CN114295199A - Wafer conveying system detection method and wafer conveying system - Google Patents
Wafer conveying system detection method and wafer conveying system Download PDFInfo
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Abstract
The invention relates to the technical field of semiconductor processing, and provides a wafer conveying system and a detection method thereof. The wafer transmission system detection method comprises the following steps: obtaining a vibration signal of the wafer in the separation process of the wafer and the wafer contactor; and if the vibration signal is determined to be greater than or equal to a preset threshold value, sending prompt information. The wafer transmission system detection method and the wafer transmission system provided by the invention are used for solving the defects that the wafer contactor and the wafer are easy to be adhered and the processing process and precision of the wafer are influenced in the related technology, and whether the wafer contactor needs to be replaced can be determined through a quantized vibration signal.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a wafer conveying system and a detection method thereof.
Background
In integrated circuit fabrication, a transfer member (e.g., a cleaning robot) carries a wafer thereon for precise transfer movement. And the wafer contactor on the transmission component plays a role in supporting the wafer, and the transmission component carries the wafer to reach the appointed station and then places the wafer on the appointed station. Along with the continuous operation of equipment, the wearing and tearing of wafer contactor, when the wafer leaves the transfer unit, take place the adhesion easily between wafer contactor and the wafer, the wafer receives the influence of adhesion, can influence the precision of wafer and the machining precision of subsequent handling, if appear to the problem of colliding with of subsequent station to and the wafer is polluted and scrapped, leads to the loss of wafer course of working big, and the machining procedure needs optimization urgently.
Disclosure of Invention
The invention provides a wafer transmission system detection method and a wafer transmission system, which are used for solving the defects that in the related technology, adhesion is easy to occur between a wafer contactor and a wafer, and the processing process and precision of the wafer are influenced, and whether the wafer contactor needs to be replaced can be determined through quantized vibration signals.
The invention provides a wafer conveying system detection method, which comprises the following steps:
obtaining a vibration signal of the wafer in the separation process of the wafer and a wafer contactor of the transmission component;
and if the vibration signal is determined to be greater than or equal to a preset threshold value, sending prompt information.
In the wafer transmission system detection method provided by the invention, in the step of acquiring the vibration signal of the wafer in the separation process of the wafer and the wafer contactor of the transmission component,
acquiring a first trigger signal when the transmission component reaches a target position, and starting to acquire a detection vibration signal;
acquiring a second trigger signal for separating the wafer contactor from the wafer, delaying a preset time, and ending acquiring the detection vibration signal;
determining the vibration signal based on the detected vibration signal.
According to the wafer conveying system detection method provided by the invention, the target position is a position where the conveying component is suitable for placing the wafer.
In the wafer transmission system detection method provided by the invention, in the step of acquiring the vibration signal of the wafer in the separation process of the wafer and the wafer contactor of the transmission component,
obtaining the detection amplitude of the wafer through a distance sensor, and determining the vibration signal based on the detection amplitude, wherein the detection amplitude is recorded as A1～An。
In the wafer transfer system detection method provided by the invention, in the step of acquiring the detection amplitude of the wafer through the distance sensor and determining the vibration signal based on the detection amplitude,
and carrying out differential processing on the detected amplitude to obtain a first calculated amplitude, and taking the first calculated amplitude as the vibration signal, wherein the preset threshold is a first preset amplitude.
In the wafer transfer system inspection method provided by the present invention, in the step of differentiating the inspection amplitude to obtain the first calculated amplitude,
obtaining the amplitude of the first order differential processing, denoted as Bn-1＝An-An-i；
Obtaining a first calculated amplitude, denoted C, of the second order differential processn-2＝Bn-1-Bn-1-i；
Wherein i is a positive integer and is an integer greater than 3, and n > i.
In the wafer transfer system detection method provided by the invention, in the step of acquiring the detection amplitude of the wafer through the distance sensor and determining the vibration signal based on the detection amplitude,
and carrying out differential processing and weighting processing on the detected amplitude to obtain a second calculated amplitude, and taking the second calculated amplitude as the vibration signal, wherein the preset threshold is a second preset amplitude.
In the wafer transfer system detection method provided by the invention, in the step of acquiring the detection amplitude of the wafer through the distance sensor and determining the vibration signal based on the detection amplitude,
acquiring at least two groups of detection amplitudes through at least two distance sensors; each distance sensor acquires the detection amplitude of different positions of the wafer;
at least two groups of detection amplitudes are subjected to differential processing to obtain at least two groups of first calculation amplitudes, and/or at least two groups of detection amplitudes are subjected to differential processing and reinforcement processing to obtain at least two groups of second calculation amplitudes;
in the step of sending a prompt message if the vibration signal is determined to be greater than or equal to the preset threshold value,
and if the maximum value of at least one of the first calculated amplitude and the second calculated amplitude is determined to be greater than or equal to the corresponding preset threshold value, sending prompt information.
In the wafer transfer system detection method provided by the invention, in the step of sending the prompt message when the vibration signal is determined to be greater than or equal to the preset threshold value,
the prompt information comprises at least one of early warning information and alarm information, and the time for replacing the wafer contactor is confirmed according to the prompt information.
The invention also provides a wafer transmission system, which comprises a bearing part and a transmission part for transmitting the wafer to the bearing part, wherein the bearing part is provided with a sensor for acquiring a vibration signal, and the vibration signal is the vibration generated by the wafer in the separation process of the wafer and the wafer contactor.
According to the wafer conveying system, the sensor used for collecting the vibration signals is a distance sensor, the bearing part is provided with the supporting piece, the supporting piece is provided with the groove body into which the wafer can be inserted, and the top wall or the bottom wall of the groove body is provided with the distance sensor.
According to the detection method of the wafer conveying system, the vibration signal generated by the wafer is obtained in the separation process of the wafer and the wafer contactor, the friction between the wafer contactor and the wafer is quantified through the vibration signal, the vibration signal is compared with the preset threshold value, whether the wafer contactor needs to be replaced or not is determined, a worker is reminded of solving the problem in time, waste caused by replacement of the wafer contactor in advance and the influence of production halt on the productivity are avoided, and the problem of poor judgment accuracy caused by interference of subjective factors in judgment modes such as manual replacement of the wafer contactor after sound is heard or replacement of the wafer contactor according to experience is solved.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a wafer handling system inspection method according to the present invention;
FIG. 2 is a second schematic flow chart of the wafer transfer system inspection method according to the present invention;
FIG. 3 is a graph of amplitude versus time of a distance sensor in the wafer handling system inspection method of the present invention;
FIG. 4 is a graph of second calculated amplitude versus time for a second order differential process in the wafer handling system inspection method of the present invention;
FIG. 5 is a graph illustrating the relationship between the intensity of the detection sound detected by the auditory sensor and the time in the wafer transfer system detection method according to the present invention;
FIG. 6 is a graph showing the relationship between the detected sound intensity, the sound intensity after the second order differential processing, and the sound intensity after the weighting processing and the time in the wafer transfer system inspection method according to the present invention;
FIG. 7 is a schematic top view of a wafer transfer system according to the present invention;
FIG. 8 is a schematic side view of a wafer transfer system according to the present invention;
fig. 9 is a partially enlarged schematic view of a portion a in fig. 8.
Reference numerals:
1. a conveying member; 11. a wafer contactor; 12. a linear motor; 13. a substrate;
2. a receiving member; 21. a first receiving member; 22. a second receiving member; 23. a support member; 24. an ultrasonic ranging sensor;
3. a wafer stage;
4. an equipment frame;
5. and (5) a wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the first aspect of the present invention, referring to fig. 1, provides a wafer conveying system detection method, including:
when the wafer is separated from the wafer contactor of the transfer unit and placed on the receiving unit, the wafer contactor is worn due to long-term use, the surface friction of the wafer contactor is increased, the wafer and the wafer contactor are bonded to each other, and the wafer is vibrated in the process of being separated from the wafer contactor due to the bonding. The vibration signal is a vibration signal, such as amplitude, vibration frequency, etc., generated by the wafer due to the adhesion of the wafer and the wafer contactor in the separation process of the wafer and the wafer contactor.
The vibration signal can be a signal detected by a sensor, the influence of the detected vibration signal on external conditions is small, the setting of a preset threshold value in a system is not influenced, and the probability of false alarm is within an allowable range; or the vibration signal is a calculation vibration signal obtained by detecting the vibration signal and processing data, and the calculation vibration signal can represent the vibration generated in the separation process of the wafer and the wafer contactor more accurately, so that the condition of false alarm is avoided.
And step 120, if the vibration signal is determined to be greater than or equal to the preset threshold value, sending prompt information.
The prompt information is used for indicating whether the wafer contactor needs to be replaced or not, and can be early warning information, alarm information and the like, and the prompt information can be acousto-optic prompt, voice prompt, text information prompt and the like, so that a worker can check the wafer contactor, and then the worker can replace the wafer contactor according to the indication of the prompt information. The preset threshold value can be obtained through experiments according to conditions such as alarm prompt in subsequent procedures, the processing precision of the wafer or the yield of wafer processing. And determining that the vibration signal is greater than or equal to a preset threshold, wherein the maximum value of the vibration signal can be selected to be compared with the preset threshold, the amplitude generated when the wafer is separated from the wafer contactor is maximum, and the maximum value can represent the state when the wafer is separated from the wafer contactor. Of course, the average value of the vibration signal may also be selected to be compared with a preset threshold.
The preset threshold is the amplitude or vibration frequency corresponding to the vibration signal.
The wafer transmission system detection method can be used for quantifying adhesion when the wafer is separated from the wafer contactor, and further performing early warning and alarming through data analysis. That is, through detecting the wafer and the separation of wafer contactor in-process, the vibration signal that the wafer produced combines the vibration signal of quantization to judge whether the wafer contactor changed, in time reminds the staff to solve the problem, avoids changing the waste that the wafer contactor caused and production shut down in advance to cause the influence on the productivity simultaneously, has solved and has relied on the artificial sound of hearing to change the wafer contactor, or has had the problem of subjective factor according to judging modes such as experience change wafer contactor.
In some embodiments, in step 110, the step of acquiring a vibration signal of the wafer during separation of the wafer from the wafer contactor of the transfer unit,
obtaining the detection amplitude of the wafer through a distance sensor, and determining the vibration signal based on the detection amplitude, wherein the detection amplitude is recorded as A1～An。
The magnitude of the adhesive force between the wafer and the wafer contactor is quantified by the amplitude of the wafer to determine whether the wafer contactor needs to be replaced. The amplitude of the wafer is detected, the interference of environmental factors to detection results is small, and the detection precision is favorably improved. When the accuracy of detecting the amplitude is high enough, the setting of the preset threshold value is not affected, that is, the probability of generating the false alarm is within the allowable range, the detected amplitude can be used as the vibration signal. The distance sensors are various in types, and the corresponding distance sensors can be selected according to the detection precision. The distance sensor can be an ultrasonic distance sensor, an infrared distance sensor, a laser ranging sensor and the like, and can be selected specifically according to needs.
The amplitude of the wafer transmitted by each wafer contactor is the changed data, the instantaneous amplitude of the wafer separated from the wafer contactor is the maximum, the amplitude detected by the distance sensor is the amplitude of each wafer at a plurality of moments, and the maximum amplitude of the wafer is compared with a preset threshold value. Of course, in some cases, the average amplitude of the wafer over a period of time may be compared to a predetermined threshold.
The detection amplitude can be obtained by detecting through the distance sensor, the types of the distance sensor are various, and the corresponding distance sensor can be selected according to the detection precision.
Such as optical distance sensor, ultrasonic distance sensor, infrared distance sensor, laser range finding sensor etc. the sensor has the range finding function in order to obtain and detect the amplitude, and the kind of sensor is concrete can be selected as required.
In some embodiments, the distance sensor is an ultrasonic ranging sensor or an optical distance sensor. The ultrasonic distance measuring sensor and the optical distance sensor have the characteristics of small environmental interference, high measuring precision and long service life.
It should be noted that, when the accuracy of the detected amplitude is high enough, and the setting of the preset threshold is not affected, that is, the probability of false alarm is within the allowable range, the detected amplitude can be directly compared with the corresponding preset threshold, and the prompt information is sent according to the comparison result.
In some embodiments, step 110, i.e., the vibration signal of the wafer during separation of the wafer from the wafer contactor of the transfer component; step 120, determining that the vibration signal is greater than or equal to a preset threshold, and sending a prompt message, specifically:
step 210, acquire wafer and transferDetecting amplitude of the wafer in the separation process of a wafer contactor of the component, wherein the detected amplitude is marked as A1～An；
Step 220, obtaining the calculated amplitude of the detected amplitude after data processing, wherein the data processing is differential processing for a plurality of times or combined with the differential processing and weighting processing for a plurality of times;
and step 230, if the maximum value in the calculated amplitudes is determined to be greater than or equal to a preset threshold value, sending prompt information to confirm the time for replacing the wafer contactor according to the prompt information.
The magnitude of the adhesive force between the wafer and the wafer contactor is quantified by the amplitude of the wafer (the amplitude of the wafer generated during the separation of the wafer from the wafer contactor) to determine whether the wafer contactor needs to be replaced. In the amplitude detection process of the wafer, the interference of environmental factors to the detection result is small, and the detection precision is favorably improved.
In some embodiments, in step 210, the step of obtaining the detected amplitude of the wafer during separation of the wafer from the wafer contactor of the transfer unit,
step 211, acquiring a first trigger signal when the transmission component reaches a target position, and starting to acquire the detection amplitude;
when the transfer member reaches the position above the receiving member and is positioned at a position where the wafer can be placed, the transfer member releases the supporting force for the wafer, and the wafer automatically falls on the receiving member under the action of gravity. When the transmission component is brought to the target position, the transmission component can release the supporting force of the wafer, and detection is started at the moment, so that the wafer is prevented from being separated from the wafer contactor too fast and being missed, and the amplitude of the wafer can be accurately detected when the wafer is separated from the wafer contactor.
Step 212, obtaining a second trigger signal for separating the wafer contactor from the wafer, delaying a preset time, and ending obtaining the detection amplitude.
The controller sends a signal for releasing the supporting acting force to the transmission component, so that the wafer and the wafer contactor start to be separated, and the signal can be used as a second trigger signal; or, when the wafer is separated from the wafer contactor, the stress state of the wafer contactor changes, and the controller obtains a signal indicating that the stress state of the wafer contactor changes, and then the signal is used as the second trigger signal.
Here, the preset duration of the delay time can be selected according to needs. In some cases, the wafer and wafer contactor separation speed is on the order of milliseconds, and the preset time period may be set to the order of milliseconds or seconds. It should be noted that the predetermined time period needs to be ended before the transfer unit carries the next wafer to the target position.
The detection amplitude is obtained according to the time period in the embodiment, so that the amplitude of the separation of the wafer and the wafer contactor can be accurately captured, invalid data can be reduced, and the data volume needing to be processed is reduced. Of course, other vibration signals may be collected in the manner of step 211 and step 212 described above.
In some embodiments, the target position is a position where the transfer member is located to place the wafer in step 211.
The transmission part reaches the target position and can be detected and known through a trigger sensor; or the controller learns that the transmission part completes the transmission action, and the transmission part reaches the target position.
In some embodiments, the step of obtaining a detected amplitude of the wafer by a distance sensor, determining the vibration signal based on the detected amplitude,
and carrying out differential processing on the detected amplitude to obtain a first calculated amplitude, and taking the first calculated amplitude as a vibration signal, wherein the preset threshold is a first preset amplitude.
The data are more stable through differential processing, and the judgment result of the wafer contactor is more accurate. The preset amplitude is a result obtained by previously differentiating the test result.
The differential processing may be first order differential processing, second order differential processing, or multiple order differential processing.
In some embodiments, in the step of differentiating the detected amplitude to obtain a first calculated amplitude,
obtaining the amplitude of the first order differential processing, denoted as Bn-1＝An-An-1；
Obtaining the amplitude of the second order differential process, denoted as Cn-2＝Bn-1-Bn-1-i；
Wherein the amplitude of the second order differential processing is taken as a first calculated amplitude, i is a positive integer, n is an integer greater than 3, and n > i.
In particular, the detected amplitude A is collected1、A2、A3、A4……An；
Amplitude B after first order differential processing1＝A2-A1、B2＝A3-A2、B3＝A4-A3……Bn-1＝An-An-1；
Amplitude C after second order differential processing1＝B2-B1、C2＝B3-B2……Cn-2＝Bn-1-Bn-2. In this case, i is 1.
In some embodiments, the step of obtaining a detected amplitude of the wafer by a distance sensor, determining the vibration signal based on the detected amplitude,
and carrying out differential processing and weighting processing on the detected amplitude to obtain a second calculated amplitude, and taking the second calculated amplitude as a vibration signal, wherein the preset threshold is a second preset amplitude.
On the basis of differential processing, weighting processing is carried out, namely, the differential result and the detection result are added to obtain a second calculation amplitude, so that data analysis is more accurate, and the judgment result of the wafer contactor is more accurate.
Compared with a method only performing differential processing, the method of the embodiment combines the differential processing and the weighting processing, so that data is more accurately and intuitively expressed, and the detection accuracy is improved.
In some embodiments, in the steps of performing the differentiation process and the weighting process on the detected amplitudes,
obtaining the amplitude of the first order differential processing, denoted as Bn-1＝An-An-1；
Obtaining the amplitude of the second order differential process, denoted as Cn-2＝Bn-1-Bn-1-i；
Obtaining a second calculated amplitude of the weighting process, denoted as Dn-2＝K1×An+K2×Cn-2；
Wherein i is a positive integer, n is an integer greater than 3, n>i；K1、K2Are weighting coefficients. K1、K2The value of (1) is generally larger than 1, and the weighting processing mainly plays a role in amplifying the amplitude, so that the early warning threshold value and the warning threshold value can be designed in a larger range, and false warning is avoided.
In this embodiment, the second order differentiation method is used to accelerate the computer processing speed, so that the system can respond quickly, i can be adjusted according to different result requirements, wherein the larger the value of i is, the faster the computer processing speed is, but the precision of the second order differentiation is reduced, whereas the smaller the value of i is, the more computer resources are occupied, but the precision of the second order differentiation is improved. K1，K2Further amplification adjustments may also be made based on the final detectability results.
As described above, the maximum value of the first calculated amplitude and the maximum value of the second calculated amplitude are compared with the corresponding preset threshold to determine whether to transmit the prompt message.
In particular, the detected amplitude A is collected1、A2、A3、A4……An；
Amplitude B after first order differential processing1＝A2-A1、B2＝A3-A2、B3＝A4-A3……Bn-1＝An-An-1；
Amplitude C after second order differential processing1＝B2-B1、C2＝B3-B2……Cn-2＝Bn-1-Bn-2；
Amplitude D after weighting1＝K1×A3+K2×C1、D2＝K1×A4+K2×C2……Dn-3＝K1×An+K2×Cn-2. Wherein i is 1.
In some embodiments, before the step of acquiring the detected amplitude of the wafer by the distance sensor, the method further includes:
at least two distance sensors are arranged.
In some embodiments, the step of obtaining a detected amplitude of the wafer by a distance sensor, determining the vibration signal based on the detected amplitude,
acquiring at least two groups of detection amplitudes through at least two distance sensors; each distance sensor acquires the detection amplitude of different positions of the wafer;
at least two groups of detection amplitudes are subjected to differential processing to obtain at least two groups of first calculation amplitudes, and/or at least two groups of detection amplitudes are subjected to differential processing and reinforcement processing to obtain at least two groups of second calculation amplitudes;
in the step of sending a prompt message if the vibration signal is determined to be greater than or equal to the preset threshold value,
and if the maximum value of at least one of the first calculated amplitude and the second calculated amplitude is determined to be greater than or equal to the corresponding preset threshold value, sending prompt information. The plurality of distance sensors simultaneously receive the vibration signals of the wafer and output analysis results, and if the output results of the distance sensors are consistent or within an allowable error range, the next step of data processing is performed to solve the problems that a single distance sensor fails, the detection error of the single distance sensor is large and the like.
Taking two distance sensors as an example, if one of the distance sensors fails, the other distance sensor can be used for monitoring, so as to continuously monitor the wafer transfer process. In addition, two groups of data detected by the two distance sensors can be averaged, so that the stability of the data is better.
Further, the distance sensor is arranged on a receiving part for receiving the wafer, and the distance sensor is fixed above or below the wafer through a support part so as to accurately acquire the amplitude of the wafer. Wherein, distance sensor sets up in the position that is close to the wafer periphery to detect the amplitude of wafer periphery, the vibration range of wafer periphery is great, and the amplitude that detects is more obvious, conveniently judges the wearing and tearing condition of wafer contactor.
In some embodiments, in step 210, the step of obtaining the detected amplitude of the wafer during separation of the wafer from the wafer contactor of the transfer unit,
the detected amplitude is an amplitude of at least one of the upper surface and the lower surface of the wafer.
The detected amplitude may be the amplitude of the upper surface of the wafer, may also be the amplitude of the lower surface of the wafer, and may also be the amplitude of both the upper surface and the lower surface of the wafer.
In some embodiments, if it is determined that the vibration signal is greater than or equal to the preset threshold, in the step of sending the prompt message,
the prompt message includes at least one of a warning message and an alarm message to confirm a time for replacing the wafer contactor according to the prompt message.
When the vibration signal (such as the first calculation amplitude or the second calculation amplitude) is larger than or equal to the warning threshold value, warning information is sent, the warning information is used for prompting that the wafer contactor of a worker needs to be replaced, and when the vibration signal (such as the first calculation amplitude or the second calculation amplitude) is larger than or equal to the warning threshold value, warning information is sent, and the warning information is used for prompting that the wafer contactor of the worker is about to reach the service life.
In one embodiment, referring to FIG. 2, during wafer transfer, a controller (i.e., CPU) controls a transfer unit (e.g., a cleaning robot) to pick up a wafer from a wafer stage, and the wafer is placed on the station of the bearing part, in the placing process, the wafer contactor is separated from the wafer to generate adhesion, so that the wafer vibrates in the separation process of the wafer contactor and the wafer, the ultrasonic ranging sensor 1 and the ultrasonic ranging sensor 2 respectively receive vibration signals, the detection amplitudes received by the two ultrasonic ranging sensors are processed by a data comparison analysis system, the data comparison analysis system carries out the differential processing and weighting processing on the detection amplitudes to obtain vibration signals, and comparing the vibration signal with a preset threshold value in the terminal detection system, and if the vibration signal is greater than or equal to the preset threshold value, performing early warning or alarming.
This embodiment, collect the amplitude of wafer through distance sensor, reunion data analysis makes the prejudgement that clean robot can be intelligent, realizes detecting the terminal point of wafer contactor, carries out accurate analysis through quantized model and data to prejudge whether need change the wafer contactor, in time remind the staff to effectively solve, avoid changing the wafer contactor ahead of time simultaneously and cause the waste of extravagant and production shut down to the productivity and cause, realized the intelligent judgement of datumization.
Referring to fig. 3, the relationship between the detected amplitude (i.e. the displacement of the wafer floating up and down) and the time obtained by the two sets of distance sensors collecting data at the same time after four wafer transfers is shown, where the abscissa is time and the ordinate is the detected amplitude. Referring to fig. 4, a relationship between a first calculated amplitude obtained by the second order differential processing of the data in fig. 3 is shown and time, where the abscissa is time and the ordinate is the first calculated amplitude obtained by the second order differential processing. It can be seen that the data fluctuation of the detected amplitude is small; the data of the first calculation vibration obtained through the second-order differential processing is increased in floating mode, and comparison and judgment are facilitated. In the figure, the preset threshold includes an early warning threshold and an alarm threshold, which are amplitude thresholds. And the controller compares the set threshold value with the second-order differential processing data to carry out early warning and alarm mechanism starting.
In some embodiments, the wafer transfer system inspection method further comprises:
acquiring a first sound signal generated in the separation process of the wafer and a wafer contactor, wherein the wafer contactor is arranged on the transmission part and used for supporting the wafer;
the wafer contactor of the transmission component supports the wafer in the process that the wafer is conveyed to the bearing component through the transmission component; in the process that the wafer is separated from the wafer contactor and placed on the bearing part, the wafer contactor is abraded due to long-term use, the surface friction force of the wafer contactor is increased, adhesion is generated between the wafer and the wafer contactor due to friction, and sound is generated. The first acoustic signal is an acoustic signal that is characteristic of the wafer and wafer contactor separation process due to friction.
Wherein, first sound signal can be the detection sound signal that directly detects through the sensor, that is to say the sound signal that produces of the wafer that detects and wafer contactor separation process, and at this moment, it needs to satisfy to detect sound signal: the accuracy is high enough, and the noise is little enough, does not influence the setting of presetting the threshold value, and the probability of taking place the false alarm is in the allowed range. Or the first sound signal is a second sound signal obtained by processing the detection sound signal, and is suitable for the condition that the accuracy of the detection sound signal is not high. Or the first sound signal is a calculation sound signal obtained by processing and calculating the detection sound signal, the calculation sound signal is subjected to denoising processing and signal integration, the calculation sound signal can represent the sound signal generated in the separation process of the wafer and the wafer contactor more accurately, and the occurrence of false alarm is avoided.
And if the first sound signal is determined to be greater than or equal to the preset threshold value, sending prompt information.
The prompt information can be early warning information, alarm information and the like, and can be acousto-optic prompt, voice prompt, text information prompt and the like, so that a worker can check the wafer contactor, and then the worker can replace the wafer contactor according to the indication of the prompt information. The preset threshold value can be obtained through experiments according to conditions such as alarm prompt in subsequent procedures, the processing precision of the wafer or the yield of wafer processing.
The first sound signal may be a parameter such as intensity and frequency of sound, and the preset threshold is also a parameter such as intensity and frequency.
The first sound signal is greater than or equal to a preset threshold, and the first sound signal may be a maximum sound signal detected or an average sound signal within a preset time period. In some cases, the first sound signal may be the largest sound signal detected, and the determination accuracy is high.
That is, the vibration signal and the first sound signal of the wafer during the separation process of the wafer and the wafer contactor of the transmission component can be acquired simultaneously, and the vibration signal and the first sound signal are combined, and if one of the vibration signal and the first sound signal is greater than or equal to the corresponding preset threshold value, prompt information can be sent. The two detection modes are combined, and the surface state of the wafer contactor can be detected from diversified angles.
The wafer transfer system detection method in this embodiment can quantify the adhesion when the wafer is separated from the wafer contactor, and then perform early warning and alarm through data analysis. That is, whether the wafer contactor is replaced or not is judged by detecting the sound signal generated when the wafer is separated from the wafer contactor and combining the quantized sound signal, so that a worker is reminded of solving the problem in time, meanwhile, the waste caused by replacing the wafer contactor in advance and the influence of production halt on productivity are avoided, and the problem that the wafer contactor is replaced after the sound is heard by the worker or the judgment mode such as replacing the wafer contactor according to experience is interfered by subjective factors to cause poor judgment accuracy is solved.
In some embodiments, the step of acquiring the first sound signal generated during the separation process of the wafer and the wafer contactor further comprises:
acquiring a detection sound signal through an auditory sensor;
determining the first sound signal based on the detection sound signal.
When the accuracy of detecting the sound signal is high enough and the number of false alarms is within the allowable range, the detected sound signal can be used as the first sound signal, and the detected sound signal is compared with the preset threshold value.
The auditory sensor detects information such as frequency and intensity of sound. The technology of the auditory sensor is mature and stable, and the acquisition precision can be selected according to actual needs. Generally, the detection sound signal is a sound signal collected by an auditory sensor, that is, all sound signals in the environment. If the noise signal in the detected sound signal is more, the detected sound signal is processed to obtain a first sound signal.
In some embodiments, in the step of determining the first sound signal based on the detection sound signal,
the detection sound signal is subjected to data processing to obtain a first sound signal.
The data processing comprises denoising processing and data integration, wherein the denoising processing is to remove interference signals in the detection sound signals, such as sound signals of equipment operation and other sound signals in the environment, so as to reserve the sound signals generated in the separation process of the wafer and the wafer contactor in the detection sound signals, perform data integration on the denoised sound signals, and take the data-integrated sound signals as first sound signals.
In some embodiments, the step of processing the detected sound signal data further includes:
acquiring a second sound signal in a preset frequency band in the detected sound signals within a preset time period; can be understood as a step of denoising processing;
obtaining the corresponding detection sound intensity of the second sound signal, wherein the detection sound intensity is recorded as D1～Dn。
The preset time period is a time period for placing the wafer on the carrying component from the transmission component, and the starting point of the preset time period may be: when the wafer is detected to be transferred to the carrier, the end point of the preset period may be: the moment when the substrate of the transport element leaves the carrier element; or, the end of the preset time period may be: and delaying the preset time when the substrate of the conveying part leaves the bearing part. Wherein detecting the position of the wafer may be performed by a camera or a position sensor. In addition, the preset time period may be a time period preset according to a cycle of transferring the wafer by the transfer part, for example, the transfer cycle is 10 seconds, and 2 seconds are monitored every 10 seconds, that is, the preset time period is 2 seconds.
The preset frequency band is the frequency of vibration generated in the separation process of the wafer and the wafer contactor, and can be measured through a preliminary test. The detected detection sound signal is subjected to Fourier transform, and the corresponding characteristic frequency and the corresponding sound intensity can be extracted.
The sound intensity can intuitively and accurately represent the vibration state of the wafer. At this time, the preset threshold is preset sound intensity, the detected sound intensity is compared with the preset sound intensity, and if the detected sound intensity is determined to be greater than or equal to the preset sound intensity, the prompt message is sent.
It should be noted that the second sound signal may also be a sound frequency within a preset sound intensity range, the second sound signal may be used as the first sound signal, and the second sound signal is compared with a preset threshold, where the preset threshold is the preset sound frequency.
In some embodiments, the preset time period is:
acquiring a first trigger signal of the transmission component reaching a target position, wherein the first trigger signal is a starting time point of the preset time period;
and acquiring a second trigger signal for separating the wafer contactor from the wafer, and delaying for a preset time to be the ending time point of the preset time period.
In this embodiment, the first trigger signal and the second trigger signal are the same as the first trigger signal and the second trigger signal for acquiring the vibration signal, which can be referred to above and are not described herein again.
In some embodiments, after the step of obtaining the corresponding detected sound intensity of the second sound signal, the method further includes:
and carrying out differential processing on the detection sound intensity to obtain a first calculated sound intensity, and taking the maximum value in the first calculated sound intensity as a first sound signal, wherein the preset threshold is a first preset sound intensity.
The present embodiment provides a data integration method. The data are more stable through differential processing, and the judgment result of the wafer contactor is more accurate. The first preset sound intensity is a result obtained by previously differentiating the test result. The maximum sound signal generated at the moment when the wafer is separated from the wafer contactor is the largest, the maximum value in the first calculated sound intensity is used as the first sound signal, and the detection accuracy is higher. The differential processing may be first order differential processing, second order differential processing, or multiple order differential processing.
In some embodiments, in the step of differentiating the detected sound intensity,
obtaining the sound intensity of the first order differential processing, denoted as En-1＝Dn-Dn-i；
Obtaining the sound intensity of the second order differential processing, noted as Fn-2＝En-1-En-1-i；
And the sound intensity of the second-order differential processing is used as the first calculated sound intensity, i is a positive integer, i can be adjusted according to different result requirements, n is an integer larger than 3, and n > i.
In particular, the detected sound intensity D is collected1、D2、D3、D4……Dn；
Sound intensity E after first order differential processing1＝D2-D1、E2＝D3-D2、E3＝D4-D3……En-1＝Dn-Dn-1；
Sound intensity F after second order differential processing1＝E2-E1、F2＝E3-E2……Fn-2＝En-1-En-2(ii) a Wherein, i is 1.
In some embodiments, after the step of obtaining the corresponding detected sound intensity of the second sound signal, the method further includes:
and carrying out differential processing and weighting processing on the detected sound intensity to obtain second calculated sound intensity, and taking the maximum value in the second calculated sound intensity as the first sound signal, wherein the preset threshold is the second preset sound intensity.
The present embodiment provides another data integration method. On the basis of the differentiation processing, weighting processing is performed, that is, the differentiation result and the detection result are added to obtain a second calculated sound intensity, so that the sound intensity data are more stable.
Compared with a method only performing differential processing, the method of the embodiment combines the differential processing and the weighting processing, so that data is more accurately and intuitively expressed, and the detection accuracy is improved.
In some embodiments, in the step of performing the differentiation processing and the weighting processing on the detected sound intensity,
obtaining the sound intensity of the first order differential processing, denoted as En-1＝Dn-Dn-i；
Obtaining the sound intensity of the second order differential processing, noted as Fn-2＝En-1-En-1-i；
Obtaining a second calculated sound intensity, G, of the weighting processn＝K3×Dn+K4×Fn-2；
Wherein i is a positive integer, n is an integer greater than 3, n>i；K3、K4Are weighting coefficients.
K3、K4The value of (1) is generally larger than 1, and the weighting processing mainly plays a role in amplifying the sound intensity, so that the early warning threshold value and the warning threshold value can be designed in a wider range, and false warning is avoided.
In this embodiment, the second order differentiation method is used to accelerate the computer processing speed, so that the system can respond quickly, i can be adjusted according to different result requirements, wherein the larger the value of i is, the faster the computer processing speed is, but the precision of the second order differentiation is reduced, whereas the smaller the value of i is, the more computer resources are occupied, but the precision of the second order differentiation is improved. K3，K4Further amplification adjustments may also be made based on the final detectability results.
In particular, the detected sound intensity D is collected1、D2、D3、D4……Dn；
Sound intensity E after first order differential processing1＝D2-D1、E2＝D3-D2、E3＝D4-D3……En-1＝Dn-Dn-1；
Sound intensity F after second order differential processing1＝E2-E1、F2＝E3-E2……Fn-2＝En-1-En-2；
Weighted sound intensity G1＝K3×G3+K4×F1、G2＝K3×G4+K4×F2……Gn-3＝K3×Gn+K4×Fn-2(ii) a Wherein, i is 1.
In some embodiments, before the step of acquiring the detection sound signal by the auditory sensor, the method further comprises:
at least two acoustic sensors are provided.
In some embodiments, in the step of acquiring the first acoustic signal generated during the separation of the wafer from the wafer contactor,
acquiring at least two groups of the first sound signals through at least two auditory sensors;
in the step of sending a prompt message if it is determined that the first sound signal is greater than or equal to a preset threshold,
and sending prompt information when the first sound signal corresponding to at least one auditory sensor is determined to be greater than or equal to a preset threshold value.
The multiple auditory sensors receive the sound signals at the same time and output analysis results, and if the output results of the multiple auditory sensors are consistent or within an allowable error range, the next denoising processing is carried out to solve the problems that a single auditory sensor fails, the detection error of the single auditory sensor is large and the like.
Taking the two acoustic sensors as an example, if one of the acoustic sensors fails, the other acoustic sensor can be used for monitoring, so as to continuously monitor the wafer transfer process. In addition, two groups of data detected by the two auditory sensors can be averaged, so that the stability of the data is better.
The determining that the first sound signal is greater than or equal to the preset threshold may be understood as determining that a maximum value of the first sound signal is greater than or equal to the preset threshold, where the maximum value of the first sound signal is closest to a sound signal generated in a process of separating the wafer from the wafer contactor.
Further, an acoustic sensor is provided at a receiving part for receiving the wafer, and/or an acoustic sensor is provided at a transfer part on which the wafer contactor is mounted. The auditory sensor is arranged on the transmission component, and is close to the wafer contactor so as to accurately collect sound signals generated by friction between the wafer and the wafer contactor. The auditory sensor is arranged on the bearing part and is kept fixed, so that the interference of movement on the detection data of the auditory sensor can be avoided, and the stability of the auditory sensor can be ensured.
In some embodiments, it is determined that the first sound signal is greater than or equal to the preset threshold, in the step of transmitting the prompt message,
the prompt message includes at least one of a warning message and an alarm message to determine a time to replace the wafer contactor according to the prompt message.
Wherein, when first sound signal is greater than or equal to the warning threshold value, then send alarm information, alarm information is used for indicateing staff wafer contactor needs to be changed, when first sound signal is greater than or equal to the warning threshold value, then send early warning information, early warning information is used for indicateing staff wafer contactor is about to need to be changed.
In one embodiment, during wafer transfer, a controller (i.e., CPU) controls a transfer unit (e.g., a cleaning robot) to pick up a wafer from a wafer stage and place the wafer in a station of a receiving unit, during the placement, a wafer contactor is separated from the wafer, during the process, an acoustic sensor 1 and an acoustic sensor 2 respectively receive sound signals, detected sound signals received by the two acoustic sensors are processed by a data contrast analysis system, the data contrast analysis system performs the above-mentioned denoising, differentiating and weighting on the detected sound signals to obtain first sound signals, and during the endpoint detection system, the first sound signals are compared with a preset threshold, and if the first sound signals are greater than or equal to the preset threshold, an early warning or alarm is performed.
This embodiment, collect the sound intensity that is in characteristic frequency through the hearing sensor, data analysis is combined again, make the prejudgement that clean robot can be intelligent, realize detecting the terminal point of wafer contactor, carry out accurate analysis through quantized model and data, whether need change the wafer contactor in advance to prejudge, in time remind the staff to effectively solve, avoid changing the wafer contactor ahead of time simultaneously and cause the waste that waste and production shut down caused the productivity, the intelligent judgement of datamation has been realized.
Referring to fig. 5, the relationship between the detected sound intensity and the time obtained by the two sets of acoustic sensors collecting data simultaneously after four wafer transfers is shown, where the abscissa is time and the ordinate is the detected sound intensity. Referring to fig. 6, the detected sound intensity, and the sound intensity of the data in fig. 5 subjected to the second order differential processing and the sound intensity of the end point detection weighting processing obtained by performing the weighting processing on the basis of the second order differential processing are illustrated, with the abscissa being time and the ordinate being the sound intensity. It can be seen that the data for detecting the sound intensity has less fluctuation; through second order differential processing, the data floating of the sound intensity is increased; through second order differential processing and weighting processing, the data floating of the sound intensity is obviously increased, and comparison and judgment are convenient. In the figure, the preset threshold is an early warning threshold and an alarm threshold, and the early warning threshold and the alarm threshold are threshold values of sound intensity. And the controller of the wafer transmission system compares the set threshold value with the weighted processing data of the end point detection, and starts an early warning and alarming mechanism.
It should be noted that the wafer transfer system detection method can simultaneously acquire the first sound signal and the vibration signal in the above embodiments, and simultaneously detect the two signals, which is helpful to improve the detection accuracy.
Embodiments of a second aspect of the present invention, as shown in fig. 7 to 9, provide a wafer transfer system, which includes a receiving part 2 and a transfer part 1 for transferring a wafer 5 to the receiving part 2, wherein the receiving part 2 is provided with a sensor for collecting a vibration signal generated by the wafer 5 during the separation of the wafer 5 from a wafer contactor 11.
The transfer unit 1 takes the wafer 5 from the wafer stage 3, and then the wafer 5 is carried into the receiving unit 2 by the linear motor 12 of the transfer unit 1, the substrate 13 of the transfer unit 1 carries the wafer 5 to the receiving unit 2, and the wafer 5 is placed on the first receiving unit 21 or the second receiving unit 22. Both the transfer part 1 and the receiving part 2 are arranged in the apparatus frame 4.
The wafer 5 transfer system of the present embodiment and the following embodiments includes a controller, and the controller is configured to control the execution of the detection method of the wafer 5 transfer system, so that the above beneficial effects are achieved, and details are not described herein, which can be referred to as above.
The wafer 5 transmission system of this embodiment possesses the vertical displacement data ability of collecting when wafer 5 and wafer contactor 11 separate, through data analysis, can intelligent prejudge, realizes carrying out the terminal point detection to the degree of adhesion problem that wafer 5 left wafer contactor 11 and takes place.
In some embodiments, the sensor for acquiring the vibration signal is a distance sensor. The distance sensor is used for detecting the displacement generated by the up-and-down floating of the wafer 5 due to vibration, and the distance sensor can accurately detect the amplitude of the wafer 5.
One or more distance sensors can be arranged, and when one distance sensor is arranged, the system is simple in structure and the data processing process is simple; when the distance sensors are arranged in a plurality of numbers, the data measured by the distance sensors can be mutually confirmed, and the condition that false triggering caused by the problems of the sensors cannot occur is guaranteed.
The distance sensor may be an ultrasonic distance measuring sensor 24 or an optical distance sensor, etc.
In some embodiments, referring to fig. 8 and 9, the receiving part 2 is provided with a supporting member 23, the supporting member 23 is provided with a slot body into which the wafer 5 can be inserted, and a distance sensor is arranged on the top wall or the bottom wall of the slot body.
Wherein, the cell body is the cell body that sets up in 5 circumference outsides of wafer, and wafer 5 can get into the cell body, and the sensor of installing in the roof of cell body or diapire can accurately detect the amplitude of wafer 5.
One or more supports 23 can be provided, and when one support 23 is provided, one or more distance sensors can be mounted on the support 23; when the support 23 is provided in plural, each support 23 may be mounted with one or more distance sensors. The support 23 may be fixed to the carrier support to facilitate mounting.
In some embodiments, at least one of the transfer unit 1 and the receiving unit 2 is provided with a sensor for acquiring a first acoustic signal generated during the separation of the wafer 5 from the wafer contactor 11.
The first sound signal generated when the wafer 5 leaves the wafer contactor 11 is obtained by a sensor, wherein the sensor may be an auditory sensor, a sound sensor, a vibration sensor, or the like, and the sensor may be of various types, and may be a sound signal generated by friction between the wafer 5 and the wafer contactor 11.
The sensor for acquiring the first sound signal is an auditory sensor. The hearing sensor has high detection accuracy and mature technology.
The hearing sensors can be set to be one or more, data detected by the plurality of hearing sensors can be mutually confirmed, the influence on the detection effect due to the failure of a single hearing sensor is avoided, and the inaccuracy in detection caused by the false triggering of the hearing sensors is also avoided. When a plurality of acoustic sensors are arranged, the acoustic signals generated by separating the wafer 5 from the wafer contactor 11 can be detected from a plurality of positions, and the accuracy of the detection structure is further improved.
The transfer component 1 comprises a base 13, a wafer contactor 11 for supporting the wafer 5 is arranged on the base 13, and an acoustic sensor is connected to at least one of the base 13 and the wafer contactor 11. The acoustic sensor is provided in the transfer unit 1, and is located close to a position where the wafer 5 rubs against the wafer contactor 11 to generate a sound, which contributes to improvement of detection accuracy.
The transmission component 1 (such as a cleaning robot) has the hearing ability and the intelligent pre-judging ability, and realizes the detection of the adhesion problem of the wafer 5 leaving the wafer contactor 11.
The receiving member is provided with an acoustic sensor. The acoustic sensor may be embedded in or mounted below a susceptor, the upper surface of which is used to receive the wafer 5. The receiving part 2 is kept in a fixed state in the device frame 4, and the acoustic sensor is mounted on the receiving part 2, so that the interference of the movement with the sound detection can be avoided.
The receiving part 2 comprises a first receiving part 21 and a second receiving part 22, each provided with an acoustic sensor in its interior or lower part.
In some embodiments, the female part 2 is provided with a support 23 for mounting an acoustic sensor. In the state where the wafer 5 is placed on the susceptor, the support 23 is located below or above the wafer 5 at a position close to the wafer 5, and the support 23 does not interfere with the operation of the transfer part 1 for placing the wafer 5 on the susceptor 2.
Set up the first installation position that is used for installing the hearing sensor on first receiving 21, support piece 23 sets up the circumference in wafer 5 outer lane, sets up second installation position and the third installation position that is used for installing the hearing sensor on support piece 23, and three hearing sensor cooperation are gathered three sets of sound data, and three sets of data are integrated and are handled, can make the testing result more accurate.
The wafer transfer system may be provided with both the distance sensor and the acoustic sensor. The distance sensor may be an optical distance sensor, an ultrasonic distance sensor, or an infrared distance measuring sensor, etc.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for inspecting a wafer transport system, comprising:
obtaining a vibration signal of the wafer in the separation process of the wafer and a wafer contactor of the transmission component;
and if the vibration signal is determined to be greater than or equal to a preset threshold value, sending prompt information.
2. The wafer transport system inspection method of claim 1, wherein in the step of acquiring the vibration signal of the wafer during the separation of the wafer from the wafer contactor of the transport component,
acquiring a first trigger signal when the transmission component reaches a target position, and starting to acquire a detection vibration signal;
acquiring a second trigger signal for separating the wafer contactor from the wafer, delaying a preset time, and ending acquiring the detection vibration signal;
determining the vibration signal based on the detected vibration signal.
3. The wafer transfer system inspection method of claim 2 wherein the target position is a position where the transfer member is positioned to accommodate placement of a wafer.
4. The wafer transport system inspection method of claim 1, wherein in the step of acquiring the vibration signal of the wafer during the separation of the wafer from the wafer contactor of the transport component,
obtaining the detection amplitude of the wafer through a distance sensor, and determining the vibration signal based on the detection amplitude, wherein the detection amplitude is recorded as A1～An。
5. The wafer transport system inspection method as claimed in claim 4, wherein in the step of acquiring a detected amplitude of the wafer by a distance sensor, determining the vibration signal based on the detected amplitude,
and carrying out differential processing on the detected amplitude to obtain a first calculated amplitude, and taking the first calculated amplitude as the vibration signal, wherein the preset threshold is a first preset amplitude.
6. The wafer transfer system inspection method of claim 5, wherein in the step of differentiating the detected amplitude to obtain the first calculated amplitude,
obtaining the amplitude of the first order differential processing, denoted as Bn-1＝An-An-i；
Obtaining a first calculated amplitude, denoted C, of the second order differential processn-2＝Bn-1-Bn-1-i；
Wherein i is a positive integer and is an integer greater than 3, and n > i.
7. The wafer transport system inspection method as claimed in claim 4, wherein in the step of acquiring a detected amplitude of the wafer by a distance sensor, determining the vibration signal based on the detected amplitude,
and carrying out differential processing and weighting processing on the detected amplitude to obtain a second calculated amplitude, and taking the second calculated amplitude as the vibration signal, wherein the preset threshold is a second preset amplitude.
8. The wafer transport system inspection method as claimed in claim 4, wherein in the step of acquiring a detected amplitude of the wafer by a distance sensor, determining the vibration signal based on the detected amplitude,
acquiring at least two groups of detection amplitudes through at least two distance sensors; each distance sensor acquires the detection amplitude of different positions of the wafer;
at least two groups of detection amplitudes are subjected to differential processing to obtain at least two groups of first calculation amplitudes, and/or at least two groups of detection amplitudes are subjected to differential processing and reinforcement processing to obtain at least two groups of second calculation amplitudes;
in the step of sending a prompt message if the vibration signal is determined to be greater than or equal to the preset threshold value,
and if the maximum value of at least one of the first calculated amplitude and the second calculated amplitude is determined to be greater than or equal to the corresponding preset threshold value, sending prompt information.
9. The method as claimed in any one of claims 1 to 8, wherein in the step of sending a prompt message if the vibration signal is greater than or equal to a predetermined threshold,
the prompt information comprises at least one of early warning information and alarm information, and the time for replacing the wafer contactor is confirmed according to the prompt information.
10. A wafer transfer system comprising a receiving component and a transfer component for transferring a wafer to said receiving component, said receiving component being provided with a sensor for acquiring a vibration signal, said vibration signal being a vibration generated by said wafer during separation of said wafer from a wafer contactor.
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