CN210694195U

CN210694195U - Integrated 3D imaging device and electronic equipment

Info

Publication number: CN210694195U
Application number: CN201921367907.6U
Authority: CN
Inventors: 刘勤
Original assignee: Shenzhen Orbbec Co Ltd
Current assignee: Orbbec Inc
Priority date: 2019-08-21
Filing date: 2019-08-21
Publication date: 2020-06-05
Anticipated expiration: 2029-08-21

Abstract

The utility model discloses an integrated 3D imaging device, which comprises a projection module, an imaging module, a floodlight, a sensor and a multi-channel flexible circuit board; the projection module is used for emitting a structured light beam to a space; the floodlight is used for projecting a floodlight beam to the space; the imaging module is used for imaging the structured light beam and/or the floodlight beam; the sensor is used for carrying out induction detection on the target object to obtain the related information of the target object; the multi-channel flexible circuit board comprises at least two branch channels, and the floodlight and the sensor are respectively arranged on the two branch channels of the multi-channel flexible circuit board. Through the arrangement of the multi-channel flexible circuit board, the optical assembly and the sensor element are integrated on the same multi-channel flexible circuit board, and the optical assembly and the sensor element are electrically connected to the main circuit board without adding an additional flexible circuit board, so that the structure of the integrated 3D imaging device is more compact, and the integration of the integrated 3D imaging device in various mobile terminals is facilitated.

Description

Integrated 3D imaging device and electronic equipment

Technical Field

The utility model relates to an optics and electron technical field, in particular to integrated 3D imaging device and electronic equipment.

Background

With the development of scientific technology, intelligent electronic devices such as mobile phones and tablets have increasingly urgent requirements on depth cameras with built-in 3D imaging, and with the rapid development of depth cameras towards smaller and smaller volumes and lower power consumption, the depth cameras become possible to be embedded into other electronic devices as built-in components.

However, due to the continuous pursuit of appearance and volume of electronic devices, great challenges are brought to the design and installation of the built-in components of the electronic devices, and not only the components are required to have a small volume, low power consumption and high heat dissipation performance, but also the layout between the components is required to be reasonable enough to achieve a high integration level. Take the cell-phone of traditional internal integration depth camera that has 3D formation of image as the example, its leading module often includes components and parts such as projection module, collection module, RGB camera, a plurality of sensor, floodlight, earphone. Due to the fact that the number of built-in components is large, the design of a traditional mobile phone with the 3D imaging depth camera integrated inside is often unreasonable, and the use experience of a user is influenced to a certain extent. Especially, as the number of components such as cameras, various functional sensors, floodlights and the like of the camera module is increased, the corresponding circuit design and various lead interfaces of the circuit become very complicated, so that the design difficulty is increased, and the development of the compact and miniaturized structure of the electronic device is not facilitated.

Therefore, it is necessary to develop and research the 3D imaging device with compact structure for the electronic product, so as to facilitate the design of the electronic product and not to affect the user experience.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art not enough, provide an integrated 3D image device and electronic equipment who makes things convenient for complete machine product design, compact structure.

In order to achieve the above object, the embodiment of the present invention provides a technical solution that:

an integrated 3D imaging device comprises a projection module, an imaging module, a floodlight, a sensor and a multi-channel flexible circuit board; wherein the content of the first and second substances,

the projection module is used for emitting the structured light beam to the space;

the floodlight is used for projecting a floodlight beam to the space;

the imaging module is used for imaging the structured light beam and/or the floodlight beam;

the sensor is used for carrying out induction detection on the target object to obtain the related information of the target object;

the multi-channel flexible circuit board comprises at least two branch channels; the floodlight and the sensor are respectively arranged on the two branch channels of the multi-channel flexible circuit board; two branch channels of the multi-channel flexible circuit board have a height difference, so that one surface of the floodlight departing from the multi-channel flexible circuit board is flush with one surface of the sensor departing from the multi-channel flexible circuit board.

Optionally, the imaging module comprises a first camera and a second camera; the sensor is a distance sensor for detecting the proximity of a target object to the integrated 3D imaging device.

Optionally, the device further comprises a fixing bracket and a main circuit board; wherein, projection module, imaging module install in on the fixed bolster.

Optionally, the projection module is located between the first camera and the second camera, and the floodlight and the distance sensor are located between the projection module and the first camera.

Optionally, the first camera and the second camera form a passive binocular structured light depth camera; the projection module and the first camera and/or the second camera form an active monocular structured light depth camera.

Optionally, the projection module and the first camera and/or the second camera form an active binocular structured light depth camera.

The color camera module is positioned between the projection module and the second camera; the centers of the first video camera, the projection module, the color camera and the second video camera are positioned on the same straight line.

Optionally, the distance sensor comprises a light generation unit and a light detection unit; the light generation unit is used for projecting a light beam to a target object; the light detection unit is used for detecting the light beam projected by the light generation unit and reflected by the target object; wherein the light generating unit emits a light beam having the same wavelength as the light beam that the light detecting unit can receive.

Optionally, still including the treater, treater and projection module, floodlight, formation of image module, distance sensor and the equal electric connection of color camera module are used for carrying out the mode at least, the mode is including monocular mode, passive binocular mode, the binocular mode of initiative.

The utility model discloses a another technical scheme does:

an electronic device comprises the integrated 3D imaging apparatus according to the above technical solution, wherein the integrated 3D imaging apparatus is mounted on a first plane of the electronic device and is used for acquiring an image and/or distance information of a target object; the screen is arranged on a second plane of the electronic equipment and is used for displaying the image and/or the distance information; the first plane and the second plane are the same plane or the first plane and the second plane are opposite planes.

The utility model discloses technical scheme's beneficial effect is:

the utility model discloses integrated 3D imaging device is through setting up the multichannel flexible circuit board, with an optical assembly and sensor element integration on same multichannel flexible circuit board, need not to add extra flexible circuit board and just connect both electricity to main circuit board, so not only save product cost, more make integrated 3D imaging device's structure compacter for this integrated 3D imaging device's structure is optimized more, thereby more does benefit to its integration in various mobile terminal.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a perspective view of the integrated 3D imaging device of the present invention;

fig. 2 is a structural illustration of the multi-channel flexible circuit board of the integrated 3D imaging device of the present invention;

FIG. 2a is a schematic illustration of the floodlight and the sensor of FIG. 2 after mounting;

FIG. 2b is another angular illustration of FIG. 2 a;

fig. 3 is a schematic structural diagram of an electronic device according to another embodiment of the present invention.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

It will be further understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner" and "outer" refer to an orientation or positional relationship as shown in the drawings, which are used for convenience in describing and simplifying the invention, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered limiting of the invention.

Referring to fig. 1-2 b, as an embodiment of the present invention, an integrated 3D imaging device 10 is provided, including: a projection module 100 for emitting a structured light beam to a space; a floodlight 110 for projecting a floodlight beam to a space; the imaging module 120 is used for imaging the structured light beam and/or the floodlight beam; in the embodiment of the present invention, the imaging module 120 includes a first camera 121 and a second camera 122; the sensor 130 is used for sensing and detecting a target object to obtain relevant information of the target object; in this embodiment, the sensor 130 is a distance sensor for detecting the proximity of the target object to the integrated 3D imaging device 10; the multi-channel flexible circuit board 14 comprises at least two branch channels, and the floodlight 110 and the sensor 130 are arranged on the two branch channels (141,142) of the multi-channel flexible circuit board 14 opposite to each other.

The embodiment of the utility model provides an in, multichannel flexible circuit board 14 is provided with two branch road passageways, and it can be understood, multichannel flexible circuit board 14 can set up a plurality of passageways, according to the specific design demand of product, can install imaging module 120, projection module 100 and other camera lens modules or detecting element on the branch road passageway of difference respectively to simplify the design, make the product structure compacter.

Wherein the two branch channels (141,142) of the multi-channel flexible circuit board 14 have a height difference, so that the side of the floodlight 110 facing away from the multi-channel flexible circuit board 14 is flush with the side of the sensor 130 facing away from the multi-channel flexible circuit board 14.

As shown in fig. 2, the multi-channel flexible circuit board 14 includes a connection portion 140, and a first branch channel 141 and a second branch channel 142 extending and separating from one end of the connection portion 140; a gap is arranged between the first branch passage 141 and the second branch passage 142; the first branch passage 141 extends and bends to form a first mounting surface 1410; the second channel 142 is bent to form a second mounting surface 1420; the first mounting surface and the second mounting surface have a height difference h. In this embodiment, the first mounting surface 1410 and the second mounting surface 1420 are both horizontal surfaces, wherein the first mounting surface 1410 is higher than the second mounting surface. It is understood that in other embodiments, the first mounting surface 1410 and the second mounting surface 1420 may not be planar, and may be other regular and/or irregular shaped surfaces; the first mounting surface 1410 may be lower than the second mounting surface 1420. Of course, in other embodiments, the first and second mounting surfaces may be at the same horizontal position, and may be specifically set according to actual needs, which is not particularly limited herein. The extending direction of the first mounting surface 1410 and the extending direction of the second mounting surface 1420 can be adjusted, the first mounting surface and the second mounting surface can be parallel or have a certain included angle, and the first mounting surface and the second mounting surface can be flexibly adjusted and arranged according to needs.

It is understood that the integrated 3D imaging device further includes a fixing bracket, and a main circuit board (not shown); the projection module 100, the imaging module 120 and the multi-channel flexible circuit board 14 provided with the distance sensor 130 and the floodlight 110 are arranged on the fixed bracket 101; the main circuit board may be a circuit board independently mounted on the fixing bracket 101, or may share the same main circuit board with a device using the integrated 3D imaging apparatus.

The optical components are connected to the main circuit board for power and circuit connection via a circuit board (not shown), which may be a Flexible Printed Circuit (FPC), a Printed Circuit Board (PCB), a rigid-flex board (flex-rigid board), or the like, and a connector (not shown), which may include any form, such as a board-to-board (BTB) connector, a Zero Insertion Force (ZIF) connector, or the like. In one embodiment, foam can be further attached to the connector to prevent light cross-talk and to prevent dust.

Referring to fig. 2a and 2b, in the integrated 3D imaging device 10 provided in this embodiment, by integrating the floodlight 110 and the distance sensor 130 on the same multi-channel flexible circuit board 14, the floodlight 110 and the distance sensor 130 are electrically connected to the main circuit board without adding an additional flexible circuit board, which not only saves the product cost, but also makes the structure of the integrated 3D imaging device 10 more compact, and in addition, because two channels (141,142) of the multi-channel flexible circuit board 14 have a height difference, the floodlight 110 and the distance sensor 130 can be mounted on the same plane, so that the structure of the integrated 3D imaging device is more optimized, and is more favorable for integration in various mobile terminals.

The projection module 100 is located between the first camera 121 and the second camera 122, and the floodlight 110 and the distance sensor 130 are located between the projection module 100 and the first camera 121. In one embodiment, the distance between the first camera 121 and the second camera 122 is 40mm, both constituting a passive binocular structured light depth camera. The distance between the projection module 100 and the second camera 122 is 20mm, and the projection module 100 and the first camera 121 and/or the second camera 122 may form an active monocular structured light depth camera or an active binocular structured light depth camera.

In one embodiment, in order to make the integrated 3D imaging device 10 possess more functions, generally, a color camera module 150, such as an RGB camera module, is also configured in the integrated 3D imaging device 10, and the RGB camera module is taken as an example in the following description, but this should not be construed as a limitation to the present invention. The integrated 3D imaging device 10, configured with an RGB camera module, has the capability of synchronously acquiring a target depth image and an RGB image. In one embodiment, the color camera module 150 is located between the projection module 100 and the second camera 122, and the distance between the color camera module 150 and the projection module 100 is 10 mm. In one embodiment, the centers of the first video camera 121, the projection module 100, the color camera 150, and the second video camera 122 are on the same straight line.

In one embodiment, the integrated 3D imaging device 10 further includes a processor (not shown) electrically connected to the projection module 100, the floodlight 110, the imaging module 120, the distance sensor 130 and the color camera module 150, at least for executing working modes, wherein the working modes include a monocular mode, a passive binocular mode and an active binocular mode. Wherein, the monocular mode means: the projection module 100 projects a structured light image, and the first camera 121 or the second camera 122 collects the structured light image; the passive binocular mode is: closing the projection module 100, and simultaneously acquiring images of the target object by the first camera 121 and the second camera 122; the active binocular mode is: the projection module 100 projects a structured light image, and the first camera 121 and the second camera 122 simultaneously capture the structured light image from different angles.

Specifically, different operation modes can be executed according to different application scenarios and environmental conditions, for example: when the target object is close to the application scene with extremely high requirements on the precision of 3D imaging, such as face authentication, face payment and the like, a monocular mode can be executed; it can be understood that the monocular mode tends to have a relatively small measurement range, so if a depth image with a wider measurement range is to be measured, the binocular mode can be performed, and although the projection field of view of the projection module is not changed, since the total collection field of view for collecting the structured light images by the two cameras (121,122) is larger than that of the structured light images collected by the single camera, the structured light images with a wider field of view than the single camera can be obtained by the two cameras.

When the outdoor scene or the target object is far away, the passive binocular mode can be executed, namely the projection module is turned off, and the target object is only acquired by the first camera (121) and the second camera (122), because: when the device is used in an outdoor environment, the patterned light beam projected by the projection module is easily influenced by strong natural light, so that the projected coded light is submerged, and although the problem can be alleviated to a certain extent by increasing the power of the projection light source, the power consumption of the whole device can be increased; when the target object is far away, the larger the projection pattern on the object is, the poorer the accuracy is, and the poorer the corresponding measurement accuracy is. Therefore, the measurement accuracy of the depth camera based on the structured light is greatly reduced along with the increase of the distance, so that the influence of various aspects such as power consumption and accuracy is combined, and in the two cases, the passive binocular mode is preferably adopted. It is understood that when the measurement distances are different, the focal lengths of the lenses in the imaging module 120 are also different.

It is understood that the proximity of the target object to the integrated 3D imaging device 10 is detected by the distance sensor 130. In general, the distance sensor 130 includes: a light generation unit 131 for projecting a light beam toward a target object; a light detection unit 132 for detecting the light beam projected by the light generation unit 131 and reflected by the target object. The wavelength of the light beam emitted by the light generating unit 131 should be the same as the wavelength of the light beam that the light detecting unit 132 can receive. Proximity determination generally includes two ways: one is that the light generating unit 131 projects a light beam to the target object and then the light detecting unit 132 estimates the distance to the target object by the intensity of the detected light beam, which is generally used to determine whether an object is close to the apparatus without accurately measuring the distance to the object. The other mode is as follows: the distance to the target is accurately measured by measuring the time from the light beam emitted by the light generation unit 131 to the light beam received by the light detection unit 132, i.e., according to the time of flight (TOF).

In one embodiment, in order to avoid crosstalk between the light generating unit 131 and the light detecting unit 132, that is, to prevent the light beam generated by the light generating unit 131 from being reflected by the target object and then being detected by the light detecting unit 132, a silicone sleeve may be adhered to the light exit and light entrance windows of the light generating unit 131 and the light detecting unit 132, so as to solve the above problem and achieve the effect of dust prevention. Similarly, in order to avoid the crosstalk phenomenon of other optical modules, for example, the patterned light beam projected by the projection module 100 is directly collected by the imaging module 120 without being reflected by the target object, in an embodiment, a PET protective film may be attached to the light exit and light entrance windows of each corresponding optical module, so as to not only solve the above problem, but also prevent dust. In one embodiment, the PET protective film is constructed of SH-010G 5.

It will be appreciated that in either approach, the proximity detection is performed by a processor that controls the various modules and units via the circuit board at respective interfaces, which may be various interfaces, such as an I2C interface. The processor may be a single processor or may be comprised of a plurality of processing units of different functionality. The processor may be a dedicated processor in the integrated 3D imaging device, and in some embodiments, when the integrated 3D imaging device is applied in some mobile terminals, the processor may also be a processor onboard the mobile terminal, or may also be an application processor AP. For example, the application processor AP in the mobile phone performs proximity determination by data transmission and reception of the light generation unit 131 and the light detection unit 132.

Specifically, the processor or the application processor triggers the distance sensor 130 through the interface, and when the distance sensor detects a target object, the processor applies a synchronous trigger signal to the projection module 100 and the imaging module 120 (so that the projection module 100 projects a structured light beam to the target object and the imaging module 120 collects a structured light image of a target environment), thereby avoiding that the projection module 100 and the imaging module 120 are always in a working state, and further reducing the power consumption of the integrated 3D imaging device 10.

It should be noted that the imaging module 120 can not only collect the light beam projected by the projection module 100 to generate the structured light image, but also further collect the light beam projected by the floodlight 110 to generate the floodlight image; specifically, the projection module 100 and the floodlight 110 can be turned on independently for different needs. In some applications, such as face recognition at night, it is often desirable to provide a flood image under flood lighting, which may be performed using the switchable floodlight 110. It will be appreciated that the wavelength of the light beam projected by the projection module 100 should be the same as the wavelength of the flood light beam projected by the flood light 110, and all of the light beams can be collected by the imaging module. Generally, the projection module 100 is used for projecting invisible light patterns, such as infrared light, and correspondingly, the imaging module 120 should be an infrared camera, and the floodlight should be an infrared floodlight. In some embodiments, the structured light pattern may also be any other wavelength of light, such as ultraviolet, visible, and the like.

In the above embodiment, the structure of the integrated 3D imaging device is described, and actually, the integrated 3D imaging device may become more and more components of electronic equipment, such as a mobile phone, a computer, a tablet, a television, and the like, so that the electronic equipment has a 3D imaging capability. The structures in the above embodiments may also be used on the integration of structures in an electronic device. The following description will be given taking a mobile phone as an example.

Fig. 3 shows another embodiment of the present invention, which provides an electronic device 20, where the electronic device 20 includes an integrated 3D imaging device, a housing 21, a screen 22, a battery 24, and a main circuit board 23 in the foregoing embodiment. The integrated 3D imaging device is installed on a first plane of the electronic device 20, and is used for acquiring an image or/and distance information of a target object; the screen 22 is mounted on a second plane of the electronic device for displaying images; the first plane and the second plane are the same plane or the first plane and the second plane are opposite planes.

In particular, the integrated 3D imaging device is configured to capture images of objects on the front of the electronic device 20, and thus is called a front-facing camera, which in some embodiments may be rear-facing or otherwise. In this structure, the respective portions of the integrated 3D imaging device are placed separately from the main circuit board 23 inside the electronic apparatus 20, and the integrated 3D imaging device is integrated as a separate component in the electronic apparatus 20. In some embodiments, the main circuit board 23 of the electronic device and the fixing bracket 100 may be integrated into one, and other components on the integrated 3D imaging device, such as a dedicated processor, may also be directly placed on the main circuit board 23 of the electronic device, or even the other processor 25 on the main circuit board 23 of the electronic device may perform the function of the dedicated processor, thereby reducing the number of components, making the whole electronic device more integrated, and reducing power consumption.

In some embodiments, the planes of the planar screens of the integrated 3D imaging devices in the mobile terminal may be the same plane or opposite planes, and the setting may be performed according to the specific situation of the mobile terminal in practical applications.

It should be understood by those skilled in the art that the embodiments of the present invention are illustrated only by the above-mentioned division of the functional units and modules for convenience and simplicity of description, and in practical applications, the above-mentioned function distribution can be completed by different functional units and modules as required, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the above-described functions. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of hardware and software functional units. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated 3D imaging device is characterized by comprising a projection module, an imaging module, a floodlight, a sensor and a multi-channel flexible circuit board; wherein the content of the first and second substances,

the floodlight is used for projecting a floodlight beam to the space;

2. The integrated 3D imaging device according to claim 1, characterized in that: the imaging module comprises a first camera and a second camera; the sensor is a distance sensor for detecting the proximity of a target object to the integrated 3D imaging device.

3. The integrated 3D imaging device according to claim 1, characterized in that: the device also comprises a fixed bracket and a main circuit board; wherein, projection module, imaging module install in on the fixed bolster.

4. The integrated 3D imaging device according to claim 2, characterized in that: the projection module is located between first camera and the second camera, floodlight, distance sensor are located between projection module and the first camera.

5. The integrated 3D imaging device according to claim 2, characterized in that: the first camera and the second camera form a passive binocular structured light depth camera; the projection module and the first camera and/or the second camera form an active monocular structured light depth camera.

6. The integrated 3D imaging device according to claim 2, characterized in that: the projection module and the first camera and/or the second camera form an active binocular structured light depth camera.

7. The integrated 3D imaging device according to claim 2, characterized in that: the color camera module is positioned between the projection module and the second camera; the centers of the first video camera, the projection module, the color camera and the second video camera are positioned on the same straight line.

8. The integrated 3D imaging device according to claim 2, characterized in that: the distance sensor includes:

a light generation unit for projecting a light beam toward a target object;

a light detection unit for detecting the light beam projected by the light generation unit and reflected by the target object; wherein the content of the first and second substances,

the light generating unit emits a light beam having the same wavelength as the light beam that the light detecting unit can receive.

9. The integrated 3D imaging device according to claim 7, characterized in that: still including the treater, treater and projection module, floodlight, formation of image module, distance sensor and the equal electric connection of color camera module are used for carrying out the mode at least, the mode is including monocular mode, passive binocular mode, the binocular mode of initiative.

10. An electronic device, comprising:

the integrated 3D imaging device according to any of claims 1 to 9, the integrated 3D imaging device being mounted on a first plane of an electronic device for acquiring image and/or distance information of a target object;

the screen is arranged on a second plane of the electronic equipment and is used for displaying the image and/or the distance information;

the first plane and the second plane are the same plane or the first plane and the second plane are opposite planes.