CN105990257B - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
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- CN105990257B CN105990257B CN201510096597.9A CN201510096597A CN105990257B CN 105990257 B CN105990257 B CN 105990257B CN 201510096597 A CN201510096597 A CN 201510096597A CN 105990257 B CN105990257 B CN 105990257B
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- Prior art keywords
- external connection
- connection terminals
- shell
- semiconductor device
- socket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The increase of embodiments of the present invention inhibition welding position.The semiconductor device of embodiment can carry out the data transmission using universal serial bus and connecting with socket, it and include shell, circuitry substrate and the 2nd external connection terminals, the shell includes opening portion, the circuitry substrate is inserted into opening portion and includes: wiring board, comprising having the multiple connection gaskets for the 1st external connection terminals that can be connect with socket；And semiconductor chip, it is equipped on wiring board；2nd external connection terminals include: being secured portion, be fixed in the inner wall of opening portion；Socket connection part is set to and is secured portion's identical faces, and can connect with socket；And the 1st pad interconnecting piece and the 2nd pad interconnecting piece, be set to the opposing face in the portion of being secured, and be electrically connected at least one of multiple connection gaskets.
Description
[related application]
Present application is enjoyed based on Japanese patent application case 2014-188532 (applying date: on September 17th, 2014)
The priority of application case.Present application all the elements comprising basic application case by referring to the basis application case.
Technical field
The invention of embodiment is related to a kind of semiconductor device.
Background technique
One of connection specification when as the information equipments such as connection computer and peripheral equipment, it is known to USB
(Universal Serial Bus: universal serial bus).For example, including public connector (also referred to as plug) and mother by utilizing
The USB connector link information equipment and peripheral equipment of connector (also referred to as socket), can not only transmit data, such as may be used also
To obtain power supply necessary to the movement of peripheral equipment from information equipment, or via usb hub connect multiple equipment.
In the USB3.0 as one of USB specification, the compatibility with USB2.0 can be kept, and had
The High Speed Transfer of 10 times or more of the transmission speed of USB2.0.In the USB connector of USB3.0, except being set to USB2.0's
Other than four connection terminals of USB connector, it is also necessary to 5 connection terminals.When the number of connection terminal increases, for example,
Have in the semiconductor device of plug, it is difficult to ensure the formation space of connection terminal in wiring board itself.Therefore, having
In the semiconductor device of the plug of USB3.0, such as consider following three-dimensional construction, that is, a part of connection terminal is made to be engaged in cloth
Line substrate keeps remainder prominent on wiring board.
Wiring board is engaged in the case where a part of connection terminal is engaged in wiring board or by plug itself
In the case where, for example, the welding by SMT (Surface Mount Technology: surface mounting technique) etc. is connect
It closes.However, because the welding of SMT etc. it is at high cost, if welding position increases, manufacturing cost can correspondingly become
It is high.In this way, which pursuit is reduced as far as weld part in it can carry out the semiconductor device using the data transmission of USB
Position, and the construction that can be manufactured inexpensively.
Summary of the invention
Embodiments of the present invention inhibit welding position in the semiconductor device that can use USB progress data transmission
Increase.
The semiconductor device of embodiment is the data that can be carried out and connecting with socket using universal serial bus
The semiconductor device of transmission, and include shell, circuitry substrate and the 2nd external connection terminals, the shell includes opening portion,
The circuitry substrate is inserted into opening portion and includes: wiring board, comprising having the 1st external connection that can be connect with socket
Multiple connection gaskets of terminal；And semiconductor chip, it is equipped on wiring board；2nd external connection terminals include: being secured
Portion is fixed in the inner wall of opening portion；Socket connection part is set to and is secured portion's identical faces, and can connect with socket；With
And the 1st pad interconnecting piece and the 2nd pad interconnecting piece, be set to the opposing face in the portion of being secured, and be electrically connected to multiple connection gaskets at least
One.
Detailed description of the invention
Fig. 1 is the figure for indicating the structure example of semiconductor device.
Fig. 2 is the figure for indicating the structure example of semiconductor device.
Fig. 3 is the figure for indicating the connection example of semiconductor device and socket.
Fig. 4 is the figure for indicating the structure example of semiconductor device.
Fig. 5 is the figure for indicating the structure example of semiconductor device.
Fig. 6 (A) and (B) are the figures to illustrate manufacturer's rule of semiconductor device.
Fig. 7 is the figure to illustrate manufacturer's rule of semiconductor device.
Fig. 8 is the figure for indicating the structure example of semiconductor device.
Fig. 9 is the figure for indicating the structure example of semiconductor device.
Figure 10 is the figure for indicating the structure example of semiconductor device.
Figure 11 is the figure for indicating the structure example of semiconductor device.
Figure 12 is the figure for indicating the structure example of semiconductor device.
Figure 13 is the figure for indicating the structure example of semiconductor device.
Figure 14 is the figure to illustrate manufacturer's rule of semiconductor device.
Figure 15 is the figure to illustrate manufacturer's rule of semiconductor device.
Specific embodiment
Embodiment is illustrated referring to the drawings.In addition, attached drawing is schematical, for example, there are thickness and putting down
The relationship of face size, the situation different from reality such as thickness ratio of each layer.In addition, in embodiment, to substantial phase
Same constituent element marks identical symbol and omits the description.
(the 1st embodiment)
Fig. 1 is to indicate can to carry out that plug using the data transmission of USB3.0 is one-piece type partly leads with socket and connecting
The figure of the structure example of body device.In addition, can also be used as if it is the specification for using identical signal and can use other USB rule
The semiconductor device that lattice carry out data transmission uses.Semiconductor device 1 shown in FIG. 1 has shell 11, is set in shell 11
The circuitry substrate 12 and 5 external connection terminals 13 with 4 external connection terminals 125.In Fig. 1, for convenience, with
Dotted line indicates a part of shell 11, and the boundary of solid line portion and dotted line part is indicated with wave.
As external connection terminals 125, power supply terminal (VBUS) is set, for the normal transmission number as differential wave
It is believed that number signal terminal (D+, D-) and ground terminal (GND) etc. must using the data transmission that USB2.0 or USB3.0 is carried out
The external connection terminals needed.
As external connection terminals 13, ground terminal (GND) is set, for the High Speed Transfer transmission as differential wave
The signal terminal (SSTX+, SSTX-) of data-signal uses the letter for receiving data-signal for the High Speed Transfer as differential wave
External connection terminals necessary to the High Speed Transfer that number terminal (SSRX+, SSRX-) etc. is carried out using USB3.0 etc..
In turn, it is illustrated referring to structure example of the Fig. 2 to semiconductor device 1.Fig. 2 is the structure example for indicating semiconductor device
Figure.In Fig. 2, diagram has the circuit lining having as Sip (System in a Package: system in package) as an example
The semiconductor device at bottom.
Shell 11 has the opening portion 110 as non-through hole.Protrusion 111 is provided on the inner wall of opening portion 110, but
Protrusion 111 may not necessarily be set.Shell 11 has insulating properties, such as is formed by synthetic resin such as polyvinyl chloride etc..For example, can also
By will include synthetic resin and multiple housing parts with groove portion are bonded to be formed to have and open in the opposite mode of groove portion
The shell 11 of oral area 110.
Circuitry substrate 12 is inserted into opening portion 110 and fixes.At this point, circuitry substrate 12 can also be contacted with shell 11 and
It is fixed.Circuitry substrate 12 for example has: wiring board 121, has the 1st face and the 2nd face toward each other；Memory chip 122,
It is equipped on the 1st face of wiring board 121；Controller chip 123 is equipped on the 1st face of wiring board 121, via wiring board
121 and be electrically connected to memory chip 122；And sealing resin layer 124, memory chip 122 and controller chip 123 is close
Envelope.In addition, being not limited to memory chip 122 and controller chip 123, or other semiconductor chips.
1st face of wiring board 121 is equivalent to the lower surface of the wiring board 121 in Fig. 2, and the 2nd face is equivalent in Fig. 2
The upper surface of wiring board 121.Wiring board 121 has multiple connection gaskets in the 1st face that is set to, will storage via connection gasket
Device chip 122 is electrically connected with controller chip 123.In addition, wiring board 121 has the outside for including at least the 2nd face that is set to
Multiple connection gaskets of connection terminal 125, connection gasket 126a and connection gasket 126b.Alternatively, it is also possible to which connection gasket need not be arranged
126b.The connection gasket in the 1st face can for example be electrically connected to the connection gasket in the 2nd face via the through-hole of perforation wiring board 121.Make
For wiring board 121, such as it can be used and have glass epoxide compound of wiring layer for the connection gasket for being set to surface etc. and set
Rouge substrate etc..In addition, memory chip 122 and the position of controller chip 123 can also overturn.
External connection terminals 125 are the external connection terminals that can be connect with socket.As external connection terminals 125, tool
There are 4 external connection terminals necessary to the data transmission shown in FIG. 1 carried out using USB2.0 or USB3.0.
Connection gasket 126a and connection gasket 126b is the connection circuitry substrate 12 to be electrically connected with external connection terminals 13
Pad.
Lamination of the memory chip 122 for example with multiple semiconductor chips, multiple semiconductor chips are across adhesion coating
The mode for being overlapped a part adheres to one another.Multiple semiconductor chips will be by that will be set to each semiconductor core using routing engagement
The electrode of piece is connected and is electrically connected.As semiconductor chip, such as can be used with memory elements such as NAND flashes
Memory chip etc..At this point, semiconductor chip can also have decoder etc. in addition to having storage unit.
Controller chip 123 controls the movement such as the write-in to the data of memory chip 122 and the reading of data.Controller
Chip 123 includes semiconductor chip, such as by will be set to the electronic pads of semiconductor chip using routing engagement and be set to
The connection gasket of wiring board 121 connects and is electrically connected to wiring board 121.
As the connection method of memory chip 122 and controller chip 123 and wiring board 121, it is not limited to beat
Flip-chip bond or tape automated bonding etc. also can be used without wire bonding in wire bonding.In addition it is also possible to using memory is made
Chip 122 and controller chip 123 on the 1st face of wiring board 121 through silicon via (Through Silicon Via:
TSV) the three-dimension mount characteristic of mode etc..
Sealing resin layer 124 is for example containing inorganic filling material (such as SiO2).Sealing resin layer 124 e.g. uses will
The sealing resin and utilization transfer molding method, compression moulding, injection molding that the inorganic filling material and organic resin etc. mix
Etc. forming processes and formed.
As external connection terminals 13, there are 5 external connection terminals necessary to the High Speed Transfer using USB3.0.Outside
Portion's connection terminal 13, which includes, is secured portion 13a, is fixed in protrusion 111；Socket connection part 13b can be connect with socket；Pad connects
Socket part 13c is electrically connected to connection gasket 126a；And pad interconnecting piece 13d, it is electrically connected to connection gasket 126b.External connection terminals 13
Extend the two sides for being secured portion 13a.
The portion 13a of being secured for example is fixed in shell 11 by being embedded in forming.So-called insertion forming, which refers to, infuses resin
Enter to make around the metal parts being inserted into mold metal and the integrated manufacturing process of resin.Preferably it is secured portion
13a has protrusion, and is fixed in shell 11 in such a way that protrusion is embedded in protrusion 111.Thus, it is possible to increase affixed face
Product, it is thus possible to improve affixed intensity.
Socket connection part 13b is set to and is secured in portion's 13a identical faces.Preferably socket connection part 13b has upper
Side becomes the flexure plane of protrusion.Moreover it is preferred that socket connection part 13b has elasticity.In turn, preferably when lining will be routed
When 2nd face at bottom 121 is set as bottom surface, the height of socket connection part 13b is than pad interconnecting piece 13c and pad interconnecting piece 13d high.Because outer
Being electrically connected for portion's connection terminal 13 and socket is carried out in the upper surface of external connection terminals 13, so using the construction,
When semiconductor device 1 is inserted into socket, external connection terminals 13 can be pressed into, want because of elasticity restore power can towards by
The connection terminal of body applies, it is possible to improve the contact strength with external connection terminals 13.
Pad interconnecting piece 13c and pad interconnecting piece 13d are set to the opposing face for being secured portion 13a.Pad interconnecting piece 13c be set to compared with
It is secured the shallow position that portion 13a leans on opening portion 110, pad interconnecting piece 13d, which is set to, is relatively secured the depth that portion 13a leans on opening portion 110
Position.That is, the pad interconnecting piece being electrically connected with circuitry substrate 12 is arranged in the two sides for being secured portion 13a.At this point, by
Protrusion 111 is arranged in the side wall of the opening portion 110 of shell 11, and pad interconnecting piece 13d is sealed by shell 11 and circuitry substrate 12.As a result,
The sealing area 15 of interconnecting piece 13d sealing will be padded by being formed in semiconductor device 1.By the way that pad interconnecting piece is arranged in sealing area 15
13d, bad connection caused by being not likely to produce because of foreign matter.In addition, as long as pad interconnecting piece 13c and pad interconnecting piece 13d are at least electric respectively
It is connected to a connection gasket.
As external connection terminals 13, such as copper alloy (for example, beryllium copper, phosphor bronze, cobalt copper) or nickel alloy (example can be used
Such as beryllium nickel) elastic material can be assigned.
Fig. 3 is illustrated in by connect semiconductor device and socket shown in Fig. 2.In Fig. 3, socket 4 has shell 16, wiring
Matrix 17, the connection terminal 18 and connection terminal 19 for being set to wiring matrix 17.As connection terminal 18, has and utilize
4 external connection terminals necessary to the data transmission that USB2.0 or USB3.0 is carried out.As connection terminal 19, has and utilize
External connection terminals necessary to the High Speed Transfer that USB3.0 is carried out.
As shown in figure 3, when semiconductor device 1 shown in Fig. 2 is inserted into socket 4, connection terminal 18 and external connection
Terminal 125 contacts, and connection terminal 19 is contacted with the socket connection part 13b of external connection terminals 13.It as a result, can be shown in Fig. 2
The one-piece type semiconductor device 1 of plug and the information equipment for having socket 4 between carry out data transmission using USB.
As described above, in the semiconductor device of present embodiment, because external connection terminals is made to be fixed in the opening of shell
The inner wall in portion, so reducing the junction of circuitry substrate and external connection terminals using welding such as SMT.Thus, it is possible to press down
The increase of welding position processed, such as manufacturing cost can be reduced.
In the case where making external connection terminals be fixed in shell, when connected to an outlet if to external connection terminals or
Circuitry substrate force so external connection terminals can become easy offset, and therefore, external connection terminals contact not with circuitry substrate
A possibility that good, is easy to get higher.In contrast, in the semiconductor device of present embodiment, by the way that multiple external connection terminals are arranged
With the connecting portion of circuitry substrate, the generation of bad connection can be inhibited.In addition, in Fig. 2, the company of connection terminal and circuitry substrate
Socket part position is two positions, but the connecting portion at three positions or more also can be set.
The construction of external connection terminals 13 is not limited to Fig. 2.Another construction of semiconductor device 1 is illustrated in Fig. 4.Figure
For semiconductor device 1 shown in 4 compared with semiconductor device 1 shown in Fig. 2, the shape of external connection terminals 13 is different.In addition, figure
In 4, the explanation of Fig. 2 can be suitably quoted for constituent element identical with semiconductor device 1 shown in Fig. 2.
In Fig. 4, pad interconnecting piece 13c is set to the depth location that opening portion 110 is leaned on compared with socket connection part 13b, pads interconnecting piece
13d is set to the shallow place position that opening portion 110 is leaned on compared with socket connection part 13b.That is, being connected in pad interconnecting piece 13c and pad
Socket connection part 13b is set between portion 13d.Pad interconnecting piece 13c and pad interconnecting piece 13d are electrically connected to a connection gasket 126a.This
When, connection gasket 126b can also be not provided with.As shown in figure 4, even if multiple and connection terminal connection is arranged in a connection gasket
In the case where position, bonding strength can also be improved, therefore the generation of bad connection can be inhibited.
In addition, the construction of circuitry substrate 12 is not limited to Fig. 2.Another construction of semiconductor device is illustrated in Fig. 5.Figure
In 5, illustrate has as PCBA (Printed Circuit Board Assembly: printed circuit board) as an example
Circuitry substrate 12 semiconductor device.Semiconductor device shown in fig. 5 and the different point of semiconductor device 1 shown in Fig. 2
Be: the upper surface of wiring board 121 is the 1st face, and external connection terminals 125, company are arranged in the 1st face of wiring board 121
Connection pad 126a, and then replace memory chip 122 and controller chip 123 and have the 1st face for being equipped on wiring board 121
Semiconductor packages 127.In addition, can suitably draw in Fig. 5 for constituent element identical with semiconductor device 1 shown in Fig. 2
With the explanation of Fig. 2.In addition, external connection terminals 13 shown in Fig. 4 also can be set in semiconductor device 1 shown in fig. 5, and
Omit connection gasket 126b.
The lead frame of semiconductor packages 127 is electrically connected to the connection gasket for being set to the 1st face of wiring board 121.It can also
The semiconductor chip such as memory and Memory Controller to be arranged in semiconductor packages 127.Can also with as shown in figure 5,
Use the semiconductor packages for having lead frame as semiconductor chip, and does not form sealing resin layer on the semiconductor package.
In addition it is also possible to which memory chip and controller chip need not be arranged.
Then, it is illustrated referring to manufacturer rule of the Fig. 6 and Fig. 7 to semiconductor device.Fig. 6 is to illustrate semiconductor
The figure of manufacturer's rule of device, Fig. 6 (A) are top views, and Fig. 6 (B) is the cross-sectional view of the line segment X-Y in Fig. 6 (A).Fig. 7 is to use
To illustrate the figure of manufacturer's rule of semiconductor device.In addition, illustrating the manufacturer of semiconductor device shown in Fig. 2 in this
Rule, but can also be used as manufacturer's rule of Fig. 4 and semiconductor device shown in fig. 5 and suitably quote.
As shown in Fig. 6 (A) and Fig. 6 (B), housing parts 11a is formed, the housing parts 11a makes the comb with protrusion 13e
Toothed outer connection terminal 13 is affixed in a manner of being embedded to protrusion 13e by insertion forming.Protrusion 13e for example passes through implementation
It rushes edge processing and is formed.It is so-called rush edge processing and refer to pass through form opening and the periphery of opening made to hold up to form the processing of protrusion
Method.In addition, multiple protrusions also can be set as protrusion 13e.Affixed face by the way that protrusion 13e is arranged, with housing parts 11a
Product becomes larger, and the affixed intensity of housing parts 11a Yu external connection terminals 13 can be improved.
Then, by separating the linking portion of external connection terminals 13 using pressurization etc., and it is directed to each tooth of comb teeth
Separate external connection terminals 13.At this point, by making to be secured portion to one end of external connection terminals 13 from by separation side
Length is longer than the length from the portion that is secured to the other end of external connection terminals 13, and becomes easy separation.By walking above
Suddenly the housing parts 11a that the portion of being secured is connected with external connection terminals 13 can be formed in.
Then, as shown in fig. 7, preparing the circuitry substrate 12 for being formed with semiconductor chip on wiring board.In turn, to utilize
The housing parts 11a and housing parts 11b of intended shape sandwiches circuitry substrate 12 and forms the mode of opening portion for housing parts
11a is bonded with housing parts 11b, and external connection terminals 13 is made to be electrically connected and fix with the connection gasket of circuitry substrate 12.For example,
Sticker etc. can be used and be bonded housing parts 11a with housing parts 11b.Semiconductor dress can be manufactured by the step
It sets.
In the manufacturing method, in order to make external connection terminals be fixed in shell, it can be welded by SMT etc. and reduce electricity
The junction of road substrate and external connection terminals.Inhibit the increase of welding position as a result, such as manufacturing cost can be reduced.
(the 2nd embodiment)
Fig. 8 and Fig. 9 is to indicate that the plug combination type half using the data transmission of USB can be carried out and connecting with socket
The figure of the structure example of conductor device.Fig. 8 is the schematic diagram observed from the side, and Fig. 9 is the signal from the direction of upper surface
Figure.In addition, for convenience, a part of constituent element is not shown in Fig. 8 and Fig. 9.
Fig. 8 and semiconductor device shown in Fig. 92 have shell 21, circuitry substrate 22 and plug 23.In addition, as shell
21 and the explanation of circuitry substrate 22 can suitably quote the explanation of shell 11 shown in Fig. 2 and circuitry substrate 12.
Shell 21 has opening portion 210.The inner wall of opening portion 210 has insertion hole 24a and groove portion 24b.Be inserted into hole 24a and
The flat shape of groove portion 24b be it is rectangular-shaped, but not limited to this.In addition, insertion hole 24a may be through hole.Shell 21
Such as the material by can apply to shell 11 is formed.For example, it is also possible to by that comprising synthetic resin and will have the multiple of groove portion
Housing parts are bonded in the mode for keeping groove portion opposite and form the shell 21 with opening portion 210.
Circuitry substrate 22 is inserted into opening portion 210 and fixes.At this point, in a manner of all be overlapped with insertion hole 24a
Circuitry substrate 22 is inserted into.In addition, circuitry substrate 22 can also be contacted with shell 21 and be fixed.Circuitry substrate 12 for example has:
Wiring board 221 has the 1st face and the 2nd face toward each other；Memory chip 222 is equipped on the 1st of wiring board 221
Face；Controller chip 223 is equipped on the 1st face of wiring board 221, and is electrically connected to storage core via wiring board 221
Piece 222；And sealing resin layer 224, memory chip 222 and controller chip 223 are sealed.In addition, being not limited to deposit
Memory chip 222 and controller chip 223, or other semiconductor chips.Memory chip 222, controller chip
223 and sealing resin layer 224 be respectively equivalent to memory chip 122, controller chip 123 and sealing resin shown in Fig. 2
Layer 124, therefore, the explanation as memory chip 222, controller chip 223 and sealing resin layer 224 can suitably draw
With the explanation of memory chip 122, controller chip 123 and sealing resin layer 124.In addition, memory chip 222 and control
The position of device chip 223 can also overturn.
Wiring board 221 have be set to the 1st face multiple connection gaskets and be set to the 2nd face include at least connection gasket
225 multiple connection gaskets.Connection gasket 225 is the connection gasket circuitry substrate 22 to be electrically connected with plug 23.Via being set to
The connection gasket in the 1st face of wiring board 221 and memory chip 222 is electrically connected with controller chip 223.In addition, the 1st face
Connection gasket can for example be electrically connected to the connection gasket in the 2nd face via the through-hole of perforation wiring board 221.As wiring board
221 can be used for example resin substrates such as the glass epoxide compound for having the wiring layer for the connection gasket for being set to surface etc..
Plug 23 has comprising the fixed shell 231 and connection terminal 232 for using protrusion 231a.For example may be used as plug 23
To use the plug for the connector for being constituted USB2.0 or USB3.0, opening portion can be set in shell 231, benefit is set in opening portion
4 external connection terminals necessary to data transmission with USB2.0 or USB3.0 must using the High Speed Transfer of USB3.0
The external connection terminals such as 5 external connection terminals needed.At this point, the lining different from circuitry substrate 22 can also be arranged in plug 23
Bottom forms external connection terminals in the substrate or shell.In addition, multiple plugs also can be set as plug 23.It can pass through
Plug 23 is inserted into socket 4 for example shown in Fig. 3 and in semiconductor device 3 and has and is carried out between the information equipment of socket 4
Utilize the data transmission of USB.In addition, it's not limited to that, the plug of other USB specifications also can be used.
The end of fixed two opposite sides that shell 231 is respectively arranged at protrusion 231a, and it is inserted into setting
In the insertion hole 24a of the inner wall of opening portion 210.Plug 23 is chimeric as a result, and is fixed on shell 21.At this point, the side of insertion hole 24a
Wall can also be contacted with fixed with protrusion 231a.
Connection terminal 232 is by the external connection terminals of plug 23 and one of multiple connection gaskets as wiring board 221
Connection gasket 225 is electrically connected.Copper etc. can be used for example as connection terminal 232.One end of connection terminal 232 is slotting to be electrically connected to
The mode of first 23 external connection terminals is engaged in the substrate in plug 23, can be with by the way that the other end is engaged in connection gasket 225
External connection terminals are electrically connected with connection gasket 225.
In Fig. 8 and semiconductor device shown in Fig. 92, by the way that insertion hole is arranged in shell, make the fixation protrusion of plug
Be embedded in insertion hole and locking-type plug, circuitry substrate and shell.Assuming that being by circuitry substrate and fixed plug
Raising fixing intensity is needed by being engaged circuitry substrate with plug using the welding of SMT.In addition, in sealing resin layer
In the case where forming insertion hole, the problems such as there are sealing state deteriorations.As a result, by making the fixation of plug be embedded in shell with protrusion
Locking-type plug, circuitry substrate and shell are come in the insertion hole of body, can inhibit the increase of the welding position using SMT on one side, on one side
Locking-type plug.Manufacturing cost can be for example reduced as a result,.In addition, because it is not necessary that insertion hole is arranged in circuitry substrate, it is possible to
Sealing state is kept, furthermore, it is possible to reduce circuitry substrate.
The construction of semiconductor device 2 is not limited to Fig. 8 and Fig. 9.Figure 10 and Figure 11 is indicate semiconductor device another
The figure of structure example.Figure 10 is the schematic diagram observed from the side, and Figure 11 is the schematic diagram from the direction of upper surface.In addition,
In Figure 10 and Figure 11, for convenience, a part of constituent element is not shown.
Compared with Fig. 8 and semiconductor device shown in Fig. 92, difference exists semiconductor device 2 shown in Figure 10 and Figure 11
In: there is insertion hole 24c instead of insertion hole 24a and groove portion 24b.In other compositions, for Fig. 8 and shown in Fig. 9 half
The identical part of conductor device 2 can suitably quote the explanation of Fig. 8 and Fig. 9.
Insertion hole 24c is set to the side wall of opening portion 210.Being inserted into hole 24c is the groove portion for being set to the side wall of opening portion 210
A part.The groove portion of shell 21 and the gap of circuitry substrate 22 become insertion hole 24c.The fixation of plug 23 is embedding with protrusion 231a
Together in insertion hole 24c.
As shown in Figures 10 and 11, the gap of the groove portion and circuitry substrate that are set to the side wall of shell is set as insertion hole,
Can by make the fixation of plug with protrusion be embedded in insertion hole and locking-type plug, circuitry substrate and shell.Thus, it is possible to one
Face inhibits the increase of the welding position using SMT etc., a face locking-type plug, such as can reduce manufacturing cost.
(the 3rd embodiment)
Figure 12 is the semiconductor device for indicating to carry out the data transmission using USB3.0 with socket and connecting
The figure of structure example.In addition, can also be used as can carry out utilizing other USB specifications if it is the specification for using identical signal
The semiconductor device of data transmission uses.Semiconductor device 3 shown in Figure 12 has shell 31, circuitry substrate 32 and outside and connects
Connecting terminal 33.In addition, the explanation as shell 31, circuitry substrate 32 and external connection terminals 33, can suitably quote Fig. 2
Shown in shell 11, circuitry substrate 12 and external connection terminals 13 explanation.
Shell 31 has opening portion 310.Protrusion 311 is set on the inner wall of opening portion 310.Shell 31 is for example by that can apply
It is formed in the material of shell 11.For example, it is also possible to by making multiple housing parts comprising synthetic resin and with groove portion with slot
The opposite mode in portion is bonded and forms the shell 31 with opening portion 310.
Circuitry substrate 32 is inserted into opening portion 310 and fixes.At this point, circuitry substrate 32 can also be contacted with shell 31 and
It is fixed.Circuitry substrate 32 has: wiring board 321, such as with the 1st face and the 2nd face toward each other；Memory chip 322,
It is equipped on the 1st face of wiring board 321；Controller chip 323；And sealing resin layer 324, by memory chip 322 and control
Device chip 323 processed seals.In addition, being not limited to memory chip 322 and controller chip 323, or other are partly led
Body chip.Because memory chip 322, controller chip 323 and sealing resin layer 324 are respectively equivalent to storage shown in Fig. 2
Device chip 122, controller chip 123 and sealing resin layer 124, thus as memory chip 322, controller chip 323,
And the explanation of sealing resin layer 324 can suitably quote memory chip 122, controller chip 123 and sealing resin layer
124 explanation.In addition, memory chip 322 and the position of controller chip 323 can also overturn.
Wiring board 321 has multiple connection gaskets in the 1st face that is set to, and will deposit via the connection gasket for being set to the 1st face
Memory chip 322 is electrically connected with controller chip 323.In addition, wiring board 321 have be set to the 2nd face can be with socket
The external connection terminals 325 of connection and multiple connection gaskets including at least connection gasket 326.The connection gasket in the 1st face for example can be through
The connection gasket in the 2nd face is electrically connected to by the through-hole of perforation wiring board 321.As wiring board 321, tool can be used for example
There are resin substrates such as the glass epoxide compound for the wiring layer for having the connection gasket for being set to surface etc..
External connection terminals 325 are the external connection terminals that can be connect with socket.For example as external connection terminals 325
With 4 external connection terminals necessary to the data transmission shown in FIG. 1 using USB2.0 or USB3.0.
Connection gasket 326 is the connection gasket circuitry substrate 32 to be electrically connected with external connection terminals 33.Connect as outside
Connecting terminal 325 has 4 external connection terminals necessary to the data transmission using USB2.0 or USB3.0.In addition, if it is
Using the specification of identical signal, it is also used as the external connection terminals of other USB specifications.
External connection terminals 33, which include, buries portion 33a, is embedded in shell 31；Socket connection part 33b can connect with socket
It connects；Interconnecting piece 33c is padded, connection gasket 326 is electrically connected to；And supported portion 33d, it is supported by protrusion 311.As external connection terminal
Son 33 has 5 external connection terminals necessary to the High Speed Transfer using USB3.0.External connection terminals 33 are using can answer
What the material for external connection terminals 13 was formed.In addition, being also used as other if it is the specification for using identical signal
The external connection terminals of USB specification.
The portion 33a of burying is set to the end of external connection terminals 33.The portion 33a of burying when forming shell 31 for example by making
One end of external connection terminals 33 is buried in shell 31 and is formed.Bury portion 33a by setting, shell 31 and outside can be improved
The affixed intensity of connection terminal 33.Bury in portion 33a, preferably external connection terminals 33 bury direction and circuitry substrate 32
Direction of insertion it is substantially parallel.It is so-called substantially parallel and not only include parallel direction, also comprising deviate parallel direction ± 10 degree with
Interior state.
The flexure plane that there is preferably socket connection part 33b upside to become protrusion.Moreover it is preferred that socket connection part
33b has elasticity.In turn, preferably when the 2nd face of wiring board 321 is set as bottom surface, the height of socket connection part 33b
Than padding interconnecting piece 33c high.Because external connection terminals 33 and socket be electrically connected be the upper surface of external connection terminals 33 into
Row, so, when semiconductor device 3 is inserted into socket, socket and external connection terminals 33 can be improved using the construction
Contact strength.
Pad interconnecting piece 33c is set to the opposing face of socket connection part 33b.In relatively pad interconnecting piece 33c by the shallow of opening portion 110
Socket connection part 33b is arranged in position, buries portion 33a in deep position setting of the relatively pad interconnecting piece 33c by opening portion 110.At this point, pad
Interconnecting piece 33c can also be sealed by shell 31 and circuitry substrate 32.
Supported portion 33d is set to the opposing face of pad interconnecting piece 33c in a manner of being overlapped in pad interconnecting piece 33c.It is supported
Portion 33d is supported by protrusion 311.As a result, towards 326 pairs of pad interconnecting piece 33c applied forces of connection gasket.Thus, it is possible to improve pad connection
The contact strength of portion 33c.
When semiconductor device 3 shown in Figure 12 is inserted into socket 4 shown in Fig. 3, connection terminal 18 and external connection
Terminal 325 contacts, and connection terminal 19 is contacted with the socket connection part 33b of external connection terminals 33.Thus, it is possible to shown in Figure 12
Semiconductor device 3 and have socket information equipment between carry out data transmission using USB.
As described above, in the semiconductor device of present embodiment, it, can because external connection terminals is made to be buried in shell
Reduce the junction of circuitry substrate and external connection terminals using welding such as SMT.Thus, it is possible to inhibit welding position
Increase, such as manufacturing cost can be reduced.
The construction of semiconductor device 3 is not limited to Figure 12.Another construction of semiconductor device is illustrated in Figure 13.Figure 13
Shown in compared with the semiconductor device 3 shown in Figure 12 of semiconductor device 3, difference at least that: have instead of shell 31
Shell 31a and shell 31b.In addition, can be fitted in Figure 13 for constituent element identical with semiconductor device 3 shown in Figure 12
The explanation of locality reference Figure 12.
In Figure 13, shell 31a has opening portion 310.Alternatively, it is also possible to which protrusion is arranged in the side wall of shell 31a.Shell
31b and circuitry substrate 32 are inserted into opening portion 310 and fix.In addition, shell 31b and circuitry substrate 32 can also be with shells
31a is contacted and is fixed.In addition, circuitry substrate 32 can also be contacted with shell 31b and be fixed.Shell 31a is for example by polyvinyl chloride
Equal metal materials such as synthetic resin or aluminium etc. are formed.In addition, shell 31b is for example formed by the material that can apply to shell 11.
A part of shell 31b is hold between portion 33a and circuitry substrate 32 in burying for external connection terminals 33.Also
It is to say, buries portion 33a and be separated by with circuitry substrate 32.
In addition, in a same manner as in the first embodiment, in semiconductor device shown in Figure 12 and Figure 13, also can be set multiple
The connecting portion of external connection terminals 33 and circuitry substrate 32.In addition it is also possible in the same manner as Fig. 5, the of wiring board 321
Carry semiconductor packages in 1 face.
Then, 4 and Figure 15 is illustrated manufacturer's rule of semiconductor device referring to Fig.1.Figure 14 and Figure 15 be to
Illustrate the figure of manufacturer's rule of semiconductor device.In addition, in this, the manufacturing method of semiconductor device shown in explanatory diagram 12
Example, but can also be used as manufacturer's rule of semiconductor device shown in Figure 13 and suitably quote.
By the way that insertion forming will be utilized to make the embedment of external connection terminals 33 of 5 connection terminals connection extremely and housing parts
The housing parts of the identical material of 31b1 and form molded component 31b2, make the linking parts of external connection terminals 33 by pressurizeing etc.
Separation, and external connection terminals 33 are separated for each tooth of comb teeth.Then, by the way that molded component 31b2 to be embedded in and consolidate
Shell 31b is formed due to housing parts 31b1.At this point, molded component 31b2 is considered as a part of shell 31b.
Then, as shown in figure 14, shell 31b is inserted into the opening portion 310 of shell 31a and fixed.In addition, in Figure 14,
Direction of insertion is set as laterally, but opening portion 310 can also be configured upward, is longitudinally inserted into shell 31b.
Then, as shown in figure 15, the circuitry substrate 32 that semiconductor chip is formed on wiring board is inserted into opening portion
310, it is electrically connected external connection terminals 33 with the connection gasket of circuitry substrate 32 and fixes.In addition, as shown in Figure 13
Make external connection terminals 33 bury portion 33a and construction that circuitry substrate 32 is separated by the case where, can also be by housing parts
31b1 is fixed on before molded component 31b2, and circuitry substrate 32 is inserted into shell 31a.In addition, direction of insertion is set in Figure 15
For transverse direction, but opening portion 310 can also be configured upward, longitudinally be inserted into circuitry substrate 32.For example, it is also possible to use adhesion
Shell 31a is bonded by agent etc. with shell 31b.Semiconductor device can be manufactured by the step.
In the case where keeping external connection terminals and shell affixed, the assemble method of shell construction or circuitry substrate can be generated
It restricts, therefore, when circuitry substrate is inserted into shell, the connection of external connection terminals and circuitry substrate is easy to become not fill
Point.In addition, parts count when housing molding is easy to increase because of the restriction of shell construction, housing molding is easy to become complicated.
In contrast, the molded component that embedment has external connection terminals is additionally formed, by it in the manufacturing method
It is molded component is chimeric with housing parts and fixed afterwards and form shell.The freedom degree of shape when housing molding becomes as a result,
The case where than directly external connection terminals being made to be fixed in shell, is high, accordingly, it is considered to the connection of external connection terminals and circuitry substrate
Intensity can be such that design is easy.
In addition, having external connection terminal by forming embedment in the case where making multiple external connection terminals separation of connection
The molded component of son, can be such that external connection terminals separate before being fixed on other housing parts.Separation becomes to hold as a result,
Easily, because 5 external connection terminals can be formed simultaneously, inhibit the increase of parts count.It in turn, because can be will be electric
Road substrate, which is inserted into after shell, has the molded component of external connection terminals to be fixed on housing parts embedment, so manufacturing
When, the damage to external connection terminals can be mitigated.
In addition, each embodiment is prompted as example, it is not intended to limit the range of invention.These novel realities
The mode of applying can be implemented with various other ways, can carry out various omissions without departing from the spirit of the invention, displacement, become
More.These embodiments or its variation are contained in the range or purport of invention, and are contained in hair documented by claim
In bright and its impartial range.
[symbol description]
1 semiconductor device
2 semiconductor devices
3 semiconductor devices
4 sockets
11 shells
11a housing parts
11b housing parts
12 circuitry substrates
13 external connection terminals
13a is secured portion
13b socket connection part
13c pads interconnecting piece
13d pads interconnecting piece
13e protrusion
15 sealing areas
16 shells
17 wiring matrixes
18 connection terminals
19 connection terminals
21 shells
22 circuitry substrates
23 plugs
24a is inserted into hole
24b groove portion
24c is inserted into hole
31 shells
31a shell
31b shell
31b1 housing parts
31b2 molded component
32 circuitry substrates
33 external connection terminals
33a buries portion
33b socket connection part
33c pads interconnecting piece
33d supported portion
110 opening portions
111 protrusions
121 wiring boards
122 memory chips
123 controller chips
124 sealing resin layers
125 external connection terminals
126a connection gasket
126b connection gasket
127 semiconductor packages
210 opening portions
221 wiring boards
222 memory chips
223 controller chips
224 sealing plum rouge layers
225 connection gaskets
231 shells
The fixed protrusion of 231a
232 connection terminals
310 opening portions
311 protrusions
321 wiring boards
322 memory chips
323 controller chips
324 sealing resin layers
325 external connection terminals
326 connection gaskets
Claims (3)
1. a kind of semiconductor device, it is characterised in that:
It can carry out the data transmission using universal serial bus and connecting with socket, and include:
Shell includes opening portion；
Circuitry substrate is inserted in the opening portion, and includes: wiring board, can connect with the socket comprising having
Multiple connection gaskets of 1st external connection terminals；And semiconductor chip, it is equipped on the wiring board；And
2nd external connection terminals include: being secured portion, are fixed in the inner wall of the opening portion；Socket connection part, be set to
It is described to be secured portion's identical faces, and can be connect with the socket；And the 1st pad interconnecting piece and the 2nd pad interconnecting piece, the described 1st
Pad interconnecting piece be set to it is described be secured the opposing face in portion and be set to the portion position shallower relative to opening portion is secured compared with described in
Set and be electrically connected to the 1st connection gasket of the circuitry substrate, the 2nd pad interconnecting piece, which is set to, described is secured the opposite of portion
It face and is set to the 2nd for being secured the portion position deeper relative to opening portion and being electrically connected to the circuitry substrate and connects
Connection pad.
2. semiconductor device according to claim 1, it is characterised in that:
The shell includes protrusion on the inner wall of the opening portion；
The portion of being secured is fixed in the protrusion；
The 2nd pad interconnecting piece is sealed by the shell and the circuitry substrate.
3. semiconductor device according to claim 1 or 2, it is characterised in that:
2nd external connection terminals include protrusion in the portion of being secured, and to be buried the protrusion by being embedded in forming
The mode entered is fixed in the shell.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-188532 | 2014-09-17 | ||
| JP2014188532A JP6334342B2 (en) | 2014-09-17 | 2014-09-17 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105990257A CN105990257A (en) | 2016-10-05 |
| CN105990257B true CN105990257B (en) | 2019-06-07 |
Family
ID=55798070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510096597.9A Active CN105990257B (en) | 2014-09-17 | 2015-03-04 | Semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6334342B2 (en) |
| CN (1) | CN105990257B (en) |
| TW (1) | TWI545850B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022050235A (en) * | 2020-09-17 | 2022-03-30 | キオクシア株式会社 | Usb memory and manufacturing method therefor |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3078616B2 (en) * | 1991-08-30 | 2000-08-21 | ケル株式会社 | Plug connector and manufacturing method thereof |
| JP2541653Y2 (en) * | 1993-05-21 | 1997-07-16 | 日本航空電子工業株式会社 | connector |
| JP2008084570A (en) * | 2006-09-26 | 2008-04-10 | Calsonic Kansei Corp | Connector |
| KR20110088885A (en) * | 2010-01-29 | 2011-08-04 | 삼성전자주식회사 | Usb apparatus having pin module |
| JP2011188193A (en) * | 2010-03-08 | 2011-09-22 | Mitsubishi Electric Corp | Recording/reproduction device, and recording/reproduction method |
| CN201708305U (en) * | 2010-04-30 | 2011-01-12 | 富士康(昆山)电脑接插件有限公司 | Mobile storage device and electric connector thereof |
| JP5781107B2 (en) * | 2013-02-22 | 2015-09-16 | 株式会社東芝 | USB device |
| JP3185159U (en) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | USB connector combination structure |
| JP3185158U (en) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | USB connector combination structure |
-
2014
- 2014-09-17 JP JP2014188532A patent/JP6334342B2/en active Active
-
2015
- 2015-03-04 CN CN201510096597.9A patent/CN105990257B/en active Active
- 2015-03-04 TW TW104106910A patent/TWI545850B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI545850B (en) | 2016-08-11 |
| JP2016062704A (en) | 2016-04-25 |
| CN105990257A (en) | 2016-10-05 |
| JP6334342B2 (en) | 2018-05-30 |
| TW201613194A (en) | 2016-04-01 |
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Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
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