CN107195588A - A kind of component for being used to fix transistor - Google Patents
A kind of component for being used to fix transistor Download PDFInfo
- Publication number
- CN107195588A CN107195588A CN201710544450.0A CN201710544450A CN107195588A CN 107195588 A CN107195588 A CN 107195588A CN 201710544450 A CN201710544450 A CN 201710544450A CN 107195588 A CN107195588 A CN 107195588A
- Authority
- CN
- China
- Prior art keywords
- transistor
- pressing plate
- insulating lid
- transistor pressing
- under
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003023 plastic Polymers 0.000 claims abstract description 13
- 239000004033 plastic Substances 0.000 claims abstract description 13
- 238000009413 insulation Methods 0.000 claims abstract description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000007306 turnover Effects 0.000 claims 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 14
- 238000000465 moulding Methods 0.000 description 10
- 239000007769 metal material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000004079 fireproofing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000306 recurrent effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Abstract
It is used to fix insulating lid, equal pressure pad piece under insulating lid on the component of transistor, including transistor pressing plate, transistor pressing plate, transistor pressing plate the invention discloses a kind of.Transistor pressing plate is metalwork, and section is U-shaped, and increases flanging to improve flexural strength.Insulating lid provides enough electric clearance and creep age distance under insulating lid and transistor pressing plate on transistor pressing plate, component is obtained reliable electric insulation.The pressure that equal pressure pad piece between transistor pressing plate and transistor bears transistor plastic housing is less than safe permissible value.Insulating lid constitutes a component by gum on insulating lid under 2 transistors, transistor pressing plate, equal pressure pad piece, transistor pressing plate, transistor pressing plate.This component passes through gum " flexible splicing " in printed circuit back.The modular construction design of the present invention, avoid the cumbersome screw installing/dismounting of single transistor, avoid aging because of plastic part, the clamping force Loose invalidation risk that creep triggers, it is applicable to the transistor-packaging structure of no screw hole, avoid the risk that transistor plastic housing is destroyed because bearing excessive pressure, printed circuit board perforated area is reduced, and firm connection when transistor is installed can be ensured.
Description
Technical field
The invention belongs to power electronic equipment field, a kind of component for being used to fix transistor is specifically related to.
Background technology
Needed if as design, it is desirable to when transistor must be positioned at the PCB back sides, the fixed structure of existing transistor,
2 transistors, or " multiple moulding+sheet metals " form are fixed using a moulding.In the presence of following defect：
(1) it can be generated heat when transistor is used, transistor plastic housing surface temperature is up to 100 degree.When transistor does not work,
Under low temperature use environment, transistor plastic housing surface temperature again can be as little as subzero 30 degree.Contacted with transistor plastic housing surface
Moulding is chronically at the recurrent state that colds and heat succeed each other, and easily occurs aging, creep, and the fastening pressure of transistor easily occurs moulding
Gradually relax, then fastening failure.
(2) yield strength and fracture strength of plastics are far below metal, when moulding being fixed on radiator using screw,
Sufficiently large moment of torsion can not be used.
(3) because technological reason is, it is necessary in advance link together transistor and moulding.It is in injection by the way of
2 cylindrical positioning pins are stretched out on part, or 2 cylindrical plastic parts are fabricated separately, the screw hole of transistor is inserted, is matched somebody with somebody using interference
Close the frictional force connection produced.But for the transistor-packaging structure without screw hole, the method is not applied to.
(4) because technological reason, it is necessary to link together moulding with PCB in advance.It is in moulding by the way of
Upper design snap fit (or card convex) structure, while designing the special-shaped screw via of correspondence snap fit on PCB.Special-shaped screw via, increase
PCB processing charges, reduces PCB usable floor area.
The content of the invention
To overcome deficiency of the prior art, the present invention is intended to provide a kind of component for being used to fix transistor, no longer makes
With moulding, PCB does not require that transistor has screw hole, and can ensure firm when transistor is installed without processing profiled hole
Connection.
To realize above-mentioned technical purpose and the technique effect, the present invention is achieved through the following technical solutions：
Insulating lid, transistor pressing plate on a kind of component for being used to fix transistor, including transistor pressing plate, transistor pressing plate
Lower insulating lid, 2 equal pressure pad pieces.
Transistor pressing plate is metal material.
2 equal pressure pad pieces are metal material.
Insulating lid is electric insulation film and fire proofing material under insulating lid and transistor pressing plate on transistor pressing plate.
When insulating lid is buckled together under insulating lid and transistor pressing plate on transistor pressing plate, internal space can just hold
Receive transistor pressing plate.
When insulating lid is buckled together under insulating lid and transistor pressing plate on transistor pressing plate, turned under respective sided seamless gap
Side close structure laminating, it is ensured that transistor pressing plate insulate to the reliable electric of PCB and transistor.
2 equal pressure pad pieces are arranged under transistor pressing plate between insulating lid and transistor pressing plate, it is to avoid metal material
Transistor pressing plate elliptic cylinder and transistor vinyl cover plane formation linear contact lay.Equal pressure pad piece is slab construction, is moulded with transistor
Expect lid plane formation face contact, the pressure for bearing transistor vinyl cover plane is reduced to below permission safety value.
Compared with prior art, advantage of the invention is that：
1) install time saving and energy saving；
2) moulding is not used；
3) PCB is without processing profiled hole.
4) do not require that transistor has screw hole.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
The embodiment of the present invention is shown in detail by following examples and its accompanying drawing.
Brief description of the drawings
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the application, this hair
Bright schematic description and description is used to explain the present invention, does not constitute inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is component explosive view.
Fig. 2 is the transistor pressing plate front schematic view of circular detents.
Fig. 3 is the transistor pressing plate reverse side schematic diagram of circular detents.
Fig. 4 is the transistor pressing plate front schematic view of square depression.
Fig. 5 is the transistor pressing plate reverse side schematic diagram of square depression.
Fig. 6 is insulating lid schematic diagram on square depression transistor pressing plate.
Fig. 7 is insulating lid schematic diagram on circular detents transistor pressing plate.
Fig. 8 is insulating lid schematic diagram under square depression transistor pressing plate.
Fig. 9 is insulating lid schematic diagram under circular detents transistor pressing plate.
Figure 10 is 2 transistor schematics of placement on fixture.
Figure 11 is that insulating lid is bonded at schematic diagram on transistor under transistor pressing plate.
Figure 12 is that 2 equal pressure pad pieces are bonded at insulating lid schematic diagram under transistor pressing plate.
Figure 13 is that transistor pressing plate is placed on schematic diagram on 2 equal pressure pad pieces.
Figure 14 is to be bonded gum thin slice schematic diagram under transistor pressing plate on the flange of insulating lid.
Figure 15 is that insulating lid bonds together schematic diagram under insulating lid and transistor pressing plate on transistor pressing plate.
Figure 16 is the top planes region bonding gum thin slice schematic diagram of insulating lid on transistor pressing plate.
Figure 17 is the schematic rear view that subassembly is bonded in PCB.
Figure 18 is that profit is screwed transistor pressing plate schematic diagram.
Figure 19 is insulating lid schematic diagram on the transistor pressing plate with raised cylindrical structure.
Embodiment
Below with reference to the accompanying drawings and assembling process is combined, to describe the present invention in detail.
Such as Figure 10,2 transistors, transistor plastics hd top face bonding gum thin slice are placed on fixture.
Insulating lid is bonded on transistor under such as Figure 11, transistor pressing plate, and relative position is ensured by fixture.
Such as Figure 12,2 equal pressure pad pieces are bonded under transistor pressing plate on insulating lid, and relative position is ensured by fixture.
Such as Figure 13, transistor pressing plate is placed on 2 equal pressure pad pieces.
Under such as Figure 14, transistor pressing plate on the flange of insulating lid, gum thin slice is bonded.
Insulating lid bonds together with insulating lid under transistor pressing plate on such as Figure 15, transistor pressing plate.
The top planes region of insulating lid, is bonded gum thin slice on such as Figure 16, transistor pressing plate.
Such as Figure 17, the subassembly of foregoing each step formation is bonded in the PCB back side.
Such as Figure 18, profit is screwed transistor pressing plate, 2 transistors is fixed so as to realize.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (6)
1. a kind of component for being used to fix transistor, it is characterised in that including being insulated on transistor pressing plate (1) and transistor pressing plate
Cover (2), insulating lid (3), 2 equal pressure pad pieces (4) under transistor pressing plate.
The flanging side face (5) of insulating lid (3) and (6) are viscous by gum under insulating lid (2) and transistor pressing plate on transistor pressing plate
It is connected together, internal cavity is put into transistor pressing plate (1) and 2 equal pressure pad pieces (4) when installing, and equal pressure pad piece (4) is in crystal
Under pipe pressing plate (1) and transistor pressing plate between insulating lid (3).
Insulating lid (2) is bonded together using gum and PCB (7) on transistor pressing plate.
Insulating lid (3) is bonded together using gum and transistor plastic housing top surface under transistor pressing plate.
Transistor pressing plate (1) is fixed on radiator (8) using screw.
2. transistor pressing plate (1) according to claim 1, it is characterised in that the transistor pressing plate (1) is metalwork, 2
End position section is U-shaped.For the gum mounting surface (9) of insulating lid (2) in increase intensity and support transistor pressing plate, the increase of 2 sides
Flanging feature (10).To accommodate screw head and increasing force part intensity, sinking cave structure (11) is devised, while can
To increase the electric clearance and creep age distance of screw and PCB.Sinking cave structure can be cylindrical cross-section or rectangle
Section (12).The contact area of transistor pressing plate (1) and transistor, to ensure reliable compression, there is provided profile is cylindroid table
The protruding features (13) in face.
3. insulating lid (2) on transistor pressing plate according to claim 1, it is characterised in that to coordinate transistor pressing plate (1)
Profile design sinking cave structure (14), for provide the insulating Design of transistor pressing plate (1) do not have within 4 weeks it is apertured under turn over
Side structure (5).Sinking cave structure can be square-section or cylindrical cross-section (15).Another scheme, for increase
Creep age distance between screw head and PCB, sinking cave structure can be changed to raised cylindrical structure (18).
4. insulating lid (3) under transistor pressing plate according to claim 1, it is characterised in that to coordinate transistor pressing plate (1)
Profile design sinking cave structure (16), for provide the insulating Design of transistor pressing plate (1) do not have within 4 weeks it is apertured under turn over
Side structure (6).Sinking cave structure can be square-section or cylindrical cross-section (17).
5. insulating lid (3) under insulating lid (2) and transistor pressing plate on transistor pressing plate according to claim 1, during installation
Transistor pressing plate (1) is clipped in the middle, lower turnup structure (5) and (6) are brought into close contact, be transistor pressing plate (1) between PCB,
Transistor pressing plate (1) provides reliable insulation between transistor.
6. equal pressure pad piece (4) according to claim 1, it is to avoid transistor pressing plate (1) and transistor plastic housing formation line
Contact, equal pressure pad piece (4) contacts with transistor plastic housing formation face, and plastic housing, which bears pressure, can be reduced to transistor supplier
Recommend below safety value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710544450.0A CN107195588A (en) | 2017-07-05 | 2017-07-05 | A kind of component for being used to fix transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710544450.0A CN107195588A (en) | 2017-07-05 | 2017-07-05 | A kind of component for being used to fix transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107195588A true CN107195588A (en) | 2017-09-22 |
Family
ID=59881878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710544450.0A Pending CN107195588A (en) | 2017-07-05 | 2017-07-05 | A kind of component for being used to fix transistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107195588A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2718832Y (en) * | 2003-10-07 | 2005-08-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN101128366A (en) * | 2005-02-23 | 2008-02-20 | 格拉德产品公司 | Container |
| CN101815372A (en) * | 2010-05-06 | 2010-08-25 | 宁波丽辰电器有限公司 | Heating element of electric heater and fixing method thereof |
| CN202373575U (en) * | 2011-12-16 | 2012-08-08 | 四川长虹欣锐科技有限公司 | Radiating device for power semiconductor device |
| CN202487561U (en) * | 2011-12-07 | 2012-10-10 | 深圳市中兴昆腾有限公司 | Reverse type transistor installing and fixing mechanism |
| CN205179530U (en) * | 2015-11-03 | 2016-04-20 | 深圳古瑞瓦特新能源股份有限公司 | Locking fixed plate subassembly that takes off of transistor |
| CN105590909A (en) * | 2016-03-21 | 2016-05-18 | 厦门科华恒盛股份有限公司 | Transistor cover and installation and fixture structure and method of transistor cover |
| CN207441684U (en) * | 2017-07-05 | 2018-06-01 | 赵西岭 | A kind of component for being used to fix transistor |
-
2017
- 2017-07-05 CN CN201710544450.0A patent/CN107195588A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2718832Y (en) * | 2003-10-07 | 2005-08-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN101128366A (en) * | 2005-02-23 | 2008-02-20 | 格拉德产品公司 | Container |
| CN101815372A (en) * | 2010-05-06 | 2010-08-25 | 宁波丽辰电器有限公司 | Heating element of electric heater and fixing method thereof |
| CN202487561U (en) * | 2011-12-07 | 2012-10-10 | 深圳市中兴昆腾有限公司 | Reverse type transistor installing and fixing mechanism |
| CN202373575U (en) * | 2011-12-16 | 2012-08-08 | 四川长虹欣锐科技有限公司 | Radiating device for power semiconductor device |
| CN205179530U (en) * | 2015-11-03 | 2016-04-20 | 深圳古瑞瓦特新能源股份有限公司 | Locking fixed plate subassembly that takes off of transistor |
| CN105590909A (en) * | 2016-03-21 | 2016-05-18 | 厦门科华恒盛股份有限公司 | Transistor cover and installation and fixture structure and method of transistor cover |
| CN207441684U (en) * | 2017-07-05 | 2018-06-01 | 赵西岭 | A kind of component for being used to fix transistor |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |