CN107221817B - USB device and its manufacturing method - Google Patents
USB device and its manufacturing method Download PDFInfo
- Publication number
- CN107221817B CN107221817B CN201710054713.XA CN201710054713A CN107221817B CN 107221817 B CN107221817 B CN 107221817B CN 201710054713 A CN201710054713 A CN 201710054713A CN 107221817 B CN107221817 B CN 107221817B
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- Prior art keywords
- terminal
- connection
- circuit board
- connection gasket
- face
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention provides the more stable USB device and its manufacturing method of connection of a kind of connection gasket made on circuit board and connection terminal.USB device of the invention includes: circuit board, comprising: distributing board includes the 1st face and the opposite side positioned at the 1st face and the 2nd face with connection gasket；And semiconductor device, it is equipped on above-mentioned 1st face；Portion of terminal, comprising: connection terminal has the connecting portion being electrically connected with connection gasket；And insulating component, there is the outside positioned at circuit board and the wall portion outstanding along the thickness direction of circuit board；And the portion of terminal is placed on the 2nd face；And solder, between connection gasket and connecting portion；And wall portion connects with circuit board, connection gasket have on the extending direction of connection terminal it is opposite to connection terminal side the 1st end and with the 1st end be opposite side the 2nd end, the shortest distance on the boundary and the 1st end of connecting portion and solder is shorter than or the shortest distance on boundary and the 2nd end equal to connecting portion and solder.
Description
[related application]
The application enjoyment is applied based on Japanese patent application 2016-57069 (applying date: on March 22nd, 2016)
Priority.The application applies by referring to the basis and the full content comprising basic application.
Technical field
Embodiments of the present invention are related to a kind of USB device and its manufacturing method.
Background technique
As a kind of connection standard when connecting the massaging devices such as computer with peripheral device, it is known to USB
(Universal Serial Bus:USB, universal serial bus).One of which of the USB3.0 as USB standard, can either protect
The compatibility with USB2.0 is held, and high-speed transfer can be carried out with the transmission speed of 10 times or more of USB2.0.USB3.0's
In USB connector, other than 4 connection terminals set on the USB connector of USB2.0, it is also necessary to 5 connection terminals.
These connection terminals are to be connected to circuit board with the state for being fixed on insulating component.
Summary of the invention
Present embodiment provide a kind of connection gasket made on circuit board and connection terminal the more stable USB device of connection and
Its manufacturing method.
The USB device of embodiment is that the USB device of data transmission is able to carry out by connecting with socket, it is characterised in that
Include: circuit board, comprising: distributing board includes the 1st face and the opposite side positioned at the 1st face and the 2nd face with connection gasket；
And semiconductor device, it is equipped on above-mentioned 1st face；Portion of terminal, comprising: connection terminal, with what is be electrically connected with the connection gasket
Connecting portion；And insulating component, there is the outside positioned at the circuit board and protruded along the thickness direction of the circuit board
Wall portion；And the portion of terminal is placed on the 2nd face；And solder, between the connection gasket and the connecting portion；
And the wall portion connects with the circuit board, the connection gasket have on the extending direction of the connection terminal with respect to institute
State the 1st end of connection terminal side and the 2nd end with the 1st end for opposite side, the connecting portion and the solder
Boundary and the 1st end the shortest distance be shorter than or equal to the connecting portion and the solder boundary and the described 2nd
The shortest distance of end.
Detailed description of the invention
Fig. 1 is the cross-sectional view for indicating the USB device of the 1st embodiment.
Fig. 2 is the top view for indicating the USB device of the 1st embodiment.
Fig. 3 (a) and be (b) cross-sectional view for indicating the manufacturing step of USB device of the 1st embodiment.
Fig. 4 (a) and be (b) cross-sectional view for indicating the manufacturing step of USB device of the 1st embodiment.
Fig. 5 is the cross-sectional view for indicating the USB device of the 1st embodiment.
Fig. 6 (a) and be (b) top view for indicating the USB device of the 2nd embodiment.
Fig. 7 (a)~(c) is the cross-sectional view for indicating the change case of USB device of the 2nd embodiment.
Specific embodiment
Hereinafter, being illustrated to the embodiment for being used to carry out an invention.
(the 1st embodiment)
Referring to figs. 1 to Fig. 4, the 1st embodiment is illustrated.In addition, attached drawing be it is schematical, exist such as thickness with
The relationship of planar dimension, ratio of thickness of each layer etc. and the different situation such as actual relationship, ratio.In addition, in embodiment party
In formula, identical symbol is marked to substantially the same constituent element and is omitted the description.
Fig. 1 to Fig. 4 is the figure indicated by connecting the USB device for being able to carry out the transmission of USB3.0 data with socket.In addition,
If it is the standard for using identical signal, then the USB device that also can be used as the data transmission for being able to carry out other USB standards is come
It uses.
Fig. 1 is the schematic side view of the USB device 10 of present embodiment.Fig. 2 is by a part of shell 1 shown in FIG. 1
It bows after removing and sees the schematic top plan view of USB device 10.In fig. 1 and fig. 2, the USB comprising circuit board 2 is illustrated as an example
Device, wherein the circuit board 2 is SiP (System in a Package:SiP, systematization encapsulation).In addition, relative to Fig. 1
X-direction, 3 side of portion of terminal is set as " front ", 1 side of shell is set as " rear ", below also the same processing.
Fig. 1 and USB device shown in Fig. 2 10 include shell 1, circuit board 2 and portion of terminal 3.Shell 1 includes to pass through as non-
The opening portion 11 of through-hole.Shell 1 has insulating properties.Such as can be formed by synthetic resin such as polyvinyl chloride etc., it can also be led by having
Electrical metal is formed.In addition, can also will have a pair of shells component of the groove portion shaped using synthetic resin with groove portion phase
Pair mode be bonded, the shell 1 with opening portion 11 is consequently formed.In addition, the shape of shell 1 be not limited to it is shown in FIG. 1
Shape.For example, can also be according to all shell 1 is arranged in be overlapped mode with circuit board 2.In addition, also tool can be provided separately with shell 1
There is the shell of the function as shell, wherein the shell is in protection circuit plate 2 from the part outstanding of shell 1.
Circuit board 2 is for example set to opening portion 11.Circuit board 2 can be fixed by shell 1.In addition, circuit board 2 includes: wiring
Plate 21 is the 2nd face 21b of opposite side with the 1st face 21a and relative to the 1st face 21a；Memory chip 22 and controller chip
23 equal semiconductor devices, are equipped on the 1st face 21a of distributing board 21；And resin layer 24, sealing semiconductor part.Relative to the 1st
Face 21a and the 2nd face 21b is substantially vertical, it is circuit board 2 in the X-axis direction with respect to 2 sides in, by the side in front
It is set as the 3rd face 2a.In addition, being not limited to memory chip 22 and controller chip 23, it is possible to use other semiconductors zero
Part.In addition, memory chip 22 and the position of controller chip 23 can also overturn.
In addition, the construction of circuit board 2 is not limited to SiP, such as can also be for PCBA (Printed Circuit
Board Assembly:PCBA, printed circuit-board assembly) circuit board etc..
1st face 21a of distributing board 21 is equivalent to the lower surface of distributing board 21 in Fig. 1, and the 2nd face 21b is equivalent to wiring in Fig. 1
The upper surface of plate 21.Distributing board 21 is with multiple connection gaskets including at least the connection gasket 211 for being set to the 1st face 21a and at least
Multiple connection gaskets comprising being set to the connection gasket 212 of the 2nd face 21b.The connection gasket of 1st face 21a is for example via perforation distributing board
21 through-hole and the connection gasket 212 for being electrically connected to the 2nd face 21b.As distributing board 21, such as the epoxy with wiring layer can be used
Resin plates such as glass etc., wherein the wiring layer includes the connection gasket for being set to surface.
Connection gasket 211 is the connection gasket for will be electrically connected between semiconductor device and distributing board 21.Connection gasket 212 is to use
The connection gasket that will be electrically connected between portion of terminal 3 and distributing board 21.Connection gasket 211 and connection gasket 212 are for example set as rectangular-shaped.
Memory chip 22 is electrically connected to connection gasket 211.Product of the memory chip 22 for example with multiple semiconductor chips
Layer body, and multiple semiconductor chips are clipped adhesive layer and are bonded mutually in a manner of a part overlapping.Multiple semiconductor chips are logical
It crosses routing engagement etc. the electronic pads for being set to each semiconductor chip are connected to each other, thus be electrically connected to each other.As semiconductor core
Piece, such as the memory chip etc. with memory elements such as NAND (Not And, with non-) flash memories can be used.At this point, half
Conductor chip also may include decoder etc. other than storage unit.
Controller chip 23 is electrically connected to the connection gasket on the 1st face 21a of distributing board 21.Controller chip 23 is by semiconductor core
Piece is constituted, and controls the movements such as data write-in and the data reading to memory chip 22.Memory chip 22 and controller chip
23 be, for example, to be connect the electronic pads for being set to semiconductor chip with the connection gasket for being set to distributing board 21 by routing engagement etc.,
Thus it is electrically connected to distributing board 21.
As the connection method of memory chip 22 and controller chip 23 and distributing board 21, it is not limited to routing and connects
It closes, it is possible to use flip-chip bond or coil type are engaged etc. automatically without wire bonding.In addition, it is possible to use make memory chip 22
(Through Silicon Via:TSV, silicon are worn with TSV made of the 1st face 21a of the controller chip 23 laminated on distributing board 21
Hole) mode etc. three-dimension packaging construction.
Resin layer 24 is arranged in a manner of sealed storage device chip 22 and controller chip 23.Resin layer 24 for example containing
Inorganic filling material (such as SiO2).Resin layer 24 is, for example, use the inorganic filling material and organic resin etc. are mixed and
At sealing resin, formed by forming processes such as metaideophone forming process, compression forming method, injection molding methods.
Then, the construction of portion of terminal 3 is illustrated.
As shown in Figures 1 and 2, portion of terminal 3 is set on circuit board 2, and is electrically connected with circuit board 2.Portion of terminal 3 for example by
Shell 1 is kept.
Portion of terminal 3 includes the 1st terminal 31, the 2nd terminal 33 and insulating component 32.In addition, though illustrating 5 in Fig. 2
1st terminal 31 and 4 the 2nd terminals 33, but the quantity of the 1st terminal 31 and the 2nd terminal 33 is not particularly limited.In addition, the 1st terminal
It's not limited to that for the shape of 31 and the 2nd terminal 33.
1st terminal 31 and the 2nd terminal 33 are for example with the function as the connection terminal that can be connect with socket.As even
Connecting terminal, such as ground terminal (GND), signal terminal (SSTX+, SSTX-), signal terminal (SSRX+, SSRX-) can be enumerated etc.
The connection terminal etc. of high-speed transfer for USB2.0 or 3.0, wherein the signal terminal (SSTX+, SSTX-) is used for as poor
The high-speed transfer of dynamic signal is with data-signal is sent, and the signal terminal (SSRX+, SSRX-) is for the height as differential wave
Speed transmission reception data-signal.
There is such as one end to be located at front and protrude from the socket connection part 31a of the 2nd terminals side and another for 1st terminal 31
End is located behind and protrudes from the tail portion 31b of circuit board 2, and the middle part between socket connection part 31a and tail portion 31b is by insulation structure
Part 32 covers.
Tail portion 31b is exposed to 2 side of circuit board at rear from insulating component 32, with the 1st terminal 31 with length direction just
Shape made of the width direction extension of friendship, and at least one of it is electrically connected to multiple connection gaskets (being herein connection gasket 212).Tail
Portion 31b as the 1st terminal 31 and connection gasket 212 connecting portion and function.Tail portion 31b for example by welding etc. via
Solder 4 and be engaged in connection gasket 212, but it's not limited to that for joint method.
2nd terminal 33 is for example connect with the connection gasket positioned at the 2nd face 21b of distributing board 21.Wherein, the connection gasket can be company
The connection gasket different from connection gasket 212 can also be set to the lower part of portion of terminal 3 by connection pad 212.
As the 1st terminal 31 and the 2nd terminal 33, copper alloy (such as beryllium copper, phosphor bronze, cobalt copper) or nickel alloy can be used
(such as beryllium nickel) etc. is capable of providing the material of elasticity.In addition, the 1st terminal 31 both can be identical with the material of the 2nd terminal 33, it can also not
Together.
1st terminal 31 and the 2nd terminal 33 are fixed on insulating component 32.The position for passing through insulating component 32 as a result, can make
1st terminal 31 and the 2nd terminal 33 and connection gasket position alignment.
Insulating component 32 is equipped on the 2nd face 21b of circuit board 2.Insulating component 32 has to be protruded from relative to Z-direction
The wall portion 32a in the 1st face side 21a (lower direction).That is, wall portion 32a is protruded along the thickness direction of circuit board 2.Wall portion 32a
The 4th face 32b with the 3rd face 2a opposite direction with circuit board 2.In the present embodiment, the 4th face 32b of insulating component 32 and electricity
3rd face 2a of road plate 2 adjoins one another.
For example, there are in the case where gap, have following worry between the 3rd face 2a and the 4th face 32b: when by USB device 10
When being inserted into socket, wall portion 32a and socket are collided and are squeezed, and thus insulating component 32 deforms, and the 1st terminal 31 with connect
There is cracking equivalent damage in the interconnecting piece of pad 212, therefore with connection gasket 212 positional shift occurs for the 1st terminal 31, to cause to connect
It is bad.In the present embodiment, since the 3rd face 2a of the 4th face 32b and circuit board 2 of insulating component 32 adjoin one another, so this
A little worries are reduced.
As insulating component 32, such as resin can be used etc..
In addition, the construction of portion of terminal 3 is not limited to Fig. 1 and construction shown in Fig. 2.
Then, the manufacturing method of the USB device of present embodiment 10 is illustrated.
Fig. 3 and Fig. 4 is the schematic side view for the manufacturer's rule for illustrating the USB device 100 of present embodiment.Such as figure
Shown in 3 (a), prepare to carry semiconductor device and the circuit board 2 with multiple connection gaskets comprising connection gasket 212.
Then, as shown in Fig. 3 (b), on connection gasket 212, such as coating solder 4.Solder 4 is coated on connection gasket for example
Central portion.
Then, as shown in Fig. 4 (a), portion of terminal 3 is carried on the circuit board 2.At this point, being located at connection gasket with tail portion 31b
Portion of terminal 3 is positioned in electricity by the position of 212 inclined front side, and the mode that at least part of tail portion 31b connects with solder 4
On road plate 2.In addition, there are gaps between the 3rd face 2a and the 4th face 32b at this time.
Then, as shown in Fig. 4 (b), solder 4 is melted by reflow soldering process, and by it is cooling by tail portion 31b with connect
Pad 212 is fixed.At this point, solder 4 using surface tension by tail portion 31b to 4 side-lining of solder.It is placed in 4 front of solder as a result,
Tail portion 31b is rearward drawn, and portion of terminal 3 is whole therewith also rearward moves.That is, tail portion 31b is from the front of connection gasket 212 position
It sets and is moved to such as central location.The movement is referred to as self alignment effect.That is, in Fig. 4 (b), when will prolong with the 1st terminal 31
The front ends for stretching the connection gasket 212 of direction opposite direction are set as the 1st end 212a, and rear end is set as the 2nd end 212b
When, the shortest distance on the boundary and the 1st end 212a of tail portion 31b and solder 4 is shorter than or the boundary equal to tail portion 31b and solder 4
With the shortest distance of the 2nd end 212b.In addition, so-called boundary refers to the part that solder 4 connects with tail portion 31b.Self alignment effect
Generated movement, which is connected by wall portion 32a with the 3rd face 2a of circuit board 2, to be stopped.Therefore, portion of terminal 3 be with the 3rd face 2a with
The distance measurements in the gap of the 4th face 32b rearward move.
Finally, the circuit board 2 equipped with portion of terminal 3 is accommodated in shell 1, thus the USB device 10 of present embodiment
It completes.
USB device 10 according to the present embodiment, by self alignment effect caused by the surface tension as solder 4 and absolutely
The wall portion 32a of edge component 32, the connection gasket 212 that the central portion of the tail portion 31b of the 1st terminal 31 can be adhered on circuit board 2
Central portion or the position of side on the front than central portion, and the positional relationship that can reduce connection gasket 212 and tail portion 31b is uneven
Worry.Therefore, circuit board 2 and the connection of portion of terminal 3 can be made more stable.
For example, then carrying out reflow soldering process tail portion 31b to be placed in the central portion of connection gasket 212 rather than front
In the case of, by self alignment effect, tail portion 31b can be moved relative to circuit board 2 along any one in X-direction and Y direction
It is dynamic.In the present embodiment, by the way that tail portion 31b to be placed in the front of connection gasket 212 in advance, tail portion 31b can be made to pass through certainly
Alignment effect only rearward moves, and it is (forward for central portion or than central portion herein to be located at desired position on connection gasket 212
The position of square side).In addition, having in the central part of tail portion 31b in the case where the ratio central portion side rearward of connection gasket even
A possibility that moving distance of tail portion 31b becomes larger and positional shift occurs on connection pad 212, therefore it is preferable that tail portion 31b
Positioned at the central portion of connection gasket 212 or than central side on the front.
In addition, since wall portion 32a connects with circuit board 2, so following worry to be reduced: being inserted into when by USB device 10
When to such as socket, wall portion 32a is collided with socket and is squeezed, and thus insulating component 32 deforms, so the 1st terminal 31 with even
There is cracking equivalent damage in the interconnecting piece of connection pad 212, therefore with connection gasket 212 positional shift occurs for the 1st terminal 31, thus the company of causing
It connects bad.
In addition, in the present embodiment, there is shown the connection gasket 212 on circuit board 2 is connect with tail portion 31b, but with connection
The connecting portion of pad 212 is not limited to tail portion 31b, such as in the case where the 1st terminal 31 of shape as shown in Figure 5,
Connecting portion can will be used as between socket connection part 31a and tail portion 31b.In addition, omitting the 1st end for convenience's sake in Fig. 5
Portion of terminal 3 other than son 31.
(the 2nd embodiment)
Then, using Fig. 6 and Fig. 7, the 2nd embodiment is illustrated.
The shape of 2nd embodiment connection gasket compared with the 1st embodiment is different, but it is other constitute and manufacturing method with
1st implementation form is identical.Therefore, only the part different from the 1st embodiment is illustrated, identical part is omitted.
Fig. 6 (a) is that the vertical view of the portion of terminal 3 for the USB device 10 for indicating the 2nd embodiment and a part of circuit board 2 is shown
It is intended to.The top perspective view of Fig. 6 (b) expression connection gasket 212.
As shown in fig. 6, in the present embodiment, connection gasket 212 is using the shape for being composed 2 quadrangles of size.
Be rectangular combination in the case of fig. 5, and the lesser rectangle of area be set to the front of circuit board 2, by area compared with
Big rectangle is set to the rear of circuit board 2.By the way that connection gasket 212 is set as this shape, passing through self alignment effect
And when moving, the mobile distance of portion of terminal 3 (tail portion 31b) institute becomes larger.
Hereinafter, being illustrated to its reason.It is lesser with area if being coated with solder 4 to the connection gasket 212 of the shape
Quadrangle is compared, and the amount for the solder 4 that the biggish quadrangle of area is applied is relatively more.Herein, tail portion 31b is placed in connection
In pad on the lesser quadrangle of area.The amount of solder 4 is more, then surface tension when reflow soldering process is bigger, therefore tail portion 31b
The solder 4 for being connected the biggish tetragonal side of area in pad is more strongly drawn.Therefore, mobile by self alignment effect institute
Apart from larger.
In addition, connection gasket 212, can also be set as shown in Fig. 7 (a), (b) by the change case as the 2nd embodiment
Shape.As shown in Fig. 7 (a), 2 quadrangles of size are trapezoidal and rectangle.By the trapezoidal front for being set to circuit board 2, will grow
The rectangular rear for being set to circuit board 2.In the case where change case, compared with the connection gasket 212 of Fig. 5, size is dimetric to be connect
Conjunction portion is more gentle, therefore degree of excursion unevenness caused by self alignment effect is further reduced.
In addition, connection gasket 212 is not limited to the quadrangle combination there are size relation, if the connection at 2 rear of circuit board
The connection gasket area that 212 areas are greater than front is padded, then for example, can also apply triangle or other shapes as shown in Fig. 7 (b).
In the present embodiment, so-called quadrangle is for example, it also includes feelings of the dimetric angle with radian as shown in Fig. 7 (c)
Condition.
It, can be by making the connection gasket 212 at 2 rear of circuit board as described above, according to the USB device 10 of this implementation form
Area is greater than the area of the connection gasket 212 in front, and increases degree of excursion caused by self alignment effect.Therefore, it can be applied to hold
The larger situation in the gap of the 3rd face 2a of the 4th face 32b and circuit board 2 of sub-portion 3.
More than, several embodiments of the invention are illustrated, but these embodiments are to mention as an example
Out, it is not intended to limit the range of invention.These novel embodiments can be implemented with various other ways, and can be not
Various omissions, substitutions and changes are carried out in the range of disengaging inventive concept.These embodiments and its variation are included in the model of invention
Enclose and purport in, and be included in claims documented by invention and its equalization range in.
Symbol description
1 shell
2 circuit boards
The 3rd face 2a
3 portion of terminal
10 USB devices
11 opening portions
21 distributing boards
The 1st face 21a
The 2nd face 21b
22 memory chips
23 controller chips
24 resin layers
31 the 1st terminals
31a socket
The tail portion 31b
32 insulating components
32a wall portion
The 4th face 32b
33 the 2nd terminals
211,212 connection gasket
Claims (5)
1. a kind of USB device is able to carry out data transmission by connecting with socket, it is characterised in that include:
Circuit board, comprising: distributing board includes the 1st face and the opposite side positioned at the 1st face and the 2nd face with connection gasket；
And semiconductor device, it is equipped on above-mentioned 1st face；
Portion of terminal, comprising: connection terminal has the connecting portion being electrically connected with the connection gasket；And insulating component, have and is located at
The outside of the circuit board and the wall portion outstanding along the thickness direction of the circuit board；And the portion of terminal is placed in described
On 2 faces；And
Solder, between the connection gasket and the connecting portion；And
The wall portion connects with the circuit board,
The connection gasket have on the extending direction of the connection terminal with respect to the 1st end positioned at the connection terminal side
Portion and with the 1st end be opposite side the 2nd end,
The shortest distance of part and the 1st end that the connecting portion connects with the solder is shorter than or equal to the connection
The shortest distance of part and the 2nd end that position connects with the solder.
2. USB device according to claim 1, it is characterised in that:
The shape of the connection gasket is 2 tetragonal adjacent, and close to the quadrangle of the portion of terminal and the separate portion of terminal
Quadrangle compared to area it is smaller.
3. a kind of manufacturing method of USB device, to have it is a pair of it is opposite to the 1st side and the 2nd side circuit board upper table
The connection gasket in face is coated with solder,
It loads connection terminal on the solder, so that the connection terminal is adhered to the connection gasket by Reflow Soldering after mounting；
The manufacturing method of the USB device is characterized in that:
The connection terminal is fixed on the insulating component with wall portion, which is located at the outside of the circuit board, and be along
1st side and be arranged,
The connecting portion of the connection terminal connecting with the connection gasket is placed in partially described 1st side on the solder
Position, and
After the Reflow Soldering, the wall portion connects with the circuit board.
4. the manufacturing method of USB device according to claim 3, it is characterised in that:
The connecting portion of the connection terminal connecting with the connection gasket is by the Reflow Soldering to the 2nd side sidesway
It is dynamic.
5. the manufacturing method of USB device according to claim 3 or 4, it is characterised in that:
The connection gasket close to the 1st side part with close to the 2nd side part compared with, area compared with
It is small.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016057069A JP6454656B2 (en) | 2016-03-22 | 2016-03-22 | USB device and manufacturing method thereof |
| JP2016-057069 | 2016-03-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107221817A CN107221817A (en) | 2017-09-29 |
| CN107221817B true CN107221817B (en) | 2019-08-06 |
Family
ID=59927678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710054713.XA Active CN107221817B (en) | 2016-03-22 | 2017-01-24 | USB device and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6454656B2 (en) |
| CN (1) | CN107221817B (en) |
| TW (1) | TWI645622B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108462822B (en) * | 2018-06-02 | 2024-03-19 | Oppo广东移动通信有限公司 | Light sensing component and electronic equipment |
| JP2022050235A (en) * | 2020-09-17 | 2022-03-30 | キオクシア株式会社 | Usb memory and manufacturing method therefor |
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|---|---|---|---|---|
| JP2004296306A (en) * | 2003-03-27 | 2004-10-21 | Mitsubishi Electric Corp | Connector for surface mounting |
| CN101032057A (en) * | 2004-09-29 | 2007-09-05 | 株式会社自动网络技术研究所 | Connector for substrate |
| CN201285843Y (en) * | 2008-08-27 | 2009-08-05 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
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| US20060186180A1 (en) * | 2005-02-24 | 2006-08-24 | Northrop Grumman Corporation | Accurate relative alignment and epoxy-free attachment of optical elements |
| JP2007156682A (en) * | 2005-12-02 | 2007-06-21 | Toshiba Corp | Portable storage device |
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| JP2016012627A (en) * | 2014-06-27 | 2016-01-21 | 三菱電機株式会社 | Component mounting method, component mounting structure and electronic apparatus including the same |
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| JP2004296306A (en) * | 2003-03-27 | 2004-10-21 | Mitsubishi Electric Corp | Connector for surface mounting |
| CN101032057A (en) * | 2004-09-29 | 2007-09-05 | 株式会社自动网络技术研究所 | Connector for substrate |
| CN201285843Y (en) * | 2008-08-27 | 2009-08-05 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102159061A (en) * | 2010-12-22 | 2011-08-17 | 番禺得意精密电子工业有限公司 | Electronic component manufacturing method and electronic component manufactured by using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017174892A (en) | 2017-09-28 |
| CN107221817A (en) | 2017-09-29 |
| JP6454656B2 (en) | 2019-01-16 |
| TW201735455A (en) | 2017-10-01 |
| TWI645622B (en) | 2018-12-21 |
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