CN107204293A - 半导体装置的制造方法及半导体装置 - Google Patents
半导体装置的制造方法及半导体装置 Download PDFInfo
- Publication number
- CN107204293A CN107204293A CN201710129003.9A CN201710129003A CN107204293A CN 107204293 A CN107204293 A CN 107204293A CN 201710129003 A CN201710129003 A CN 201710129003A CN 107204293 A CN107204293 A CN 107204293A
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- CN
- China
- Prior art keywords
- face
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- housing section
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 230000001629 suppression Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-053149 | 2016-03-16 | ||
JP2016053149A JP2017168692A (ja) | 2016-03-16 | 2016-03-16 | 半導体装置の製造方法および半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107204293A true CN107204293A (zh) | 2017-09-26 |
CN107204293B CN107204293B (zh) | 2019-08-09 |
Family
ID=59904879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710129003.9A Active CN107204293B (zh) | 2016-03-16 | 2017-03-06 | 半导体装置的制造方法及半导体装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2017168692A (zh) |
CN (1) | CN107204293B (zh) |
TW (1) | TWI615916B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108046208A (zh) * | 2017-12-15 | 2018-05-18 | 芜湖致通汽车电子有限公司 | 一种用于传感器模块约束圈封装设备及其使用方法 |
CN108100987A (zh) * | 2017-12-15 | 2018-06-01 | 芜湖致通汽车电子有限公司 | 一种适用于约束圈封装设备用于电路板放置的放置托盘 |
CN111527674A (zh) * | 2017-12-28 | 2020-08-11 | 日本电产株式会社 | 马达单元 |
CN114123068A (zh) * | 2021-11-12 | 2022-03-01 | 深圳市海曼科技股份有限公司 | 一种接线盒中用于电路板的固定结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005005168A (ja) * | 2003-06-13 | 2005-01-06 | Furukawa Electric Co Ltd:The | 回路基板内蔵型コネクタ |
CN101562290A (zh) * | 2008-04-17 | 2009-10-21 | 富士康(昆山)电脑接插件有限公司 | 移动存储装置 |
CN102300429A (zh) * | 2010-06-28 | 2011-12-28 | 松下电工株式会社 | 电子设备存放壳 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3389977B2 (ja) * | 1995-09-01 | 2003-03-24 | 住友電装株式会社 | 板材収容箱 |
US6307752B1 (en) * | 1999-12-30 | 2001-10-23 | Hubbell Incorporated | Housing for electrical device with relief for shearable ribs |
US7306159B1 (en) * | 2003-06-07 | 2007-12-11 | Rochelo Donald R | Protective case for six different sized memory cards |
TWM380616U (en) * | 2009-06-12 | 2010-05-11 | A & H Information Co Ltd | Electrical connector |
TWM375954U (en) * | 2009-08-06 | 2010-03-11 | Rayco Electronics Ltd | Flash memory |
-
2016
- 2016-03-16 JP JP2016053149A patent/JP2017168692A/ja not_active Ceased
-
2017
- 2017-02-09 TW TW106104200A patent/TWI615916B/zh active
- 2017-03-06 CN CN201710129003.9A patent/CN107204293B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005005168A (ja) * | 2003-06-13 | 2005-01-06 | Furukawa Electric Co Ltd:The | 回路基板内蔵型コネクタ |
JP4028439B2 (ja) * | 2003-06-13 | 2007-12-26 | 古河電気工業株式会社 | 回路基板内蔵型コネクタ |
CN101562290A (zh) * | 2008-04-17 | 2009-10-21 | 富士康(昆山)电脑接插件有限公司 | 移动存储装置 |
CN102300429A (zh) * | 2010-06-28 | 2011-12-28 | 松下电工株式会社 | 电子设备存放壳 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108046208A (zh) * | 2017-12-15 | 2018-05-18 | 芜湖致通汽车电子有限公司 | 一种用于传感器模块约束圈封装设备及其使用方法 |
CN108100987A (zh) * | 2017-12-15 | 2018-06-01 | 芜湖致通汽车电子有限公司 | 一种适用于约束圈封装设备用于电路板放置的放置托盘 |
CN108046208B (zh) * | 2017-12-15 | 2021-07-20 | 芜湖致通汽车电子有限公司 | 一种用于传感器模块约束圈封装设备及其使用方法 |
CN111527674A (zh) * | 2017-12-28 | 2020-08-11 | 日本电产株式会社 | 马达单元 |
CN114123068A (zh) * | 2021-11-12 | 2022-03-01 | 深圳市海曼科技股份有限公司 | 一种接线盒中用于电路板的固定结构 |
CN114123068B (zh) * | 2021-11-12 | 2023-08-22 | 深圳市海曼科技股份有限公司 | 一种接线盒中用于电路板的固定结构 |
Also Published As
Publication number | Publication date |
---|---|
TWI615916B (zh) | 2018-02-21 |
JP2017168692A (ja) | 2017-09-21 |
TW201735229A (zh) | 2017-10-01 |
CN107204293B (zh) | 2019-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220129 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
|
TR01 | Transfer of patent right |