CN107205318A - Scribing equipment and dicing method - Google Patents
Scribing equipment and dicing method Download PDFInfo
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- CN107205318A CN107205318A CN201610835688.4A CN201610835688A CN107205318A CN 107205318 A CN107205318 A CN 107205318A CN 201610835688 A CN201610835688 A CN 201610835688A CN 107205318 A CN107205318 A CN 107205318A
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- substrate
- thickness
- cutting surfaces
- score wheel
- ratio
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
A kind of scribing equipment of exemplary embodiment according to the present invention may include：Score wheel, it is configured on substrate form scribe line；Driver element, it moves score wheel perpendicular to substrate, and score wheel is pressed against the pressing force on substrate by adjustment；Image acquisition units, image acquisition units collection forms the image of the cutting surfaces for the substrate being cut after scribe line on substrate；And control unit, it measures the shape of cutting surfaces based on the image gathered by image acquisition units, and when the shape of cutting surfaces exceeds term of reference, pressing force is changed by controlling driver element.
Description
Technical field
The present invention relates to a kind of scribe line that formed on substrate so as to the scribing equipment and dicing method of cutting substrate.
Background technology
In general, for the liquid crystal display panel of flat-panel monitor, organic electroluminescence panel, inorganic EL face
Plate, transmission projection substrate, reflective projection substrate etc. are made by using unit glass panel (hereinafter, referred to " cell substrate ")
Make, unit glass panel is made by the way that fragility mother glass panel (hereinafter, referred to " substrate ") is cut to predetermine sizes
Into.
The processing (technique) of cutting substrate includes：Scribing is handled, by will be made up of the hard material of such as diamond
Score wheel is pressed against substrate with predetermined pressing force and moves the score wheel along predetermined cuts line to form scribe line, and wherein substrate will
It is cut along above-mentioned predetermined cuts line；And sliver processing, by along the scribe line press substrate come cutting substrate so as to
Obtaining unit substrate.
Scribing equipment in correlation technique has a problem that：Because the pressing force of score wheel is optionally set, institute
To produce fragment or chip from substrate during scribing processing and sliver processing procedure.
The content of the invention
The present invention is intended to provide a kind of scribing equipment and dicing method, characteristic change or the spy of substrate even in score wheel
In the case of levying change, it also can uniformly and consistently keep the quality of the cutting surfaces of substrate.
A kind of scribing equipment is provided according to the exemplary embodiment of the present invention, it includes：Score wheel, it is configured to
Scribe line is formed on substrate；Driver element, it moves score wheel perpendicular to substrate, and score wheel is pressed against on substrate by adjustment
Pressing force；Image acquisition units, it gathers the cutting surfaces for the substrate being cut on substrate after formation scribe line
Image；And control unit, it measures the shape of cutting surfaces based on the image gathered by image acquisition units, and ought cut
When the shape for cutting surface exceeds term of reference, pressing force is changed by controlling driver element.
At least one factor in the measurable following factor of control unit：The penetration depth that score wheel is penetrated in substrate；By
The thickness of the median crack (median crack, intermediate cracking) of score wheel formation；First ratio, it penetrates depth for score wheel
The ratio of degree and the thickness of substrate；Second ratio, its for median crack thickness and substrate thickness ratio；3rd ratio,
It is the penetration depth of score wheel and the ratio of the thickness of the thickness sum of median crack and substrate；By breaking that sliver processing is formed
Split the thickness in portion；And the 4th ratio, its for fracture thickness and substrate thickness ratio.Moreover, above-mentioned ought measure
Factor at least one exceed predetermined reference scope when, can by control driver element change be applied to score wheel by
Pressure.
The area that control unit can exceed at least one factor in the factor measured in place of the predetermined reference scope
Domain is set as target area；Also, control unit can change to be applied to by controlling driver element within target area draws
The pressing force of piece wheel.
Scribing equipment may also include unevenness measuring unit, and it measures the unevenness of the cutting surfaces of substrate.
Scribing equipment may also include mobile device, the cutting surfaces for the substrate that its basis is measured by unevenness measuring unit
Unevenness, by image acquisition units toward and away from substrate cutting surfaces move.
Unevenness measuring unit may include：Unevenness measurement head, its be installed into can along substrate cutting surfaces
It is mobile；Unevenness measures component, and it is installed in unevenness measurement head so that the cutting surfaces with substrate are contacted, and energy
Moved according to the unevenness of the cutting surfaces of substrate toward and away from the cutting surfaces of substrate；And position-measurement device, its
Measure the position that unevenness measures component.
The end contacted with the cutting surfaces of substrate of component is measured in unevenness, friction reduction component can be set.
A kind of dicing method is provided in accordance with an alternative illustrative embodiment of the present invention, and it includes step：(a) by using
Score wheel is pressed against on the first substrate by one pressing force, forms scribe line on the first substrate；(b) cutting has in step (a)
The first substrate of the scribe line of middle formation；(c) image of collection cutting surfaces of the first substrate of cutting in step (b)；(d)
Based on the image of the cutting surfaces of collection in step (c), the shape of the cutting surfaces of first substrate is measured；(e) determine in step
Suddenly whether the shape of the cutting surfaces of measurement exceeds predetermined reference scope in (d)；And (f) is when cutting for being measured in step (d)
When the shape for cutting surface exceeds predetermined reference scope, score wheel is pressed against by using second pressing force different from the first pressing force
On second substrate, scribe line is formed on second substrate.
Step (d) may include to measure at least one factor in following factor：The penetration depth that score wheel is penetrated in substrate；
The thickness of the median crack formed by score wheel；First ratio, its for score wheel penetration depth and substrate thickness ratio；
Second ratio, its for median crack thickness and substrate thickness ratio；3rd ratio, its for score wheel penetration depth with
The ratio of the thickness sum of median crack and the thickness of substrate；The thickness of the fracture formed by sliver processing；And the 4th ratio
Value, its for fracture thickness and substrate thickness ratio；Step (e) may include to determine in step (d) in the factor of measurement
At least one factor whether exceed predetermined reference scope；And step (f) may include, when in the factor of measurement in step (d)
At least one factor when exceeding predetermined reference scope, by using second pressing force different from the first pressing force by scribing wheel load
Lean against on second substrate, scribe line is formed on second substrate.
Step (f) may include：(g) at least one factor in the factor measured in step (d) is exceeded into predetermined reference
Region in place of scope is set as target area；And (h) by the step (g) within the target area of setting with first
Score wheel is pressed against on second substrate by the second different pressing force of pressing force, and scribe line is formed on second substrate.
According to the scribing equipment and dicing method of the exemplary embodiment of the present invention, the property even in score wheel is changed
Or in the case that the property of substrate is changed, also scribing to change can be applied to by the shape of the cutting surfaces according to substrate
The pressing force of wheel, and keep the uniform and constant quality of cutting surfaces.
That is, can be by based on following factor according to the scribing equipment and dicing method of the exemplary embodiment of the present invention
In at least one factor change and be applied to the pressing force of score wheel, to keep the uniform and constant quality of cutting surfaces, this
A little factors include：The depth of the sunk part formed by score wheel, i.e. the penetration depth of score wheel；In score wheel is formed
The thickness of position crackle；First ratio, its for score wheel penetration depth and substrate thickness ratio；Second ratio, during it is
The ratio of the thickness of position crackle and the thickness of substrate；3rd ratio, it is the penetration depth of score wheel and the thickness of median crack
The ratio of the thickness of sum and substrate；The thickness of the fracture formed in sliver processing procedure；And the 4th ratio, it is disconnected
Split the ratio of the thickness in portion and the thickness of substrate.
In addition, according to the scribing equipment of the exemplary embodiment of the present invention, by using with the uneven of simple structure
Spend measuring unit to measure the size of the unevenness of the cutting surfaces of substrate, as a result, can easily and effectively determine
The quality of the cutting surfaces of substrate.
In addition, according to the scribing equipment of the exemplary embodiment of the present invention, can be measured not according to by position-measurement device
The uniformity measures the displacement of component, image acquisition units is moved toward and away from the cutting surfaces of substrate, as a result, image
Interval between collecting unit and the cutting surfaces of substrate can consistently be kept.Therefore, Jiao of the camera of image acquisition units
Point can be always situated on the cutting surfaces of substrate, as a result, the shape of the cutting surfaces of substrate can be measured more accurately.
Brief description of the drawings
Fig. 1 is the view of the scribing head for the scribing equipment for schematically showing the exemplary embodiment according to the present invention.
Fig. 2 is to schematically show to form scribing on substrate using the scribing equipment of the exemplary embodiment according to the present invention
The view of the state of the image of the state of line and the cutting surfaces of collection substrate.
Fig. 3 and Fig. 4 are to show to be formed on substrate in the scribing equipment using the exemplary embodiment according to the present invention to draw
During the processing procedure of piece line, the view of the state of median crack is formed in a substrate.
Fig. 5 is the view for the cutting surfaces for schematically showing substrate.
Fig. 6 is the flow chart for the dicing method for showing the exemplary embodiment according to the present invention.
Fig. 7 is that the unevenness measuring unit for showing scribing equipment in accordance with an alternative illustrative embodiment of the present invention is regarded
Figure.
Embodiment
Hereinafter, the scribing equipment and dicing method of the exemplary embodiment according to the present invention are described with reference to the accompanying drawings.
As depicted in figs. 1 and 2, included according to the scribing equipment of the exemplary embodiment of the present invention：Scribing first 100；Control
Unit 200, it controls the operation of scribing first 100；And image acquisition units 300, it gathers substrate S cutting surfaces S1 figure
Picture.
Scribing first 100 may be mounted to that in framework (not shown) can be moved relative to substrate S.Scribing first 100
It may include：Score wheel 10, it is configured on substrate S form scribe line L；Retainer 20 is taken turns, it keeps score wheel 10；Driving
Unit 30, vertically its support wheel retainer 20 and movable pulley retainer 20；And guiding piece 40, its guide wheel retainer 20
It is vertically movable.
Driver element 30 may be structured to linear movement mechanism, for example：By air pressure or the actuator of hydraulic operation, pass through electricity
The linear electric machine or ball screw framework of magnetic interaction operation.For example, as shown in fig. 1, driver element 30 may be structured to
Voice coil motor.In this case, driver element 30 may include：Coil 31, its driving wheel retainer 20；Encoder 32, it connects
It is connected to coil 31；And linear scale 33, the displacement of its measurement wheel retainer 20.
In this configuration, wheel retainer 20 moves down preset distance by the operation of driver element 30, as a result, drawing
Piece wheel 10 starts and substrate S contact.In this case, wheel retainer 20 can be adjusted by adjusting the moment of torsion of driver element 30
The distance moved down, therefore can adjust the pressing force used in score wheel 10 is pressed against on substrate S.Wheel retainer 20 is to moving down
Dynamic distance can be detected by linear scale 33, and control unit 200 is based on the wheel retainer 20 detected by linear scale 33
Move down distance to control encoder 32, so as to adjust the moment of torsion of driver element 30.
Meanwhile, as described above, cutting substrate S processing includes：Scribing is handled, by the way that score wheel 10 is pressed against into substrate S
Score wheel 10 above and along predetermined cuts line (substrate S will be cut along the predetermined cuts line) is moved, is formed on substrate S
Scribe line L；And sliver processing, by pressing substrate S along scribe line L come cutting substrate S, so as to obtaining unit substrate.
As shown in Fig. 3 to Fig. 5, during scribing is handled, base is being compressed against simultaneously when score wheel 10 is mobile on substrate S
When being rotated in the state of on plate S, as score wheel 10 is compressed against on substrate S, the formation sunk part P in substrate S, and
The vertical crackle for being referred to as median crack M is also formed in substrate S.In some cases, median crack M can only be formed without shape
Be in depression part P.
Moreover, in sliver processing procedure, formed in substrate S in the state of predetermined median crack M, shear stress along
Scribe line L is applied to substrate S, so as to as crackle is grown by median crack, form fracture C, its result in substrate S
It is that substrate S is cut by moment.
Simultaneously as the continuous friction between score wheel 10 and substrate S, score wheel 10 worn and torn repeatedly (mechanical wear and
Thermal wear).The degree of wear of score wheel 10 is impacted to sunk part P and median crack M size.Moreover, substrate S property
Matter (such as substrate S thickness and fragility) also influences sunk part P and median crack M size.In addition, the property of score wheel 10
(such as hardness of score wheel 10 and the angle of cutting edge) also influences sunk part P and median crack M size.
Sunk part P and median crack M size and substrate S cutting surfaces S1 quality be (such as cutting surfaces S1's
Surface roughness or smoothness) it is closely related.Especially, the quality based on median crack M, the surface for forming cutting surfaces S1 is thick
Rugosity, and substrate S Impact Fracture Toughness can change.If sunk part P and median crack S size are irregular
, then substrate S cutting surfaces S1 poor quality, as a result, there is the problem of producing fragment, chip etc..
Therefore, in the case that the property of substrate S or score wheel 10 changes, it is still necessary to by forming uniform chi
Very little sunk part P and median crack M, come the cutting surfaces S1 that keeps substrate S constant-quality.
Therefore, being provided with image acquisition units 300 according to the scribing equipment of the exemplary embodiment of the present invention, it gathers substrate
S cutting surfaces S1 image.
For example, image acquisition units 300 may include camera 70.Camera 70 may be structured to gather substrate S cutting surfaces
S1 overall image.Such as another example, substrate S can be moved in the state of camera 70 is by fixation, and camera 70 can edge
The direction of substrate S movements gathers cutting surfaces S1 image.Such as another embodiment, image acquisition units 300 can be provided with movement
Device (not shown), cutting surfaces S1 of the mobile device along substrate S moves camera 70, and camera 70 can be constructed
For the image for the cutting surfaces S1 that substrate S is gathered when being moved along substrate S cutting surfaces S1.
Moreover, the image based on the cutting surfaces S1 collected by image acquisition units 300, the measurement of control unit 200 is cut
Surface S1 shape is cut, it is later determined that the cutting surfaces S1 measured shape is whether within term of reference, i.e. it is determined that cutting
Whether surface S1 quality is subjected to.In the case of control unit 200 determines that cutting surfaces S1 quality is acceptable, control is single
Member 200 controls driver element 30 so that driver element 30 uses and is pressed against score wheel 10 with previous press power identical pressing force
On substrate S.In addition, in the case where control unit 200 determines that cutting surfaces S1 quality can not be received, control unit 200
Control driver element 30 so that score wheel 10 is pressed against substrate by driver element 30 using the pressing force different from previous press power
On S.
Especially, the image of the cutting surfaces S1 based on the substrate S collected by image acquisition units 300, control unit
200 can obtain the information on following factor, be used as the whether receivable reference of quality for determining cutting surfaces S1.
(1) the sunk part P formed by score wheel 10 depth D, i.e. the penetration depth that score wheel 10 is penetrated in substrate S
D；
(2) the median crack M formed by score wheel 10 thickness T；
(3) first ratio D/A, it is the ratio of the penetration depth D and substrate S thickness A of score wheel 10；
(4) second ratio T/A, it is the ratio of median crack M thickness T and substrate S thickness A；
(5) the 3rd ratios (D+T)/A, it is the penetration depth D of score wheel 10 and median crack M thickness T sums and base
The ratio of plate S thickness A；
(6) the fracture C formed by sliver processing thickness B；
(7) the 4th ratio B/A, it is the ratio of fracture C thickness B and substrate S thickness A.
First, the penetration depth D of score wheel 10 and score wheel 10 property (such as hardness of the cutting edge of score wheel 10,
The degree of wear and angle) it is relevant and relevant with score wheel 10 is pressed against into pressing force used on substrate S.Therefore, phase is being applied
Under conditions of pressing force, in the case where the property of score wheel 10 changes due to abrasion of score wheel 10 etc., score wheel 10
Penetration depth D can be changed.Therefore, whether control unit 200 can be by determining the penetration depth D of score wheel 10 beyond predetermined
Term of reference, to determine whether cutting surfaces S1 quality is subjected to.Here, can substrate S cutting surfaces S1 quality not
Under acceptable and sunk part P, median crack M or fracture C state in irregular shape, from the score wheel 10 to measure
Penetration depth D based on experiment in obtain term of reference.That is, by analyzing changing according to the penetration depth D of score wheel 10
Sunk part P, the median crack M or fracture C shape for becoming and changing, and by sunk part P, median crack M or
Fracture C obtains the penetration depth D of score wheel 10 when having defect, can set term of reference.
Moreover, property (such as hardness of the cutting edge of score wheel 10, the mills of median crack M thickness T also with score wheel 10
Damage degree and angle) it is relevant and relevant with score wheel 10 is pressed against into pressing force used on substrate S.Therefore, applying identical
Under conditions of pressing force, when the property of score wheel 10 changes due to abrasion of score wheel 10 etc., median crack M thickness T
It can change.Therefore, by determining whether median crack M thickness T exceeds predetermined reference scope, control unit 200, which can determine that, cuts
Whether the quality for cutting surface S1 is subjected to.Here, can substrate S cutting surfaces S1 quality is unacceptable and sunk part P,
Under median crack M or fracture C state in irregular shape, from the reality based on the median crack M measured thickness T
Test middle acquisition term of reference.That is, by analyzing the sunk part P changed according to median crack M thickness T change, middle position
Crackle M or fracture C shape, and by obtaining middle position when sunk part P, median crack M or fracture C have defect
Crackle M thickness T, can set term of reference.
Moreover, the first ratio D/A is used for the penetration depth D for measuring the score wheel 10 based on substrate S thickness A.
Compared with the cutting surfaces S1 situation of quality is determined based on the quantitative value of the penetration depth D of score wheel 10, based on first
In the case of quality of the ratio D/A to determine cutting surfaces S1, it more accurately can determine and predict that sunk part P, middle position split
Line M or fracture C shape.Equally, whether control unit 200 can exceed predetermined reference scope by the first ratio D/A of determination,
To determine whether cutting surfaces S1 quality is subjected to.Here, can substrate S cutting surfaces S1 quality it is unacceptable and recessed
Under the state in irregular shape for falling into part P, median crack M or fracture C, from based on the first ratio D/A measured
Experiment in obtain term of reference.That is, split by analyzing the sunk part P changed according to the first ratio D/A change, middle position
Line M or fracture C shape, and compared by obtaining first when sunk part P, median crack M or fracture C have defect
Value D/A, can set term of reference.
Moreover, the second ratio T/A is used for the thickness T for measuring the median crack M based on substrate S thickness A.With base
Determine that the situation of cutting surfaces S1 quality is compared in median crack M thickness T quantitative value, true based on the second ratio T/A
In the case of the quality for determining cutting surfaces S1, sunk part P, median crack M or fracture C more accurately can be determined and predicted
Shape.Equally, control unit 200 can be by determining whether the second ratio T/A exceeds predetermined reference scope, to determine cutting table
Whether face S1 quality is subjected to.Here, can substrate S cutting surfaces S1 quality is unacceptable and sunk part P, middle position
Under crackle M or fracture C state in irregular shape, obtained from the experiment based on the second ratio T/A measured
Term of reference.That is, by analyzing the sunk part P, median crack M or the fracture C that change according to the second ratio T/A change
Shape, and by obtaining the second ratio T/A when sunk part P, median crack M or fracture C have defect, can set
Term of reference.
Moreover, the 3rd ratio (D+T)/A be used to measuring score wheel 10 based on substrate S thickness A penetrate depth
Spend D and median crack M thickness T.With the quantitative value of the penetration depth D based on score wheel 10 and median crack M thickness T number
Value determines that the situation of cutting surfaces S1 quality is compared, and is determining cutting surfaces S1 matter based on the 3rd ratio (D+T)/A
In the case of amount, sunk part P, median crack M or fracture C shape more accurately can be determined and predicted.Equally, control
Unit 200 can be by determining whether the 3rd ratio (D+T)/A exceeds predetermined reference scope, to determine that cutting surfaces S1 quality is
It is no acceptable.Here, can substrate S cutting surfaces S1 quality is unacceptable and sunk part P, median crack M or fracture
Under portion C state in irregular shape, obtained from the experiment based on the 3rd ratio (the D+T)/A measured and refer to model
Enclose.That is, by analyzing the sunk part P, median crack M or the fracture C that change according to the 3rd ratio (D+T)/A change
Shape, and by obtaining the 3rd ratio (D+T)/A when sunk part P, median crack M or fracture C have defect, can set
Determine term of reference.
Moreover, sunk part P and median crack M that fracture C is formed by score wheel 10 are formed, and fracture C thickness B
Property (such as hardness of the cutting edge of score wheel 10, the degree of wear and angle) with score wheel 10, score wheel 10 is pressed against
Pressing force used and substrate S property (such as substrate S fragility) are relevant on substrate S.Therefore, identical pressing is being applied
Under conditions of power, in the case where the property of score wheel 10 changes due to abrasion of score wheel 10 etc., fracture C thickness B
It can be changed.Therefore, control unit 200 can be by determining whether fracture C thickness B exceeds predetermined reference scope, to determine
Whether cutting surfaces S1 quality is subjected to.Here, can substrate S cutting surfaces S1 quality is unacceptable and sunk part
Under P, median crack M or fracture C state in irregular shape, from the reality based on the fracture C measured thickness B
Test middle acquisition term of reference.That is, split by analyzing the sunk part P changed according to fracture C thickness B change, middle position
Line M or fracture C shape, and by obtaining fracture when sunk part P, median crack M or fracture C have defect
C thickness B, can set term of reference.
Moreover, the 4th ratio B/A is used for the thickness B for measuring the fracture C based on substrate S thickness A.With based on
Fracture C thickness B quantitative value determines that the situation of cutting surfaces S1 quality is compared, and is determining to cut based on the 4th ratio B/A
In the case of the quality for cutting surface S1, sunk part P, median crack M or fracture C shape more accurately can be determined and predicted
Shape.Equally, control unit 200 can be by determining whether the 4th ratio B/A exceeds predetermined reference scope, to determine cutting surfaces S1
Quality whether be subjected to.Here, can substrate S cutting surfaces S1 quality is unacceptable and sunk part P, median crack
Under M or fracture C state in irregular shape, reference is obtained from the experiment based on the 4th ratio B/A measured
Scope.That is, by analyzing the sunk part P, median crack M or the fracture C that are changed according to the 4th ratio B/A change
Shape, and by obtaining the 4th ratio B/A when sunk part P, median crack M or fracture C have defect, ginseng can be set
Examine scope.
Meanwhile, in the case that at least one factor in following factor exceeds its term of reference, control unit 200 is controlled
Score wheel 10 is pressed against pressing force used on substrate S by driver element 30 so as to change：(1) depression formed by score wheel 10
Part P depth D, i.e. the penetration depth D of score wheel 10；(2) the median crack M formed by score wheel 10 thickness T；(3)
One ratio D/A, it is the ratio of the penetration depth D and substrate S thickness A of score wheel 10；(4) second ratio T/A, it is middle position
The ratio of crackle M thickness T and substrate S thickness A；(5) the 3rd ratios (D+T)/A, its for score wheel 10 penetration depth D and
The ratio of median crack M thickness T sums and substrate S thickness A；(6) the fracture C's formed during sliver processing procedure
Thickness B；And (7) the 4th ratio B/A, its for fracture C thickness B and substrate S thickness A ratio.
Therefore, even if the property (such as degree of wear of score wheel 10) of score wheel 10 and substrate S property change, also can
Enough pressing forces that score wheel 10 is applied to by changing, consistently to keep：(1) penetration depth D of score wheel 10, (2) are by drawing
The median crack M thickness T of the formation of piece wheel 10, (3) first ratio D/A, (4) second ratio T/A, (5) the 3rd ratios (D+T)/
A, (6) fracture C thickness B and (7) the 4th ratio B/A.Therefore, even if the property of score wheel 10 or substrate S property change
Become, the pressing force of score wheel 10 can be also applied to by changing, to keep cutting surfaces S1 uniform, constant quality.
In addition, being referred at least one factor only within substrate S whole cutting surfaces S1 regional area beyond it
In the case of scope, control unit 200 sets the region beyond its predetermined reference scope of at least one factor measured
It is set to target area, and the pressing force for controlling driver element 30 to be applied to score wheel 10 changes within target area.
Therefore, referred at least one factor only within substrate S whole cutting surfaces S1 regional area beyond it
In the case of scope, the pressing force for being applied to score wheel 10 changes within regional area, so as to remain：(1) score wheel
Thickness T, (3) first ratio D/A, (4) second ratios for the median crack M that 10 penetration depth D, (2) are formed by score wheel 10
T/A, (5) the 3rd ratios (D+T)/A, (6) fracture C thickness B and (7) the 4th ratio B/A.Therefore, even if score wheel 10
Property or substrate S property change, also the pressing force of score wheel 10 can be applied to by changing, to keep cutting surfaces S1
Uniform, constant quality.
Hereinafter, the scribble method according to exemplary embodiment of the invention will be described.
Hereinafter, the substrate S for receiving the measurement of the above-mentioned factor related to cutting surfaces S1 is defined as first substrate；
And, using based on the factor with first substrate associated measurement come change or maintain pressing force, be formed on scribe line L's
Substrate S is defined as second substrate.Herein, first substrate can be the test substrate for being not used in actual production, and second substrate can
To be the substrate for actual production.Such as another example, first substrate can be after the completion of scribing processing and sliver processing from
If the substrate selected in stem substrate.First substrate can regularly be selected, is randomly chosen, or be held on the substrate of predetermined quantity
Selected after row scribing processing and sliver processing.Second substrate can be, using based on first substrate associated measurement because
Usually change or the pressing force maintained, the substrate for being formed on scribe line.Such as another example, first substrate can be from substrate
Cut off and remove the inactive area of a substrate without being used for actual product, and second substrate can be from substrate cutting simultaneously
It is used for the effective coverage of a substrate of actual product after removal first substrate.
In addition, the pressing force for being applied to the score wheel 10 of first substrate is defined as the first pressing force；And based on the
The factor of one substrate associated measurement is defined as the second pressing force come the pressing force of the score wheel 10 changed.
According to the scribble method of the exemplary embodiment of the present invention, score wheel 10 is pressed against the by using the first pressing force
On one substrate, scribe line L (S110) is formed on the first substrate.
Further, the first substrate (S120) with scribe line L is cut by sliver processing.
Further, the cutting surfaces S1 of first substrate image is gathered by using image acquisition units 300, is cut
Cut the image (S130) on surface.
Further, the image of the cutting surfaces S1 based on first substrate, measures at least one factor of following factor, this
A little factors include：(1) the thickness T for the median crack M that the penetration depth D of score wheel 10, (2) are formed by score wheel 10, (3) first
Ratio D/A, (4) second ratio T/A, (5) the 3rd ratios (D+T)/A, (6) fracture C thickness B and (7) the 4th ratio B/
A(S140)。
Further, it is determined that whether at least one factor in the factor measured exceeds predetermined term of reference
(S150).In the case that at least one factor in the factor measured exceeds predetermined reference scope, pressed by using with first
The second different pressing force of pressure presses score wheel 10, and scribe line (S160) is formed on second substrate.
If for example, the median crack M formed in first substrate thickness T is less than term of reference, can be drawn by increase
Score wheel 10, i.e., be pressed against on second substrate by the pressing force of piece wheel 10 by using the second pressing force higher than the first pressing force,
To increase the size for the median crack M that will be formed in second substrate.Further, if the middle position formed in first substrate is split
Line M thickness T is higher than term of reference, then can be by reducing the pressing force of score wheel 10, i.e., by using less than the first pressing force
Score wheel 10 is pressed against on second substrate by the second pressing force, to reduce the chi for the median crack M that will be formed in second substrate
It is very little.
As described above, according to the scribble method of the exemplary embodiment of the present invention, even if the property of score wheel 10 (is such as drawn
The degree of wear of piece wheel 10) and substrate S property change, also can be applied to the pressing force of score wheel 10 by changing, come permanent
It is fixed to keep：(1) the thickness T for the median crack M that the penetration depth D of score wheel 10, (2) are formed by score wheel 10, (3) first ratios
D/A, (4) second ratio T/A, (5) the 3rd ratios (D+T)/A, (6) fracture C thickness B and (7) the 4th ratio B/A.Cause
This, even if the property of score wheel 10 or substrate S property change, can also be applied to the pressing force of score wheel 10 by changing,
To keep cutting surfaces S1 uniform, constant quality.
Meanwhile, at least one factor in the factor measured only substrate S whole cutting surfaces S1 partial zones
In the case of exceeding its predetermined reference scope within domain, at least one factor measured exceeds the part of its predetermined reference scope
Region is set to target area, and can be incited somebody to action by with second pressing force different from the first pressing force within target area
Score wheel 10 is pressed against on second substrate, and scribe line is formed on second substrate.
Therefore, at least one factor in Multiple factors only substrate S whole cutting surfaces S1 regional area it
It is interior exceed its term of reference in the case of, be applied to the pressing force of score wheel 10 and change within the regional area, so that constant
Ground is kept：(1) the thickness T for the median crack M that the penetration depth D of score wheel 10, (2) are formed by score wheel 10, (3) first ratios
D/A, (4) second ratio T/A, (5) the 3rd ratios (D+T)/A, (6) fracture C thickness B and (7) the 4th ratio B/A.Cause
This, even if the property of score wheel 10 or substrate S property change, can also be applied to the pressing force of score wheel 10 by changing,
To keep cutting surfaces S1 uniform, constant quality.
Hereinafter, reference picture 7 is described to the scoring equipment of the exemplary embodiment according to the present invention.
Unevenness measuring unit 400 may include according to the scoring equipment of the exemplary embodiment of the present invention, its measurement base
Plate S cutting surfaces S1 unevenness.
Unevenness measuring unit 400 may include：Unevenness measurement head 410, it is installed to be can be along substrate S's
Cutting surfaces S1 is moved；Unevenness measure component 430, its be installed in unevenness measurement head 410 so as to according to
Substrate S cutting surfaces S1 unevenness is moved toward and away from substrate S cutting surfaces S1；And position-measurement device
450, it measures the position that unevenness measures component 430.
Linear movement mechanism (such as by air pressure or the actuator of hydraulic operation, by electromagnetic interaction operate it is linear
Motor or ball screw framework) it may be connected to unevenness measurement head 410.In cutting for unevenness measurement head 410 and substrate S
Cut under surface S1 states spaced apart by a predetermined distance, unevenness measurement head 410 can by linear movement mechanism cutting along substrate S
Cut surface S1 movements.
Unevenness measurement head 410 by it is mobile when, unevenness measurement component 430 can be according to substrate S cutting surfaces
S1 unevenness is moved toward and away from substrate S cutting surfaces S1.The elastic component of such as spring can be surveyed with unevenness
Amount component 430 is connected so that unevenness measurement component 430 can be moved according to substrate S cutting surfaces S1 unevenness.
In this case, such as ball or roller friction reduction component 431 may be disposed at unevenness measurement component 430 with substrate S
Cutting surfaces S1 contact end.
Position-measurement device 450 is connected to control unit 200 so that the unevenness measured by position-measurement device 450
Measure the position of component 430 and the information of displacement may pass to control unit 200.
Position-measurement device 450 may include：Reference member 451, it is arranged on unevenness measurement component 430；And
Detection means 452, it is installed into face of reference member 451.Position-measurement device 450 is by using reference member 451 and inspection
Interacting come the position for measuring unevenness measurement component 430 and displacement between survey component 452.
For example, reference member 451 may be structured to the scale with predetermined graduated, detection means 452 may be structured to use
In the camera of the image of collection scale.In this case, can the figure based on the reference member 451 gathered by detection means 452
As measuring the relative position between reference member 451 and detection means 452, and it can be surveyed based on the relative position measured
Measure the position that unevenness measures component 430.
For another example, reference member 451 may include reflecting surface, and its position reflected according to light changes the angle of reflection of light,
And detection means 452 may include：Photoemission pickoff, it launches light towards reflecting surface；And optical receiving sensor, it connects
Receive the light reflected from reflecting surface.In this case, measured by measuring the angle of reflection of the light reflected from reference member 451
Relative position between reference member 451 and detection means 452, can measure unevenness survey based on the relative position measured
Measure the position of component 430.
According to construction as described above, the end for measuring component 430 in unevenness is contacted with substrate S cutting surfaces S1
In the state of, when cutting surfaces S1 of the unevenness measurement head 410 along substrate S is moved, unevenness measurement component 430
Moved according to substrate S cutting surfaces S1 unevenness toward and away from substrate S cutting surfaces S1.
Because unevenness measurement component 430 is moved, the relative position between reference member 451 and detection means 452
It is changed, and unevenness can be measured based on the change of the relative position between reference member 451 and detection means 452
Measure the displacement of component 430.The displacement of unevenness measurement component 430 means what is formed on substrate S cutting surfaces S1
The size (magnitude) of unevenness.Therefore, it can measure the displacement of component 430 to measure unevenness based on unevenness
Size, and substrate S cutting surfaces S1 quality can be determined based on the size of the unevenness measured.If for example,
The size of unevenness is more than predetermined reference value, then control unit 200 can determine that substrate S cutting surfaces S1 quality can not connect
By substrate S has defect.
As described above, the unevenness measuring unit 400 with simple structure can be used to measure substrate S cutting surfaces
The size of S1 unevenness, as a result, substrate S cutting surfaces S1 quality can be determined easily and effectively.
Meanwhile, image acquisition units 300 may be disposed in unevenness measurement head 410, and image acquisition units 300 can
It is connected with mobile device 350, the mobile device makes image acquisition units 300 be moved toward and away from substrate S cutting surfaces S1.
Mobile device 350 can be configured to linear movement mechanism, for example：By air pressure or the actuator of hydraulic operation, pass through electromagnetism phase interaction
With the linear electric machine or ball screw framework of operation.
Mobile device 350 can be connected with control unit 200, and control unit 200 is based on being measured by position-measurement device 450
The displacement of unevenness measurement component 430 control mobile device 350 so that mobile device 350 may correspond to unevenness
The displacement of measurement component 430 carrys out mobile image acquisition unit 300.
Therefore, the displacement of component 430, IMAQ list are measured according to the unevenness measured by position-measurement device 450
Member 300 can be moved toward and away from substrate S cutting surfaces S1, as a result, image acquisition units 300 and substrate S cutting
Interval between the S1 of surface can be constant all the time.That is, image acquisition units 300 can be measured according to by unevenness measuring unit 400
To substrate S cutting surfaces S1 unevenness move, as a result, image acquisition units 300 and substrate S cutting
Interval between the S1 of surface can consistently be kept.Therefore, the focus of the camera 70 of image acquisition units 300 can be always situated in base
On plate S cutting surfaces S1, therefore, substrate S cutting surfaces S1 shape can be more accurately measured.
Multiple exemplary embodiments of the present invention are described for illustrative purpose herein.It will be appreciated, however, that this hair
Bright scope is not limited to specific exemplary embodiment, and in the premise for the scope for not departing from appended claims restriction
Under, various modifications can be carried out.
Claims (11)
1. a kind of dicing method, it includes step：
(a) score wheel is pressed against on the first substrate by using the first pressing force, scribe line is formed on the first substrate；
(b) first substrate of the cutting with the scribe line formed in step (a)；
(c) image of collection cutting surfaces of the first substrate of cutting in step (b)；
(d) image of the cutting surfaces of collection in step (c) is based on, the shape of the cutting surfaces of the first substrate is measured
Shape；
(e) determine whether the shape of the cutting surfaces of measurement in step (d) exceeds predetermined reference scope；And
(f) when the shape of the cutting surfaces of measurement in the step (d) exceeds the predetermined reference scope, by using with institute
State the second different pressing force of the first pressing force the score wheel is pressed against on the second substrate, on the second substrate
Form scribe line.
2. dicing method according to claim 1, wherein, step (d) include measuring in following factor at least one because
Element：The penetration depth that the score wheel is penetrated in the substrate；The thickness of the median crack formed by the score wheel；First ratio
Value, it is the penetration depth and the ratio of the thickness of the substrate of the score wheel；Second ratio, it is the median crack
The ratio of thickness and the thickness of the substrate；3rd ratio, it is the penetration depth and the median crack of the score wheel
Thickness sum and the ratio of the thickness of the substrate；The thickness of the fracture formed by sliver processing；And the 4th ratio, it is
The ratio of the thickness of the fracture and the thickness of the substrate,
Step (e) includes determining whether at least one factor in step (d) in the factor of measurement exceeds predetermined reference model
Enclose, and
Step (f) includes, when at least one factor in the factor of measurement in step (d) exceeds the predetermined reference scope
When, the score wheel is pressed against the second substrate by using second pressing force different from first pressing force
On, form scribe line on the second substrate.
3. dicing method according to claim 2, wherein, step (f) includes：
(g) area for exceeding at least one factor in the factor of measurement in step (d) in place of the predetermined reference scope
Domain is set as target area；And
(h) by the step (g) within the target area of setting with different from first pressing force described second
The score wheel is pressed against on the second substrate by pressing force, and scribe line is formed on the second substrate.
4. a kind of scribing equipment, it includes：
Score wheel, it is configured on substrate form scribe line；
Driver element, it moves the score wheel perpendicular to the substrate, and adjusts described for the score wheel to be pressed against
Pressing force on substrate；
Image acquisition units, it gathers the cutting surfaces for the substrate being cut after formation scribe line on the substrate
Image；And
Control unit, it measures the shape of the cutting surfaces based on the image gathered by described image collecting unit, and
When the shape of the cutting surfaces exceeds term of reference, the pressing force is changed by controlling the driver element.
5. scribing equipment according to claim 4, wherein, described control unit measure in following factor at least one because
Element：The penetration depth that the score wheel is penetrated in the substrate；The thickness of the median crack formed by the score wheel；First ratio
Value, it is the penetration depth and the ratio of the thickness of the substrate of the score wheel；Second ratio, it is the median crack
The ratio of thickness and the thickness of the substrate；3rd ratio, it is the penetration depth and the median crack of the score wheel
Thickness sum and the ratio of the thickness of the substrate；The thickness of the fracture formed by sliver processing；And the 4th ratio, it is
The ratio of the thickness of the fracture and the thickness of the substrate；And when at least one factor in the above-mentioned factor of measurement exceeds
During predetermined reference scope, change the pressing force for being applied to the score wheel by controlling described control unit.
6. scribing equipment according to claim 5, wherein, described control unit by least one in the factor of measurement because
Region of the element in place of the predetermined reference scope is set as target area；Also, described control unit passes through in the mesh
The driver element, which is controlled, within mark region is applied to the pressing force of the score wheel to change.
7. scribing equipment according to claim 4, in addition to：
Unevenness measuring unit, it measures the unevenness of the cutting surfaces of the substrate.
8. scribing equipment according to claim 7, in addition to：
Mobile device, the unevenness of the cutting surfaces for the substrate that its basis is measured by the unevenness measuring unit,
The cutting surfaces of described image collecting unit toward and away from the substrate are moved.
9. the scribing equipment according to claim 7 or 8, wherein, the unevenness measuring unit includes：
Unevenness measurement head, it, which is installed into, to be moved along the cutting surfaces of the substrate；
Unevenness measures component, and it is installed in the unevenness measurement head so that the cutting surfaces with the substrate connect
Touch, and can be moved according to the unevenness of the cutting surfaces of the substrate toward and away from the cutting surfaces of the substrate；And
Position-measurement device, it measures the position that the unevenness measures component.
10. scribing equipment according to claim 9, wherein, the unevenness measure component with the substrate
The end of cutting surfaces contact, component is reduced provided with friction.
11. scribing equipment according to claim 9, wherein, the position-measurement device includes：Reference member, it is set
On unevenness measurement component；And detection means, it is installed into face of the reference member, institute's position measurement
Device measures the unevenness measurement structure by using the interaction between the reference member and the detection means
The position of part.
Applications Claiming Priority (4)
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| KR20160032059 | 2016-03-17 | ||
| KR10-2016-0032059 | 2016-03-17 | ||
| KR1020160093658A KR102605919B1 (en) | 2016-03-17 | 2016-07-22 | Scribing apparatus and scribing method |
| KR10-2016-0093658 | 2016-07-22 |
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|---|---|---|---|---|
| CN109553286A (en) * | 2017-09-27 | 2019-04-02 | 塔工程有限公司 | Scribing equipment |
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