CN105990257A - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- CN105990257A CN105990257A CN201510096597.9A CN201510096597A CN105990257A CN 105990257 A CN105990257 A CN 105990257A CN 201510096597 A CN201510096597 A CN 201510096597A CN 105990257 A CN105990257 A CN 105990257A
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- China
- Prior art keywords
- housing
- external connection
- connection terminals
- socket
- semiconductor device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The embodiment of the present invention is provided to inhibit an increase of soldering portion. The embodied semiconductor device is capable of using USB to perform data transmission through connection to a socket, and includes a housing, a circuit substrate, and second external connection terminals. The housing is provided with an opening portion. The circuit substrate is inserted into the opening portion and includes: a wiring substrate including a plurality of connection pads having first external connection terminals capable of connecting to the socket; and a semiconductor chip disposed on the wiring substrate. The second external connection terminal includes: a fixed portion fixedly connected to an inner wall of the opening portion; a socket connection portion arranged on the same surface as the fixed portion for connection to the socket; and a first pad connection portion and a second pad connection portion that are arranged on the opposite surfaces relative to the fixed portion and electrically connected to at least one of the plurality of connection pads.
Description
[related application]
Subject application is enjoyed based on Japanese patent application case 2014-188532 (applying date: on JIUYUE 17th, 2014)
The priority of application case.Subject application comprises all the elements of basis application case by referring to this basis application case.
Technical field
The invention of embodiment relates to a kind of semiconductor device.
Background technology
As connecting the information equipments such as computer and one of connection specification during peripheral equipment, it is known to USB (Universal
Serial Bus: USB (universal serial bus)).Such as, comprise public connector (also referred to as plug) by utilization and female connectors is (also
Be referred to as socket) USB connector link information equipment and peripheral equipment, be possible not only to transmit data, such as can also be from
Power supply necessary to the action of information equipment acquisition peripheral equipment, or multiple equipment is connected via usb hub.
As in the USB3.0 of one of USB specification, the compatibility with USB2.0 can be kept, and have
The High Speed Transfer of the transfer rate of more than 10 times of USB2.0.In the USB connector of USB3.0, except being arranged at
Beyond four connection terminals of the USB connector of USB2.0, in addition it is also necessary to 5 connect terminal.When the number connecting terminal
During increase, such as, in the semiconductor device possessing plug, it is difficult to guarantee to connect the formation of terminal at wiring board itself
Space.Therefore, in possessing the semiconductor device of plug of USB3.0, such as, consider following three-dimensional structure, i.e. make
The part connecting terminal is engaged in wiring board, makes remainder prominent on wiring board.
It is engaged in wiring board in the case of the part connecting terminal is engaged in wiring board or by plug itself
In the case of, such as, connect by the welding of SMT (Surface Mount Technology: surface mounting technique) etc.
Close.But, because the cost of the welding of SMT etc. is high, if so welding position increases, then manufacturing cost can phase
Uprise with answering.Consequently, it is possible to can carry out utilizing in the semiconductor device that the data of USB transmit, pursue as far as possible
Ground reduces welding position, and the structure that can be manufactured inexpensively.
Summary of the invention
Embodiments of the present invention suppress welding position USB can be utilized to carry out in the semiconductor device of data transmission
Increase.
The semiconductor device of embodiment can be by being connected with socket and carrying out utilizing the data of USB (universal serial bus) to pass
The semiconductor device sent, and comprise housing, circuitry substrate and the 2nd external connection terminals, described housing comprises opening
Portion, described circuitry substrate is inserted into peristome and comprises: wiring board, comprises and has the 1st can be connected with socket
Multiple connection gaskets of external connection terminals；And semiconductor chip, it is equipped on wiring board；Described 2nd external connection terminals
Comprise: be secured portion, be fixed in the inwall of peristome；Socket connection part, is arranged at and is secured portion's identical faces, and
Can be connected with socket；And the 1st pad connecting portion and the 2nd pad connecting portion, it is arranged at the opposing face in the portion of being secured, and electricity
It is connected at least one of multiple connection gasket.
Accompanying drawing explanation
Fig. 1 is the figure of the structure example representing semiconductor device.
Fig. 2 is the figure of the structure example representing semiconductor device.
Fig. 3 is the figure representing semiconductor device with the connection example of socket.
Fig. 4 is the figure of the structure example representing semiconductor device.
Fig. 5 is the figure of the structure example representing semiconductor device.
Fig. 6 (A) and (B) are the figures of manufacturer's rule that semiconductor device is described.
Fig. 7 is the figure of manufacturer's rule that semiconductor device is described.
Fig. 8 is the figure of the structure example representing semiconductor device.
Fig. 9 is the figure of the structure example representing semiconductor device.
Figure 10 is the figure of the structure example representing semiconductor device.
Figure 11 is the figure of the structure example representing semiconductor device.
Figure 12 is the figure of the structure example representing semiconductor device.
Figure 13 is the figure of the structure example representing semiconductor device.
Figure 14 is the figure of manufacturer's rule that semiconductor device is described.
Figure 15 is the figure of manufacturer's rule that semiconductor device is described.
Detailed description of the invention
Referring to the drawings embodiment is illustrated.It addition, accompanying drawing is schematic, such as, there is thickness with flat
The relation of face size, the situation different from reality such as thickness ratio of each layer.Additionally, in embodiment, to essence
Upper identical element marks identical symbol and omits the description.
(the 1st embodiment)
Fig. 1 is to represent that the plug that can carry out utilizing the data of USB3.0 to transmit by being connected with socket is one-piece type partly to lead
The figure of the structure example of body device.It addition, if using the specification of identical signal, it is also possible to as utilizing other
USB specification carries out the semiconductor device of data transmission and uses.Semiconductor device 1 shown in Fig. 1 possesses housing 11, sets
The circuitry substrate 12 with 4 external connection terminals 125 being placed in housing 11 and 5 external connection terminals 13.
In Fig. 1, for convenience, it is represented by dotted lines a part for housing 11, represents solid line portion and dotted line part with wave
Border.
As external connection terminals 125, power supply terminal (VBUS) is set, for the normal transmission number as differential wave
The data that the signal terminal (D+, D-) of the number of it is believed that and ground terminal (GND) etc. utilize USB2.0 or USB3.0 to carry out pass
Send necessary external connection terminals.
As external connection terminals 13, ground terminal (GND) is set, sends for the High Speed Transfer as differential wave
The signal terminal (SSTX+, SSTX-) of data signal, for as the High Speed Transfer of differential wave with receiving data signal
Signal terminal (SSRX+, SSRX-) etc. utilize external connection terminals etc. necessary to the High Speed Transfer that USB3.0 carries out.
And then, with reference to Fig. 2, the structure example of semiconductor device 1 is illustrated.Fig. 2 is the structure representing semiconductor device
The figure of example.In Fig. 2, it is shown with the electricity possessed as Sip (System in a Package: system in package) as an illustration
The semiconductor device of road substrate.
Housing 11 possesses the peristome 110 as non-through hole.Protuberance 111 it is provided with on the inwall of peristome 110, but
Protuberance 111 can also be set.Housing 11 has insulating properties, such as, formed by synthetic resin etc. such as polrvinyl chloride.Example
As, it is also possible to by by comprise synthetic resin and have multiple housing parts in groove portion with groove portion in opposite directions by the way of fit and shape
Become there is the housing 11 of peristome 110.
Circuitry substrate 12 is inserted into peristome 110 and fixes.Now, circuitry substrate 12 can also connect with housing 11
Touch and fix.Circuitry substrate 12 such as possesses: wiring board 121, has the 1st toward each other and the 2nd；Deposit
Memory chip 122, is equipped on the 1st of wiring board 121；Controller chip 123, is equipped on wiring board 121
The 1st, be electrically connected to memory chip 122 via wiring board 121；And sealing resin layer 124, will deposit
Memory chip 122 and controller chip 123 seal.It addition, be not limited to memory chip 122 and controller chip
123, it is also possible to for other semiconductor chips.
1st face of wiring board 121 is equivalent to the lower surface of the wiring board 121 in Fig. 2, and the 2nd face is equivalent to Fig. 2
In the upper surface of wiring board 121.Wiring board 121 has the multiple connection gaskets being arranged at the 1st, via connection
Pad and memory chip 122 is electrically connected with controller chip 123.Additionally, wiring board 121 has including at least setting
It is placed in multiple connection gaskets of external connection terminals 125, connection gasket 126a and the connection gasket 126b of the 2nd.It addition,
Connection gasket 126b can also be set.The connection gasket of the 1st such as can be via the through hole of through wiring board 121
It is electrically connected to the connection gasket of the 2nd.As wiring board 121, such as, can use to have and possess the connection being arranged at surface
The resin substrates etc. such as the glass epoxide compound of the wiring layer of pad.Additionally, memory chip 122 and controller chip 123
Position can also overturn.
External connection terminals 125 is the external connection terminals can being connected with socket.As external connection terminals 125, tool
The data utilizing USB2.0 or USB3.0 to carry out shown in Fig. 1 are had to transmit necessary 4 external connection terminals.
Connection gasket 126a and connection gasket 126b is the connection in order to circuitry substrate 12 to be electrically connected with external connection terminals 13
Pad.
Memory chip 122 such as has the lamination of multiple semiconductor chip, and multiple semiconductor chips are to make across adhesion coating
The mode of part overlap adheres to one another.Multiple semiconductor chips will be arranged at each semiconductor core by utilizing routing to engage
The electrode of sheet connects and is electrically connected.As semiconductor chip, such as, can use the storages such as there is NAND flash
The memory chip etc. of element.Now, semiconductor chip can also possess decoder etc. in addition to possessing memory element.
Controller chip 123 controls the action such as the write of the data to memory chip 122 and the reading of data.Controller
Chip 123 comprises semiconductor chip, such as by utilizing routing joint will be arranged at electronic pads and the setting of semiconductor chip
Connection gasket in wiring board 121 connects and is electrically connected to wiring board 121.
As memory chip 122 and controller chip 123 and the method for attachment of wiring board 121, it is not limited to beat
Wire bonding, it is possible to use flip-chip bond or winding joint automatically etc. are without wire bonding.In addition it is also possible to make to deposit
Memory chip 122 and the controller chip 123 silicon through hole (Through on the 1st of wiring board 121
Silicon Via:TSV) three-dimension mount characteristic of mode etc..
Sealing resin layer 124 such as contains inorganic filling material (such as SiO2).Sealing resin layer 124 e.g. use by
Sealing resin that described inorganic filling material and organic resin etc. mix also utilizes transfer molding method, compression moulding, injection molding
The forming processes such as method and formed.
As external connection terminals 13, there is 5 external connection terminals necessary to the High Speed Transfer utilizing USB3.0.
External connection terminals 13 has: be secured portion 13a, is fixed in protuberance 111；Socket connection part 13b, can be with socket
Connect；Pad connecting portion 13c, is electrically connected to connection gasket 126a；And pad connecting portion 13d, it is electrically connected to connection gasket 126b.
External connection terminals 13 extends the both sides being secured portion 13a.
The portion 13a of being secured such as is fixed in housing 11 by insert molding.So-called insert molding refers to infuse resin into
The surrounding of the metal parts being inserted in mould makes the manufacturing process that metal is integrated with resin.Preferably it is secured portion
13a has a projection, and is embedded in by projection and is fixed in housing 11 in the way of protuberance 111.Thus, it is possible to increase solid
Junction is amassed, it is thus possible to improve affixed intensity.
Socket connection part 13b is arranged at and is secured in portion's 13a identical faces.On preferably socket connection part 13b has
Side becomes protruding flexure plane.Moreover it is preferred that socket connection part 13b and there is elasticity.And then, preferably when inciting somebody to action
When 2nd face of wiring board 121 is set to bottom surface, the aspect ratio pad connecting portion 13c of socket connection part 13b and pad connecting portion
13d is high.Because the electrical connection of external connection terminals 13 and socket is to carry out at the upper surface of external connection terminals 13, institute
To utilize described structure, when semiconductor device 1 is inserted into socket, external connection terminals 13 can be pressed into, because of bullet
Property and want the power restored to apply towards the connection terminal of receptor, it is possible to improve and the connecing of external connection terminals 13
Touch intensity.
Pad connecting portion 13c and pad connecting portion 13d is arranged at the opposing face being secured portion 13a.Pad connecting portion 13c is arranged at
Relatively being secured the portion 13a shallow position by peristome 110, pad connecting portion 13d is arranged at and is relatively secured portion 13a by peristome
The deep position of 110.It is to say, arrange, in the both sides being secured portion 13a, the pad connecting portion electrically connected with circuitry substrate 12.
Now, by arranging protuberance 111 at the sidewall of the peristome 110 of housing 11, pad connecting portion 13d is by housing 11 and electricity
Road substrate 12 seals.Thus, the sealing area 15 sealed by pad connecting portion 13d is formed at semiconductor device 1.Pass through
Pad connecting portion 13d is set at sealing area 15, is not likely to produce the bad connection caused because of foreign body.It addition, pad connecting portion
As long as 13c and pad connecting portion 13d is the most at least electrically connected to a connection gasket.
As external connection terminals 13, such as, can use copper alloy (such as, beryllium copper, phosphor bronze, cobalt copper) or nickel alloy (example
Such as beryllium nickel) etc. can give elasticity material.
It is illustrated in Fig. 3 by connect the semiconductor device shown in Fig. 2 and socket.In Fig. 3, socket 4 possess housing 16,
Wiring matrix 17, the connection terminal 18 being arranged at wiring matrix 17 and connection terminal 19.As connecting terminal 18,
There are the data utilizing USB2.0 or USB3.0 to carry out and transmit necessary 4 external connection terminals.As connecting terminal
19, there is external connection terminals necessary to the High Speed Transfer utilizing USB3.0 to carry out.
As it is shown on figure 3, when the semiconductor device 1 shown in Fig. 2 is inserted into socket 4, connect terminal 18 with outside
Connect terminal 125 to contact, and connection terminal 19 contacts with the socket connection part 13b of external connection terminals 13.Thus,
Can carry out utilizing USB between the one-piece type semiconductor device of the plug shown in Fig. 21 and the information equipment possessing socket 4
Data transmission.
As it has been described above, in the semiconductor device of present embodiment, because making external connection terminals be fixed in the peristome of housing
Inwall, so the welding such as available SMT reduce the junction of circuitry substrate and external connection terminals.Thus, may be used
To suppress the increase of welding position, such as, can reduce manufacturing cost.
In the case of making external connection terminals be fixed in housing, if when connected to an outlet to external connection terminals or electricity
Substrate so external connection terminals that exerts a force in road can become easily to offset, and therefore, external connection terminals contacts not with circuitry substrate
Good probability easily uprises.In contrast, in the semiconductor device of present embodiment, by arranging multiple external connection
Terminal and the connecting portion of circuitry substrate, can suppress the generation of bad connection.It addition, in Fig. 2, connect terminal and electricity
The connecting portion of road substrate is two positions but it also may arrange the connecting portion at more than three positions.
The structure of external connection terminals 13 is not limited to Fig. 2.Another structure of semiconductor device 1 is illustrated in Fig. 4.
Semiconductor device 1 shown in Fig. 4 is compared with the semiconductor device 1 shown in Fig. 2, and the shape of external connection terminals 13 is not
With.It addition, in Fig. 4, can suitably quote Fig. 2 for the element identical with the semiconductor device 1 shown in Fig. 2
Explanation.
In Fig. 4, pad connecting portion 13c is arranged at the relatively socket connection part 13b depth location by peristome 110, and pad connects
Portion 13d is arranged at the position, shallow place leaning on peristome 110 compared with socket connection part 13b.It is to say, at pad connecting portion 13c
And between pad connecting portion 13d, socket connection part 13b is set.Pad connecting portion 13c and pad connecting portion 13d is electrically connected to one
Connection gasket 126a.At this time it is also possible to be not provided with connection gasket 126b.As shown in Figure 4, even if arranging at a connection gasket
Multiple with in the case of the connecting portion being connected terminal, it is also possible to improve bonding strength, therefore can suppress bad connection
Produce.
Additionally, the structure of circuitry substrate 12 is not limited to Fig. 2.Another structure of semiconductor device is illustrated in Fig. 5.
In Fig. 5, illustrate as an example and have as PCBA (Printed Circuit Board Assembly: printed circuit board (PCB) dress
Join) the semiconductor device of circuitry substrate 12.Semiconductor device shown in Fig. 5 and semiconductor device 1 phase shown in Fig. 2
It is than difference: the upper surface of wiring board 121 is the 1st, and outside is set the 1st of wiring board 121
Connect terminal 125, connection gasket 126a, and then replace memory chip 122 and controller chip 123 to possess and be equipped on
The semiconductor packages 127 of the 1st of wiring board 121.It addition, in Fig. 5, for filling with the quasiconductor shown in Fig. 2
Put 1 identical element and can suitably quote the explanation of Fig. 2.Additionally, in the semiconductor device 1 shown in Fig. 5,
External connection terminals 13 shown in Fig. 4 can also be set, and omit connection gasket 126b.
The lead frame of semiconductor packages 127 is electrically connected to be arranged at the connection gasket of the 1st of wiring board 121.Also may be used
To arrange the such as semiconductor chip such as memorizer and Memory Controller in semiconductor packages 127.Can also be such as Fig. 5 institute
Show, use and possess the semiconductor packages of lead frame as semiconductor chip, and form sealing tree the most on the semiconductor package
Lipid layer.In addition it is also possible to memory chip and controller chip need not be arranged.
Then, with reference to Fig. 6 and Fig. 7, manufacturer's rule of semiconductor device is illustrated.Fig. 6 is to illustrate partly to lead
The figure of manufacturer's rule of body device, Fig. 6 (A) is top view, and Fig. 6 (B) is the sectional view of the line segment X-Y in Fig. 6 (A).
Fig. 7 is the figure of manufacturer's rule that semiconductor device is described.It addition, in this, illustrate the quasiconductor shown in Fig. 2
Manufacturer's rule of device but it also may as the semiconductor device shown in Fig. 4 and Fig. 5 manufacturer's rule and suitably
Quote.
As shown in Fig. 6 (A) and Fig. 6 (B), form housing parts 11a, described housing parts 11a and make that there is projection 13e
Comb teeth-shaped external connection terminals 13 is affixed in the way of projection 13e being imbedded by insert molding.Projection 13e is such as
Rush edge processing by enforcement and formed.What is called is rushed edge processing and is referred to be formed by forming opening and make the periphery of opening hold up
The processing method of projection.It addition, multiple projection can also be arranged as projection 13e.By arranging projection 13e, with shell
The affixed area of body component 11a becomes big, can improve the affixed intensity of housing parts 11a and external connection terminals 13.
Then, by utilizing pressurization etc. to be separated by the linking portion of external connection terminals 13, and for each tooth of comb
External connection terminals 13 is made to separate.Now, by make from by the portion that is secured of separation side to the one of external connection terminals 13
The length of end is longer to the length of the other end of external connection terminals 13 than from the portion that is secured, and makes separation become easy.Logical
Cross above step to be formed at the portion of being secured and be connected with the housing parts 11a of external connection terminals 13.
Then, as it is shown in fig. 7, prepare to be formed with on wiring board the circuitry substrate 12 of semiconductor chip.And then, in order to
Sandwich circuitry substrate 12 with the housing parts 11b of housing parts 11a and intended shape and form the mode of peristome by housing
Parts 11a and housing parts 11b fits, and makes external connection terminals 13 electrically connect with the connection gasket of circuitry substrate 12 and consolidate
Fixed.For example, it is also possible to use sticker etc. to be fitted by housing parts 11a and housing parts 11b.Can be by described step
Suddenly semiconductor device is manufactured.
In described manufacture method, in order to make external connection terminals be fixed in housing, can be reduced by welding such as SMT
Circuitry substrate and the junction of external connection terminals.Thus, the increase of suppression welding position, such as, can reduce manufacture
Cost.
(the 2nd embodiment)
Fig. 8 and Fig. 9 is to represent the plug combination type that can carry out utilizing the data of USB to transmit by being connected with socket
The figure of the structure example of semiconductor device.Fig. 8 is the schematic diagram observed from the side, and Fig. 9 is to observe from upper surface direction
Schematic diagram.It addition, in Fig. 8 and Fig. 9, for convenience, a part of element is not shown.
Semiconductor device 2 shown in Fig. 8 and Fig. 9 possesses housing 21, circuitry substrate 22 and plug 23.It addition, make
Saying of the housing 11 shown in Fig. 2 and circuitry substrate 12 can be suitably quoted for the explanation of housing 21 and circuitry substrate 22
Bright.
Housing 21 possesses peristome 210.The inwall of peristome 210 has insertion hole 24a and groove portion 24b.Insert hole 24a
And the flat shape of groove portion 24b is rectangular-shaped, but it is not limited to this.It addition, inserting hole 24a can also be through hole.
Housing 21 is such as formed by the material that can apply to housing 11.For example, it is also possible to by synthetic resin will be comprised and has
Multiple housing parts in groove portion are fitted in the way of making groove portion in opposite directions and are formed the housing 21 with peristome 210.
Circuitry substrate 22 is inserted into peristome 210 and fixes.Now, with the most not overlapping with inserting hole 24a side
Circuitry substrate 22 is inserted by formula.It addition, circuitry substrate 22 can also contact with housing 21 and fix.Circuitry substrate 12
Such as possess: wiring board 221, there is the 1st toward each other and the 2nd；Memory chip 222, is equipped on
The 1st of wiring board 221；Controller chip 223, is equipped on the 1st of wiring board 221, and via wiring
Substrate 221 and be electrically connected to memory chip 222；And sealing resin layer 224, by memory chip 222 and control
Device chip 223 seals.It addition, be not limited to memory chip 222 and controller chip 223, it is also possible to for other
Semiconductor chip.Memory chip 222, controller chip 223 and sealing resin layer 224 are respectively equivalent to Fig. 2 institute
Memory chip 122, controller chip 123 and the sealing resin layer 124 shown, accordingly, as memory chip 222,
Memory chip 122, controller core can be suitably quoted in the explanation of controller chip 223 and sealing resin layer 224
Sheet 123 and the explanation of sealing resin layer 124.Additionally, the position of memory chip 222 and controller chip 223 is also
Can overturn.
Wiring board 221 have be arranged at multiple connection gaskets of the 1st and be arranged at the 2nd including at least connection gasket
Multiple connection gaskets of 225.Connection gasket 225 is the connection gasket in order to circuitry substrate 22 to be electrically connected with plug 23.Via
It is arranged at the connection gasket of the 1st of wiring board 221 and memory chip 222 is electrically connected with controller chip 223.
Additionally, the connection gasket of the 1st such as can be electrically connected to the connection of the 2nd via the through hole of through wiring board 221
Pad.The glass epoxide with the wiring layer possessing the connection gasket being arranged at surface such as can be used as wiring board 221
The resin substrates etc. such as compound.
Plug 23 has the housing 231 comprising fixing projection 231a and connects terminal 232.As plug 23 such as
The plug of the adapter constituting USB2.0 or USB3.0 can be used, peristome can be set at housing 231, at opening
Portion arranges and utilizes the data of USB2.0 or USB3.0 transmit necessary 4 external connection terminals or utilize USB3.0
High Speed Transfer necessary to the external connection terminals such as 5 external connection terminals.At this time it is also possible to arrange at plug 23
The substrate different from circuitry substrate 22, forms external connection terminals at this substrate or housing.It addition, as plug 23 also
Multiple plug can be set.Can be by plug 23 being inserted into the such as socket 4 shown in Fig. 3 and at semiconductor device 3
And possess the data transmission carrying out utilizing USB between the information equipment of socket 4.It addition, be not limited to this, it is possible to
To use the plug of other USB specification.
The end of fixing in opposite directions two sides being respectively arranged at housing 231 by projection 231a, and it is inserted into setting
Insertion hole 24a in the inwall of peristome 210.Thus, plug 23 is fitted together to and is fixed on housing 21.Now, insert
The sidewall of hole 24a can also contact by projection 231a with fixing.
Connect terminal 232 using the external connection terminals of plug 23 and one of the multiple connection gaskets as wiring board 221
Connection gasket 225 electrically connects.Copper etc. such as can be used as connecting terminal 232.Connect one end of terminal 232 to be electrically connected
The mode of the external connection terminals being connected to plug 23 is engaged in the substrate in plug 23, by the other end is engaged in connection
External connection terminals can be electrically connected by pad 225 with connection gasket 225.
In the semiconductor device 2 shown in Fig. 8 and Fig. 9, by arranging insertion hole at housing, make the fixing with prominent of plug
Rise be embedded in insertion hole and locking-type plug, circuitry substrate and housing.Assume in the situation that circuitry substrate is fixing with plug
Under, in order to improve fixing intensity, need circuitry substrate to be engaged with plug by utilizing the welding of SMT.Additionally,
In the case of sealing resin layer is formed and inserts hole, there is the problems such as sealing state deterioration.Thus, by making consolidating of plug
Fixed projection is embedded in the insertion hole of housing and fixes plug, circuitry substrate and housing, can simultaneously suppress to utilize SMT
The increase of welding position, a locking-type plug.Thus, manufacturing cost can such as be reduced.Additionally, because without
Circuitry substrate arranges insertion hole, it is possible to keep sealing state, furthermore, it is possible to reduce circuitry substrate.
The structure of semiconductor device 2 is not limited to Fig. 8 and Fig. 9.Figure 10 and Figure 11 is represent semiconductor device another
The figure of one structure example.Figure 10 is the schematic diagram observed from the side, and Figure 11 is the schematic diagram observed from upper surface direction.
It addition, in Figure 10 and Figure 11, for convenience, a part of element is not shown.
Semiconductor device 2 shown in Figure 10 and Figure 11 compared with the semiconductor device 2 shown in Fig. 8 and Fig. 9, difference
It is: replace inserting hole 24a and groove portion 24b and there is insertion hole 24c.Other constitute in, for Fig. 8 and figure
The part that semiconductor device 2 shown in 9 is identical can suitably quote the explanation of Fig. 8 and Fig. 9.
Insert hole 24c and be arranged at the sidewall of peristome 210.Insert the groove that hole 24c is disposed on the sidewall of peristome 210
The part in portion.The groove portion of housing 21 and the gap of circuitry substrate 22 become insertion hole 24c.Fixing the using of plug 23 is dashed forward
Play 231a and be embedded in insertion hole 24c.
As shown in Figures 10 and 11, it is set to the gap in the groove portion and circuitry substrate that are arranged at the sidewall of housing insert hole,
Can by the fixing projection making plug be embedded in insertion hole and locking-type plug, circuitry substrate and housing.Thus, may be used
Utilize the increase of the welding position of SMT etc., a locking-type plug with one side suppression, such as, can reduce manufacturing cost.
(the 3rd embodiment)
Figure 12 is the structure representing the semiconductor device that can carry out utilizing the data of USB3.0 to transmit by being connected with socket
Make the figure of example.It addition, if using the specification of identical signal, it is also possible to as carrying out utilizing other USB to advise
The semiconductor device that the data of lattice transmit uses.Semiconductor device 3 shown in Figure 12 possess housing 31, circuitry substrate 32,
And external connection terminals 33.It addition, as housing 31, circuitry substrate 32 and the explanation of external connection terminals 33, can
Suitably to quote the housing 11 shown in Fig. 2, circuitry substrate 12 and the explanation of external connection terminals 13.
Housing 31 possesses peristome 310.The inwall of peristome 310 arranges protuberance 311.Housing 31 is such as by energy
The material being applied to housing 11 is formed.For example, it is also possible to by making comprise synthetic resin and there are multiple housings in groove portion
Parts by groove portion in opposite directions in the way of fit and form the housing 31 with peristome 310.
Circuitry substrate 32 is inserted into peristome 310 and fixes.Now, circuitry substrate 32 can also connect with housing 31
Touch and fix.Circuitry substrate 32 possesses: wiring board 321, such as, have the 1st toward each other and the 2nd；Deposit
Memory chip 322, is equipped on the 1st of wiring board 321；Controller chip 323；And sealing resin layer 324,
Memory chip 322 and controller chip 323 are sealed.It addition, be not limited to memory chip 322 and controller
Chip 323, it is also possible to for other semiconductor chips.Because memory chip 322, controller chip 323 and sealing tree
Lipid layer 324 is respectively equivalent to the memory chip 122 shown in Fig. 2, controller chip 123 and sealing resin layer 124,
So the explanation as memory chip 322, controller chip 323 and sealing resin layer 324 can suitably be quoted
Memory chip 122, controller chip 123 and the explanation of sealing resin layer 124.Additionally, memory chip 322
Can also overturn with the position of controller chip 323.
Wiring board 321 has the multiple connection gaskets being arranged at the 1st, will deposit via the connection gasket being arranged at the 1st
Memory chip 322 electrically connects with controller chip 323.Additionally, wiring board 321 has is arranged at the 2nd permissible
The external connection terminals 325 being connected with socket and the multiple connection gaskets including at least connection gasket 326.The connection of the 1st
Pad such as can be electrically connected to the connection gasket of the 2nd via the through hole of through wiring board 321.As wiring board 321,
Such as can use the resin substrates etc. such as the glass epoxide compound with the wiring layer possessing the connection gasket being arranged at surface.
External connection terminals 325 is the external connection terminals can being connected with socket.As external connection terminals 325 such as
There are the data utilizing USB2.0 or USB3.0 shown in Fig. 1 and transmit necessary 4 external connection terminals.
Connection gasket 326 is the connection gasket in order to circuitry substrate 32 to be electrically connected with external connection terminals 33.Connect as outside
Connecting terminal 325 has data necessary 4 external connection terminals of transmission utilizing USB2.0 or USB3.0.It addition,
If using the specification of identical signal, it is also possible to as the external connection terminals of other USB specification.
External connection terminals 33 has: bury portion 33a, is embedded in housing 31；Socket connection part 33b, can be with socket
Connect；Pad connecting portion 33c, is electrically connected to connection gasket 326；And supported portion 33d, protuberance 311 support.As
External connection terminals 33 has 5 external connection terminals necessary to the High Speed Transfer utilizing USB3.0.External connection terminal
Son 33 is that the material using and can apply to external connection terminals 13 is formed.It addition, if use the rule of identical signal
Lattice, it is also possible to as the external connection terminals of other USB specification.
The portion 33a of burying is arranged at the end of external connection terminals 33.The portion 33a of burying is such as by when forming housing 31
The one end making external connection terminals 33 is buried in housing 31 and is formed.Bury portion 33a by setting, housing can be improved
31 with the affixed intensity of external connection terminals 33.Bury in portion 33a, preferably the side of burying of external connection terminals 33
To almost parallel with the direction of insertion of circuitry substrate 32.What is called is almost parallel and not only comprises parallel direction, also comprises partially
State within parallel direction ± 10 degree.
Preferably socket connection part 33b has the flexure plane that upside becomes protruding.Moreover it is preferred that socket connection part
33b has elasticity.And then, preferably when the 2nd face of wiring board 321 is set to bottom surface, socket connection part 33b
Aspect ratio pad connecting portion 33c high.Because external connection terminals 33 is at external connection terminals 33 with the electrical connection of socket
Upper surface carry out, so utilizing described structure, when semiconductor device 3 is inserted into socket, can improve socket with
The contact strength of external connection terminals 33.
Pad connecting portion 33c is arranged at the opposing face of socket connection part 33b.Relatively padding connecting portion 33c by peristome 110
Shallow position arranges socket connection part 33b, buries portion 33a relatively padding the connecting portion 33c deep position setting by peristome 110.
Now, pad connecting portion 33c can also be sealed by housing 31 and circuitry substrate 32.
Supported portion 33d is arranged at the opposing face of pad connecting portion 33c in the way of being overlapped in pad connecting portion 33c.Supported
Portion 33d is supported by protuberance 311.Thus, towards connection gasket 326, pad connecting portion 33c is applied power.Thus, it is possible to carry
The contact strength of high pad connecting portion 33c.
When the semiconductor device 3 shown in Figure 12 is inserted into the socket 4 shown in Fig. 3, connects terminal 18 and connect with outside
Connecting terminal 325 contacts, and connects terminal 19 and contacts with the socket connection part 33b of external connection terminals 33.Thus, it is possible to
Between semiconductor device 3 and the information equipment possessing socket shown in Figure 12, carry out utilizing the data transmission of USB.
As it has been described above, in the semiconductor device of present embodiment, because making external connection terminals be buried in housing, so can
To utilize the welding such as SMT to make circuitry substrate reduce with the junction of external connection terminals.Thus, it is possible to suppression welding
The increase at position, such as, can reduce manufacturing cost.
The structure of semiconductor device 3 is not limited to Figure 12.Another structure of semiconductor device is illustrated in Figure 13.Figure
Semiconductor device 3 shown in 13 compared with the semiconductor device 3 shown in Figure 12, difference at least that: replace housing
31 and there is housing 31a and housing 31b.It addition, in Figure 13, for identical with the semiconductor device 3 shown in Figure 12
Element can suitably quote the explanation of Figure 12.
In Figure 13, housing 31a has peristome 310.Alternatively, it is also possible to the sidewall at housing 31a arranges protuberance.Shell
Body 31b and circuitry substrate 32 are inserted into peristome 310 and fix.It addition, housing 31b and circuitry substrate 32 also may be used
Fix to contact with housing 31a.Additionally, circuitry substrate 32 can also contact with housing 31b and fix.Housing 31a
Such as formed by metal materials such as synthetic resin or aluminum etc. such as polrvinyl chloride.Additionally, housing 31b is such as by can apply to shell
The material of body 11 is formed.
A part of housing 31b is hold between the portion that the buries 33a and circuitry substrate 32 of external connection terminals 33.Also
That is, bury portion 33a and be separated by with circuitry substrate 32.
It addition, in a same manner as in the first embodiment, in the semiconductor device shown in Figure 12 and Figure 13, it is also possible to arrange many
Individual external connection terminals 33 and the connecting portion of circuitry substrate 32.In addition it is also possible in the same manner as Fig. 5, at wiring lining
1st the lift-launch semiconductor packages at the end 321.
Then, with reference to Figure 14 and Figure 15, manufacturer's rule of semiconductor device is illustrated.Figure 14 and Figure 15 is to use
Figure with manufacturer's rule of explanation semiconductor device.It addition, in this, the system of the semiconductor device shown in Figure 12 is described
Make method example but it also may suitably quote as manufacturer's rule of the semiconductor device shown in Figure 13.
Make 5 to connect by utilizing insert molding external connection terminals 33 that terminals link imbed to housing parts
The housing parts of the identical material of 31b1 and form molded component 31b2, waited by pressurization and make the company of external connection terminals 33
Knot is partially separated, and each tooth for comb makes external connection terminals 33 separate.Then, by by molded component 31b2
Embed and be fixed on housing parts 31b1 and form housing 31b.Now, molded component 31b2 is considered as housing 31b
A part.
Then, as shown in figure 14, housing 31b is inserted into the peristome 310 of housing 31a and fixes.It addition, figure
In 14, direction of insertion is set to laterally but it also may peristome 310 is configured upward, longitudinally housing 31b is inserted.
Then, as shown in figure 15, the circuitry substrate 32 that wiring board is formed semiconductor chip is inserted into peristome
310, make external connection terminals 33 electrically connect with the connection gasket of circuitry substrate 32 and fix.It addition, as shown in figure 13
As make the structure that the portion that the buries 33a of external connection terminals 33 and circuitry substrate 32 are separated by the case of, it is also possible to
Before housing parts 31b1 is fixed on molded component 31b2, circuitry substrate 32 is inserted into housing 31a.It addition, figure
In 15, direction of insertion is set to laterally but it also may peristome 310 is configured upward, longitudinally by circuitry substrate 32
Insert.For example, it is also possible to use sticker etc. to be fitted by housing 31a and housing 31b.Can be made by described step
Manufacturing semiconductor device.
In the case of making external connection terminals and housing affixed, the assemble method of housing structure or circuitry substrate can produce system
About, therefore, when circuitry substrate is inserted into housing, external connection terminals easily becomes not fill with the connection of circuitry substrate
Point.Additionally, because of the restriction of housing structure, parts count during housing molding easily becomes many, housing molding easily becomes multiple
Miscellaneous.
In contrast, in described manufacture method, being additionally formed embedment has the molded component of external connection terminals, by it
After by chimeric with housing parts for molded component and fixing and form housing.Thus, the degree of freedom of shape during housing molding becomes
Must be higher than directly making external connection terminals be fixed in the situation of housing, accordingly, it is considered to external connection terminals and circuitry substrate
Bonding strength, can make design easy.
Additionally, in the case of the multiple external connection terminals making link separate, have external connection terminals by forming embedment
Molded component, external connection terminals can be made to separate before being fixed on other housing parts.Thus, separation becomes to hold
Easily, because 5 external connection terminals can be concurrently formed, the increase of parts count is therefore suppressed.And then, because permissible
Embedment have after circuitry substrate is inserted into housing the molded component of external connection terminals be fixed on housing parts, so
During fabrication, the damage to external connection terminals can be alleviated.
It addition, each embodiment is pointed out as example, it is not intended to limit the scope of invention.The reality of these novelties
The mode of executing can be implemented in other various modes, can carry out within a range not departing from the gist of the invention various omission, displacement,
Change.These embodiments or its change are contained in scope or the purport of invention, and are contained in described in claim
Invention and equalization scope in.
[symbol description]
1 semiconductor device
2 semiconductor devices
3 semiconductor devices
4 sockets
11 housings
11a housing parts
11b housing parts
12 circuitry substrate
13 external connection terminals
13a is secured portion
13b socket connection part
13c pad connecting portion
13d pad connecting portion
13e projection
15 sealing areas
16 housings
17 wiring matrixes
18 connect terminal
19 connect terminal
21 housings
22 circuitry substrate
23 plugs
24a inserts hole
24b groove portion
24c inserts hole
31 housings
31a housing
31b housing
31b1 housing parts
31b2 molded component
32 circuitry substrate
33 external connection terminals
33a buries portion
33b socket connection part
33c pad connecting portion
33d supported portion
110 peristomes
111 protuberances
121 wiring boards
122 memory chips
123 controller chips
124 sealing resin layers
125 external connection terminals
126a connection gasket
126b connection gasket
127 semiconductor packages
210 peristomes
221 wiring boards
222 memory chips
223 controller chips
224 seal prunus mume (sieb.) sieb.et zucc. lipid layer
225 connection gaskets
231 housings
The fixing projection of 231a
232 connect terminal
310 peristomes
311 protuberances
321 wiring boards
322 memory chips
323 controller chips
324 sealing resin layers
325 external connection terminals
326 connection gaskets
Claims (5)
1. a semiconductor device, it is characterised in that:
It can carry out utilizing the data transmission of USB (universal serial bus) by being connected with socket, and comprises:
Housing, comprises peristome；
Circuitry substrate, is inserted in described peristome, and comprises: wiring board, comprises that have can be with described socket
Multiple connection gaskets of the 1st external connection terminals connected；And semiconductor chip, it is equipped on described wiring board；And
2nd external connection terminals, comprises: be secured portion, is fixed in the inwall of described peristome；Socket connection part,
It is arranged at and the described portion's identical faces that is secured, and can be connected with described socket；And the 1st pad connecting portion and the 2nd pad even
Meet portion, be arranged at described in be secured the opposing face in portion, and be electrically connected to the plurality of connection gasket at least one.
Semiconductor device the most according to claim 1, it is characterised in that:
Described housing comprises protuberance on the inwall of described peristome；
The described portion of being secured is arranged between described 1st pad connecting portion and described 2nd pad connecting portion, and is fixed in described convex
Portion；
Described 1st pad connecting portion is electrically connected to the 1st connection gasket；
Described 2nd pad connecting portion is electrically connected to the 2nd connection gasket；And
Described 2nd pad connecting portion is sealed by described housing and described circuitry substrate.
Semiconductor device the most according to claim 1 and 2, it is characterised in that:
Described 2nd external connection terminals comprises projection in the described portion of being secured, and to be dashed forward described by insert molding
The mode playing embedment is fixed in described housing.
4. a semiconductor device, it is characterised in that:
Can carry out utilizing the data transmission of USB (universal serial bus) by being connected with socket, and comprise:
1st housing, comprises and has the 1st peristome inserting hole on sidewall；
Circuitry substrate, is inserted in described 1st peristome, and comprises: wiring board, comprise multiple connection gasket；And
Semiconductor chip, is equipped on described wiring board；And
Plug, comprises: the 2nd housing, comprises and is arranged at the end of side and is embedded in the fixing with prominent of described insertion hole
Rise and the 2nd peristome；External connection terminals, it is arranged at described 2nd peristome, can be connected with described socket；With
And inside connects terminal, described external connection terminals is electrically connected with at least one of the plurality of connection gasket.
5. a semiconductor device, it is characterised in that:
It can carry out utilizing the data transmission of USB (universal serial bus) by being connected with socket, and comprises:
Housing, comprises peristome；
Circuitry substrate, is inserted in described peristome, and comprises: wiring board, comprises and has and can insert with described
Multiple connection gaskets of the 1st external connection terminals that seat connects；And semiconductor chip, it is equipped on described wiring board；With
And
2nd external connection terminals, comprises: bury portion, is arranged at end and is embedded in the inwall of described peristome；Insert
Seat connecting portion, can be connected with described socket；And pad connecting portion, it is arranged at the opposing face of described socket connection part,
And it is electrically connected at least one of the plurality of connection gasket.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-188532 | 2014-09-17 | ||
| JP2014188532A JP6334342B2 (en) | 2014-09-17 | 2014-09-17 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105990257A true CN105990257A (en) | 2016-10-05 |
| CN105990257B CN105990257B (en) | 2019-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510096597.9A Active CN105990257B (en) | 2014-09-17 | 2015-03-04 | Semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6334342B2 (en) |
| CN (1) | CN105990257B (en) |
| TW (1) | TWI545850B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022050235A (en) * | 2020-09-17 | 2022-03-30 | キオクシア株式会社 | Usb memory and manufacturing method therefor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201708305U (en) * | 2010-04-30 | 2011-01-12 | 富士康(昆山)电脑接插件有限公司 | Mobile storage device and electric connector thereof |
| JP2011188193A (en) * | 2010-03-08 | 2011-09-22 | Mitsubishi Electric Corp | Recording/reproduction device, and recording/reproduction method |
| JP3185158U (en) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | USB connector combination structure |
| JP3185159U (en) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | USB connector combination structure |
| JP3191030U (en) * | 2013-03-27 | 2014-06-05 | 丸景企業有限公司 | USB connector plug |
| CN104009305A (en) * | 2013-02-22 | 2014-08-27 | 株式会社东芝 | Usb device and usb system |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3078616B2 (en) * | 1991-08-30 | 2000-08-21 | ケル株式会社 | Plug connector and manufacturing method thereof |
| JP2541653Y2 (en) * | 1993-05-21 | 1997-07-16 | 日本航空電子工業株式会社 | connector |
| JP2008084570A (en) * | 2006-09-26 | 2008-04-10 | Calsonic Kansei Corp | Connector |
| KR20110088885A (en) * | 2010-01-29 | 2011-08-04 | 삼성전자주식회사 | Usb apparatus having pin module |
-
2014
- 2014-09-17 JP JP2014188532A patent/JP6334342B2/en active Active
-
2015
- 2015-03-04 TW TW104106910A patent/TWI545850B/en active
- 2015-03-04 CN CN201510096597.9A patent/CN105990257B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011188193A (en) * | 2010-03-08 | 2011-09-22 | Mitsubishi Electric Corp | Recording/reproduction device, and recording/reproduction method |
| CN201708305U (en) * | 2010-04-30 | 2011-01-12 | 富士康(昆山)电脑接插件有限公司 | Mobile storage device and electric connector thereof |
| CN104009305A (en) * | 2013-02-22 | 2014-08-27 | 株式会社东芝 | Usb device and usb system |
| JP3191030U (en) * | 2013-03-27 | 2014-06-05 | 丸景企業有限公司 | USB connector plug |
| JP3185158U (en) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | USB connector combination structure |
| JP3185159U (en) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | USB connector combination structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201613194A (en) | 2016-04-01 |
| TWI545850B (en) | 2016-08-11 |
| CN105990257B (en) | 2019-06-07 |
| JP6334342B2 (en) | 2018-05-30 |
| JP2016062704A (en) | 2016-04-25 |
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| TA01 | Transfer of patent application right | ||
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Effective date of registration: 20170809 Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Toshiba Corp. |
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Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
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