CN107205318B - Scribing apparatus and scribing method - Google Patents
Scribing apparatus and scribing method Download PDFInfo
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- CN107205318B CN107205318B CN201610835688.4A CN201610835688A CN107205318B CN 107205318 B CN107205318 B CN 107205318B CN 201610835688 A CN201610835688 A CN 201610835688A CN 107205318 B CN107205318 B CN 107205318B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
A dicing apparatus according to an exemplary embodiment of the present invention may include: a scribing wheel configured to form a scribing line on a substrate; a driving unit which moves the scribing wheel perpendicularly to the substrate and adjusts a pressing force pressing the scribing wheel against the substrate; an image pickup unit that picks up an image of a cut surface of a substrate that is cut after a scribe line is formed on the substrate; and a control unit that measures a shape of the cutting surface based on the image captured by the image capturing unit, and changes the pressing force by controlling the driving unit when the shape of the cutting surface exceeds a reference range.
Description
Technical Field
The present invention relates to a scribing apparatus and a scribing method for forming a scribing line on a substrate so as to cut the substrate.
Background
In general, a liquid crystal display panel, an organic electroluminescence panel, an inorganic electroluminescence panel, a transmissive projection substrate, a reflective projection substrate, and the like used for a flat panel display are manufactured by using a unit glass panel (hereinafter, referred to as "unit substrate") made by cutting a brittle mother glass panel (hereinafter, referred to as "substrate") into a predetermined size.
The process of cutting the substrate includes: a dicing process of forming a dicing line by pressing a dicing wheel made of a hard material such as diamond against a substrate with a predetermined pressing force and moving the dicing wheel along a prearranged cut line along which the substrate is to be cut; and a breaking process of cutting the substrate by pressing the substrate along the scribing line so as to obtain a unit substrate.
The related art dicing apparatus has problems in that: since the pressing force of the dicing wheel is set arbitrarily, chips or chippings are generated from the substrate during the dicing process and the breaking process.
Disclosure of Invention
The present invention is directed to provide a dicing apparatus and a dicing method capable of uniformly and constantly maintaining the quality of a cut surface of a substrate even in the case where the characteristics of a dicing wheel or the characteristics of the substrate are changed.
There is provided a scribing apparatus according to an exemplary embodiment of the present invention, including: a scribing wheel configured to form a scribing line on a substrate; a driving unit which moves the scribing wheel perpendicularly to the substrate and adjusts a pressing force pressing the scribing wheel against the substrate; an image pickup unit that picks up an image of a cut surface of a substrate that is cut after a scribe line is formed on the substrate; and a control unit that measures a shape of the cutting surface based on the image captured by the image capturing unit, and changes the pressing force by controlling the driving unit when the shape of the cutting surface exceeds a reference range.
The control unit may measure at least one of the following factors: the penetration depth of the scribing wheel into the substrate; the thickness of median crack (median crack) formed by the dicing wheel; a first ratio of a penetration depth of the dicing wheel to a thickness of the substrate; a second ratio of the thickness of the median crack to the thickness of the substrate; a third ratio, which is the ratio of the sum of the penetration depth of the scribing wheel and the thickness of the median crack to the thickness of the substrate; thickness of the fracture formed by the splinter process; and a fourth ratio, which is a ratio of the thickness of the breaking portion to the thickness of the substrate. Also, when at least one of the above-described measured factors exceeds a predetermined reference range, the pressing force applied to the dicing wheel may be changed by controlling the driving unit.
The control unit may set an area where at least one of the measured factors exceeds the predetermined reference range as a target area; also, the control unit may change the pressing force applied to the scribing wheel by controlling the driving unit within the target area.
The scribing apparatus may further include an unevenness measuring unit that measures unevenness of the cut surface of the substrate.
The scribing apparatus may further include a moving device that moves the image pickup unit toward and away from the cut surface of the substrate according to the unevenness of the cut surface of the substrate measured by the unevenness measuring unit.
The unevenness measuring unit may include: a non-uniformity measuring head mounted to be movable along a cutting surface of a substrate; a unevenness measuring member that is mounted on the unevenness measuring head so as to be in contact with the cut surface of the substrate, and that is movable toward and away from the cut surface of the substrate in accordance with unevenness of the cut surface of the substrate; and a position measuring device that measures a position of the unevenness measuring member.
At an end of the unevenness measuring member that contacts the cut surface of the substrate, a friction reducing member may be provided.
According to another exemplary embodiment of the present invention, there is provided a dicing method including the steps of: (a) forming a scribing line on the first substrate by pressing a scribing wheel against the first substrate with a first pressing force; (b) cutting the first substrate having the scribe lines formed in step (a); (c) acquiring an image of the cut surface of the first substrate cut in step (b); (d) measuring a shape of the cut surface of the first substrate based on the image of the cut surface acquired in step (c); (e) determining whether the shape of the cutting surface measured in step (d) is beyond a predetermined reference range; and (f) forming a scribing line on the second substrate by pressing the scribing wheel against the second substrate with a second pressing force different from the first pressing force when the shape of the cut surface measured in the step (d) is out of the predetermined reference range.
Step (d) may comprise measuring at least one of the following factors: the penetration depth of the scribing wheel into the substrate; the thickness of median cracks formed by the dicing wheel; a first ratio of a penetration depth of the dicing wheel to a thickness of the substrate; a second ratio of the thickness of the median crack to the thickness of the substrate; a third ratio, which is the ratio of the sum of the penetration depth of the scribing wheel and the thickness of the median crack to the thickness of the substrate; thickness of the fracture formed by the splinter process; and a fourth ratio, which is a ratio of the thickness of the fracture part to the thickness of the substrate; step (e) may include determining whether at least one of the factors measured in step (d) is outside a predetermined reference range; and the step (f) may include forming a scribing line on the second substrate by pressing the scribing wheel against the second substrate with a second pressing force different from the first pressing force when at least one of the factors measured in the step (d) is out of the predetermined reference range.
Step (f) may comprise: (g) setting an area where at least one of the factors measured in step (d) exceeds a predetermined reference range as a target area; and (h) forming a scribe line on the second substrate by pressing the scribing wheel against the second substrate with a second pressing force different from the first pressing force within the target area set in step (g).
According to the dicing apparatus and the dicing method of the exemplary embodiments of the present invention, even in the case where the properties of the dicing wheel are changed or the properties of the substrate are changed, it is possible to maintain the uniform and constant quality of the cutting surface by changing the pressing force applied to the dicing wheel according to the shape of the cutting surface of the substrate.
That is, according to the dicing apparatus and the dicing method of the exemplary embodiments of the present invention, it is possible to maintain a uniform and constant quality of a cut surface by varying a pressing force applied to a dicing wheel based on at least one of the following factors, including: the depth of the recessed portion formed by the dicing wheel, i.e., the penetration depth of the dicing wheel; the thickness of median cracks formed by the dicing wheel; a first ratio of a penetration depth of the dicing wheel to a thickness of the substrate; a second ratio of the thickness of the median crack to the thickness of the substrate; a third ratio, which is the ratio of the sum of the penetration depth of the scribing wheel and the thickness of the median crack to the thickness of the substrate; thickness of fracture formed during the splinter treatment; and a fourth ratio, which is a ratio of the thickness of the breaking portion to the thickness of the substrate.
Further, according to the scribing apparatus of the exemplary embodiment of the present invention, the magnitude of the unevenness of the cut surface of the substrate is measured by using the unevenness measuring unit having a simple configuration, and as a result, the quality of the cut surface of the substrate can be easily and effectively determined.
Further, according to the scribing apparatus of the exemplary embodiment of the present invention, the image pickup unit may be moved toward and away from the cut surface of the substrate according to the displacement of the unevenness measuring member measured by the position measuring device, and as a result, the interval between the image pickup unit and the cut surface of the substrate may be constantly maintained. Therefore, the focal point of the camera of the image pickup unit may be always located on the cut surface of the substrate, and as a result, the shape of the cut surface of the substrate may be more accurately measured.
Drawings
Fig. 1 is a view schematically showing a dicing head of a dicing apparatus according to an exemplary embodiment of the present invention.
Fig. 2 is a view schematically showing a state in which a scribing line is formed on a substrate using a scribing apparatus according to an exemplary embodiment of the present invention, and a state in which an image of a cut surface of the substrate is captured.
Fig. 3 and 4 are views illustrating a state in which median cracks are formed in a substrate during a process of forming a scribe line on the substrate using a scribing apparatus according to an exemplary embodiment of the present invention.
Fig. 5 is a view schematically showing a cut surface of a substrate.
Fig. 6 is a flowchart illustrating a dicing method according to an exemplary embodiment of the present invention.
Fig. 7 is a view illustrating an unevenness measuring unit of a dicing apparatus according to another exemplary embodiment of the present invention.
Detailed Description
Hereinafter, a dicing apparatus and a dicing method according to exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
As shown in fig. 1 and 2, a dicing apparatus according to an exemplary embodiment of the present invention includes: a dicing head 100; a control unit 200 that controls the operation of the dicing head 100; and an image pickup unit 300 which picks up an image of the cut surface S1 of the substrate S.
The dicing head 100 may be mounted on a frame (not shown) so as to be movable relative to the substrate S. The scribing head 100 may include: a scribing wheel 10 configured to form a scribing line L on a substrate S; a wheel holder 20 that holds the dicing wheel 10; a driving unit 30 supporting the wheel holder 20 and vertically moving the wheel holder 20; and a guide 40 guiding vertical movement of the wheel holder 20.
The drive unit 30 may be configured as a linear motion mechanism, for example: an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. For example, as shown in fig. 1, the driving unit 30 may be configured as a voice coil motor. In this case, the driving unit 30 may include: a coil 31 that drives the wheel holder 20; an encoder 32 connected to the coil 31; and a linear scale 33 that measures the displacement of the wheel holder 20.
In this configuration, the wheel holder 20 is moved downward by a predetermined distance by the operation of the driving unit 30, with the result that the scribing wheel 10 starts to contact the substrate S. In this case, the distance that the wheel holder 20 moves downward can be adjusted by adjusting the torque of the driving unit 30, and thus the pressing force with which the dicing wheel 10 is pressed against the substrate S can be adjusted. The distance of downward movement of the wheel holder 20 can be detected by the linear scale 33, and the control unit 200 controls the encoder 32 based on the distance of downward movement of the wheel holder 20 detected by the linear scale 33, thereby adjusting the torque of the driving unit 30.
Meanwhile, as described above, the process of cutting the substrate S includes: a dicing process of forming a dicing line L on the substrate S by pressing the dicing wheel 10 against the substrate S and moving the dicing wheel 10 along a prearranged cut line along which the substrate S is to be cut; and a breaking process of cutting the substrate S by pressing the substrate S along the dicing line L so as to obtain a unit substrate.
As shown in fig. 3 to 5, during the dicing process, when the dicing wheel 10 is moved on the substrate S while being rotated in a state of being pressed against the substrate S, as the dicing wheel 10 is pressed against the substrate S, a concave portion P is formed in the substrate S, and a vertical crack called a median crack M is also formed in the substrate S. In some cases, only the median cracks M may be formed without forming the depressed portions P.
Further, during the breaking process, in a state where a predetermined median crack M is formed in the substrate S, a shear stress is applied to the substrate S along the dicing line L, so that a fracture portion C is formed in the substrate S as a crack grows from the median crack, with the result that the substrate S is instantaneously cut.
Meanwhile, the scribing wheel 10 is repeatedly worn (mechanical wear and thermal wear) due to continuous friction between the scribing wheel 10 and the substrate S. The degree of wear of the scribing wheel 10 affects the size of the recessed portion P and the median crack M. Moreover, the properties of the substrate S (such as the thickness and brittleness of the substrate S) also affect the dimensions of the recessed portion P and the median crack M. In addition, the properties of the dicing wheel 10 (such as the hardness of the dicing wheel 10 and the angle of the cutting edge) also affect the size of the recessed portion P and the median crack M.
The sizes of the recessed portion P and the median crack M are closely related to the quality of the cut surface S1 of the substrate S, such as the surface roughness or smoothness of the cut surface S1. In particular, based on the quality of the median crack M, the surface roughness of the cut surface S1 is formed, and the impact fracture toughness of the substrate S may vary. If the sizes of the recessed portion P and the median crack S are irregular, the quality of the cut surface S1 of the substrate S is poor, and as a result, there is a problem in that chips, and the like are generated.
Therefore, even in the case where the properties of the substrate S or the dicing wheel 10 are changed, it is necessary to maintain a constant quality of the cut surface S1 of the substrate S by forming the depressed portions P and the median cracks M of a uniform size.
To this end, the scribing apparatus according to the exemplary embodiment of the present invention is provided with the image pickup unit 300 which picks up an image of the cutting surface S1 of the substrate S.
For example, the image acquisition unit 300 may include a camera 70. The camera 70 may be configured to capture an image of the entirety of the cut surface S1 of the substrate S. As another example, the substrate S may be moved in a state where the camera 70 is fixed, and the camera 70 may capture an image of the cut surface S1 in a direction in which the substrate S is moved. As still another embodiment, the image pickup unit 300 may be provided with a moving device (not shown) that moves the camera 70 along the cutting surface S1 of the substrate S, and the camera 70 may be configured to pick up an image of the cutting surface S1 of the substrate S while moving along the cutting surface S1 of the substrate S.
Also, based on the image of the cut surface S1 acquired by the image acquisition unit 300, the control unit 200 measures the shape of the cut surface S1, and then determines whether the measured shape of the cut surface S1 is within the reference range, i.e., determines whether the quality of the cut surface S1 is acceptable. In the case where the control unit 200 determines that the quality of the cut surface S1 is acceptable, the control unit 200 controls the drive unit 30 so that the drive unit 30 presses the dicing wheel 10 against the substrate S with the same pressing force as the previous pressing force. Further, in the case where the control unit 200 determines that the quality of the cut surface S1 is not acceptable, the control unit 200 controls the drive unit 30 so that the drive unit 30 presses the dicing wheel 10 against the substrate S with a pressing force different from the previous pressing force.
In particular, based on the image of the cut surface S1 of the substrate S captured by the image capturing unit 300, the control unit 200 may obtain information on the following factors as a reference for determining whether the quality of the cut surface S1 is acceptable.
(1) The depth D of the concave portion P formed by the dicing wheel 10, i.e., the penetration depth D of the dicing wheel 10 into the substrate S;
(2) the thickness T of median cracks M formed by the dicing wheel 10;
(3) a first ratio D/a, which is a ratio of the penetration depth D of the dicing wheel 10 to the thickness a of the substrate S;
(4) a second ratio T/A, which is the ratio of the thickness T of the median crack M to the thickness A of the substrate S;
(5) a third ratio (D + T)/a, which is a ratio of the sum of the penetration depth D of the dicing wheel 10 and the thickness T of the median crack M to the thickness a of the substrate S;
(6) thickness B of fracture part C formed by the splinter process;
(7) a fourth ratio B/A, which is the ratio of the thickness B of the fracture C to the thickness A of the substrate S.
First, the penetration depth D of the dicing wheel 10 is related to the properties of the dicing wheel 10, such as the hardness, degree of wear, and angle of the cutting edge of the dicing wheel 10, and to the pressing force with which the dicing wheel 10 is pressed against the substrate S. Accordingly, the penetration depth D of the dicing wheel 10 may be changed in the case where the properties of the dicing wheel 10 are changed due to wear of the dicing wheel 10 or the like under the same pressing force applied. Accordingly, the control unit 200 may determine whether the quality of the cutting surface S1 is acceptable by determining whether the penetration depth D of the dicing wheel 10 is beyond a predetermined reference range. Here, the reference range may be obtained from an experiment based on the measured penetration depth D of the scribing wheel 10 in a state where the quality of the cut surface S1 of the substrate S is not acceptable and the shapes of the concave portion P, the median crack M, or the fractured portion C are irregular. That is, the reference range may be set by analyzing the shape of the depression part P, median crack M, or fracture C, which is changed according to the change of the penetration depth D of the dicing wheel 10, and by obtaining the penetration depth D of the dicing wheel 10 when the depression part P, median crack M, or fracture C has a defect.
Moreover, the thickness T of the median crack M is also related to the properties of the dicing wheel 10 (such as the hardness, degree of wear and angle of the cutting edge of the dicing wheel 10), and to the pressing force with which the dicing wheel 10 is pressed against the substrate S. Therefore, under the condition that the same pressing force is applied, the thickness T of the median crack M may be changed when the properties of the dicing wheel 10 are changed due to wear of the dicing wheel 10, or the like. Accordingly, the control unit 200 may determine whether the quality of the cut surface S1 is acceptable by determining whether the thickness T of the median crack M is beyond a predetermined reference range. Here, the reference range may be obtained from an experiment based on the measured thickness T of the median crack M in a state where the quality of the cut surface S1 of the substrate S is unacceptable and the shapes of the recessed portion P, the median crack M, or the fractured portion C are irregular. That is, the reference range may be set by analyzing the shape of the recessed portion P, median crack M, or fractured portion C, which is changed according to the change in the thickness T of the median crack M, and by obtaining the thickness T of the median crack M when the recessed portion P, median crack M, or fractured portion C has a defect.
Also, the first ratio D/a is used to measure the penetration depth D of the scribing wheel 10 based on the thickness a of the substrate S. In the case where the mass of the cutting surface S1 is determined based on the first ratio D/a, the shape of the recessed portion P, the median crack M, or the fracture C can be determined and predicted more accurately than in the case where the mass of the cutting surface S1 is determined based on the quantitative value of the penetration depth D of the dicing wheel 10. Also, the control unit 200 may determine whether the quality of the cut surface S1 is acceptable by determining whether the first ratio D/a is beyond a predetermined reference range. Here, the reference range may be obtained from an experiment based on the measured first ratio D/a in a state where the quality of the cut surface S1 of the substrate S is not acceptable and the shapes of the recessed portion P, median crack M, or fractured portion C are irregular. That is, the reference range may be set by analyzing the shape of the depressed portion P, median crack M, or fractured portion C, which is changed according to the change of the first ratio D/a, and by obtaining the first ratio D/a when the depressed portion P, median crack M, or fractured portion C has a defect.
Also, the second ratio T/a is used to measure the thickness T of the median crack M based on the thickness a of the substrate S. In the case where the mass of the cutting surface S1 is determined based on the second ratio T/a, the shape of the recessed portion P, median crack M, or fracture C can be determined and predicted more accurately than in the case where the mass of the cutting surface S1 is determined based on the quantitative value of the thickness T of the median crack M. Also, the control unit 200 may determine whether the quality of the cut surface S1 is acceptable by determining whether the second ratio T/a is beyond a predetermined reference range. Here, the reference range may be obtained from an experiment based on the measured second ratio T/a in a state where the quality of the cut surface S1 of the substrate S is not acceptable and the shapes of the recessed portion P, median crack M, or fractured portion C are irregular. That is, the reference range may be set by analyzing the shape of the depressed portion P, median crack M, or fractured portion C, which is changed according to the change of the second ratio T/a, and by obtaining the second ratio T/a when the depressed portion P, median crack M, or fractured portion C has a defect.
Also, the third ratio (D + T)/a is used to measure the penetration depth D of the dicing wheel 10 and the thickness T of the median crack M based on the thickness a of the substrate S. In the case where the mass of the cutting surface S1 is determined based on the third ratio (D + T)/a, the shape of the depressed portion P, the median crack M, or the fractured portion C can be determined and predicted more accurately, as compared to the case where the mass of the cutting surface S1 is determined based on the magnitude of the penetration depth D of the dicing wheel 10 and the magnitude of the thickness T of the median crack M. Also, the control unit 200 may determine whether the quality of the cutting surface S1 is acceptable by determining whether the third ratio (D + T)/a is beyond a predetermined reference range. Here, the reference range may be obtained from an experiment based on the measured third ratio (D + T)/a in a state where the quality of the cut surface S1 of the substrate S is not acceptable and the shape of the recessed portion P, median crack M, or fractured portion C is irregular. That is, the reference range may be set by analyzing the shape of the depressed portion P, median crack M, or fractured portion C, which is changed according to the change of the third ratio (D + T)/a, and by obtaining the third ratio (D + T)/a when the depressed portion P, median crack M, or fractured portion C has a defect.
Also, the fracture C is formed by the concave portion P and the median crack M formed by the dicing wheel 10, and the thickness B of the fracture C is related to the properties of the dicing wheel 10, such as the hardness, degree of wear, and angle of the cutting edge of the dicing wheel 10, the pressing force with which the dicing wheel 10 is pressed against the substrate S, and the properties of the substrate S, such as the brittleness of the substrate S. Accordingly, the thickness B of the fracture part C may be changed in the case where the properties of the dicing wheel 10 are changed due to wear of the dicing wheel 10 or the like under the same pressing force applied. Accordingly, the control unit 200 may determine whether the quality of the cut surface S1 is acceptable by determining whether the thickness B of the fracture portion C is beyond a predetermined reference range. Here, the reference range may be obtained from an experiment based on the measured thickness B of the fracture C in a state where the quality of the cut surface S1 of the substrate S is not acceptable and the shape of the depressed portion P, median crack M, or fracture C is irregular. That is, the reference range may be set by analyzing the shape of the depressed portion P, median crack M, or fracture C that changes according to the change in the thickness B of the fracture C, and by obtaining the thickness B of the fracture C when the depressed portion P, median crack M, or fracture C has a defect.
Moreover, the fourth ratio B/a is used to measure the thickness B of the fracture C based on the thickness a of the substrate S. In the case where the mass of the cutting surface S1 is determined based on the fourth ratio B/a, the shape of the recessed portion P, median crack M, or fracture C can be determined and predicted more accurately than in the case where the mass of the cutting surface S1 is determined based on the quantitative value of the thickness B of the fracture C. Also, the control unit 200 may determine whether the quality of the cut surface S1 is acceptable by determining whether the fourth ratio B/a is beyond a predetermined reference range. Here, the reference range may be obtained from an experiment based on the measured fourth ratio B/a in a state where the quality of the cut surface S1 of the substrate S is not acceptable and the shapes of the recessed portion P, median crack M, or fractured portion C are irregular. That is, the reference range may be set by analyzing the shape of the concave portion P, median crack M, or fractured portion C, which is changed according to the change of the fourth ratio B/a, and by obtaining the fourth ratio B/a when the concave portion P, median crack M, or fractured portion C has a defect.
Meanwhile, in the case where at least one of the following factors is out of its reference range, the control unit 200 controls the driving unit 30 so as to change the pressing force with which the dicing wheel 10 is pressed against the substrate S: (1) the depth D of the concave portion P formed by the dicing wheel 10, that is, the penetration depth D of the dicing wheel 10; (2) the thickness T of median cracks M formed by the dicing wheel 10; (3) a first ratio D/a, which is a ratio of the penetration depth D of the dicing wheel 10 to the thickness a of the substrate S; (4) a second ratio T/A, which is the ratio of the thickness T of the median crack M to the thickness A of the substrate S; (5) a third ratio (D + T)/a, which is a ratio of the sum of the penetration depth D of the dicing wheel 10 and the thickness T of the median crack M to the thickness a of the substrate S; (6) a thickness B of a fracture C formed during the splinter process; and (7) a fourth ratio B/a, which is a ratio of the thickness B of the fracture portion C to the thickness a of the substrate S.
Therefore, even if the properties of the dicing wheel 10 (such as the degree of wear of the dicing wheel 10) and the properties of the substrate S are changed, it is possible to constantly maintain: (1) the depth of penetration D of the dicing wheel 10, (2) the thickness T of median cracks M formed by the dicing wheel 10, (3) a first ratio D/a, (4) a second ratio T/a, (5) a third ratio (D + T)/a, (6) the thickness B of the fracture C, and (7) a fourth ratio B/a. Therefore, even if the properties of the dicing wheel 10 or the properties of the substrate S are changed, it is possible to maintain a uniform, constant quality of the cut surface S1 by changing the pressing force applied to the dicing wheel 10.
Further, in the case where at least one factor exceeds its reference range only within a partial area of the entire cutting surface S1 of the substrate S, the control unit 200 sets the measured area of the at least one factor exceeding its predetermined reference range as a target area, and controls the driving unit 30 so that the pressing force applied to the dicing wheel 10 is changed within the target area.
Therefore, in the case where at least one factor exceeds its reference range only within a local area of the entire cut surface S1 of the substrate S, the pressing force applied to the dicing wheel 10 changes within the local area, thereby always maintaining: (1) the depth of penetration D of the dicing wheel 10, (2) the thickness T of median cracks M formed by the dicing wheel 10, (3) a first ratio D/a, (4) a second ratio T/a, (5) a third ratio (D + T)/a, (6) the thickness B of the fracture C, and (7) a fourth ratio B/a. Therefore, even if the properties of the dicing wheel 10 or the properties of the substrate S are changed, it is possible to maintain a uniform, constant quality of the cut surface S1 by changing the pressing force applied to the dicing wheel 10.
Hereinafter, a scribing method according to an exemplary embodiment of the present invention will be described.
Hereinafter, the substrate S subjected to the measurement of the above-described factors related to the cut surface S1 is defined as a first substrate; in contrast, the substrate S on which the scribe line L is formed using the pressing force that is changed or maintained based on the factors measured in association with the first substrate is defined as a second substrate. Here, the first substrate may be a test substrate not used for actual production, and the second substrate may be a substrate used for actual production. As another example, the first substrate may be a substrate selected from several substrates after the dicing process and the breaking process are completed. The first substrate may be selected periodically, randomly, or after performing a dicing process and a cleaving process on a predetermined number of substrates. The second substrate may be a substrate on which scribe lines are formed using a pressing force that is changed or maintained based on factors measured in association with the first substrate. As yet another example, the first substrate may be an inactive area of one substrate that is cut and removed from the substrate without being used for an actual product, and the second substrate may be an active area of one substrate that is used for an actual product after the first substrate is cut and removed from the substrate.
Further, the pressing force of the scribing wheel 10 applied to the first substrate is defined as a first pressing force; and the pressing force of the dicing wheel 10 that changes based on the factors measured in association with the first substrate is defined as a second pressing force.
According to the scribing method of the exemplary embodiment of the present invention, the scribing line L is formed on the first substrate by pressing the scribing wheel 10 against the first substrate with the first pressing force (S110).
Further, the first substrate having the scribing line L is cut by the breaking process (S120).
Further, an image of the cut surface of the first substrate S1 is acquired by capturing an image of the cut surface using the image capturing unit 300 (S130).
Further, based on the image of the cut surface S1 of the first substrate, at least one of the following factors is measured, including: (1) the depth of penetration D of the dicing wheel 10, (2) the thickness T of median cracks M formed by the dicing wheel 10, (3) a first ratio D/a, (4) a second ratio T/a, (5) a third ratio (D + T)/a, (6) the thickness B of the fracture C, and (7) a fourth ratio B/a (S140).
Further, it is determined whether at least one of the measured factors is out of a predetermined reference range (S150). In the case where at least one of the measured factors is out of the predetermined reference range, a scribing line is formed on the second substrate by pressing the scribing wheel 10 with a second pressing force different from the first pressing force (S160).
For example, if the thickness T of the median crack M formed in the first substrate is lower than the reference range, the size of the median crack M to be formed in the second substrate may be increased by increasing the pressing force of the dicing wheel 10, i.e., by pressing the dicing wheel 10 against the second substrate with a second pressing force higher than the first pressing force. Further, if the thickness T of the median crack M formed in the first substrate is higher than the reference range, the size of the median crack M to be formed in the second substrate may be reduced by reducing the pressing force of the dicing wheel 10, i.e., by pressing the dicing wheel 10 against the second substrate with a second pressing force lower than the first pressing force.
As described above, according to the scribing method of the exemplary embodiment of the present invention, even if the properties of the scribing wheel 10 (such as the degree of wear of the scribing wheel 10) and the properties of the substrate S are changed, it is possible to constantly maintain by changing the pressing force applied to the scribing wheel 10: (1) the depth of penetration D of the dicing wheel 10, (2) the thickness T of median cracks M formed by the dicing wheel 10, (3) a first ratio D/a, (4) a second ratio T/a, (5) a third ratio (D + T)/a, (6) the thickness B of the fracture C, and (7) a fourth ratio B/a. Therefore, even if the properties of the dicing wheel 10 or the properties of the substrate S are changed, it is possible to maintain a uniform, constant quality of the cut surface S1 by changing the pressing force applied to the dicing wheel 10.
Meanwhile, in the case where at least one of the measured factors exceeds its predetermined reference range only within a partial area of the entire cutting surface S1 of the substrate S, the partial area of the at least one measured factor exceeding its predetermined reference range is set as a target area, and a scribing line can be formed on the second substrate by pressing the scribing wheel 10 against the second substrate with a second pressing force different from the first pressing force within the target area.
Therefore, in the case where at least one of the factors exceeds its reference range only within a local area of the entire cutting surface S1 of the substrate S, the pressing force applied to the dicing wheel 10 changes within the local area, thereby constantly maintaining: (1) the depth of penetration D of the dicing wheel 10, (2) the thickness T of median cracks M formed by the dicing wheel 10, (3) a first ratio D/a, (4) a second ratio T/a, (5) a third ratio (D + T)/a, (6) the thickness B of the fracture C, and (7) a fourth ratio B/a. Therefore, even if the properties of the dicing wheel 10 or the properties of the substrate S are changed, it is possible to maintain a uniform, constant quality of the cut surface S1 by changing the pressing force applied to the dicing wheel 10.
Hereinafter, a scribing apparatus according to an exemplary embodiment of the present invention will be described with reference to fig. 7.
The scribing apparatus according to the exemplary embodiment of the present invention may include the unevenness measuring unit 400 that measures unevenness of the cut surface S1 of the substrate S.
The unevenness measuring unit 400 may include: an unevenness measuring head 410 mounted to be movable along a cutting surface S1 of the substrate S; an unevenness measuring member 430 mounted on the unevenness measuring head 410 so as to be movable toward and away from the cutting surface S1 of the substrate S according to unevenness of the cutting surface S1 of the substrate S; and a position measuring device 450 that measures the position of the unevenness measuring member 430.
A linear motion mechanism, such as an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism, may be connected to the unevenness measuring head 410. The unevenness measuring head 410 may be moved along the cutting surface S1 of the substrate S by a linear motion mechanism in a state where the unevenness measuring head 410 is spaced apart from the cutting surface S1 of the substrate S by a predetermined distance.
While the unevenness measuring head 410 is moved, the unevenness measuring member 430 may be moved toward and away from the cutting surface S1 of the substrate S according to the unevenness of the cutting surface S1 of the substrate S. An elastic member such as a spring may be connected with the unevenness measuring member 430 so that the unevenness measuring member 430 may move according to unevenness of the cutting surface S1 of the substrate S. In this case, a friction reducing member 431 such as a ball or a roller may be provided at an end of the unevenness measuring member 430 that is in contact with the cutting surface S1 of the substrate S.
The position measuring device 450 is connected to the control unit 200 so that information of the position and displacement of the unevenness measuring member 430 measured by the position measuring device 450 can be transmitted to the control unit 200.
For example, the reference member 451 may be configured as a scale having a predetermined scale, and the detection member 452 may be configured as a camera for capturing an image of the scale. In this case, the relative position between the reference member 451 and the detection member 452 may be measured based on the image of the reference member 451 captured by the detection member 452, and the position of the unevenness measuring member 430 may be measured based on the measured relative position.
For another example, the reference member 451 may include a reflective surface that changes a reflection angle of light according to a position where the light is reflected, and the detecting member 452 may include: a light emitting sensor that emits light toward the reflection surface; and a light receiving sensor that receives light reflected from the reflection surface. In this case, the relative position between the reference member 451 and the detection member 452 is measured by measuring the reflection angle of the light reflected from the reference member 451, and the position of the unevenness measuring member 430 may be measured based on the measured relative position.
According to the configuration as described above, when the unevenness measuring head 410 is moved along the cutting surface S1 of the substrate S in a state where the end of the unevenness measuring member 430 is in contact with the cutting surface S1 of the substrate S, the unevenness measuring member 430 is moved toward and away from the cutting surface S1 of the substrate S in accordance with the unevenness of the cutting surface S1 of the substrate S.
As the unevenness measuring member 430 is moved, the relative position between the reference member 451 and the detecting member 452 is changed, and the displacement of the unevenness measuring member 430 can be measured based on the change in the relative position between the reference member 451 and the detecting member 452. The displacement of the unevenness measuring member 430 means the magnitude (magnitude) of the unevenness formed on the cut surface S1 of the substrate S. Accordingly, the magnitude of the unevenness may be measured based on the displacement of the unevenness measuring means 430, and the quality of the cut surface S1 of the substrate S may be determined based on the measured magnitude of the unevenness. For example, if the magnitude of the unevenness is greater than a predetermined reference value, the control unit 200 may determine that the quality of the cut surface S1 of the substrate S, which has a defect, is not acceptable.
As described above, the magnitude of the unevenness of the cut surface S1 of the substrate S can be measured using the unevenness measuring unit 400 having a simple configuration, and as a result, the quality of the cut surface S1 of the substrate S can be easily and effectively determined.
Meanwhile, the image pickup unit 300 may be disposed on the unevenness measuring head 410, and the image pickup unit 300 may be connected with a moving device 350 that moves the image pickup unit 300 toward and away from the cutting surface S1 of the substrate S. The moving device 350 may be configured as a linear motion mechanism, such as: an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism.
The moving device 350 may be connected with the control unit 200, and the control unit 200 controls the moving device 350 based on the displacement of the unevenness measuring member 430 measured by the position measuring device 450 so that the moving device 350 may move the image collection unit 300 corresponding to the displacement of the unevenness measuring member 430.
Accordingly, the image pickup unit 300 may be moved toward and away from the cut surface S1 of the substrate S according to the displacement of the unevenness measuring member 430 measured by the position measuring device 450, and as a result, the interval between the image pickup unit 300 and the cut surface S1 of the substrate S may be always constant. That is, the image pickup unit 300 may move according to the unevenness of the cut surface S1 of the substrate S measured by the unevenness measuring unit 400, and as a result, the interval between the image pickup unit 300 and the cut surface S1 of the substrate S may be constantly maintained. Accordingly, the focal point of the camera 70 of the image pickup unit 300 may be always located on the cut surface S1 of the substrate S, and thus, the shape of the cut surface S1 of the substrate S may be more accurately measured.
Various exemplary embodiments of the present invention have been described herein for illustrative purposes. It should be recognized, however, that the scope of the present invention is not limited to the specific exemplary embodiments, and that various modifications may be made without departing from the scope of the invention as defined by the appended claims.
Claims (11)
1. A dicing method, comprising the steps of:
(a) forming a scribing line on a first substrate by pressing a scribing wheel against the first substrate with a first pressing force;
(b) cutting the first substrate having the scribe lines formed in step (a);
(c) capturing an image of the cut surface of the first substrate cut in step (b);
(d) measuring a shape of the cut surface of the first substrate based on the image of the cut surface acquired in step (c);
(e) determining whether the shape of the cutting surface measured in step (d) is beyond a predetermined reference range; and
(f) forming a scribing line on a second substrate by pressing the scribing wheel against the second substrate with a second pressing force different from the first pressing force when the shape of the cut surface measured in step (d) is out of the predetermined reference range.
2. The dicing method of claim 1, wherein step (d) includes measuring at least one of the following factors: a penetration depth of the saw wheel into the substrate; a thickness of median cracks formed by the dicing wheel; a first ratio of a penetration depth of the dicing wheel to a thickness of the substrate; a second ratio of the thickness of the median crack to the thickness of the substrate; a third ratio of the thickness of the substrate to the sum of the penetration depth of the dicing wheel and the thickness of the median crack; thickness of the fracture formed by the splinter process; and a fourth ratio, which is a ratio of a thickness of the breaking portion to a thickness of the substrate,
step (e) includes determining whether at least one of the factors measured in step (d) is outside a predetermined reference range, and
step (f) includes, when at least one of the factors measured in step (d) is out of the predetermined reference range, forming a dicing line on the second substrate by pressing the dicing wheel against the second substrate with the second pressing force different from the first pressing force.
3. The dicing method of claim 2, wherein the step (f) includes:
(g) setting an area where at least one of the factors measured in step (d) exceeds the predetermined reference range as a target area; and
(h) forming a scribe line on the second substrate by pressing the scribing wheel against the second substrate with the second pressing force different from the first pressing force within the target area set in step (g).
4. A dicing apparatus, comprising:
a scribing wheel configured to form a scribing line on a substrate;
a driving unit that moves the dicing wheel perpendicularly to the substrate and adjusts a pressing force for pressing the dicing wheel against the substrate;
an image pickup unit that picks up an image of a cut surface of the substrate that is cut after a scribe line is formed on the substrate; and
a control unit that measures a shape of the cutting surface based on the image captured by the image capturing unit, and changes the pressing force by controlling the driving unit when the shape of the cutting surface is out of a reference range.
5. The dicing apparatus of claim 4, wherein the control unit measures at least one of: a penetration depth of the saw wheel into the substrate; a thickness of median cracks formed by the dicing wheel; a first ratio of a penetration depth of the dicing wheel to a thickness of the substrate; a second ratio of the thickness of the median crack to the thickness of the substrate; a third ratio of the thickness of the substrate to the sum of the penetration depth of the dicing wheel and the thickness of the median crack; thickness of the fracture formed by the splinter process; and a fourth ratio, which is a ratio of a thickness of the breaking portion to a thickness of the substrate; and changing the pressing force applied to the scribing wheel by controlling the control unit when at least one of the measured factors exceeds a predetermined reference range.
6. The dicing apparatus of claim 5, wherein the control unit sets an area where at least one of the measured factors exceeds the predetermined reference range as a target area; and the control unit changes the pressing force applied to the dicing wheel by controlling the driving unit within the target region.
7. The dicing apparatus of claim 4, further comprising:
a non-uniformity measuring unit that measures non-uniformity of a cut surface of the substrate.
8. The dicing apparatus of claim 7, further comprising:
a moving device that moves the image pickup unit toward and away from the cut surface of the substrate according to the unevenness of the cut surface of the substrate measured by the unevenness measuring unit.
9. The dicing apparatus according to claim 7 or 8, wherein the unevenness measuring unit includes:
a non-uniformity measuring head mounted to be movable along a cutting surface of the substrate;
a unevenness measuring member that is mounted on the unevenness measuring head so as to be in contact with the cut surface of the substrate, and that is movable toward and away from the cut surface of the substrate in accordance with unevenness of the cut surface of the substrate; and
a position measuring device that measures a position of the unevenness measuring member.
10. The dicing apparatus according to claim 9, wherein a friction reducing member is provided at an end of the unevenness measuring member that contacts the cutting surface of the substrate.
11. The scribing apparatus of claim 9, wherein the position measuring device comprises: a reference member provided on the unevenness measuring member; and a detecting member installed to face the reference member, the position measuring device measuring a position of the unevenness measuring member by using an interaction between the reference member and the detecting member.
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| KR20160032059 | 2016-03-17 | ||
| KR10-2016-0032059 | 2016-03-17 | ||
| KR10-2016-0093658 | 2016-07-22 | ||
| KR1020160093658A KR102605919B1 (en) | 2016-03-17 | 2016-07-22 | Scribing apparatus and scribing method |
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| CN107205318B true CN107205318B (en) | 2021-01-29 |
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| KR102027136B1 (en) * | 2017-09-27 | 2019-10-01 | 주식회사 탑 엔지니어링 | Scribing apparatus |
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