CN108462822B - Photosensitive components and electronic equipment - Google Patents
Photosensitive components and electronic equipment Download PDFInfo
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- CN108462822B CN108462822B CN201810560047.1A CN201810560047A CN108462822B CN 108462822 B CN108462822 B CN 108462822B CN 201810560047 A CN201810560047 A CN 201810560047A CN 108462822 B CN108462822 B CN 108462822B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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Abstract
本申请公开了一种光感组件及电子设备,所述光感组件包括红外补光灯、第一光传感器、第二光传感器和电路板,所述红外补光灯、第一光传感器和第二光传感器相互固定,所述电路板包括第一连接端、第二连接端、第三连接端和总接线端,所述第一连接端、第二连接端和第三连接端分别固定连接所述红外补光灯、第一光传感器和第二光传感器,所述总接线端与所述第一连接端、第二连接端和第三连接端电连接。所述红外补光灯、第一光传感器和第二光传感器仅通过所述总接线端传输电信号,简化了所述电路板结构,优化了所述光感组件的排布结构。
This application discloses a light-sensing component and electronic equipment. The light-sensing component includes an infrared fill-in light, a first light sensor, a second light sensor and a circuit board. The infrared fill-in light, the first light sensor and the third light sensor are The two light sensors are fixed to each other. The circuit board includes a first connection end, a second connection end, a third connection end and a main terminal. The first connection end, the second connection end and the third connection end are respectively fixedly connected to each other. As for the infrared fill light, the first light sensor and the second light sensor, the main terminal is electrically connected to the first connection end, the second connection end and the third connection end. The infrared fill light, the first light sensor and the second light sensor only transmit electrical signals through the main terminal, simplifying the circuit board structure and optimizing the arrangement structure of the light sensing components.
Description
技术领域Technical field
本申请涉及电子设备领域,尤其涉及一种光感组件及电子设备。The present application relates to the field of electronic equipment, and in particular, to a light-sensing component and electronic equipment.
背景技术Background technique
目前手机中会设置多个光线传感器件和红外补光灯,每一光线传感器和红外补光灯均需要通过电路板获取电信号。随着光线传感器的数量增多,多个光线传感器与补光灯的排布结构受限制,导致为多个光线传感器和红外补光灯提供电信号的电路板结构复杂,影响手机内部排布结构。Currently, multiple light sensors and infrared fill lights are installed in mobile phones. Each light sensor and infrared fill light needs to obtain electrical signals through the circuit board. As the number of light sensors increases, the arrangement structure of multiple light sensors and fill lights is restricted, resulting in a complex structure of the circuit board that provides electrical signals for multiple light sensors and infrared fill lights, affecting the internal arrangement structure of the mobile phone.
发明内容Contents of the invention
本申请提供一种光感组件及电子设备。This application provides a light-sensing component and electronic equipment.
本申请提供了一种光感组件,其中,所述光感组件包括红外补光灯、第一光传感器、第二光传感器和电路板,所述电路板包括第一连接端、第二连接端、第三连接端和总接线端,所述第一连接端、第二连接端和第三连接端分别固定连接所述红外补光灯、第一光传感器和第二光传感器,所述总接线端与所述第一连接端、第二连接端和第三连接端电连接,经所述所述第一连接端、第二连接端和第三连接端分别与所述结红外补光灯、第一光传感器和第二光传感器传输电信号。This application provides a light-sensing component, wherein the light-sensing component includes an infrared fill light, a first light sensor, a second light sensor and a circuit board. The circuit board includes a first connection end, a second connection end , the third connection end and the main terminal, the first connection end, the second connection end and the third connection end are respectively fixedly connected to the infrared fill light, the first light sensor and the second light sensor, the main connection end The end is electrically connected to the first connection end, the second connection end and the third connection end, and is respectively connected to the junction infrared fill light lamp through the first connection end, the second connection end and the third connection end. The first light sensor and the second light sensor transmit electrical signals.
本申请还提供一种电子设备,其中,所述电子设备包括上述的光感组件。This application also provides an electronic device, wherein the electronic device includes the above-mentioned light-sensing component.
本申请还提供一种电子设备,其中,所述电子设备包括光感组件、装置本体和滑动连接所述装置本体的滑块,所述光感组件包括红外补光灯、第一光传感器、第二光传感器和电路板,所述红外补光灯、第一光传感器和第二光传感器固定于所述滑块,所述电路板包括第一连接端、第二连接端、第三连接端和总接线端,所述第一连接端、第二连接端和第三连接端分别固定连接所述红外补光灯、第一光传感器和第二光传感器,所述总接线端与所述第一连接端、第二连接端和第三连接端电连接,经所述所述第一连接端、第二连接端和第三连接端分别与所述红外补光灯、第一光传感器和第二光传感器传输电信号,所述总接线端还电连接所述装置本体。This application also provides an electronic device, wherein the electronic device includes a light-sensing component, a device body and a slider slidingly connected to the device body. The light-sensing component includes an infrared fill light, a first light sensor, and a third light sensor. Two light sensors and a circuit board, the infrared fill light, the first light sensor and the second light sensor are fixed on the slider, the circuit board includes a first connection end, a second connection end, a third connection end and A main terminal, the first connection terminal, the second connection terminal and the third connection terminal are fixedly connected to the infrared fill light, the first light sensor and the second light sensor respectively, the main terminal is connected to the first The connection end, the second connection end and the third connection end are electrically connected to the infrared fill light, the first light sensor and the second connection end respectively through the first connection end, the second connection end and the third connection end. The light sensor transmits electrical signals, and the main terminal is also electrically connected to the device body.
本申请提供的光感组件及电子设备,通过所述电路板包括第一连接端、第二连接端、第三连接端和总接线端,所述第一连接端、第二连接端和所述第三连接端分别与所述红外补光灯、第一光传感器和第二光传感器电连接,所述总接线端与所述第一连接端、第二连接端和第三连接端电连接,经所述第一连接端、第二连接端和第三连接端与所述红外补光灯、第一光传感器和第二光传感器输电信号,使得所述红外补光灯、第一光传感器和第二光传感器仅通过所述总接线端传输电信号,简化了所述电路板结构,优化了所述光感组件的排布结构。The light-sensing component and electronic equipment provided by this application include a first connection terminal, a second connection terminal, a third connection terminal and a main terminal through the circuit board. The first connection terminal, the second connection terminal and the The third connection terminal is electrically connected to the infrared fill light, the first light sensor and the second light sensor respectively, and the general terminal is electrically connected to the first connection terminal, the second connection terminal and the third connection terminal, Power signals are transmitted to the infrared fill light, the first light sensor and the second light sensor through the first connection end, the second connection end and the third connection end, so that the infrared fill light lamp, the first light sensor and The second light sensor only transmits electrical signals through the main terminal, which simplifies the structure of the circuit board and optimizes the arrangement structure of the light sensing components.
附图说明Description of the drawings
为了更清楚地说明本申请实施例的技术方案,下面将对实施方式中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本申请一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the implementation. Obviously, the drawings in the following description are some implementations of the present application. For ordinary people in the art For technical personnel, other drawings can also be obtained based on these drawings without exerting creative work.
图1是本申请实施例提供的电子设备的示意图;Figure 1 is a schematic diagram of an electronic device provided by an embodiment of the present application;
图2是本申请实施例提供的电子设备的另一示意图;Figure 2 is another schematic diagram of an electronic device provided by an embodiment of the present application;
图3是本申请实施例提供的电子设备的光感组件的立体示意图;Figure 3 is a three-dimensional schematic diagram of a light-sensing component of an electronic device provided by an embodiment of the present application;
图4是本申请实施例提供的电子设备的光感组件另一示意图;Figure 4 is another schematic diagram of a light-sensing component of an electronic device provided by an embodiment of the present application;
图5是本申请实施例提供的电子设备的光感组件的分解示意图;Figure 5 is an exploded schematic diagram of a light-sensing component of an electronic device provided by an embodiment of the present application;
图6是本申请实施例提供的电子设备的光感组件的组装示意图;Figure 6 is a schematic assembly diagram of a light-sensing component of an electronic device provided by an embodiment of the present application;
图7是本申请实施例提供的电子设备的光感组件的另一分解示意图;Figure 7 is another exploded schematic diagram of the light-sensing component of the electronic device provided by the embodiment of the present application;
图8是本申请实施例提供的电子设备的光感组件的另一组装示意图;Figure 8 is another schematic assembly diagram of the light-sensing component of the electronic device provided by the embodiment of the present application;
图9是本申请实施例提供的电子设备的光感组件的另一立体示意图;Figure 9 is another three-dimensional schematic view of the light-sensing component of the electronic device provided by the embodiment of the present application;
图10是本申请实施例提供的电子设备的示意图;Figure 10 is a schematic diagram of an electronic device provided by an embodiment of the present application;
图11是本申请实施例提供的电子设备的分解示意图。Figure 11 is an exploded schematic diagram of an electronic device provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
本申请实施例的描述中,需要理解的是,术语“厚度”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是暗示或指示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of the embodiments of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "thickness" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, and does not imply that Or indicating that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation on the application.
请参阅图1和图2,本申请提供一种电子设备1000,所述电子设备1000包括光感组件100、装置本体200和滑动连接所述装置本体200的滑块300。所述光感组件100包括红外补光灯10、第一光传感器20、第二光传感器30和电路板40。所述红外补光灯10、第一光传感器20和第二光传感器30固定于所述滑块300。所述电路板40包括第一连接端41、第二连接端42、第三连接端43和总接线端44。所述第一连接端41、第二连接端42和第三连接端43分别固定连接所述红外补光灯10、第一光传感器20和第二光传感器30。所述总接线端44与所述第一连接端41、第二连接端42和第三连接端43电连接,经所述所述第一连接端41、第二连接端42和第三连接端43分别与所述红外补光灯10、第一光传感器20和第二光传感器30传输电信号,所述总接线端44还电连接所述装置本体200。Referring to Figures 1 and 2, the present application provides an electronic device 1000. The electronic device 1000 includes a light sensing component 100, a device body 200, and a slider 300 slidingly connected to the device body 200. The light sensing component 100 includes an infrared fill light 10 , a first light sensor 20 , a second light sensor 30 and a circuit board 40 . The infrared fill light 10 , the first light sensor 20 and the second light sensor 30 are fixed on the slider 300 . The circuit board 40 includes a first connection terminal 41 , a second connection terminal 42 , a third connection terminal 43 and a main terminal 44 . The first connection end 41 , the second connection end 42 and the third connection end 43 are respectively fixedly connected to the infrared fill light 10 , the first light sensor 20 and the second light sensor 30 . The main terminal 44 is electrically connected to the first connection terminal 41 , the second connection terminal 42 and the third connection terminal 43 , through the first connection terminal 41 , the second connection terminal 42 and the third connection terminal 43 transmits electrical signals to the infrared fill light 10, the first light sensor 20 and the second light sensor 30 respectively, and the main terminal 44 is also electrically connected to the device body 200.
可以理解的是,所述滑块300相对所述装置本体200滑动伸缩,以带动所述红外补光灯10、第一光传感器20和第二光传感器30相对所述装置本体200伸出或收缩。所述电路板40将所述装置本体200与所述红外补光灯10、第一光传感器20和第二光传感器30导通,以实现所述红外补光灯10、第一光传感器20和第二光传感器30与所述装置本体200传输电信号。所述电子设备1000可以是手机、笔记本电脑或平板电脑等。所述光感组件100可以通过所述红外补光灯10对目标物体发射红外光线,并通过红外感应器件获取目标物体的红外图像。所述光感组件100还可以通过所述第一光传感器20可以感应环境的光线强度。所述光感组件100还可以通过所述第二光传感器30可以感应目标物体在接近所述电子设备1000时的光线,以实现检测目标物体是否接近所述电子设备1000。It can be understood that the slider 300 slides and contracts relative to the device body 200 to drive the infrared fill light 10, the first light sensor 20 and the second light sensor 30 to extend or contract relative to the device body 200. . The circuit board 40 conducts the device body 200 with the infrared fill light 10, the first light sensor 20 and the second light sensor 30, so as to realize the infrared fill light 10, the first light sensor 20 and the second light sensor 30. The second light sensor 30 transmits electrical signals to the device body 200 . The electronic device 1000 may be a mobile phone, a notebook computer or a tablet computer, etc. The light sensing component 100 can emit infrared light to a target object through the infrared fill light 10 and acquire an infrared image of the target object through an infrared sensing device. The light sensing component 100 can also sense the light intensity of the environment through the first light sensor 20 . The light sensing component 100 can also sense the light of a target object when it approaches the electronic device 1000 through the second light sensor 30 to detect whether the target object approaches the electronic device 1000 .
通过所述电路板40包括第一连接端41、第二连接端42、第三连接端43和总接线端44,所述第一连接端41、第二连接端42和所述第三连接端43分别与所述红外补光灯10、第一光传感器20和第二光传感器30电连接,所述总接线端44与所述第一连接端41、第二连接端42和第三连接端43电连接,经所述第一连接端41、第二连接端42和第三连接端43与所述红外补光灯10、第一光传感器20和第二光传感器30输电信号,使得所述红外补光灯10、第一光传感器20和第二光传感器30仅通过所述总接线端44传输电信号,简化了所述电路板40结构,优化了所述光感组件100的排布结构。The circuit board 40 includes a first connection terminal 41, a second connection terminal 42, a third connection terminal 43 and a main terminal 44. The first connection terminal 41, the second connection terminal 42 and the third connection terminal 43 is electrically connected to the infrared fill light 10, the first light sensor 20 and the second light sensor 30 respectively, and the main terminal 44 is connected to the first connection end 41, the second connection end 42 and the third connection end. 43 is electrically connected to the infrared fill light 10, the first light sensor 20 and the second light sensor 30 through the first connection end 41, the second connection end 42 and the third connection end 43, so that the The infrared fill light 10, the first light sensor 20 and the second light sensor 30 only transmit electrical signals through the main terminal 44, simplifying the structure of the circuit board 40 and optimizing the arrangement structure of the light sensing component 100 .
本实施方式中,所述红外补光灯10、第一光传感器20和第二光传感器30在所述滑块300上相互并排。所述红外补光灯10、第一光传感器20和第二光传感器30固定于所述滑块300远离所述装置本体200,以方便随所述滑块300相对所述装置本体200伸出,减小所述滑块300的滑动行程。所述电路板40位于所述滑块300靠近所述装置本体200处,以方便电连接所述装置本体200。所述电路板40与所述红外补光灯10、第一光传感器20和第二光传感器30并排。所述总接线端44朝向所述装置本体200。所述第一连接端41、第二连接端42和第三连接端43分别邻近于所述滑块300远离所述装置本体200的边缘。使得所述电路板40与所述红外补光灯10、第一光传感器20和第二光传感器30排布更密集,优化所述电子设备1000的排布结构。所述第一连接端41、第二连接端42和所述第三连接端43相互靠拢,并位于所述电路板40远离所述装置本体200处。所述总线接端44位于所述电路板40靠近所述装置本体200的一侧边处。所述总线接端44与所述第一连接端41、第二连接端42和第三连接端43相对,并通过铜箔线缆相导通,以避免所述总接线端44的导电线路与所述第一连接端41、第二连接端42和所述第三连接端43串扰。In this embodiment, the infrared fill light 10 , the first light sensor 20 and the second light sensor 30 are arranged side by side on the slider 300 . The infrared fill light 10, the first light sensor 20 and the second light sensor 30 are fixed on the slider 300 away from the device body 200, so as to facilitate the extension of the slider 300 relative to the device body 200. Reduce the sliding stroke of the slider 300. The circuit board 40 is located on the slider 300 close to the device body 200 to facilitate electrical connection to the device body 200 . The circuit board 40 is arranged side by side with the infrared fill light 10 , the first light sensor 20 and the second light sensor 30 . The main terminal 44 faces the device body 200 . The first connection end 41 , the second connection end 42 and the third connection end 43 are respectively adjacent to the edge of the slider 300 away from the device body 200 . The circuit board 40 , the infrared fill light 10 , the first light sensor 20 and the second light sensor 30 are arranged more densely, thereby optimizing the arrangement structure of the electronic device 1000 . The first connection end 41 , the second connection end 42 and the third connection end 43 are close to each other and are located on the circuit board 40 away from the device body 200 . The bus terminal 44 is located on one side of the circuit board 40 close to the device body 200 . The bus terminal 44 is opposite to the first connection terminal 41, the second connection terminal 42 and the third connection terminal 43, and is connected through a copper foil cable to prevent the conductive lines of the bus terminal 44 from interfacing with each other. The first connection terminal 41 , the second connection terminal 42 and the third connection terminal 43 have crosstalk.
进一步地,请参阅图3和图4,所述电路板40包括接线基部50、第一延伸部60、第二延伸部70和第三延伸部80。所述第一延伸部60、第二延伸部70和第三延伸部80分别由所述接线基部50延伸出。所述总接线端44设置于所述接线基部50,所述第一连接端41设置于所述第一延伸部60,所述第二连接端42设置于所述第二延伸部70,所述第三连接端43设置于所述第三延伸部80。Further, please refer to FIGS. 3 and 4 , the circuit board 40 includes a wiring base 50 , a first extension part 60 , a second extension part 70 and a third extension part 80 . The first extension part 60 , the second extension part 70 and the third extension part 80 respectively extend from the wiring base 50 . The main terminal 44 is provided on the wiring base 50 , the first connection terminal 41 is provided on the first extension part 60 , the second connection terminal 42 is provided on the second extension part 70 , and the The third connecting end 43 is provided on the third extension portion 80 .
本实施方式中,所述接线基部50包括第一边缘51和相对所述第一边缘51设置的第二边缘52,以及连接于所述第一边缘51和所述第二边缘52之间的第三边缘53。所述第一边缘51相较于所述第二边缘52远离所述装置本体200。即所述第一边缘51与所述第二边缘52的相对方向大致平行所述滑块300相对所述装置本体200的滑动方向。所述第一延伸部60由所述第三边缘52延伸出。所述第二延伸部70和所述第三延伸部80由所述第一边缘51延伸出。所述第二延伸部70和所述第三延伸部80相互隔离。所述第二延伸部70和所述第三延伸部80分别位于所述第一边缘51长度方向两端,以使得所述第一延伸部60与所述第二延伸部70相靠近,进而使得所述红外补光灯10和所述第一光传感器20相靠拢,以使所述光感组件100结构紧凑。所述接线基部50在所述第二边缘52处延伸由接线延伸板54。所述总接线端54设置于所述接线延伸板54,所述接线延伸板54朝靠近所述装置本体200方向延伸,以方便所述总接线端54电连接所述装置本体200。所述第一边缘51和所述第二边缘52大致垂直所述滑块300的滑动方向。所述第三边缘53大致平行所述滑块300相对所述装置本体200的滑动方向。所述接线延伸板54沿大致垂直所述第二边缘52方向延伸。所述第一延伸部60沿大致平行所述第二边缘52方向延伸。所述第二延伸部70和所述第三延伸部80沿大致垂直所述第一边缘51方向延伸。所述总接线端44设置于所述接线延伸板54远离所述接线基部50的一端。所述第一连接端41设置于所述第一延伸部60远离所述接线基部50的一端。所述第二连接端42设置于所述第二延伸部70远离所述接线基部50一端。所述第三连接端43设置于所述第三延伸部80远离所述接线基部50一端。In this embodiment, the wiring base 50 includes a first edge 51 and a second edge 52 arranged opposite to the first edge 51 , and a third edge connected between the first edge 51 and the second edge 52 . Three Edges 53. The first edge 51 is further away from the device body 200 than the second edge 52 . That is, the relative direction of the first edge 51 and the second edge 52 is substantially parallel to the sliding direction of the slider 300 relative to the device body 200 . The first extension portion 60 extends from the third edge 52 . The second extension portion 70 and the third extension portion 80 extend from the first edge 51 . The second extension part 70 and the third extension part 80 are isolated from each other. The second extension part 70 and the third extension part 80 are respectively located at both ends of the first edge 51 in the length direction, so that the first extension part 60 and the second extension part 70 are close to each other, so that The infrared fill light 10 and the first light sensor 20 are close to each other, so that the light sensing component 100 has a compact structure. The wiring base 50 extends from the second edge 52 by a wiring extension plate 54 . The main terminal 54 is provided on the wiring extension plate 54 , and the wiring extension plate 54 extends in a direction close to the device body 200 to facilitate the electrical connection of the main terminal 54 to the device body 200 . The first edge 51 and the second edge 52 are substantially perpendicular to the sliding direction of the slider 300 . The third edge 53 is substantially parallel to the sliding direction of the slider 300 relative to the device body 200 . The wiring extension plate 54 extends in a direction substantially perpendicular to the second edge 52 . The first extending portion 60 extends in a direction substantially parallel to the second edge 52 . The second extension portion 70 and the third extension portion 80 extend in a direction substantially perpendicular to the first edge 51 . The main terminal 44 is provided at an end of the wiring extension plate 54 away from the wiring base 50 . The first connecting end 41 is provided at an end of the first extending portion 60 away from the wiring base 50 . The second connecting end 42 is disposed at an end of the second extending portion 70 away from the wiring base 50 . The third connecting end 43 is disposed at an end of the third extending portion 80 away from the wiring base 50 .
进一步地,请参阅图4,所述第一延伸部60在所述第一连接端41处设置第一焊盘61,所述红外补光灯10焊接于所述第一焊盘61,所述总接线端44经所述第一焊盘61电连接所述红外补光灯10。Further, please refer to FIG. 4 , the first extension part 60 is provided with a first soldering pad 61 at the first connection end 41 , and the infrared fill light lamp 10 is welded to the first soldering pad 61 . The main terminal 44 is electrically connected to the infrared fill light 10 through the first pad 61 .
本实施方式中,所述第一焊盘61与所述第一延伸部60的铜箔线路导通。所述第一延伸部60的铜箔线路与所述接线基部50的铜箔线路导通。所述第一焊盘61与所述接线基部50相导通,并经所述接线基部50的铜箔线路与所述总接线端44相导通。所述第一焊盘61设置于所述第一延伸部60的一侧。所述红外补光灯10的底部设置焊接于所述第一焊盘61的导电触点。所述红外补光灯10通过焊接于所述第一焊盘61,与所述第一延伸部60结构稳固,并实现与所述第一延伸部60导通,以实现与所述总接线端44传输电信号。所述红外补光灯10的底部层叠于所述第一延伸部60上,以利用所述第一延伸部60实现对所述红外补光灯10进行支撑。In this embodiment, the first bonding pad 61 is electrically connected to the copper foil circuit of the first extension part 60 . The copper foil circuit of the first extension part 60 is electrically connected to the copper foil circuit of the wiring base part 50 . The first bonding pad 61 is electrically connected to the wiring base 50 , and is electrically connected to the main terminal 44 through the copper foil circuit of the wiring base 50 . The first bonding pad 61 is disposed on one side of the first extension part 60 . The bottom of the infrared fill light 10 is provided with conductive contacts welded to the first pad 61 . The infrared fill light 10 is structurally stable with the first extension part 60 by being welded to the first pad 61 and is electrically connected to the first extension part 60 to achieve connection with the main terminal. 44 transmits electrical signals. The bottom of the infrared fill light lamp 10 is stacked on the first extension part 60 so that the first extension part 60 is used to support the infrared fill light lamp 10 .
进一步地,所述第二延伸部70在所述第二连接端42处设置第二焊盘71,所述第一光传感器20焊接于所述第二焊盘71,所述总接线端44经所述第二焊盘71电连接所述第一光传感器20。Further, the second extension part 70 is provided with a second welding pad 71 at the second connection end 42 , the first light sensor 20 is welded to the second welding pad 71 , and the bus terminal 44 is The second bonding pad 71 is electrically connected to the first photosensor 20 .
本实施方式中,所述第二焊盘71与所述第二延伸部70的铜箔线路导通。所述第二延伸部70的铜箔线路与所述接线基部50的铜箔线路导通。所述第二焊盘71与所述接线基部50相导通,并经所述接线基部50的铜箔线路与所述总接线端44相导通。所述第二焊盘71设置于所述第二延伸部70的一侧。所述第一光传感器20的底部设置焊接于所述第二焊盘71的导电触点。所述第一光传感器20通过焊接于所述第二焊盘71,与所述第二延伸部70结构稳固,并实现与所述第二延伸部70导通,以实现与所述总接线端44传输电信号。所述第一光传感器20的底部层叠于所述第二延伸部70上,以利用所述第二延伸部70实现对所述第一光传感器20进行支撑。In this embodiment, the second bonding pad 71 is electrically connected to the copper foil circuit of the second extension part 70 . The copper foil circuit of the second extension part 70 is electrically connected to the copper foil circuit of the wiring base part 50 . The second bonding pad 71 is electrically connected to the wiring base 50 , and is electrically connected to the main terminal 44 through the copper foil circuit of the wiring base 50 . The second bonding pad 71 is disposed on one side of the second extension portion 70 . The bottom of the first photosensor 20 is provided with conductive contacts welded to the second pad 71 . The first light sensor 20 is structurally stable with the second extension part 70 by being welded to the second pad 71 and is electrically connected to the second extension part 70 to achieve connection with the bus terminal. 44 transmits electrical signals. The bottom of the first light sensor 20 is stacked on the second extension part 70 , so that the second extension part 70 is used to support the first light sensor 20 .
进一步地,所述第三延伸部80在所述第三连接端43处设置第三焊盘81,所述第二光传感器30焊接于所述第三焊盘81,所述总接线端44经所述第三焊盘81电连接所述第二光传感器30。Further, the third extension part 80 is provided with a third welding pad 81 at the third connection end 43, the second light sensor 30 is welded to the third welding pad 81, and the main terminal 44 is The third pad 81 is electrically connected to the second photosensor 30 .
本实施方式中,所述第三焊盘81与所述第三延伸部80的铜箔线路导通。所述第三延伸部80的铜箔线路与所述接线基部50的铜箔线路导通。所述第三焊盘81与所述接线基部50相导通,并经所述接线基部50的铜箔线路与所述总接线端44相导通。所述第三焊盘81设置于所述第三延伸部80的一侧。所述第二光传感器30的底部设置焊接于所述第三焊盘81的导电触点。所述第二光传感器30通过焊接于所述第三焊盘81,与所述第三延伸部80结构稳固,并实现与所述第三延伸部80导通,以实现与所述总接线端44传输电信号。所述第二光传感器30的底部层叠于所述第三延伸部80上,以利用所述第三延伸部80实现对所述第二光传感器30进行支撑。In this embodiment, the third bonding pad 81 is electrically connected to the copper foil circuit of the third extension part 80 . The copper foil circuit of the third extension part 80 is electrically connected to the copper foil circuit of the wiring base part 50 . The third bonding pad 81 is electrically connected to the wiring base 50 , and is electrically connected to the main terminal 44 through the copper foil circuit of the wiring base 50 . The third bonding pad 81 is provided on one side of the third extension part 80 . The bottom of the second photosensor 30 is provided with conductive contacts welded to the third pad 81 . The second light sensor 30 is structurally stable with the third extension part 80 by being welded to the third pad 81 and is electrically connected to the third extension part 80 to achieve connection with the bus terminal. 44 transmits electrical signals. The bottom of the second light sensor 30 is stacked on the third extension part 80 , so that the third extension part 80 is used to support the second light sensor 30 .
进一步地,请参阅图5,所述光感组件100还包括器件支架90,所述第一延伸部60、第二延伸部70和第三延伸部80贴合于所述器件支架90。所述红外补光灯10层叠于所述第一延伸部60背离所述器件支架90一侧,所述第一光传感器20层叠于所述第二延伸部70背离所述器件支架90一侧,所述第二光传感器30层叠于所述第三延伸部80背离所述器件支架90一侧。Further, please refer to FIG. 5 , the photosensitive assembly 100 further includes a device bracket 90 , and the first extension part 60 , the second extension part 70 and the third extension part 80 are attached to the device bracket 90 . The infrared fill light 10 is stacked on the side of the first extension part 60 facing away from the device bracket 90 , and the first light sensor 20 is stacked on the side of the second extension part 70 facing away from the device bracket 90 . The second photosensor 30 is stacked on the side of the third extending portion 80 away from the device bracket 90 .
本实施方式中,所述器件支架90固定于所述滑块300远离所述装置本体200的边缘。所述器件支架90对所述第一延伸部60、第二延伸部70和第三延伸部80进行支撑稳固,以及对所述红外补光灯10、第一光传感器20和所述第二光传感器30支撑稳固。所述接线基部50部分抵触于所述器件支架90,另一部分相对所述器件支架90凸出,所述总接线端44设置于所述接线基部50凸出于所述器件支架90的部分。即所述接线基部50部分贴合于所述器件支架90,以方便稳固所述电路板40。所述接线基部50连接所述接线延伸板54的部分相对所述器件支架90凸出,以方便所述总接线端44电连接所述装置本体200。所述器件支架90包括主支撑部91和与所述主支撑部91相并排的第一副支撑部92。所述主支撑部91具有第一底部911和相对所述第一底部911设置的第一顶部912,以及连接于所述第一底部911和所述第一顶部912之间第一侧部913及第二侧部914,所述第一副支撑部92固定于所述主支撑部91的第二侧部914。所述第一副支撑部92具有与所述第一底部911相平行的第二底部921和与所述第一顶部912相平行的第二顶部922,以及连接于所述第二底部921和所述第二顶部922之间第三侧部923及第四侧部924。所述第三侧部923与所述第一侧部913相平行。所述第四侧部924与所述第一侧部914相平行。所述接线基部50部分贴合于所述第一底部911和所述第二底部921。所述接线基部50连接所述第一延伸部60及所述第二延伸部70的部分贴合于所述第四侧部924。所述接线基部50连接所述第三延伸部80的部分贴合于所述第一侧部913。所述第一延伸部60相对所述接线基部50折弯,并贴合于所述第二顶部922。所述第二延伸部70相对所述接线基部50折弯,并贴合于所述第三侧部923。所述第三延伸部80相对所述接线基部50折弯,并贴合于所述第一顶部912。所述红外补光灯10堆叠于所述器件支架90的第二顶部922。所述红外补光灯10的朝向背离所述第一延伸部60。所述第一光传感器20堆叠于所述器件支架90的第三侧部923。所述第一光传感器20朝向背离所述第二延伸部70。所述第二光传感器30堆叠于所述器件支架90的第一顶部912。所述第二光传感器30的朝向大致于所述红外补光灯10的朝向相同。In this embodiment, the device bracket 90 is fixed to the edge of the slider 300 away from the device body 200 . The device bracket 90 supports and stabilizes the first extension part 60 , the second extension part 70 and the third extension part 80 , and supports the infrared fill light 10 , the first light sensor 20 and the second light sensor 20 . The sensor 30 is supported firmly. Part of the wiring base 50 resists the device bracket 90 , and another part protrudes relative to the device bracket 90 . The general terminal 44 is provided at a portion of the wiring base 50 that protrudes from the device bracket 90 . That is, the wiring base 50 is partially attached to the device bracket 90 to facilitate the stabilization of the circuit board 40 . The portion of the wiring base 50 connected to the wiring extension plate 54 protrudes relative to the device bracket 90 to facilitate the electrical connection of the main terminal 44 to the device body 200 . The device holder 90 includes a main support part 91 and a first auxiliary support part 92 parallel to the main support part 91 . The main support part 91 has a first bottom 911 and a first top 912 arranged opposite to the first bottom 911, and a first side part 913 connected between the first bottom 911 and the first top 912. The second side portion 914 , the first auxiliary support portion 92 is fixed to the second side portion 914 of the main support portion 91 . The first auxiliary support part 92 has a second bottom 921 parallel to the first bottom 911 and a second top 922 parallel to the first top 912, and is connected to the second bottom 921 and the second top 922. The third side part 923 and the fourth side part 924 are between the second top part 922. The third side portion 923 is parallel to the first side portion 913 . The fourth side portion 924 is parallel to the first side portion 914 . The wiring base 50 is partially attached to the first bottom 911 and the second bottom 921 . The portion of the wiring base 50 connecting the first extension portion 60 and the second extension portion 70 is attached to the fourth side portion 924 . The portion of the wiring base 50 connected to the third extension portion 80 is attached to the first side portion 913 . The first extension part 60 is bent relative to the wiring base 50 and fits the second top part 922 . The second extension portion 70 is bent relative to the wiring base portion 50 and attached to the third side portion 923 . The third extension portion 80 is bent relative to the wiring base 50 and fits the first top portion 912 . The infrared fill light 10 is stacked on the second top 922 of the device bracket 90 . The infrared fill light 10 is oriented away from the first extension part 60 . The first light sensor 20 is stacked on the third side 923 of the device bracket 90 . The first light sensor 20 faces away from the second extending portion 70 . The second light sensor 30 is stacked on the first top 912 of the device bracket 90 . The direction of the second light sensor 30 is substantially the same as the direction of the infrared fill light 10 .
进一步地,请参阅图6和图7,所述器件支架90设有第一支架定位部93、第二支架定位部94、第三支架定位部95和支撑定位部96。所述第一延伸部60设有与所述第一支架定位部93配合的第一板件定位部62。所述第二延伸部70设有与所述第二支架定位部94配合的第二板件定位部72。所述第三延伸部80设有与所述第三支架定位部95配合的第三板件定位部82。所述接线基部50设有与所述支撑定位部96配合的基板定位部55。Further, please refer to FIGS. 6 and 7 , the device bracket 90 is provided with a first bracket positioning part 93 , a second bracket positioning part 94 , a third bracket positioning part 95 and a support positioning part 96 . The first extension part 60 is provided with a first plate positioning part 62 that cooperates with the first bracket positioning part 93 . The second extension portion 70 is provided with a second plate positioning portion 72 that cooperates with the second bracket positioning portion 94 . The third extension portion 80 is provided with a third plate positioning portion 82 that cooperates with the third bracket positioning portion 95 . The wiring base 50 is provided with a substrate positioning portion 55 that cooperates with the supporting positioning portion 96 .
本实施方式中,所述第一支架定位部93为设置于所述第二顶部922的两个定位柱。所述第一板件定位部62为设置于所述第一延伸部60的两个定位孔。通过所述第一支架定位部93与所述第一板件定位部62相配合,使得所述第一延伸部60稳固于所述器件支架90,以及将所述红外补光灯10稳固于所述器件支架90的第二顶部922上。所述第二支架定位部94为设置于所述第三侧部923的两个定位柱。所述第二板件定位部72为设置于所述第二延伸部70的两个定位孔。通过所述第二支架定位部94与所述第二板件定位部72相配合,使得所述第二延伸部70稳固于所述器件支架90,以及将所述第一光传感器20稳固于所述器件支架90的第三侧部923上。所述第三支架定位部95为设置于所述第一顶部912的两个定位柱。所述第三板件定位部82为设置于所述第三延伸部80的两个定位孔。通过所述第三支架定位部95与所述第三板件定位部82相配合,使得所述第三延伸部80稳固于所述器件支架90,以及将所述第二光传感器30稳固于所述器件支架90的第一顶部912上。所述支撑定位部96为设置于所述第一底部911的定位柱。所述基板定位部55为设置于所述接线基部50的定位孔。通过所述支撑定位部96与所述基板定位部55相配合,使得所述接线基部50稳固于所述器件支架90的第一底部911,增加所述光感组件100的稳固性。In this embodiment, the first bracket positioning part 93 is two positioning posts provided on the second top 922 . The first plate positioning part 62 is two positioning holes provided in the first extension part 60 . The first bracket positioning part 93 cooperates with the first plate positioning part 62 so that the first extension part 60 is stabilized on the device bracket 90 and the infrared fill light 10 is stabilized on the device bracket 90 . on the second top 922 of the device holder 90 . The second bracket positioning part 94 is two positioning posts provided on the third side part 923 . The second plate positioning part 72 is two positioning holes provided in the second extension part 70 . The second bracket positioning part 94 cooperates with the second plate positioning part 72 so that the second extension part 70 is stabilized on the device bracket 90 and the first light sensor 20 is stabilized on the device bracket 90 . on the third side 923 of the device holder 90 . The third bracket positioning part 95 is two positioning posts provided on the first top 912 . The third plate positioning part 82 is two positioning holes provided in the third extension part 80 . The third bracket positioning part 95 cooperates with the third plate positioning part 82 so that the third extension part 80 is stabilized on the device bracket 90 and the second light sensor 30 is stabilized on the device bracket 90 . on the first top 912 of the device holder 90 . The support positioning portion 96 is a positioning post provided on the first bottom 911 . The substrate positioning portion 55 is a positioning hole provided in the wiring base portion 50 . The support positioning portion 96 cooperates with the substrate positioning portion 55 so that the wiring base 50 is firmly fixed to the first bottom 911 of the device bracket 90 , thereby increasing the stability of the light sensing assembly 100 .
进一步地,请参阅图7和图8,所述第四侧部924设有第一卡槽925,所述第一侧部913设有与所述第一卡槽925相隔离的第二卡槽915。所述接线基部50与所述第一延伸部60相连接的部分卡合于所述第一卡槽925。所述接线基部50与所述第三延伸部80相连接的部分卡合于所述第二卡槽915。所述第一底部911还设有第三卡槽916。所述接线基部50部分卡合于所述第三卡槽916。所述第一卡槽915、第二卡槽925和所述第三卡槽916对所述电路板40施加卡合作用力,使得所述电路板40与所述器件支架90结构稳固,提高所述光感组件100的安全性。Further, please refer to Figures 7 and 8. The fourth side portion 924 is provided with a first card slot 925, and the first side portion 913 is provided with a second card slot isolated from the first card slot 925. 915. The portion of the wiring base 50 connected to the first extending portion 60 is engaged in the first slot 925 . The connecting portion of the wiring base 50 and the third extending portion 80 is engaged in the second slot 915 . The first bottom 911 is also provided with a third slot 916 . The wiring base 50 is partially engaged with the third slot 916 . The first card slot 915, the second card slot 925 and the third card slot 916 exert a locking force on the circuit board 40, so that the circuit board 40 and the device bracket 90 are structurally stable and improve the stability of the circuit board 40. The safety of the light sensing component 100.
进一步地,请参阅图7、图8和图9,第三侧部923还设有第一收容槽926。所述第一光传感器20和所述第二延伸部70固定于所述第一收容槽926内。利用所述第一收容槽926收容所述第二延伸部70和所述第一光传感器20,以对所述第一光传感器20进行保护,而且使得所述光感组件100结构更紧凑。所述第一顶部912还设有第二收容槽917。所述第二收容槽917位于所述红外补光灯10和所述第二光传感器20之间,所述光感组件100还包括红外摄像头110,所述红外摄像头110固定于所述第二收容槽917内。所述红外摄像头110与所述红外补光灯10相靠拢,方便所述红外补光灯10的红外光线照射至目标物体,并反射至所述红外摄像头110。所述主支撑部91在所述第一顶部912还设有与所述第二收容槽917相隔离的第三收容槽918。所述光感组件100还包括成像摄像头120。所述第三收容槽918位于所述第二收容槽917远离所述副支撑部92一侧。即所述成像摄像头120位于所述红外摄像头110远离所述红外补光灯10一侧。所述红外摄像头110位于所述红外补光灯10靠近所述成像摄像头120一侧,使得所述红外摄像头110的拍摄画面与所述成像摄像头120的拍摄画面存在重叠区域,提高红外成像与景象成像的合成效果。所述主支撑部91还包括位于所述第二收容槽917和所述第三收容槽918之间的第四收容槽919。所述光感组件100还包括受话器130。所述受话器130固定于所述第四收容槽919内。所述器件支架90还包括第二副支撑部93。所述第二副支撑部93位于所述主支撑部91远离所述第一副支撑部92一侧。所述第二副支撑部93靠近所述第三收容槽918。所述光感组件100还包括激光点阵器140。所述激光点阵器140固定于所述第二副支撑部93上。所述激光点阵器140与所述成像摄像头120相靠拢,使得所述光感组件100结构紧凑,优化所述光感组件100的排布结构。所述成像摄像头120与所述红外摄像头110之间存在间距。所述光感组件100还包括摄像头模组150,所述摄像头模组150位双摄像头模组。所述摄像头模组150固定于所述成像摄像头120和所述红外摄像头110之间。所述摄像头模组150抵触于所述器件之间90的主支撑部91。所述光感组件100充分利用所述电子设备1000的内部排布空间,使得所述电子设备1000的内部排布结构紧凑。Further, please refer to FIG. 7 , FIG. 8 and FIG. 9 , the third side part 923 is also provided with a first receiving groove 926 . The first light sensor 20 and the second extension part 70 are fixed in the first receiving groove 926 . The first receiving groove 926 is used to receive the second extension part 70 and the first light sensor 20 to protect the first light sensor 20 and make the light sensing assembly 100 more compact. The first top 912 is also provided with a second receiving groove 917 . The second receiving groove 917 is located between the infrared fill light 10 and the second light sensor 20. The light sensing component 100 also includes an infrared camera 110, and the infrared camera 110 is fixed to the second receiving chamber. In slot 917. The infrared camera 110 is close to the infrared fill light 10 , so that the infrared light of the infrared fill light 10 can be irradiated to the target object and reflected to the infrared camera 110 . The main support part 91 is also provided with a third receiving groove 918 isolated from the second receiving groove 917 on the first top 912 . The light sensing component 100 also includes an imaging camera 120 . The third receiving groove 918 is located on the side of the second receiving groove 917 away from the auxiliary support part 92 . That is, the imaging camera 120 is located on the side of the infrared camera 110 away from the infrared fill light 10 . The infrared camera 110 is located on the side of the infrared fill light 10 close to the imaging camera 120, so that the shooting pictures of the infrared camera 110 and the shooting pictures of the imaging camera 120 have an overlapping area, which improves infrared imaging and scene imaging. synthesis effect. The main support part 91 further includes a fourth receiving groove 919 located between the second receiving groove 917 and the third receiving groove 918 . The light sensing component 100 also includes a receiver 130 . The receiver 130 is fixed in the fourth receiving slot 919 . The device holder 90 also includes a second auxiliary support part 93 . The second auxiliary support part 93 is located on the side of the main support part 91 away from the first auxiliary support part 92 . The second auxiliary support part 93 is close to the third receiving groove 918 . The photosensitive component 100 further includes a laser dot matrix 140 . The laser dot matrix 140 is fixed on the second auxiliary support part 93 . The laser dot matrix 140 and the imaging camera 120 are close together, so that the light sensing component 100 is compact and the arrangement structure of the light sensing component 100 is optimized. There is a gap between the imaging camera 120 and the infrared camera 110 . The light-sensing component 100 also includes a camera module 150, which is a 150-bit dual camera module. The camera module 150 is fixed between the imaging camera 120 and the infrared camera 110 . The camera module 150 resists the main supporting portion 91 between the devices 90 . The light-sensing assembly 100 makes full use of the internal arrangement space of the electronic device 1000, making the internal arrangement structure of the electronic device 1000 compact.
所述第一光传感器20的朝向平行所述滑块300相对所述装置本体200的滑动方向,所述第一光传感器20朝向所述滑块300端部的外侧接收环境光线,在所述第一光传感器20随所述滑块300相对所述装置本体200收缩时,所述第一光传感器20仍然可以检测所述电子设备1000外界环境光线亮度,以调节所述电子设备1000的显示屏亮度。所述环境光传感器20朝向平行主板,以使得所述第一光传感器20在所述电子设备1000的顶端端面上感应环境光光线,进而避免在所述电子设备1000的正面或背面感应光线,以避免破坏所述电子设备1000的正面和背面结构。The first light sensor 20 is oriented parallel to the sliding direction of the slider 300 relative to the device body 200 , and the first light sensor 20 receives ambient light toward the outside of the end of the slider 300 . When the first light sensor 20 retracts with the slider 300 relative to the device body 200, the first light sensor 20 can still detect the brightness of the external ambient light of the electronic device 1000 to adjust the brightness of the display screen of the electronic device 1000. . The ambient light sensor 20 faces parallel to the main board, so that the first light sensor 20 senses ambient light on the top end surface of the electronic device 1000, thereby avoiding sensing light on the front or back of the electronic device 1000. Avoid damaging the front and back structures of the electronic device 1000 .
进一步地,请参阅图10和图11,所述电子设备1000还包括滑块电路板310,所述滑块电路板310包括主线路板320和总线路板330,所述主线路板320固定于所述滑块300,所述总线路板330由所述主线路板320延伸出,并电连接于所述装置本体200,所述总接线端44电连接于所述主线路板320,经所述总线路板330电连接所述装置本体200。Further, please refer to Figures 10 and 11. The electronic device 1000 also includes a slider circuit board 310. The slider circuit board 310 includes a main circuit board 320 and a main circuit board 330. The main circuit board 320 is fixed on The slider 300 and the main circuit board 330 extend from the main circuit board 320 and are electrically connected to the device body 200. The main terminal 44 is electrically connected to the main circuit board 320 and passes through the main circuit board 320. The main circuit board 330 is electrically connected to the device body 200 .
本实施方式中,所述滑块电路板310将所述电路板40与所述装置本体200传输电信号。所述滑块电路板310还包括由所述主线路板320延伸的第一分支321、第二分支322、第三分支323和第四分支324。所述第一分支321电连接所述接线延伸板54的总接线端44,以实现所述第一分支电连接所述红外补光灯10。所述第二分支323电连接所述红外摄像头110。所述第三分支323电连接所述成像摄像头120。所述第四分支324电连接所述激光点阵器140。所述摄像头模组150固定于所述第二分支322和所述第三分支323之间。所述主线路板320还设有与所述摄像头模组150正对的摄像线端325,以及还设有朝向所述受话器130延伸的第五分支326。所述摄像线端325为板对板连接器。所述摄像线端325经电路板与所述摄像头模组150电连接。所述第五分支326沿所述摄像头模组150的两个摄像头之间的部分延伸至所述受话器130。所述成像摄像头120可以是前置摄像头。所述摄像头模组150可以是后置摄像头。所述主线路板320电连接所述红外补光灯10、红外摄像头110、成像摄像头120、受话器130、激光点阵器140和摄像头模组150。所述主线路板320还通过所述电路板40电连接所述第一光传感器20和所述第二光传感器30。即所述滑块电路板320可以电连接多个器件。所述滑块电路板320还通过所述总线路板330,实现所述装置本体200与所述红外补光灯10、红外摄像头110、成像摄像头120、受话器130、激光点阵器140、摄像头模组150、第一光传感器20和第二光传感器30传递电信号。In this embodiment, the slider circuit board 310 transmits electrical signals between the circuit board 40 and the device body 200 . The slider circuit board 310 also includes a first branch 321 , a second branch 322 , a third branch 323 and a fourth branch 324 extending from the main circuit board 320 . The first branch 321 is electrically connected to the main terminal 44 of the wiring extension plate 54 , so that the first branch is electrically connected to the infrared fill light lamp 10 . The second branch 323 is electrically connected to the infrared camera 110 . The third branch 323 is electrically connected to the imaging camera 120 . The fourth branch 324 is electrically connected to the laser dot 140 . The camera module 150 is fixed between the second branch 322 and the third branch 323 . The main circuit board 320 is also provided with a camera line end 325 facing the camera module 150 , and a fifth branch 326 extending toward the receiver 130 . The camera line end 325 is a board-to-board connector. The camera cable end 325 is electrically connected to the camera module 150 through a circuit board. The fifth branch 326 extends along the portion between the two cameras of the camera module 150 to the receiver 130 . The imaging camera 120 may be a front-facing camera. The camera module 150 may be a rear camera. The main circuit board 320 is electrically connected to the infrared fill light 10, the infrared camera 110, the imaging camera 120, the receiver 130, the laser dot matrix 140 and the camera module 150. The main circuit board 320 is also electrically connected to the first light sensor 20 and the second light sensor 30 through the circuit board 40 . That is, the slider circuit board 320 can electrically connect multiple devices. The slider circuit board 320 also realizes the connection between the device body 200 and the infrared fill light 10, infrared camera 110, imaging camera 120, receiver 130, laser dot matrix device 140, and camera module through the bus circuit board 330. Group 150, first light sensor 20 and second light sensor 30 communicate electrical signals.
进一步地,所述装置本体200包括中框210和固定于所述中框210的主板220。所述滑块300滑动连接所述中框210。所述总线路板330包括远离所述主体线路板320的主板连接部331和连接于所述主板连接部331与所述主体线路板320的折弯舒展部332,所述主板连接部331固定连接所述主板220,所述折弯舒展部332位于所述主板220与所述主板连接部331相背的一侧。Further, the device body 200 includes a middle frame 210 and a motherboard 220 fixed to the middle frame 210 . The slider 300 is slidably connected to the middle frame 210 . The main circuit board 330 includes a main board connection portion 331 away from the main circuit board 320 and a bending and stretching portion 332 connected between the main board connection portion 331 and the main circuit board 320. The main board connection portion 331 is fixedly connected. On the main board 220 , the bending and stretching portion 332 is located on the side of the main board 220 opposite to the main board connecting portion 331 .
本实施方式中,所述滑块电路板310为柔性电路板。由于所述主板连接部331固定于所述装置本体200,而所述主线路板320固定于所述滑块300。当所述滑块300相对所述装置本体200伸出或收缩,带动所述总线路板330产生形变,使得所述折弯舒展部332折弯。为了方便所述折弯舒展部332折弯,并减少所述折弯舒展部332的应力损失,所述主板220与所述中框210之间存在收容槽。所述折弯舒展部332收容于所述主板220朝向所述中框210一侧。所述主板连接部331可拆卸连接于所述主板220背离所述中框210一侧。所述主板连接部331与所述主板220通过板对板连接器实现相连接。当然,在其他试试方式中,所述滑块电路板310也可以是软硬结合板。所述主体线路板320可以构成所述滑块路板310的硬板部分,所述总线路板330可以构成所述滑块电路板310的软板部分。In this embodiment, the slider circuit board 310 is a flexible circuit board. Since the main board connecting portion 331 is fixed to the device body 200 , the main circuit board 320 is fixed to the slider 300 . When the slider 300 extends or contracts relative to the device body 200, the main circuit board 330 is driven to deform, causing the bending and stretching portion 332 to bend. In order to facilitate the bending of the bending and stretching portion 332 and reduce the stress loss of the bending and stretching portion 332 , a receiving groove is provided between the main board 220 and the middle frame 210 . The bending and stretching portion 332 is received on the side of the main board 220 facing the middle frame 210 . The mainboard connecting portion 331 is detachably connected to the side of the mainboard 220 away from the middle frame 210 . The mainboard connecting portion 331 is connected to the mainboard 220 through a board-to-board connector. Of course, in other attempts, the slider circuit board 310 may also be a soft-hard combination board. The main circuit board 320 may constitute a hard board part of the slider circuit board 310 , and the main circuit board 330 may constitute a soft board part of the slider circuit board 310 .
进一步地,所述总线路板330包括由所述主线路板320延伸出的第一总支333和由所述主线路板320延伸出的第二总支334,所述第一总支333远离所述主线路板320一端可拆卸连接所述装置本体200,所述第二总支334远离所述主线路板320一端可拆卸连接所述装置本体200。Further, the main circuit board 330 includes a first general branch 333 extending from the main circuit board 320 and a second general branch 334 extending from the main circuit board 320. The first general branch 333 is away from One end of the main circuit board 320 is detachably connected to the device body 200 , and one end of the second general branch 334 away from the main circuit board 320 is detachably connected to the device body 200 .
本实施方式中,所述第一总支333和所述第二总支334由所述主线路板320的第一边缘51延伸出。所述第一总支333的延伸方向和所述第二总支334的延伸方向均大致平行所述滑块300相对所述装置本体200的滑动方向。所述第一总支333和所述第二总支334分别位于所述主体线路板320长度方向两端。所属第一总支333远离所述主体线路板320一端设置板对板连接器插座。所述第二总支334远离所述主体线路板320一端设置板对板连接器插座。所述第一总支333和所述第二总支334均与所述主板220插接,以实现所述总线路板320与所述主板220可拆卸连接。所述第一总支333和所述第二总支334之间存在收容空间335,所述电子设备1000还包括固定于所述中框210的驱动机构230,所述驱动机构230位于所述收容空间335内,驱动所述滑块200滑动。所述驱动机构230包括电机、丝杆和螺母。所述电机固定于所述装置本体200,驱动所述丝杆转动,所述丝杆带动所述螺母相对所述装置本200滑动。所述滑块300固定连接所述螺母,随所述螺母相对所述装置本体200滑动。利用所述螺母对所述滑块200正对所述摄像头模组20的位置施加滑动力,方便带动所述滑块200滑动,使得所述滑块200滑动顺畅。所述第一总支333和所述第二总支334对所述驱动机构230避让,优化了所述电子设备1000的结构排布。In this embodiment, the first general branch 333 and the second general branch 334 extend from the first edge 51 of the main circuit board 320 . The extension direction of the first general branch 333 and the extension direction of the second general branch 334 are both substantially parallel to the sliding direction of the slider 300 relative to the device body 200 . The first general branch 333 and the second general branch 334 are respectively located at both ends of the main circuit board 320 in the length direction. A board-to-board connector socket is provided at one end of the first general branch 333 away from the main circuit board 320 . A board-to-board connector socket is provided at one end of the second general branch 334 away from the main circuit board 320 . The first general branch 333 and the second general branch 334 are both plugged into the main board 220 to realize detachable connection between the main circuit board 320 and the main board 220 . There is a receiving space 335 between the first general branch 333 and the second general branch 334. The electronic device 1000 further includes a driving mechanism 230 fixed on the middle frame 210. The driving mechanism 230 is located in the receiving space. In the space 335, the slider 200 is driven to slide. The driving mechanism 230 includes a motor, a screw rod and a nut. The motor is fixed to the device body 200 and drives the screw rod to rotate. The screw rod drives the nut to slide relative to the device body 200 . The slider 300 is fixedly connected to the nut and slides relative to the device body 200 along with the nut. The nut is used to apply a sliding force to the position where the slider 200 faces the camera module 20 to facilitate the sliding of the slider 200 and make the slider 200 slide smoothly. The first general branch 333 and the second general branch 334 avoid the driving mechanism 230 , thereby optimizing the structural arrangement of the electronic device 1000 .
进一步地,所述电子设备1000还包括固定于所述装置本体200的显示器240,所述显示器240具有显示区241,所述红外补光灯10、红外摄像头110、成像摄像头120、受话器130、激光点阵器140、摄像头模组150、第一光传感器20和第二光传感器30收缩于所述装置本体200,所述显示区241至少覆盖部分所述红外补光灯10、红外摄像头110、成像摄像头120和激光点阵器140。利用所述显示区241可以覆盖红外补光灯10、红外摄像头110、成像摄像头120和激光点阵器140,避免所述显示屏240在所述显示区241开设供所述红外补光灯10、红外摄像头110、成像摄像头120和激光点阵器14传输信号的信号端口,以增大所述显示区241在所述显示屏240的占比,实现全面屏显示结构。所述显示屏240盖合于所述中框210背离所述主板220一侧。所述电子设备1000还包括背壳250。所述背壳250盖合于所述中框210背离所述显示屏240一侧。所述主板220位于所述背壳250和所述中框210之间。所述背壳250的边缘与所述显示屏240的边缘大致对齐。在所述滑块300相对所述装置本体200收缩状态下,所述背壳250完全覆盖所述滑块300和所述光感组件100,以及所述装置本体200。所述显示屏240完全覆盖所述滑块300和所述光感组件100。Further, the electronic device 1000 also includes a display 240 fixed on the device body 200. The display 240 has a display area 241. The infrared fill light 10, the infrared camera 110, the imaging camera 120, the receiver 130, the laser The dot matrix 140, the camera module 150, the first light sensor 20 and the second light sensor 30 are retracted in the device body 200, and the display area 241 at least covers part of the infrared fill light 10, infrared camera 110, imaging Camera 120 and laser dot matrix device 140. The display area 241 can be used to cover the infrared fill light 10, the infrared camera 110, the imaging camera 120 and the laser dot matrix device 140, thereby preventing the display screen 240 from opening in the display area 241 for the infrared fill light 10, The infrared camera 110, the imaging camera 120 and the laser dot matrix device 14 are signal ports for transmitting signals to increase the proportion of the display area 241 in the display screen 240 and achieve a full-screen display structure. The display screen 240 is covered on the side of the middle frame 210 facing away from the motherboard 220 . The electronic device 1000 also includes a back case 250 . The back shell 250 covers the side of the middle frame 210 facing away from the display screen 240 . The motherboard 220 is located between the back case 250 and the middle frame 210 . The edge of the back shell 250 is substantially aligned with the edge of the display screen 240 . When the slider 300 is retracted relative to the device body 200 , the back case 250 completely covers the slider 300 , the photosensitive component 100 , and the device body 200 . The display screen 240 completely covers the slider 300 and the light sensing component 100 .
可以理解的是,当所述滑块300相对所述装置本体200完全伸出时,所述滑块300带动所述结构光模组、受话器130、第一光传感器20和第二光传感器30伸出所述装置本体200,所述结构光模组、受话器130、第一光传感器20和所述第二光传感器30相对所述显示屏240展开时;所述红外补光灯10可以避开所述显示屏240对人脸发射红外光线,以检测人脸与所述电子设备1000的距离;所述激光点阵器140可以朝人脸发射点阵结构红外光线,以检测人脸特征结构。所述红外摄像头110采集所述激光点阵器140发射的激光点阵结构。所述成像摄像头120可以拍摄人脸图像画面,用以与所述红外摄像头110采集的激光点阵结构进行合成,还可以用于常规拍摄等。所述受话器130可以避开所述显示屏240向用户提供通话语音;所述第二光传感器30可以是由环境光传感器、红外距离传感器和红外光发射器构成。所述第二光传感器30可以实现检测环境光线亮度、利用红外光线判断外界部件是否接近所述电子设备的功能。所述第二光传感器30在相对所述显示屏240展开后,可以检测外界环境光线亮度,以控制显示屏亮度,以辅助所述成像摄像头120的自拍功能,还可以在所述受话器130向用户提供通话语音状态下,检测用户脸部是否靠近所述显示屏240,以控制所述显示屏240亮屏或者息屏。在所述第一光传感器20随所述滑块300相对所述装置本体200伸出状态下,所述第一光传感器20可以停止工作,由所述第二光传感器30检测环境光线亮度。It can be understood that when the slider 300 is fully extended relative to the device body 200, the slider 300 drives the structured light module, the receiver 130, the first light sensor 20 and the second light sensor 30 to extend. When the device body 200 is taken out and the structured light module, receiver 130, first light sensor 20 and second light sensor 30 are unfolded relative to the display screen 240; the infrared fill light 10 can avoid all The display screen 240 emits infrared light toward the human face to detect the distance between the human face and the electronic device 1000; the laser dot matrix device 140 can emit infrared light toward the human face in a dot matrix structure to detect the characteristic structure of the human face. The infrared camera 110 collects the laser lattice structure emitted by the laser lattice device 140 . The imaging camera 120 can capture human face images for synthesis with the laser dot matrix structure collected by the infrared camera 110, and can also be used for regular photography, etc. The receiver 130 can avoid the display screen 240 to provide voice calls to the user; the second light sensor 30 can be composed of an ambient light sensor, an infrared distance sensor and an infrared light emitter. The second light sensor 30 can realize the function of detecting the brightness of ambient light and using infrared light to determine whether external components are close to the electronic device. After the second light sensor 30 is deployed relative to the display screen 240 , it can detect the brightness of the external ambient light to control the brightness of the display screen to assist the self-timer function of the imaging camera 120 , and can also detect the brightness of the external ambient light to the user through the receiver 130 . In the voice call state, it is detected whether the user's face is close to the display screen 240 to control the display screen 240 to turn on or off. When the first light sensor 20 is extended relative to the device body 200 along with the slider 300 , the first light sensor 20 can stop working, and the second light sensor 30 detects ambient light brightness.
通过所述电路板包括第一连接端、第二连接端、第三连接端和总接线端,所述第一连接端、第二连接端和所述第三连接端分别与所述红外补光灯、第一光传感器和第二光传感器电连接,所述总接线端与所述第一连接端、第二连接端和第三连接端电连接,经所述第一连接端、第二连接端和第三连接端与所述红外补光灯、第一光传感器和第二光传感器输电信号,使得所述红外补光灯、第一光传感器和第二光传感器仅通过所述总接线端传输电信号,简化了所述电路板结构,优化了所述光感组件的排布结构。The circuit board includes a first connection end, a second connection end, a third connection end and a main terminal, and the first connection end, the second connection end and the third connection end are respectively connected to the infrared fill light The lamp, the first light sensor and the second light sensor are electrically connected. The main terminal is electrically connected to the first connection end, the second connection end and the third connection end. The infrared fill light, the first light sensor and the second light sensor transmit power signals to the infrared fill light, the first light sensor and the second light sensor, so that the infrared fill light, the first light sensor and the second light sensor only pass through the main terminal Transmitting electrical signals simplifies the structure of the circuit board and optimizes the arrangement structure of the light-sensing components.
以上是本申请实施例的实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请实施例原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本申请的保护范围。The above is the implementation of the embodiments of the present application. It should be pointed out that for those of ordinary skill in the technical field, several improvements and modifications can be made without departing from the principles of the embodiments of the present application. These improvements and modifications can also be made. regarded as the protection scope of this application.
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