 22 is set to reduce speed now (moment t11, Figure 42).The translational speed of fork 22 is passed through over time, It is gradually reduced with close progressive position, and fork 22 is stopped (moment t12, Figure 43) in the progressive position.Afterwards, For example judge whether the value (analogue value) of the pressure at expulsion detected by back pressure transducer 28 in the stopping being higher than a reference value, In the case where being determined as the not higher than a reference value, such as output represents the abnormal alarm of pressure at expulsion, makes to enter using conveying arm 2 Capable conveying stops.In the case where being determined as that the analogue value is higher than a reference value, wafer W is carried out by the lifting action of base station 21 To mounting portion C1 handing-over.Then, if wafer W has been likely to occur exception, and wafer W is marked.
The operating state of t10~moment t12 fork 22 at the time of indicated by the solid line above-mentioned in Figure 44 curve map.It is bent Transverse axis, the longitudinal axis of line chart represent time, the translational speed of fork 22 respectively.In addition, the chain-dotted line in curve map is to carry out Compare and show not to be determined as the line of the operating state of abnormal fork 22 under normal circumstances during advance, curve map T13 is the timing that fork 22 reduces speed now under normal conditions at the time of middle, and moment t14 is fork 22 under normal conditions Stop at the timing of progressive position.As illustrated on the graph, when being determined to have abnormal, fork 22 is determined in more early than moment t13 When reduce speed now.That is, the timing ratio that fork 22 reduces speed now is early at the time of presetting.
(abnormal 1 during reception)
In the state of base station 21 stops at mounting portion C1 nearby side, wafer W fork 22 is received from mounting portion C1 Start from progressive position draw back position movement (moment t20).That is, after fork 22 is since the state shown in Figure 43 Move back.In the moving process obtain differential value time series data, carry out time series data in differential value with it is defined The comparison of a reference value.When result of the comparison is that differential value exceedes defined a reference value, it is determined to have exception, opens fork 22 Begin to slow down (moment t21).Then, the translational speed of fork 22 is passed through over time, i.e. with close to going-back position and gradually Decline, and fork 22 is stopped (moment t22) in going-back position.Afterwards, with before fork 22 is located in abnormal 1 in output When entering position similarly, the analogue value based on pressure at expulsion is judged, according to the result of determination, such as output represents exhaust pressure The conveying stopping that the abnormal alarm of power and making is carried out using conveying arm 2, or wafer W is marked.Also, also carry out brilliant Whether circle W center is located at the judgement in permissible range, and the result even in the judgement carried out based on the analogue value is not enter In the case of the stopping of row conveying, also make conveying in the case of not being located in the center for being judged as wafer W in permissible range The conveying that arm 2 is carried out stops, and exports alarm.
Figure 45 curve map in the same manner as Figure 44 curve map, the fork 22 indicated by the solid line when being determined as above-mentioned abnormal Operating state, the operating state of the fork 22 when representing normal with chain-dotted line.T23 is in normal situation at the time of in curve map The timing that lower fork 22 reduces speed now, moment t24 is the timing that fork 22 stops at going-back position under normal conditions.Such as song As shown in line chart, when being determined to have abnormal, fork 22 reduces speed now in the timing more early than moment t23.That is, The timing ratio that fork 22 reduces speed now is early at the time of presetting.
In abnormal 1 in output and abnormal 1 when receiving, the speed of fork 22 is controlled as described above be for Suppress because causing pressure at expulsion to decline exception, result wafer W due to inertia forwards or rear movement and with fork 22 it Between the speed difference that produces, so as to suppress position skews of the wafer W on fork 22.In addition it is also possible to from when detecting abnormal Carving t11, t21 and rising makes the speed of fork 22 keep speed during moment t11, t21 unchangeably to be elapsed respectively, then makes the speed Degree declines, but the speed of fork 22, which is controlled, as shown in each curve map can further reduce above-mentioned speed Difference, so as to more reliably suppress above-mentioned position skew.
(abnormal 2 during output)
Extremely 1 action when abnormal 2 action during output described below is that instead of above-mentioned output and carry out Action, illustrate centered on the difference of abnormal 1 action during by with the output.Remain wafer W fork 22 During going-back position is moved to the advanced position, the time series data of differential value is obtained, when differential value exceedes a reference value When, it is determined to have exception, when being judged as, fork 22 is promptly slowed down and is stopped (being now set to for example Moment t31).Thus, fork 22 stops before the progressive position for example shown in Figure 43 is reached.Then, it is determined that in the stopping Whether the analogue value of the pressure at expulsion of acquisition is higher than a reference value, in the case where the analogue value is higher than a reference value, starts fork 22 Retreat (will now be set to such as moment t32).The speed during retrogressing than it is normal when fork 22 astern speed it is low.
Then, fork 22 is stopped and (will be now set to such as moment t33) when fork 22 reaches going-back position, stop at this In the case that the analogue value of the pressure at expulsion got when only is higher than a reference value, detection wafer W center, and judge to be somebody's turn to do Whether center is in permissible range.When being determined as that center is in permissible range, make the carry forward of fork 22 Put movement.The pace when forward speed ratio is normal is low.
Then, (such as moment will be now set to when fork 22 like that as shown in figure 43 reaches progressive position and stops T34), judge whether the analogue value of the pressure at expulsion got in the stopping being higher than a reference value, be judged to being higher than a reference value In the case of, with it is normal when wafer W is joined to mounting portion C1 likewise by the lifting action of base station 21, and set the crystalline substance Circle W has been likely to occur exception, and wafer W is marked.In the analogue value for being judged to obtaining in moment t31, t33, t34 In the case of being not higher than a reference value, output represents the abnormal alarm of pressure at expulsion, and stops the action of conveying arm 2, no The conveying action of wafer W after carrying out again at the time of the judgement is carried out.In addition, sentencing between moment t33 and moment t34 In the case of being determined as center not in permissible range in fixed, stop the action of conveying arm 2, no longer carry out later crystalline substance Circle W conveying.
(abnormal 2 during reception)
Extremely 1 action when abnormal 2 action during reception described below is that instead of above-mentioned reception and carry out Action, illustrate centered on the difference of abnormal 1 action during by with the reception.Remain wafer W fork 22 During progressive position draws back position movement, the time series data of differential value is obtained, when differential value exceedes a reference value When, it is determined to have exception, when being judged as, fork 22 is promptly slowed down and is stopped (being now set to for example Moment t41).Then, it is determined that whether the analogue value of the pressure at expulsion obtained in the stopping being higher than a reference value, it is higher than in the analogue value In the case of a reference value, fork 22 is set to start again at retrogressing (will now be set to such as moment t42).The speed ratio during retrogressing is just The astern speed of fork 22 when often is low.
Then, fork 22 is reached going-back position and is stopped and (will now be set to such as moment t43), obtained in the stopping In the case that the analogue value of the pressure at expulsion arrived is higher than a reference value, if wafer W has been likely to occur exception, and to wafer W It is marked.It is then detected that wafer W center, and judge the center whether in permissible range.When sentencing When being set to center in permissible range, conveying arm 2 is utilized to continue to convey wafer W.It is being determined as that t41, t43 are obtained at the moment In the case that the analogue value taken is not higher than a reference value, output represents the abnormal alarm of pressure at expulsion, and makes the action of conveying arm 2 Stop, the conveying action of the wafer W after no longer carrying out at the time of the judgement is carried out.In addition, after moment t43 on In the case of being determined as center not in permissible range in the judgement of above-mentioned center, stop the action of conveying arm 2 Only, later wafer W conveying is no longer carried out.In addition, in output abnormal 1,2 and abnormal 1,2 when receiving in, in fork 22 move and stop or moved and when stopping from progressive position position of drawing back to the advanced position from going-back position, also based on from The sensor (not shown) acquisition of corresponding with the pressure at expulsion in blast pipe 26 data signal of output with the pressure at expulsion pair The value (digital value) answered carries out having judgement without exception, but omits in the above description.
In addition, etchant resist formation component possesses the rotary chuck for adsorbing and keeping wafer W and rotating wafer W and is used as Wafer W mounting portion, after etchant resist is formed, from nozzle to the wafer W rotated by the rotary chuck periphery Portion supplies diluent, and the unwanted etchant resist of wafer W peripheral part is annularly removed.For the width by etchant resist is removed Degree is set to setting value, and requires rotary chuck to make the pivot of the rotary chuck mode consistent with wafer W center high Join to precision wafer W.Based on it is such the reasons why, compared wafer W when in etchant resist formation component with heating component 15 and carried During the permissible range of the skew between the center and setting position of wafer W when being placed in mounting portion, etchant resist formation component The permissible range is smaller than the permissible range of heating component 15.
Therefore, control signal is sent from control unit 5 to conveying arm F3, F4, forming component (second to etchant resist Conveying destination) output wafer W when be determined to have exception in the case of, when carrying out above-mentioned output abnormal 2 in it is illustrated Action, in the case of being determined to have exception when to heating component (first conveying destination) output wafer W, exported When abnormal 1 in illustrated action.That is, determining conveying according to the species of the component of wafer W conveying destination The reply action that arm F3, F4 are carried out.Acted, can be prevented anti-by carrying out reply corresponding with conveying destination like this The removal width of etchant resist becomes abnormal in erosion film formation component, can suppress the decline of the yield rate of product, and omit to The moving back and forth of unnecessary fork 22 during heating component handing-over wafer W, so as to suppress the decline of productivity ratio.
, also can be in the same manner as conveying arm F3, F4 according to the species of wafer W conveying destination on other conveying arms It is controlled, certain in the exception 2 in abnormal 1 during being exported when illustrated control and output in illustrated control One kind control.In addition, being not limited to wafer W or flat-panel monitor system using the substrate of the conveying mechanism conveying of the present invention The glass substrate made.In addition, the device of the application present invention is not limited to coating and developing apparatus, dielectric film can also be applied to Forming apparatus etc..So, the invention is not restricted to above-mentioned each embodiment, each embodiment can suitably be changed or Combination.

Claims (16)

1. a kind of base board delivery device, it is characterised in that possess：
Board holder, it possesses the suction hole for attracting and keeping substrate；
Travel mechanism, it is used to move the board holder；
Pressure detecting portion, the pressure for the attraction path that its pair is connected with the suction hole is detected；And
Control unit, it detects the different of the conveying of the substrate based on the differential value of the detected pressure value of the pressure detecting portion Often.
2. base board delivery device according to claim 1, it is characterised in that
The control unit estimates abnormal species based on the differential value.
3. base board delivery device according to claim 1 or 2, it is characterised in that
The estimated abnormal species is at least one of following exception：
Carrying state of the substrate in the first mounting portion for receiving the substrate for the board holder is abnormal；
Have different between the substrate and the board holder received by the board holder from first mounting portion Thing is present；
The substrate breakage received by the board holder from first mounting portion；And
After the board holder receives the substrate from first mounting portion and the substrate is delivered to and is used as this The damage that the substrate is produced before second mounting portion of the conveying destination of substrate.
4. the base board delivery device according to Claims 2 or 3, it is characterised in that
The control unit exports the control signal for carrying out reply action corresponding with abnormal species.
5. base board delivery device according to claim 4, it is characterised in that
It is used as the reply action being estimated as in the case of carrying state exception of the substrate in first mounting portion, institute State action of the control unit to the travel mechanism to be controlled, to connect from first mounting portion in the board holder The ratio of the time as inactive state before receiving after the substrate and the substrate being delivered into second mounting portion does not have Have estimate in the case of exception should time as inactive state it is long.
6. base board delivery device according to claim 4, it is characterised in that
It is used as the reply action being estimated as in the case of carrying state exception of the substrate in first mounting portion, institute State action of the control unit to the travel mechanism to be controlled, to pass through first mounting portion in the board holder Before receiving after the substrate and conveying the substrate to second mounting portion, by the substrate again to the first mounting Portion is conveyed.
7. the base board delivery device according to any one of claim 4 to 6, it is characterised in that
It is used as the reply action for being estimated as having between the substrate and the board holder in the presence of foreign matter, institute State action of the control unit to the travel mechanism to be controlled, to cause before the substrate is delivered into second mounting portion By the substrate-placing in the interim placement section for placing temporarily, then, by the board holder so that the board holder The mode different from estimating relative position during exception relative to the relative position of the substrate is from the interim placement section Receive the substrate.
8. base board delivery device according to claim 7, it is characterised in that
The control unit is based on the detected pressure value obtained when receiving substrate from the interim placement section by board holder Differential value, be controlled come the action to the travel mechanism, should so that the board holder is moved to foreign matter removal portion Foreign matter removal portion is used to remove the foreign matter for being attached to the board holder.
9. the base board delivery device according to any one of claim 4 to 8, it is characterised in that
It is used as the reply action being estimated as in the case of the substrate breakage, action of the control unit to the travel mechanism It is controlled, to cause the substrate received by the board holder being placed in first mounting portion again, makes the base Plate stops to the conveying of second mounting portion.
10. the base board delivery device according to any one of claim 4 to 9, it is characterised in that
As the reply action being estimated as in the case that the substrate generation is damaged, the control unit exports alarm output section Alarm.
11. the base board delivery device according to any one of claim 1 to 10, it is characterised in that
The base station for setting the board holder is also equipped with,
The travel mechanism makes advance and retreat between progressive position and going-back position of the board holder on the base station,
In the board holder to remain the state of the substrate from one in the progressive position and the going-back position Direction the opposing party move during when detecting abnormal, the control unit output control signal to carry out the first advance and retreat control, In the first advance and retreat control, the translational speed of the board holder is set to start to reduce in the timing more early than predetermined timing, and And the opposing party with the board holder into the progressive position and the going-back position is close and make the mobile speed Degree reduces.
12. the base board delivery device according to any one of claim 1 to 11, it is characterised in that
Possess the base station for setting the board holder,
The travel mechanism makes advance and retreat between progressive position and going-back position of the board holder on the base station,
The base station possesses substrate position test section, and the substrate position test section is used for being in described in the going-back position The position for the substrate that board holder remains detected,
Moved in the board holder with remain the state of the substrate from the going-back position to the progressive position During when detecting abnormal, the control unit output control signal second is retreated control with carrying out the second advance and retreat control at this In, the state for making the board holder to remain the substrate is moved to the going-back position, to be examined by the substrate position Detected in survey portion.
13. base board delivery device according to claim 12, it is characterised in that
Make the board holder from the going-back position to institute in order to which the substrate is delivered into the first conveying destination When detecting abnormal during stating progressive position movement, the control unit output control signal is controlled with carrying out first advance and retreat System,
Make the substrate in order to which the substrate is delivered into the second conveying purposes different from the described first conveying destination When maintaining part detects abnormal during being moved from the going-back position to the progressive position, the control unit output control Signal is controlled with carrying out second advance and retreat.
14. a kind of substrate carrying method, it is characterised in that including following process：
Attract substrate using suction hole, the substrate is held in board holder；
The board holder movement for making to remain the substrate using travel mechanism；
The pressure of the attraction path connected using pressure detecting portion pair with the suction hole is detected；And
The differential value of detected pressure value based on the pressure detecting portion, come the exception of the conveying that detects the substrate.
15. substrate carrying method according to claim 14, it is characterised in that
Also include following process：Abnormal species is estimated based on the differential value.
16. substrate carrying method according to claim 15, it is characterised in that
Also include following process：Carry out reply action corresponding with the estimated abnormal species.
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