JP6334342B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device.

  USB (Universal Serial Bus: USB) is known as one of the connection standards for connecting information devices such as computers and peripheral devices. For example, by connecting an information device and a peripheral device with a USB connector including a male connector (also referred to as a plug) and a female connector (also referred to as a receptacle), not only data transfer becomes possible, but also, for example, from the information device to the peripheral It is also possible to obtain a power source necessary for device operation and to connect a plurality of devices via a USB hub.

  With USB 3.0, which is one of the USB standards, it is possible to perform high-speed transfer having a transfer speed 10 times or more that of USB 2.0 while maintaining compatibility with USB 2.0. The USB 3.0 USB connector requires five connection terminals in addition to the four connection terminals provided on the USB 2.0 USB connector. When the number of connection terminals increases, for example, in a semiconductor device having a plug, it becomes difficult to secure a space for forming connection terminals on the wiring board itself. Therefore, in a semiconductor device having a USB 3.0 plug, for example, a three-dimensional structure in which a part of a connection terminal is joined to a wiring board and the remaining part protrudes on the wiring board is conceivable.

  When a part of the connection terminal is joined to the wiring board or when the plug itself is joined to the wiring board, the joining is performed by solder joining such as SMT (Surface Mount Technology: SMT). However, since the cost of solder joints such as SMT is high, if the number of solder joints increases, the manufacturing cost increases accordingly. Thus, a semiconductor device capable of transferring data by USB is required to have a structure that can be manufactured at low cost by minimizing the number of solder joints.

Japanese Patent Application Laid-Open No. 2014-164887

  The problem to be solved by the invention of the embodiment is to suppress an increase in the number of solder joints in a semiconductor device capable of data transfer by USB.

The semiconductor device of the embodiment is a semiconductor device capable of transferring data by USB by connecting to a receptacle, and is a first that can be connected to a receptacle having a housing having an opening and an opening. A circuit board having a wiring board having a plurality of connection pads including external connection terminals, a semiconductor chip mounted on the wiring board, a fixing part fixed to the inner wall of the opening, and a fixing part provided on the same surface A receptacle connecting portion connectable to the receptacle, and a first pad connecting portion and a second pad connecting portion provided on the opposite surface of the fixing portion and electrically connected to at least one of the plurality of connecting pads. And a second external connection terminal. The second external connection terminal further has a protrusion, and is fixed to the housing so that the protrusion is embedded.

It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the example of a connection of a semiconductor device and a receptacle. It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure for demonstrating the example of the manufacturing method of a semiconductor device. It is a figure for demonstrating the example of the manufacturing method of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure which shows the structural example of a semiconductor device. It is a figure for demonstrating the example of the manufacturing method of a semiconductor device. It is a figure for demonstrating the example of the manufacturing method of a semiconductor device.

  Hereinafter, embodiments will be described with reference to the drawings. The drawings are schematic, and for example, the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like may be different from the actual ones. In the embodiments, substantially the same constituent elements are denoted by the same reference numerals and description thereof is omitted.

(First embodiment)
FIG. 1 is a diagram illustrating a structure example of a plug-integrated semiconductor device capable of transferring data by USB 3.0 by connecting to a receptacle. Note that any standard that uses a similar signal may be used as a semiconductor device capable of data transfer according to another USB standard. A semiconductor device 1 shown in FIG. 1 includes a housing 11, a circuit board 12 having four external connection terminals 125 provided in the housing 11, and five external connection terminals 13. In FIG. 1, for convenience, a part of the housing 11 is indicated by a dotted line, and a boundary between the solid line part and the dotted line part is indicated by a wavy line.

  The external connection terminal 125 includes a USB 2.0 or a USB 3... Such as a power supply terminal (VBUS), signal terminals (D +, D−) for normal transfer data signals that are differential signals, and a ground terminal (GND). External connection terminals necessary for data transfer by 0 are provided.

  The external connection terminal 13 includes a ground terminal (GND), signal terminals (SSTX +, SSTX−) for transmission data signals for high-speed transfer, which are differential signals, and reception data signals for high-speed transfer, which are differential signals. For example, external connection terminals necessary for high-speed transfer by USB 3.0 such as signal terminals (SSRX +, SSRX−) are provided.

  Further, a structural example of the semiconductor device 1 will be described with reference to FIG. FIG. 2 is a diagram illustrating a structure example of a semiconductor device. FIG. 2 illustrates a semiconductor device including a circuit board that is a SiP (System in a Package: SiP) as an example.

  The housing 11 includes an opening 110 that is a non-through hole. Although the convex portion 111 is provided on the inner wall of the opening 110, it is not always necessary. The casing 11 has an insulating property and is formed of a synthetic resin such as polyvinyl chloride. For example, the casing 11 having the opening 110 may be formed by bonding a plurality of casing members made of synthetic resin and having a groove so that the grooves face each other.

  The circuit board 12 is inserted into the opening 110 and fixed. At this time, the circuit board 12 may be fixed in contact with the housing 11. The circuit board 12 includes, for example, a wiring board 121 having a first surface and a second surface facing each other, a memory chip 122 mounted on the first surface of the wiring board 121, and a first surface of the wiring board 121. And a controller chip 123 electrically connected to the memory chip 122 through the wiring substrate 121, and a sealing resin layer 124 that seals the memory chip 122 and the controller chip 123. Note that the present invention is not limited to the memory chip 122 and the controller chip 123, and may be other semiconductor chips.

  The first surface of the wiring substrate 121 corresponds to the lower surface of the wiring substrate 121 in FIG. 2, and the second surface corresponds to the upper surface of the wiring substrate 121 in FIG. The wiring substrate 121 has a plurality of connection pads provided on the first surface, and the memory chip 122 and the controller chip 123 are electrically connected via the connection pads. In addition, the wiring board 121 has a plurality of connection pads including at least an external connection terminal 125, a connection pad 126a, and a connection pad 126b provided on the second surface. Note that the connection pad 126b is not necessarily provided. The connection pads on the first surface can be electrically connected to the connection pads on the second surface via vias that penetrate the wiring substrate 121, for example. As the wiring substrate 121, for example, a resin substrate such as glass epoxy having a wiring layer provided with connection pads provided on the surface can be used. Further, the positions of the memory chip 122 and the controller chip 123 may be reversed.

  The external connection terminal 125 is an external connection terminal that can be connected to the receptacle. The external connection terminals 125 include four external connection terminals necessary for data transfer by USB 2.0 or USB 3.0 shown in FIG.

  The connection pad 126 a and the connection pad 126 b are connection pads for electrically connecting the circuit board 12 and the external connection terminal 13.

  The memory chip 122 has, for example, a stack of a plurality of semiconductor chips, and the plurality of semiconductor chips are bonded to each other so as to partially overlap each other with an adhesive layer interposed therebetween. The plurality of semiconductor chips are electrically connected by connecting electrodes provided on the respective semiconductor chips by wire bonding. As the semiconductor chip, for example, a memory chip having a storage element such as a NAND flash memory can be used. At this time, the semiconductor chip may include a decoder or the like in addition to the memory cell.

  The controller chip 123 controls operations such as data writing and data reading with respect to the memory chip 122. The controller chip 123 is composed of a semiconductor chip, and is electrically connected to the wiring board 121 by connecting electrode pads provided on the semiconductor chip and connection pads provided on the wiring board 121 by wire bonding, for example.

  The method of connecting the memory chip 122 and controller chip 123 to the wiring board 121 is not limited to wire bonding, and wireless bonding such as flip chip bonding or tape automated bonding may be used. Alternatively, a three-dimensional mounting structure such as a TSV (Through Silicon Via: TSV) system in which the memory chip 122 and the controller chip 123 are stacked on the first surface of the wiring board 121 may be used.

The sealing resin layer 124 contains, for example, an inorganic filler (for example, SiO ₂ ). For example, the sealing resin layer 124 is formed by a molding method such as a transfer molding method, a compression molding method, or an injection molding method using a sealing resin obtained by mixing the above inorganic filler with an organic resin or the like.

  As the external connection terminal 13, it has five external connection terminals required for high-speed transfer by USB3.0. The external connection terminal 13 is electrically connected to the fixed portion 13a fixed to the convex portion 111, the receptacle connecting portion 13b connectable to the receptacle, the pad connecting portion 13c electrically connected to the connection pad 126a, and the connection pad 126b. And a pad connection portion 13d connected to each other. The external connection terminal 13 extends on both sides of the fixing portion 13a.

  The fixing portion 13a is fixed to the housing 11 by, for example, insert molding. Insert molding is a molding method in which a resin is injected around a metal part inserted into a mold and the metal and the resin are integrated. It is preferable that the fixing portion 13 a has a protrusion and is fixed to the housing 11 so that the protrusion is embedded in the convex portion 111. Thereby, since the fixing area can be increased, the fixing strength can be improved.

  The receptacle connecting portion 13b is provided on the same surface as the fixing portion 13a. It is preferable that the receptacle connecting part 13b has a curved surface whose upper side is convex. Moreover, it is preferable that the receptacle connection part 13b has springiness. Furthermore, when the second surface of the wiring board 121 is the bottom surface, the height of the receptacle connecting portion 13b is preferably higher than the pad connecting portion 13c and the pad connecting portion 13d. Since the electrical connection between the external connection terminal 13 and the receptacle is performed on the upper surface of the external connection terminal 13, the external connection terminal 13 is pushed in by the above structure when the semiconductor device 1 is inserted into the receptacle. Since the force to return to the original is applied toward the connection terminal of the receptor, the contact strength with the external connection terminal 13 can be increased.

  The pad connection portion 13c and the pad connection portion 13d are provided on the opposite surface of the fixing portion 13a. The pad connection portion 13c is provided at a position shallower than the fixing portion 13a, and the pad connection portion 13d is provided at a position deeper than the fixing portion 13a. That is, pad connection portions that are electrically connected to the circuit board 12 are provided on both sides of the fixing portion 13a. At this time, by providing the convex portion 111 on the side wall of the opening 110 of the housing 11, the pad connection portion 13 d is sealed by the housing 11 and the circuit board 12. Therefore, the semiconductor device 1 is formed with the sealing region 15 that seals the pad connection portion 13d. By providing the pad connection portion 13d in the sealing region 15, connection failure due to foreign matter is less likely to occur. Note that each of the pad connection portion 13c and the pad connection portion 13d only needs to be electrically connected to at least one connection pad.

  As the external connection terminal 13, for example, a material capable of imparting spring properties such as a copper alloy (for example, beryllium copper, phosphor bronze, cobalt copper) or a nickel alloy (for example, beryllium nickel) can be used.

  An example of connecting the semiconductor device shown in FIG. 2 and the receptacle is shown in FIG. In FIG. 3, the receptacle 4 includes a housing 16, a wiring base 17, a connection terminal 18 provided on the wiring base 17, and a connection terminal 19. The connection terminals 18 have four external connection terminals necessary for data transfer by USB 2.0 or USB 3.0. The connection terminal 19 has an external connection terminal necessary for high-speed transfer by USB 3.0.

  As shown in FIG. 3, when the semiconductor device 1 shown in FIG. 2 is inserted into the receptacle 4, the connection terminal 18 comes into contact with the external connection terminal 125, and the connection terminal 19 comes into contact with the receptacle connection portion 13 b of the external connection terminal 13. As a result, data transfer by USB can be performed between the plug-integrated semiconductor device 1 shown in FIG. 2 and an information device including the receptacle 4.

  As described above, in the semiconductor device of the present embodiment, the external connection terminals are fixed to the inner wall of the opening of the housing, and therefore, the number of joints between the circuit board and the external connection terminals may be reduced by solder joint such as SMT. it can. Therefore, an increase in solder joint locations is suppressed, and for example, manufacturing costs can be reduced.

  When fixing the external connection terminal to the housing, the external connection terminal is easily displaced when force is applied to the external connection terminal or circuit board when connecting to the receptacle, so the probability of poor contact between the external connection terminal and the circuit board increases. Cheap. On the other hand, in the semiconductor device of the present embodiment, the occurrence of connection failure can be suppressed by providing a plurality of connection locations between the external connection terminals and the circuit board. In FIG. 2, there are two connection points between the connection terminal and the circuit board, but three or more connection points may be provided.

  The structure of the external connection terminal 13 is not limited to FIG. Another structural example of the semiconductor device 1 is shown in FIG. The semiconductor device 1 shown in FIG. 4 is different from the semiconductor device 1 shown in FIG. Note that in FIG. 4, the description of FIG. 2 can be used as appropriate for the same components as those of the semiconductor device 1 shown in FIG.

  In FIG. 4, the pad connection portion 13c is provided at a deeper position of the opening 110 than the receptacle connection portion 13b, and the pad connection portion 13d is provided at a shallower position of the opening 110 than the receptacle connection portion 13b. That is, the receptacle connection part 13b is provided between the pad connection part 13c and the pad connection part 13d. The pad connection part 13c and the pad connection part 13d are electrically connected to one connection pad 126a. At this time, the connection pad 126b may not be provided. As shown in FIG. 4, even when a plurality of connection locations with connection terminals are provided on one connection pad, the connection strength can be increased, so that the occurrence of connection failure can be suppressed.

  Moreover, the structure of the circuit board 12 is not limited to FIG. Another example of the structure of the semiconductor device is shown in FIG. FIG. 5 illustrates a semiconductor device having a circuit board 12 which is a PCBA (Printed Circuit Board Assembly: PCBA) as an example. In the semiconductor device illustrated in FIG. 5, the upper surface of the wiring substrate 121 is the first surface compared to the semiconductor device 1 illustrated in FIG. 2, and the external connection terminals 125 and the connection pads are formed on the first surface of the wiring substrate 121. The semiconductor package 127 is provided with a semiconductor package 127 mounted on the first surface of the wiring substrate 121 instead of the memory chip 122 and the controller chip 123. Note that in FIG. 5, the description of FIG. 2 can be used as appropriate for the same components as those of the semiconductor device 1 illustrated in FIG. 2. In the semiconductor device 1 shown in FIG. 5, the external connection terminal 13 shown in FIG. 4 may be provided and the connection pad 126b may be omitted.

  In the semiconductor package 127, the lead frame is electrically connected to connection pads provided on the first surface of the wiring substrate 121. The semiconductor package 127 may be provided with a semiconductor chip such as a memory and a memory controller. As shown in FIG. 5, a semiconductor package including a lead frame is used as a semiconductor chip, and a sealing resin layer may not be formed on the semiconductor package. Further, the memory chip and the controller chip are not necessarily provided.

  Next, an example of a method for manufacturing a semiconductor device will be described with reference to FIGS. 6A and 6B are diagrams for explaining an example of a method for manufacturing a semiconductor device, FIG. 6A is a plan view, and FIG. 6B is a cross-sectional view taken along line XY in FIG. FIG. FIG. 7 is a diagram for explaining an example of a method for manufacturing a semiconductor device. Here, although an example of a method for manufacturing the semiconductor device illustrated in FIG. 2 will be described, the method can also be appropriately used as an example of a method for manufacturing the semiconductor device illustrated in FIGS.

  As shown in FIGS. 6A and 6B, the housing member 11a is formed by fixing the comb-like external connection terminals 13 having the protrusions 13e so that the protrusions 13e are embedded by insert molding. . The protrusion 13e is formed by performing a burring process, for example. Burring is a processing method for forming protrusions by forming openings and raising the periphery of the openings. A plurality of protrusions may be provided as the protrusion 13e. By providing the protrusions 13e, the fixing area between the casing member 11a and the casing member 11a and the external connection terminal 13 can be increased.

  Next, the external connection terminal 13 is separated for each comb tooth by separating the connecting portion of the external connection terminal 13 by a press or the like. At this time, separation is facilitated by making the length from the fixing portion on the separated side to one end of the external connection terminal 13 longer than the length from the fixing portion to the other end of the external connection terminal 13. Through the above steps, the housing member 11a to which the external connection terminal 13 is fixed at the fixing portion can be formed.

  Next, as shown in FIG. 7, a circuit board 12 having a semiconductor chip formed on a wiring board is prepared. Further, the casing member 11a and the casing member 11b are bonded together so that the circuit board 12 is sandwiched between the casing member 11a and the casing member 11b having a desired shape and an opening is formed, and the external connection terminal 13 And the connection pads of the circuit board 12 are electrically connected and fixed. For example, the housing member 11a and the housing member 11b may be bonded using an adhesive or the like. Through the above process, a semiconductor device can be manufactured.

  In the above manufacturing method, since the external connection terminals are fixed to the housing, the number of joints between the circuit board and the external connection terminals can be reduced by solder joint such as SMT. Therefore, an increase in solder joint locations is suppressed, and for example, manufacturing costs can be reduced.

(Second Embodiment)
FIG. 8 and FIG. 9 are diagrams showing a structure example of a plug combination type semiconductor device capable of transferring data by USB by connecting to a receptacle. FIG. 8 is a schematic diagram viewed from the side surface direction, and FIG. 9 is a schematic diagram viewed from the top surface direction. 8 and 9, some components are not shown for convenience.

  The semiconductor device 2 illustrated in FIGS. 8 and 9 includes a housing 21, a circuit board 22, and a plug 23. The description of the case 11 and the circuit board 12 shown in FIG. 2 can be used as appropriate for the description of the case 21 and the circuit board 22.

  The housing 21 includes an opening 210. The inner wall of the opening 210 has an insertion hole 24a and a groove 24b. Although the planar shape of the insertion hole 24a and the groove part 24b is a rectangular shape, it is not limited to this. The insertion hole 24a may be a through hole. The casing 21 is formed of a material applicable to the casing 11, for example. For example, the casing 21 having the opening 210 may be formed by bonding a plurality of casing members made of synthetic resin and having the groove portions facing each other.

  The circuit board 22 is inserted into the opening 210 and fixed. At this time, the circuit board 22 is inserted so as not to overlap all of the insertion holes 24a. The circuit board 22 may be fixed in contact with the housing 21. The circuit board 12 includes, for example, a wiring board 221 having a first surface and a second surface facing each other, a memory chip 222 mounted on the first surface of the wiring board 221, and a first surface of the wiring board 221. And a controller chip 223 electrically connected to the memory chip 222 via the wiring substrate 221, and a sealing resin layer 224 that seals the memory chip 222 and the controller chip 223. Note that the present invention is not limited to the memory chip 222 and the controller chip 223, and may be other semiconductor chips. Since the memory chip 222, the controller chip 223, and the sealing resin layer 224 correspond to the memory chip 122, the controller chip 123, and the sealing resin layer 124 illustrated in FIG. 2, respectively, the memory chip 222, the controller chip 223, and the sealing chip As the description of the stopping resin layer 224, the description of the memory chip 122, the controller chip 123, and the sealing resin layer 124 can be used as appropriate. Further, the positions of the memory chip 222 and the controller chip 223 may be reversed.

  The wiring board 221 includes a plurality of connection pads provided on the first surface and a plurality of connection pads including at least a connection pad 225 provided on the second surface. The connection pad 225 is a connection pad for electrically connecting the circuit board 22 and the plug 23. The memory chip 222 and the controller chip 223 are electrically connected via connection pads provided on the first surface of the wiring board 221. Further, the connection pads on the first surface can be electrically connected to the connection pads on the second surface through vias penetrating the wiring substrate 221, for example. As the wiring substrate 221, for example, a resin substrate such as glass epoxy having a wiring layer provided with connection pads provided on the surface can be used.

  The plug 23 includes a housing 231 including a fixing protrusion 231 a and a connection terminal 232. As the plug 23, for example, a plug constituting a USB 2.0 or USB 3.0 connector can be used. An opening is provided in the housing 231, which is necessary for data transfer by USB 2.0 or USB 3.0. External connection terminals such as four external connection terminals and five external connection terminals necessary for high-speed transfer by USB 3.0 can be provided. At this time, a board different from the circuit board 22 may be provided on the plug 23 and the external connection terminal may be formed on the board or the housing. A plurality of plugs may be provided as the plug 23. For example, by inserting the plug 23 into the receptacle 4 shown in FIG. 3, data transfer by USB can be performed between the semiconductor device 3 and the information device including the receptacle 4. However, the present invention is not limited to this, and other USB standard plugs may be used.

  The fixing protrusions 231 a are provided at the end portions of the two opposite side surfaces of the housing 231, and are inserted into the insertion holes 24 a provided in the inner wall of the opening 210. Thereby, the plug 23 is fitted and fixed to the housing 21. At this time, the side wall of the insertion hole 24a may be in contact with the fixing protrusion 231a.

  The connection terminal 232 electrically connects the external connection terminal of the plug 23 and the connection pad 225 which is one of the plurality of connection pads of the wiring board 221. For example, copper or the like can be used as the connection terminal 232. One end of the connection terminal 232 is joined to the substrate in the plug 23 so as to be electrically connected to the external connection terminal of the plug 23, and the other end is joined to the connection pad 225, thereby connecting to the external connection terminal. The pad 225 can be electrically connected.

  In the semiconductor device 2 shown in FIGS. 8 and 9, the plug, the circuit board, and the housing are fixed by providing the insertion hole in the housing and fitting the fixing protrusion of the plug into the insertion hole. If the circuit board and the plug are fixed, it is necessary to join the circuit board and the plug by soldering using SMT in order to increase the fixing strength. In addition, when the insertion hole is formed in the sealing resin layer, there is a problem that the sealing state is deteriorated. Therefore, by fixing the plug, the circuit board, and the casing by fitting the fixing protrusion of the plug into the insertion hole of the casing, the plug can be fixed while suppressing an increase in solder joint locations due to SMT. Can do. Thus, for example, the manufacturing cost can be reduced. Moreover, since it is not necessary to provide the insertion hole in the circuit board, the sealing state is maintained, and the circuit board can be made small.

  The structure of the semiconductor device 2 is not limited to FIGS. 10 and 11 are diagrams illustrating another structure example of the semiconductor device. FIG. 10 is a schematic diagram viewed from the side surface direction, and FIG. 11 is a schematic diagram viewed from the top surface direction. 10 and 11, some components are not shown for convenience.

  The semiconductor device 2 shown in FIGS. 10 and 11 differs from the semiconductor device 2 shown in FIGS. 8 and 9 in that it has an insertion hole 24c instead of the insertion hole 24a and the groove 24b. In other structures, the description of FIGS. 8 and 9 can be used as appropriate for the same portions as those of the semiconductor device 2 illustrated in FIGS.

  The insertion hole 24 c is provided on the side wall of the opening 210. The insertion hole 24 c is a part of a groove provided in the side wall of the opening 210. A gap between the groove portion of the housing 21 and the circuit board 22 becomes an insertion hole 24c. The fixing protrusion 231a of the plug 23 is fitted into the insertion hole 24c.

  As shown in FIGS. 10 and 11, the gap between the groove provided on the side wall of the housing and the circuit board is used as an insertion hole, and the plug fixing circuit is fitted into the insertion hole so that the plug, circuit The substrate and the housing can be fixed. Therefore, it is possible to fix the plug while suppressing an increase in solder joint locations due to SMT or the like, and for example, it is possible to reduce manufacturing costs.

(Third embodiment)
FIG. 12 is a diagram illustrating a structure example of a semiconductor device capable of transferring data by USB 3.0 by connecting to a receptacle. Note that any standard that uses a similar signal may be used as a semiconductor device capable of data transfer according to another USB standard. The semiconductor device 3 illustrated in FIG. 12 includes a housing 31, a circuit board 32, and external connection terminals 33. Note that the description of the casing 11, the circuit board 12, and the external connection terminal 13 illustrated in FIG. 2 can be used as appropriate for the description of the casing 31, the circuit board 32, and the external connection terminal 33.

  The housing 31 includes an opening 310. A convex portion 311 is provided on the inner wall of the opening 310. The casing 31 is formed of a material applicable to the casing 11, for example. For example, you may form the housing | casing 31 which has the opening part 310 by bonding together the some housing member which consists of synthetic resins and has a groove part so that a groove part may oppose.

  The circuit board 32 is inserted into the opening 310 and fixed. At this time, the circuit board 32 may be fixed in contact with the housing 31. The circuit board 32 includes, for example, a wiring board 321 having a first surface and a second surface facing each other, a memory chip 322 mounted on the first surface of the wiring board 321, a controller chip 323, and a memory chip 322. And a sealing resin layer 324 that seals the controller chip 323. Note that the present invention is not limited to the memory chip 322 and the controller chip 323, and other semiconductor chips may be used. Since the memory chip 322, the controller chip 323, and the sealing resin layer 324 correspond to the memory chip 122, the controller chip 123, and the sealing resin layer 124 shown in FIG. 2, respectively, the memory chip 322, the controller chip 323, and the sealing chip As the description of the stopping resin layer 324, the description of the memory chip 122, the controller chip 123, and the sealing resin layer 124 can be used as appropriate. Further, the positions of the memory chip 322 and the controller chip 323 may be reversed.

  The wiring board 321 has a plurality of connection pads provided on the first surface, and the memory chip 322 and the controller chip 323 are electrically connected via the connection pads provided on the first surface. In addition, the wiring substrate 321 includes a plurality of connection pads including at least connection pads 326 and external connection terminals 325 that can be connected to receptacles provided on the second surface. The connection pads on the first surface can be electrically connected to the connection pads on the second surface through vias penetrating the wiring substrate 321, for example. As the wiring substrate 321, for example, a resin substrate such as a glass epoxy having a wiring layer including a connection pad provided on the surface can be used.

  The external connection terminal 325 is an external connection terminal that can be connected to the receptacle. As the external connection terminals 325, for example, there are four external connection terminals necessary for data transfer by USB 2.0 or USB 3.0 shown in FIG.

  The connection pad 326 is a connection pad for electrically connecting the circuit board 32 and the external connection terminal 33. The external connection terminals 325 have four external connection terminals necessary for data transfer by USB 2.0 or USB 3.0. In addition, if it is a standard using the same signal, it may be used as an external connection terminal of another USB standard.

  The external connection terminal 33 is supported by the embedded portion 33 a embedded in the housing 31, the receptacle connection portion 33 b connectable to the receptacle, the pad connection portion 33 c electrically connected to the connection pad 326, and the convex portion 311. 33d of supported parts. The external connection terminals 33 have five external connection terminals necessary for high-speed transfer by USB 3.0. The external connection terminal 33 is formed using a material applicable to the external connection terminal 13. In addition, if it is a standard using the same signal, it may be used as an external connection terminal of another USB standard.

  The buried portion 33 a is provided at the end of the external connection terminal 33. The buried portion 33 a is formed by, for example, burying one end of the external connection terminal 33 in the housing 31 when forming the housing 31. By providing the buried portion 33a, the fixing strength between the housing 31 and the external connection terminal 33 can be improved. In the buried portion 33 a, the buried direction of the external connection terminal 33 is preferably substantially parallel to the insertion direction of the circuit board 32. “Substantially parallel” includes not only the parallel direction but also a state within ± 10 degrees from the parallel direction.

  The receptacle connecting portion 33b preferably has a curved surface with a convex upper side. Moreover, it is preferable that the receptacle connection part 33b has springiness. Furthermore, when the second surface of the wiring board 321 is the bottom surface, it is preferable that the height of the receptacle connecting portion 33b is higher than that of the pad connecting portion 33c. Since the electrical connection between the external connection terminal 33 and the receptacle is performed on the upper surface of the external connection terminal 33, the contact strength between the receptacle and the external connection terminal 33 is increased when the semiconductor device 3 is inserted into the receptacle by the above structure. Can be increased.

  The pad connection part 33c is provided on the opposite surface of the receptacle connection part 33b. The receptacle connecting portion 33b is provided at a position shallower than the pad connecting portion 33c, and the buried portion 33a is provided at a position deeper than the pad connecting portion 33c. At this time, the pad connection portion 33 c may be sealed by the housing 31 and the circuit board 32.

  The supported portion 33d is provided on the opposite surface of the pad connection portion 33c so as to overlap the pad connection portion 33c. The supported portion 33d is supported by the convex portion 311. Thereby, a force is applied to the pad connection portion 33c toward the connection pad 326. Therefore, the contact strength of the pad connection part 33c can be improved.

  When the semiconductor device 3 shown in FIG. 12 is inserted into the receptacle 4 shown in FIG. 3, the connection terminal 18 comes into contact with the external connection terminal 325, and the connection terminal 19 comes into contact with the receptacle connection portion 33 b of the external connection terminal 33. As a result, data transfer by USB can be performed between the semiconductor device 3 shown in FIG. 12 and the information device including the receptacle.

  As described above, in the semiconductor device according to the present embodiment, the external connection terminals are buried in the housing, so that the number of joints between the circuit board and the external connection terminals can be reduced by solder joint such as SMT. Therefore, an increase in solder joint locations is suppressed, and for example, manufacturing costs can be reduced.

  The structure of the semiconductor device 3 is not limited to FIG. Another structural example of the semiconductor device is shown in FIG. The semiconductor device 3 shown in FIG. 13 is different from the semiconductor device 3 shown in FIG. 12 in that it has a housing 31a and a housing 31b instead of the housing 31. Note that in FIG. 13, the description of FIG. 12 can be used as appropriate for the same components as those of the semiconductor device 3 illustrated in FIG. 12.

  In FIG. 13, the housing 31 a has an opening 310. In addition, you may provide a convex part in the side wall of the housing | casing 31a. The housing 31b and the circuit board 32 are inserted into the opening 310 and fixed. The housing 31b and the circuit board 32 may be fixed in contact with the housing 31a. The circuit board 32 may be fixed in contact with the housing 31b. The casing 31a is made of, for example, a synthetic resin such as polyvinyl chloride or a metal material such as aluminum. Moreover, the housing | casing 31b is formed with the material applicable to the housing | casing 11, for example.

  A part of the housing 31 b is sandwiched between the buried portion 33 a of the external connection terminal 33 and the circuit board 32. That is, the buried portion 33 a is separated from the circuit board 32.

  Similar to the first embodiment, in the semiconductor device shown in FIGS. 12 and 13, a plurality of connection portions between the external connection terminals 33 and the circuit board 32 may be provided. Similarly to FIG. 5, a semiconductor package may be mounted on the first surface of the wiring board 321.

  Next, an example of a method for manufacturing a semiconductor device will be described with reference to FIGS. 14 and 15 are diagrams for explaining an example of a method for manufacturing a semiconductor device. Note that although an example of a method for manufacturing the semiconductor device illustrated in FIG. 12 is described here, the method can be appropriately used as an example of a method for manufacturing the semiconductor device illustrated in FIG.

  By molding the external connection terminal 33 to which the five connection terminals are connected by embedding it in the casing member made of the same material as the casing member 31b1, the molding member 31b2 is formed, and the connecting portion of the external connection terminal 33 is separated by pressing or the like. Then, the external connection terminal 33 is separated for each comb tooth. Thereafter, the casing 31b is formed by fitting and fixing the molding member 31b2 to the casing member 31b1. At this time, the molding member 31b2 can be regarded as a part of the housing 31b.

  Next, as shown in FIG. 14, the housing 31b is inserted into the opening 310 of the housing 31a and fixed. In FIG. 14, the insertion direction is the horizontal direction, but the opening 310 may be arranged upward and the housing 31 b may be inserted in the vertical direction.

  Next, as shown in FIG. 15, the circuit board 32 in which the semiconductor chip is formed on the wiring board is inserted into the opening 310, and the external connection terminals 33 and the connection pads of the circuit board 32 are electrically connected and fixed. To do. As shown in FIG. 13, in the case where the buried portion 33a of the external connection terminal 33 and the circuit board 32 are separated from each other, the circuit board 32 is attached to the casing 31a before the casing member 31b1 is fixed to the molding member 31b2. It may be inserted. In FIG. 15, the insertion direction is the horizontal direction, but the opening 310 may be arranged upward and the circuit board 32 may be inserted in the vertical direction. For example, the casing 31a and the casing 31b may be bonded using an adhesive or the like. Through the above process, a semiconductor device can be manufactured.

  When fixing the external connection terminal and the housing, there are restrictions on the housing structure and circuit board assembly method, so the connection between the external connection terminal and the circuit board is insufficient when the circuit board is inserted into the housing. Prone. In addition, due to restrictions on the housing structure, the number of parts at the time of housing molding tends to increase, and housing molding tends to be complicated.

  On the other hand, in the manufacturing method described above, a molded member in which the external connection terminal is embedded is separately formed, and then the molded member and the housing member are fitted and fixed to form the housing. As a result, the degree of freedom in shape when molding the casing is higher than when the external connection terminals are directly fixed to the casing, so that it is easier to design in consideration of the connection strength between the external connection terminals and the circuit board. it can.

  Further, when separating a plurality of external connection terminals to be coupled, the external connection terminals can be separated before being fixed to another casing member by forming a molding member in which the external connection terminals are embedded. Thereby, separation becomes easy and five external connection terminals can be formed at the same time, so that an increase in the number of parts is suppressed. Furthermore, since it is possible to fix the molded member in which the external connection terminal is embedded after the circuit board is inserted into the housing to the housing member, damage to the external connection terminal can be reduced during manufacturing. .

  Each embodiment is presented as an example and is not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 2 ... Semiconductor device, 3 ... Semiconductor device, 4 ... Receptacle, 11 ... Case, 11a ... Case member, 11b ... Case member, 12 ... Circuit board, 13 ... External connection terminal, 13a ... Adhesion Part, 13b ... receptacle connection part, 13c ... pad connection part, 13d ... pad connection part, 13e ... projection, 15 ... sealing region, 16 ... housing, 17 ... wiring substrate, 18 ... connection terminal, 19 ... connection terminal, DESCRIPTION OF SYMBOLS 21 ... Case, 22 ... Circuit board, 23 ... Plug, 24a ... Insertion hole, 24b ... Groove part, 24c ... Insertion hole, 31 ... Case, 31a ... Case, 31b ... Case, 31b1 ... Case member , 31b2 ... molding member, 32 ... circuit board, 33 ... external connection terminal, 33a ... buried portion, 33b ... receptacle connection portion, 33c ... pad connection portion, 33d ... supported portion, 110 ... opening, 111 ... convex portion, 121 ... wiring board, 1 DESCRIPTION OF SYMBOLS 2 ... Memory chip, 123 ... Controller chip, 124 ... Sealing resin layer, 125 ... External connection terminal, 126a ... Connection pad, 126b ... Connection pad, 127 ... Semiconductor package, 210 ... Opening, 221 ... Wiring board, 222 ... Memory chip, 223 ... Controller chip, 224 ... Sealing resin layer, 225 ... Connection pad, 231 ... Housing, 231a ... Fixing protrusion, 232 ... Connection terminal, 310 ... Opening, 311 ... Projection, 321 ... Wiring board 322, memory chip, 323, controller chip, 324, sealing resin layer, 325, external connection terminal, 326, connection pad.

Claims (3)

A semiconductor device capable of transferring data by USB by connecting to a receptacle,
A housing having an opening;
A circuit board including a wiring board having a plurality of connection pads including a first external connection terminal inserted into the opening and capable of being connected to the receptacle; and a semiconductor chip mounted on the wiring board;
A fixing portion fixed to the inner wall of the opening, a receptacle connecting portion provided on the same surface as the fixing portion and connectable to the receptacle, provided on an opposite surface of the fixing portion , and front
The first connection pad of the circuit board is provided at a position shallower to the opening than the fixing portion.
Provided on the opposite surface of the electrically connected first pad connecting portion and the fixing portion;
It is provided at a position deeper than the fixed portion with respect to the opening, and is formed on the second connection pad of the circuit board.
A second external connection terminal having a second pad connection part electrically connected ,
The second external connection terminal further includes a protrusion, and is fixed to the housing so that the protrusion is embedded. The semiconductor device according to claim 1,
The housing has a convex portion on the inner wall of the opening,
The fixing portion is fixed to the convex portion,
The semiconductor device, wherein the second pad connection portion is sealed by the casing and the circuit board. The semiconductor device according to claim 1 or 2,
The second external connection terminal is a semiconductor device having the protrusion on the fixing portion and fixed to the housing so that the protrusion is embedded by insert molding.

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