JP2016012627A - Component mounting method, component mounting structure and electronic apparatus including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting method, a component mounting structure capable of reducing generation of engagement failure on BtoB connector, and an electronic apparatus including the same.SOLUTION: In a base plate 2, plural positioning holes 2c are formed in a position where plural positioning bosses 1d are inserted in the center of the holes when a connection terminal 1b of a connector 1 is positioned at a position which is displaced in an engagement direction A from the center 2a-1 of a rand 2a. In a bonding step to join the connection terminals 1b to the rand 2a, the connection terminals 1b of the connector 1 is shifted in a direction B opposite to the engagement direction A by a self-alignment effect; i.e. heat-melt solder causes the connection terminals 1b of the connector 1 toward the center of the rand 2a. By bringing the positioning bosses 1d to come into contact with the side wall of positioning hole 2c, the connector 1 is properly positioned on the base plate 2.

Description

  The present invention relates to a component mounting method for mounting a board-to-board connector, a so-called BtoB connector on a substrate, a component mounting structure, and an electronic apparatus including the component mounting structure.

A method of mounting components on a substrate by reflow soldering is generally performed.
In reflow soldering, a solder paste is applied to a land on a substrate, and then component terminals are arranged on the land. Then, the board in this state is passed through a reflow furnace to melt the solder paste, thereby electrically connecting the terminal of the component and the land of the board.

  In such reflow soldering, it is important to maintain the positional accuracy of components mounted on the board. For example, in the case of a BtoB connector, when connectors mounted on a rigid board are fitted together, it is greatly affected by the positional deviation of the connectors on the board, and the connectors cannot be accurately fitted even by a slight positional deviation.

  Therefore, for example, in Patent Document 1, in a component mounted on a substrate by reflow soldering, a positioning terminal having a solder joint surface larger than an electrical terminal is provided on the component, and the substrate corresponds to the solder joint surface of the positioning terminal. A sized positioning pad is provided. When this component is placed on the board, the solder paste applied to the positioning pad closely adheres to the solder joint surface of the positioning terminal, which has a relatively large area. The deviation is suppressed.

JP 2006-310567 A

  However, when positioning a component using only the solder paste tension as in the conventional technique represented by Patent Document 1, the positioning terminals are displaced due to the wind pressure in the reflow furnace, and the position and mounting angle of the component may be shifted. There is sex.

  Therefore, conventionally, not only the tension of the solder paste but also a method of providing a positioning engagement portion between the component and the board and mechanically positioning the component on the board using the positioning engagement portion is generally used. Has been done. For example, a positioning boss is provided on the component side, a boss hole is provided on the board side, and the boss and boss hole are arranged so that the component is placed at the target position on the board when the boss is inserted into the center of the boss hole. Set the position of.

In addition, when applying the positioning method described above to automatic placement of parts by an automatic placement machine, the boss hole diameter is more than the boss diameter, taking into account the placement accuracy of the automatic placement machine and boss dimensional variations (part tolerance). Must be set larger. In this case, the larger the hole diameter, the smaller the boss insertion error during automatic mounting, but the greater the amount of displacement of the parts as the boss can move in the space between the boss hole and the side wall.
For example, in a BtoB connector in which a first connector mounted on the outer edge of a rigid board is fitted to a second connector mounted on the other board, the boss is shifted from the center of the boss hole to the first. If the connectors are mounted with their positions shifted inward on the board, the movement of each board is restricted, and the first connector may not be able to be fully fitted to the second connector. There is.

  In addition, if the boss hole diameter is made smaller in order to prioritize the accuracy of the component mounting position, the movement of the boss inserted into the boss hole is reduced and the displacement of the component mounting position is also reduced. To increase. For example, there is a possibility that the boss is not inserted into the boss hole and the connector is mounted in a state where it floats from the board.

  The present invention has been made to solve the above-described problems, and provides a component mounting method, a component mounting structure, and an electronic apparatus including the component mounting method that can reduce the occurrence of poor fitting of a BtoB connector. With the goal.

  A component mounting method according to the present invention is a component mounting method for mounting on a substrate so that at least one of a pair of connectors that are fitted and conducted with each other in a board-to-board connector is fitted in a direction parallel to the board surface. A positioning step of placing the connector terminals on the lands provided on the board surface of the connector via the solder material, and a joining step of joining the connector terminals to the lands by heating and melting the solder material. The board has a positioning boss at the position where the positioning boss is inserted into the center of the hole when the connector terminal is arranged at a position shifted in the fitting direction for fitting the connector from the center of the land. In the joining step, self-alignment in which the molten solder material moves the connector terminal to the center side of the land The result, move the connector pin in a direction opposite to the fitting direction, and wherein the positioning the connector on the substrate by applying the positioning boss on the side wall of the positioning hole.

  According to the present invention, there is an effect that occurrence of poor fitting of the BtoB connector can be reduced.

It is a figure which shows the BtoB connector provided with the component mounting structure which concerns on Embodiment 1 of this invention. It is a figure which shows the male connector in the BtoB connector of FIG. It is a figure which shows the female side connector in the BtoB connector of FIG. It is a figure which shows the board | substrate which mounts the male side connector of FIG. It is a figure which shows the component mounting structure which concerns on the former and Embodiment 1. FIG. FIG. 10 is a diagram showing a modification of the positioning hole in the first embodiment.

Embodiment 1 FIG.
FIG. 1 is a view showing a BtoB connector provided with a component mounting structure according to Embodiment 1 of the present invention. FIG. 2 is a view showing a male connector in the BtoB connector of FIG. FIG. 3 is a view showing a female connector in the BtoB connector of FIG. FIG. 4 is a view showing a substrate on which the male connector of FIG. 1 is mounted.

In the BtoB connector according to the present invention, at least one of the pair of connectors that are fitted to each other and are conducted is mounted on the substrate so as to fit in a direction parallel to the substrate surface.
For example, as shown in FIG. 1 (a), the connector 1 has a connector 3 in a direction parallel to the substrate surface with its fitting port facing outward (in the direction of arrow A, hereinafter referred to as fitting direction A). It is mounted on the outer edge of the substrate 2 so as to fit together.

As shown in FIG. 1A, the connector 3 is mounted on the board surface of the board 4 with the fitting opening facing upward. Thereby, as shown in FIG. 1B, the connector 1 and the connector 3 are fitted in the direction in which the substrate 2 is orthogonal to the substrate surface of the substrate 4. Since both the boards 2 and 4 are rigid boards, the movement of the connector 1 in the fitting direction A is restricted by the connector 3 and the board 4.
Therefore, when the position of the connector 1 is shifted to the opposite side (inward direction of the board surface) from the fitting direction A, there is a possibility that the connector 1 cannot be completely fitted to the connector 3.

2A is a top view of the connector 1 which is a male connector, FIG. 2B is an arrow view from the direction of arrow a in FIG. 2A, and FIG. 2C is FIG. It is an arrow figure from the arrow b direction of).
The connector 1 has the contact terminal 1a which protruded from the fitting port, as shown to Fig.2 (a). When the connector 1 is fitted to the connector 3, the contact terminal 1 a comes into contact with the contact terminal inside the connector 3 and is electrically connected. The contact terminal 1a is coupled to the connection terminal 1b inside the connector 1. The connection terminal 1b is joined to the land 2a of the substrate 2 by soldering. Further, the positioning terminals 1 c provided on the left and right sides of the connector 1 are soldered to the lands 2 b of the substrate 2.

As shown in FIGS. 2A and 2C, the connection terminal 1b is exposed on the back surface of the connector 1, and a positioning boss 1d is provided as shown in FIG. 2B. .
The positioning boss 1 d is inserted into the positioning hole 2 c shown in FIG. 4 when the connector 1 is mounted on the substrate 2. In the example shown in FIG. 2B, one positioning boss 1d is provided on each of the left and right sides of the connector 1, and the connector 1 is positioned on both the left and right sides.

3A is a front view of the connector 3 which is a female-side connector, FIG. 3B is a perspective view of the upper surface side of the connector 3, and FIG. 3C is a perspective view of the back surface side of the connector 3. .
As shown in FIGS. 3A and 3C, the connector 3 has a mounting surface with the connection terminals 3a exposed on the lower surface, and a fitting port on the upper surface as shown in FIG. 3B. 3c is open. The contact terminal 1 a of the connector 1 is inserted into the fitting port 3 c and comes into contact with the contact terminal inside the connector 3. The contact terminals are connected to the connection terminals 3 a inside the connector 3, and the connection terminals 3 a are soldered to lands provided on the board surface of the board 4.

Further, as shown in FIGS. 3A and 3C, a positioning boss 3 b is provided on the lower surface of the connector 3. The positioning boss 3 b is inserted into a positioning hole (not shown) provided on the board surface of the board 4 when the connector 3 is mounted on the board 4.
In the example shown in FIG. 3C, one positioning boss 3b is provided at the diagonal position on the lower surface of the connector 3, and the connector 3 is positioned at the diagonal position on the lower surface.

  The component mounting structure according to the present invention is a structure in which at least one connector of a BtoB connector is mounted on a board so as to fit in a direction parallel to the board surface, and is applied to mounting the connector 1 on the board 2 described above. . Therefore, in the following, the process of mounting the connector 1 on the board 2 will be described in detail. As pretreatment, a solder paste is applied to lands 2a and 2b provided on the substrate surface of the substrate 2 shown in FIG.

  First, as an arrangement step, the connector 1 is arranged on the board surface of the board 2 while inserting the positioning boss 1 d of the connector 1 into the positioning hole 2 c of the board 2. Thereby, the connection terminal 1b of the connector 1 is disposed on the land 2a via the solder paste, and the positioning terminal 1c is disposed on the land 2b via the solder paste. In addition, you may implement this arrangement | positioning step using an automatic mounting machine.

  Subsequently, the substrate 2 on which the connector 1 is arranged as described above is passed through a reflow furnace to heat and melt the solder paste. The connection terminal 1b of the connector 1 is joined to the land 2a by the heat-melted solder. The process so far corresponds to a joining step in which the connection terminal 1b of the connector 1 is joined to the land 2a and the positioning terminal 1c is joined to the land 2b by the solder paste heated and melted.

FIG. 5 is a diagram showing a component mounting structure according to the related art and the first embodiment.
FIG. 5A shows the component mounting structure of Conventional Example 1. FIG. In Conventional Example 1, the connector 1 is arranged at a target position on the board surface of the board 2 by inserting the positioning boss 1 d of the connector 1 into the positioning hole 100 provided in the board 2.
For example, when the positioning boss 1d is inserted into the center of the positioning hole 100 in the placement step, the connection terminal 1b of the connector 1 is positioned at the center of the land 2a of the substrate 2.

In the conventional example 1, the hole diameter a1 of the positioning hole 100 is sufficiently larger than the diameter a of the positioning boss 1d in consideration of the mounting accuracy of the automatic mounting machine and the boss dimensional variation (part tolerance). . For example, the hole diameter is a boss diameter + 0.2 mm.
By configuring in this way, insertion errors of the positioning boss 1d during automatic mounting are reduced. However, when the hole diameter is a1, the displacement amount of the connector 1 is increased by the amount that the positioning boss 1d can move in the space between the positioning hole 100 and the side wall of the positioning hole 100.

  For example, when the positioning boss 1d moves to the side opposite to the fitting direction A of the connector 1 as shown in FIG. 5A, the connector 1 is displaced inward on the board surface. If the connection terminal 1b and the land 2a are joined in this state, the state in which the connector 1 is retracted inward is maintained, so that there is a possibility that the connector 1 cannot be completely fitted to the connector 3.

In the arrangement step, the positioning boss 1d is shifted to the opposite side to the fitting direction A of the connector 1, and accordingly, the connection terminal 1b is shifted from the center of the land 2a to the opposite side to the fitting direction A. However, there is a possibility that the displacement of the connector 1 is eliminated by the self-alignment effect of the molten solder in the joining step.
However, since the self-alignment effect varies depending on individual conditions such as the surface tension of the molten solder and the contact length between the connection terminal 1b and the solder, the connection terminal 1b is not accurately moved to the center of the land 2a.
That is, if the positioning boss 1d is greatly displaced in the direction opposite to the fitting direction A of the connector 1, the connection terminal 1b is not completely returned to the center of the land 2a, and the state displaced in the opposite direction to the fitting direction A is maintained. There is a high possibility.

FIG. 5B shows the component mounting structure of Conventional Example 2. Also in Conventional Example 2, the connector 1 is arranged at a target position on the board surface of the board 2 by inserting the positioning boss 1 d of the connector 1 into the positioning hole 101 provided in the board 2.
For example, when the positioning boss 1 d is inserted into the center of the positioning hole 101 in the placement step, the connection terminal 1 b of the connector 1 is positioned at the center of the land 2 a of the substrate 2.

In the prior art 2, giving priority to the accuracy of the mounting position of the connector 1, the hole diameter a2 of the positioning hole 101 is larger than the diameter a of the positioning boss 1d, but smaller than the hole diameter a1 of the prior art 1. ing. For example, the hole diameter is a boss diameter +0.1 mm.
With this configuration, if the positioning boss 1d is accurately inserted into the positioning hole 101, the movement of the positioning boss 1d is reduced, and the amount of displacement of the connector 1 attachment position is also reduced.
However, as the hole diameter a2 is smaller than the hole diameter a1, as shown in FIG. 5B, there are many cases where the positioning boss 1d cannot be inserted into the positioning hole 101 due to the displacement of the positioning boss 1d.

Therefore, in the board 2 according to the present invention, as shown in FIG. 5C, the center 1b-1 of the connection terminal 1b of the connector 1 is a distance C in the fitting direction A from the center 2a-1 of the land 2a. A positioning hole 2c is provided at a portion where the positioning boss 1d is inserted into the center of the hole when it is disposed at a shifted position. That is, the positioning hole 2c is at a position shifted in the fitting direction A by the distance C from the position of the positioning hole 100 of the conventional example 1.
The distance C is a distance that defines a distance range (hereinafter referred to as a fitting allowable range) in which the connector 1 can be accurately fitted to the connector 3, and the dimensions of the BtoB connector to which the present invention is applied and the type of connector. Etc.
For example, in the substrate 2 in which the positioning hole 2c is shifted by the distance C in the fitting direction A, the position (positioning boss 1d) where the positioning boss 1d is in contact with the side wall in the direction opposite to the fitting direction A of the positioning hole 2c. Even if the connection terminal 1b is joined to the land 2a in a state in which the connector 1 is farthest away from the fitting direction A, the distance C is set so that the connector 1 is within the fitting allowable range.

Since the positioning hole 2c has the hole diameter a1 as in the conventional example 1, the insertion error of the positioning boss 1d during automatic mounting is reduced.
In addition, even when the positioning boss 1d is inserted into the positioning hole 2c while being shifted to the opposite side to the fitting direction A during automatic mounting, the positioning hole 2c is shifted in the fitting direction A in advance. As the fitting with the connector 3 becomes incomplete, the connector 1 is not positioned in a retracted state.

In the present invention, as shown in FIG. 5C, the center 1b-1 of the connection terminal 1b of the connector 1 is shifted from the center 2a-1 of the land 2a in the fitting direction A in the placement step.
However, as shown in FIG. 5D, the connection terminal 1b moves in the direction B on the center side of the land 2a by the self-alignment effect of the solder heated and melted in the joining step.
Thereby, the positioning boss 1d hits the side wall of the positioning hole 2c, and the connector 1 is positioned on the board surface of the board 2. That is, the positioning boss 1d inserted into the positioning hole 2c is restricted from moving in the direction opposite to the fitting direction A.

FIG. 6 is a diagram showing a modification of the positioning hole in the first embodiment. FIG. 6A is a top view of the positioning hole 2ca, and FIG. 6B is a diagram showing a state where the positioning boss 1d hits the side wall of the positioning hole 2ca.
As shown in FIG. 6A, the positioning hole 2ca has a constricted portion 2ca-1 in which the hole shape on the side opposite to the fitting direction A of the connector 1 is narrowed. With this configuration, when the connection terminal 1b moves to the center side of the land 2a due to the self-alignment effect of the heat-melted solder, the positioning boss 1d is constricted as shown in FIG. 6B. It abuts on 2ca-1.

The narrowed portion 2ca-1 contacts the positioning boss 1d in a direction opposite to the fitting direction A and also contacts the left and right directions D1 and D2. Therefore, the movement of the positioning boss 1d inserted into the positioning hole 2ca is restricted from the left and right directions D1 and D2, and the connector 1 can be positioned in the left and right directions D1 and D2.
That is, the connector 1 can be positioned also in the direction in which the narrowed portion 2ca-1 contacts the positioning boss 1d.
Although FIG. 6 shows a shape in which a part of the circular hole is narrowed, the positioning hole is a polygonal hole if the shape is narrowed in the direction opposite to the fitting direction A. Also good.

  In the first embodiment, the solder paste is applied on the land 2a. However, the solder bump may be provided on the land 2a.

As described above, according to the first embodiment, the connection terminals 1b of the connector 1 are disposed on the lands 2a provided on the substrate surface of the substrate 2 via the solder paste, and the solder paste is heated and melted so that the connector 1 connecting terminal 1b is joined to land 2a. The connector 1 has a positioning boss 1d. On the board 2, when the connection terminal 1b of the connector 1 is arranged at a position shifted from the center 2a-1 of the land 2a in the fitting direction A, the positioning boss 1d is positioned at a position where the positioning boss 1d is inserted into the hole center. A hole 2c is provided. In the joining step of joining the connection terminal 1b to the land 2a, the solder 1 heated and melted moves the connection terminal 1b of the connector 1 toward the center side of the land 2a by the self-alignment effect. The connector 1 is positioned on the board 2 by moving the positioning boss 1d against the side wall of the positioning hole 2c.
With this configuration, the connector 1 is not mounted in a retracted state so that the fitting with the connector 3 becomes incomplete, and the occurrence of poor fitting of the BtoB connector can be reduced. .

  Further, according to the first embodiment, the positioning hole 2ca has the narrowed portion 2ca-1 in which the hole shape on the side opposite to the fitting direction A of the connector 1 is narrowed. With this configuration, the connector 1 can be positioned even in the direction in which the squeezed portion 2ca-1 contacts the positioning boss 1d.

  Furthermore, according to the first embodiment, the electronic device includes the above-described component mounting structure. Thereby, the electronic device with which the said effect is acquired can be provided.

  In the present invention, any component of the embodiment can be modified or any component of the embodiment can be omitted within the scope of the invention.

  1, 3 connector, 1a contact terminal, 1b, 3a connection terminal, 1b-1, 2a-1 center, 1c positioning terminal, 1d, 3b positioning boss, 2, 4 substrate, 2a, 2b land, 2c, 2ca, 100 , 101 Positioning hole, 2ca-1 constricted part, 3c fitting port.

Claims (4)

A component mounting method for mounting on a board so that at least one of a pair of connectors that are fitted and conducted with each other in a board-to-board connector is fitted in a direction parallel to the board surface,
Arranging the terminals of the connector on the lands provided on the board surface of the board via a solder material;
A bonding step of heating and melting the solder material to bond the terminals of the connector to the lands,
The connector has a positioning boss,
The board is provided with a positioning hole at a position where the positioning boss is inserted into the center of the hole when the terminal of the connector is arranged at a position shifted from the center of the land in the fitting direction for fitting the connector. And
In the joining step, the solder material heated and melted moves the connector terminal in a direction opposite to the fitting direction by a self-alignment effect of moving the connector terminal to the center side of the land, and the positioning. A component mounting method, wherein the connector is positioned on the board by applying a boss to the side wall of the positioning hole. A component mounting structure for mounting on a board so that at least one of a pair of connectors that are fitted and conducted with each other in a board-to-board connector is fitted in a direction parallel to the board surface,
The connector includes a positioning boss,
The board is provided on the board surface, and a terminal of the connector is disposed at a position shifted in a fitting direction for fitting the connector from a land where the connector terminal is disposed via a solder material. A positioning hole provided in a portion where the positioning boss is inserted into the center of the hole when arranged,
The solder material heated and melted moves the connector terminal in a direction opposite to the fitting direction by a self-alignment effect of moving the connector terminal toward the center of the land, and the positioning boss is positioned. A component mounting structure, wherein the connector is positioned on the substrate by being brought into contact with a side wall of a hole.   The component mounting structure according to claim 2, wherein the positioning hole has a narrowed hole shape opposite to the fitting direction.   An electronic apparatus comprising the component mounting structure according to claim 2.

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