CN107178930B - A kind of active downhole gauges heat management system and method - Google Patents
A kind of active downhole gauges heat management system and method Download PDFInfo
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- CN107178930B CN107178930B CN201710375593.3A CN201710375593A CN107178930B CN 107178930 B CN107178930 B CN 107178930B CN 201710375593 A CN201710375593 A CN 201710375593A CN 107178930 B CN107178930 B CN 107178930B
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- incubation cavity
- chip cartridges
- brasses
- fin
- pressure pocket
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
Abstract
The present invention discloses a kind of active downhole gauges heat management system and method, including pressure pocket, incubation cavity, fin, chip cartridges, semiconductor chilling plate, thermally conductive copper billet and semi arch brasses；Incubation cavity has close to the position at top equipped with a notch；Chip cartridges are installed in the notch；Semiconductor chilling plate, thermally conductive copper billet and semi arch brasses are sequentially arranged with inside chip cartridges；The cold end of semiconductor chilling plate is close to chip cartridges；Thermally conductive copper billet is close in semiconductor chilling plate hot end, and thermally conductive copper billet is close to semi arch brasses；Semi arch brasses is located at the outer surface of incubation cavity；Fin is set in incubation cavity；Fin top is fixed on outside chip cartridges；The both ends of incubation cavity are equipped with end cover；Incubation cavity is installed on inside pressure pocket, and semi arch brasses is in contact with the inner surface of stainless steel pressure pocket.The present invention is protected room temperature electronic device by built-in cooling device, is realized lasting cooling and heat management to the temperature field of well logging gauge internal, is realized High-Temperature Well Logging using room temperature chip.
Description
Technical field
The present invention relates to underground high temperature field of instrumentation technology in oil exploration and exploitation, in particular to a kind of active undergrounds
Instrument heat management system and method.
Background technique
In oil drilling industry, often the parameters such as geologic structure and oil reservoir resource are measured and analyzed.Usually
It needs special electronic instrument to extend into wellbore and carries out the measurement of related physical quantity, to the stratum of each depth in underground
Parameter is recorded in detail.Here it is so-called well loggings.In oil drilling and recovery process, it is often necessary to largely be surveyed
Well activity.In addition, also often using well logging in the activity such as underground water, underground heat and mineral prospecting.
Usual well head is deeper, and down-hole ambient temperature is higher, and pressure is also bigger.Generally, downhole temperature is with well depth
Increase and increased with the gradient of about 25 DEG C/km, individual area temperature gradients can also be larger.The high temperature and high pressure environment of underground is to survey
Well instrument is huge test.Especially high temperature problem, it is easy to cause the distorted signals of instrument and the mistake of electronic component
Cause thermal damage.For down-hole high pressure problem, additional pressure-bearing steel cylinder can be generally used, well logging instrument is wrapped in has wall thickness enough
Pressure pocket in.However, being directed to underground high temperature problem, there is presently no especially mature durable products.Industry has at present
Electronic component is wrapped up using phase-change material, delays the raising of electronic component temperature using the principle of decalescence.Work as phase
The phase transition process of change material just loses the ability for continuing that high temperature protection is carried out to electronic component after being properly completed, so this
Scheme is only able to achieve the transient protection of a few hours, still can not achieve and continues underground high-temperature operation for a long time.Also someone in the world
It is dedicated to researching and developing electronic material resistant to high temperature, develops electronic component resistant to high temperature.Problem is that the price of high temperature chip is generally special
Not expensive, the service life is general also shorter.Importantly, high temperature chip generally falls into protection product in the world, outlet by
Stringent control, it is difficult to buy.
Summary of the invention
The purpose of the present invention is to provide a kind of active downhole gauges heat management system and methods, to solve above-mentioned technology
Problem.The present invention is protected the room temperature electronic device being easy to get in the market by built-in cooling device, to well logging instrument
Lasting cooling and heat management are realized in internal temperature field, and the High-Temperature Well Logging function of realizing high temperature chip is gone using room temperature chip.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of active downhole gauges heat management system, including pressure pocket, incubation cavity, fin, chip cartridges, semiconductor refrigerating
Piece, thermally conductive copper billet and semi arch brasses；Incubation cavity has close to the position at top equipped with a notch；Chip cartridges are installed on described lack
In mouthful；Semiconductor chilling plate, thermally conductive copper billet and semi arch brasses are sequentially arranged with inside chip cartridges；The cold end of semiconductor chilling plate is tight
Paste chip cartridges；Thermally conductive copper billet is close in semiconductor chilling plate hot end, and thermally conductive copper billet is close to semi arch brasses；Semi arch brasses, which is located at, to be protected
The outer surface of warm chamber；Fin is set in incubation cavity；Fin top is fixed on outside chip cartridges；The both ends of incubation cavity are equipped with sealing
End cap；Incubation cavity is installed on inside pressure pocket, and semi arch brasses is in contact with the inner surface of stainless steel pressure pocket.
Further, fin is copper ripple perforated fin；The length direction of fin and the well logging being installed in incubation cavity
The direction of instrument PCB main board is consistent.
Further, a step structure is arranged at the bottom of pressure pocket, and the bottom end seal end cap of incubation cavity and incubation cavity is existed
Axial restraint.
Further, the bottom end seal end cap of incubation cavity is made of organic high temperature-resistant heat-insulating material, and center, which is provided with, to be used for
The through-hole that conducting wire is drawn；A circular groove is provided on the inside of bottom end seal end cap, fin bottom portion is equipped with a sharp mouth, and sharp mouth is inserted into circular groove
In.
Further, the end sealing end cap of incubation cavity includes the roundlet circumferential surface and and pressure pocket with heat preservation cavity wall cooperation
Inner wall cooperation great circle circumferential surface；The end sealing end cap of warm chamber is made of organic high temperature-resistant heat-insulating material；When thermal expansion, top
The swell increment of end cover is greater than the thermal expansion amount that pressure pocket is made in metal, guarantees pressure-bearing cavity wall circumferential seal.
Further, the notch is sector notch；The head of chip cartridges is sector structure, the sector notch with incubation cavity
It matches, to prevent chip cartridges to be slipped to inside incubation cavity；The side of chip cartridges has two rows of barbs；Barb is inserted into incubation cavity
In two rows of slits of sector notch, chip cartridges are fixed in sector notch.
Further, the top of fin is square bathtub construction；Square groove shape damascene chip cartridges outside and pass through line
Cylinder and fixing bolt are to fix；The inner wall contact position of fixing bolt and spool and chip cartridges high temperature resistant is insulated glue sealing.
Further, thermally conductive copper billet be sector, the big tail of head is small, top be it is arc-shaped, with semi arch brasses be brazed one
It rises；The bottom of thermally conductive copper billet is plane, is in close contact with the hot end of cooling piece, between be added to heat-conducting silicone grease.
Further, chip cartridges top is pressed with a fan-shaped sealing frame；Fan-shaped sealing frame by chip cartridges and thermally conductive copper billet with
And semi arch brasses separates；Fan-shaped sealing frame is made of high-temperature resistant thermal insulating material；Each edges and corners of its inner ring are provided with chamfering；Its
Four lateral positions are designed as retraction structure, add at each retraction structure and apply sealant resistant to high temperature.
Further, pressure pocket is stainless steel cylinder-like structure, and top is provided with internal screw thread, and bottom end is provided with external screw thread.
Further, pressure pocket is the round stainless steel sleeve of one section of 0.6m long, can bear underground high temperature and pressure.It is first
Tail both ends are provided with screw thread, so that several sections of pressure pockets are connected the longer pressure-bearing cylinder of composition.Every section of pressure pocket bottom has one small
The smaller annular stepped structure of section internal diameter, can play axial restraint to internal incubation cavity.
A kind of active downhole gauges thermal management algorithm is generated using peltier effect of the semiconductor chilling plate when being powered
Cold and hot separation, hot end, to chamber outer fluid heat loss through convection, generate consecutive low temperature in underground by the entire outer surface of metal pressure pocket
Cold chamber environment, and the electronic component of downhole gauges is placed in the cold chamber environment and carries out temperature protection.
Incubation cavity is made of heat-insulating material, is nested in the inside of pressure pocket.Incubation cavity thermal resistance is larger, can effectively hinder
Only heat is from underground hot environment quickly to transmitting inside incubation cavity, and outer diameter is slightly less than the internal diameter of pressure pocket, to be inserted into
Pressure pocket bottom.Incubation cavity is provided with a sector notch close to the one end at top, for placing copper sector chip cartridges.Chip cartridges
Sector structure is consistent with the size of incubation cavity sector notch, and the small structure of this big tail of head can prevent chip cartridges from sliding into heat preservation
It is intracavitary.Meanwhile the side of chip cartridges has two rows of barbs.Barb is inserted into two rows of gaps of incubation cavity sector notch, can be with
It is further that chip cartridges are effectively fixed.
Cooling piece is placed in copper chip cartridges.Cooling piece shape is cuboid flake structure.Cooling piece generally uses twin-stage
Design, such as the first order contain 127 pairs of semiconductor particles, and 63 pairs of semiconductor particles are contained in the second level.According to semiconductor cooler
Peltier principle, semiconductor chilling plate generates cold and hot separation under the action of outer making alive, one end heat absorption and other end heat release,
Form cold and hot end.Cold end is lower than locating environment temperature, and forms a cold chamber in inside by the insulation effect of incubation cavity
Environment.Hot end is higher than environment temperature, can use the temperature difference and effectively radiates to environment.
The bottom of copper chip cartridges and the cold end of cooling piece are in close contact, also added with heat-conducting silicone grease to enhance between two planes
Heat-conducting effect.When cooling piece is powered, cold end heat absorption can be taken away the intracorporal heat of incubation cavity, so that incubation cavity
Inside forms a cold chamber.In order to guarantee the uniformity of low temperature environment in heat-insulated cavity, the bottom of chip cartridges is externally embedded to a porous wave
Corrugated fin.The two sides of chip cartridges are provided with 4 apertures, and cylinder fixing bolt and cylinder spool can be inserted to lock the top of fin.
The bottom of fin is triangle point mouth structure, is inserted into the aperture of the bottom cover of incubation cavity, to fix the another of fin
End.
After applied voltage, the temperature in cooling piece hot end is transferred heat to higher than environment temperature by hot end heat transfer unit outer
Boundary's environment (such as drilling fluid outside pressure pocket).Hot end heat transfer unit welded by copper sector heat-conducting block and semi arch brasses and
At.One end of fan-shaped heat-conducting block is circular arc, this end is brazed together with semi arch brasses.The other side of brasses and stainless steel pressure-bearing
The inner wall of chamber contacts, and increases the heat dissipation area in cooling piece hot end.The other end of fan-shaped heat-conducting block is plane, the heat with cooling piece
End is in close contact, and two interplanars are added with heat-conducting silicone grease to enhance heat-conducting effect.The advantages of this design, is that entire stainless steel is held
The outer surface of pressure chamber all becomes the heat-delivery surface in cooling piece hot end, substantially increases the heat dissipation area (outer surface of pressure pocket
It is wrapped in drilling fluid, heat convection of the fluid on this surface can effectively take away heat).It has been previously mentioned, stratum is got over
Deep, temperature is higher.The axial thermal conductivity of stainless steel pressure pocket can also be effectively by the heat transfer of high temperature deep layer to shallow compared with low temperature
Layer.
It should be pointed out that another ingenious place of this design is when device is in room temperature, incubation cavity outer diameter is smaller
In pressure pocket internal diameter, there is a small gap between the two in this way, facilitate installation.Notice the thermal expansion coefficient ratio of incubation cavity
The high an order of magnitude of stainless steel pressure pocket, by calculating, after pressure pocket enters underground hot environment, the radial heat of incubation cavity is swollen
The swollen hot-side heat dissipation unit (semi arch brasses, fan-shaped thermally conductive copper billet) by automatic impaction cooling piece, ensure that the heat of cooling piece
It can be effectively conducted to fan-shaped heat-conducting block, then be effectively conducted to semi arch brasses, be then conducted to stainless steel pressure pocket, finally
By the entire outer wall of pressure pocket, effectively heat loss through convection gives drilling fluid (environment) again.
External heat returns to cold chamber in order to prevent, has installed a fan-shaped sealing frame additional around fan-shaped heat-conducting block.Fan
The material of shape sealing frame is consistent with incubation cavity, has very high thermal conduction resistance, can be effectively prevented between heat-conducting block and chip cartridges
Heat transfer.Meanwhile the seam crossing of all components all adds painting high-temperature heat insulation glue right to avoid any type of heat transfer and heat
Stream.
Compared with the existing technology, the invention has the following advantages:
1, the present invention is protected the room temperature electronic device being easy to get in the market by built-in cooling device, to well logging
Lasting cooling and heat management are realized in the temperature field of gauge internal, and the High-Temperature Well Logging function for realizing high temperature chip is removed using room temperature chip
Can, cost can be greatly reduced.It, thus can be in addition, the present apparatus also can protect inherently expensive electronic device resistant to high temperature
Challenge deeper stratum at higher temperature.
2, the present invention can make heat management system structure compact, the direction one in fin direction and well logging instrument PCB main board
It causes, has greatly saved space；Extension cold source of the fin as cooling piece, the distance between PCB main board is closer, can more have
The exchange heat of effect.
3, strong flexibility of the present invention both can be applied to design new well logging instrument, can be used for that existing survey is transformed
Well instrument.
4, the outer surface of entire pressure pocket is used as heat-delivery surface by the present invention, utilizes the convection current between the surface and drilling fluid
It exchanges heat to cool down the hot end of cooling piece, while heat can also to be transmitted to low temperature from high temperature deep layer shallow for the axial thermal conductivity of pressure pocket
Layer, radiating efficiency are higher.
5, install at normal temperature very convenient the invention enables each components, while it is swollen to can use material heat at high temperature
Swollen otherness and play positioning and pressuring action, greatly reduce thermal contact resistance, provide radiating efficiency.In addition, of the invention
It has reserved enough gaps dexterously to prevent excessive thermal stress and has caused device failure.
From Refrigeration Technique, the more mature solutions for refrigeration of technology has at present: sweat cooling circularly cooling, thermoelectricity system
Cold, dense-air refrigeration cycle refrigeration and magnetic refrigeration etc..Sweat cooling circularly cooling and magnetic refrigeration theoretical efficiency with higher, still
Cost height, system complex, so the feasibility under high temperature well is lower.Dense-air refrigeration cycle is freezed in efficiency, volume, is made
It is undesirable in terms of valence and feasibility.Thermoelectric cooling is not necessarily to any refrigeration moving component, though refrigerating efficiency is not most at present
Height but has many advantages, such as small size, low cost, high feasibility etc..Therefore, a kind of active downhole instrument exterior heat of the present invention
Management system is exactly to use semiconductor thermoelectric refrigeration principle, specifically for logger cooling problem and propose, and setting
All using during meter can be with material resistant to high temperature, to realize the well logging protection dress that can be continued working in the high temperature environment
It sets.
Detailed description of the invention
Fig. 1 is that a kind of each components of active downhole gauges heat management system of the present invention assemble perspective view of the explosion；
Fig. 2 is a kind of stereochemical structure sectional view of active downhole gauges heat management system of the present invention；
Fig. 3 (a) is pressure pocket structural schematic diagram of the present invention；
Fig. 3 (b) is pressure pocket bottom step structure schematic diagram of the present invention；
Fig. 4 is present invention sealing bottom cover structure schematic；
Fig. 5 is incubation cavity structural schematic diagram of the present invention；
Fig. 6 is the sealing cooperation schematic diagram of top pressure closure of the present invention and pressure pocket and incubation cavity；
Fig. 7 (a) is copper chip cartridges structural schematic diagram of the present invention；
Fig. 7 (b) is that copper chip cartridges of the present invention and incubation cavity cooperate schematic diagram；
Fig. 8 is the present invention for suppressing the copper sheet structural schematic diagram of chip cartridges；
Fig. 9 (a) is porous ripple fin structure schematic diagram of the present invention；
Fig. 9 (b) is the hollow spool of the present invention and fixing bolt structural schematic diagram；
Fig. 9 (c) is that porous ripple fin of the present invention and chip cartridges cooperate schematic diagram；
Figure 10 is hot-side heat dissipation unit of the present invention (fan-shaped copper billet and semi arch brasses) schematic diagram；
Figure 11 is the fan-shaped sealing frame schematic diagram near hot-side heat dissipation unit of the present invention；
Figure 12 is the cross-sectional view that the fan-shaped sealing frame of the present invention cooperates with chip cartridges and incubation cavity；
Figure 13 (a) is cooling piece of the present invention, chip cartridges and hot-side heat dissipation unit matching cross-sectional view；
Figure 13 (b) is cooling piece of the present invention, chip cartridges and hot-side heat dissipation unit matching Longitudinal cross section schematic；
Figure 14 is hot-side heat dissipation unit of the present invention, fan-shaped sealing frame, chip cartridges, incubation cavity, top cover and bottom cover cooperation
Schematic diagram.
Specific embodiment
The present invention is proposed under the premise of solving practicable processing technology.Below in conjunction with specific attached drawing pair
The present invention is described in further detail.
Shown in referring to Fig.1, a kind of active downhole gauges heat management system of the invention, including a pressure pocket 1, sealing
Bottom cover 2, incubation cavity 3, ripple perforated fin 4, fan-shaped sealing frame 5, chip cartridges 6, semiconductor chilling plate 7, fan-shaped thermally conductive copper billet 8,
Spool 9, top pressure closure 10, semi arch brasses 11 and fixing bolt 12.
Referring to figs. 1 to shown in Fig. 5, incubation cavity 3 has a sector notch 16, copper sector chip cartridges 6 close to the position at top
Have the characteristics that the big tail of head is small, chip cartridges 6 can be just placed in the sector notch of incubation cavity 3 without sliding；In chip cartridges 6
Portion is sequentially loaded into semiconductor chilling plate 7, fan-shaped sealing frame 5, fan-shaped thermally conductive copper billet 8 and semi arch brasses 11.The outside of chip cartridges 6
Copper ripple perforated fin 4 is installed, fin 4 is fixed on outside chip cartridges 6 by 4 top of fin by hollow spool 9 and fixing bolt 12；
Then sealing bottom cover 2 is tucked into the bottom of incubation cavity 3, while the triangled tip mouth of 4 bottom of fin is inserted into the circle of sealing bottom cover 2
The position of fin is fixed in shape slot.Incubation cavity 3 and bottom cover 2 are inserted into the bottom of pressure pocket 1 again, until bottom cover 2 is adjacent to
The step structure of 1 bottom of pressure pocket and can not slide still further below；Top pressure closure 10 is finally tucked into the top of incubation cavity 1,
Complete a kind of assembling of active downhole gauges heat management system.Extension cold source of the fin 4 as semiconductor chilling plate 7, with PCB
The distance between mainboard is closer, and ripple increases heat dissipation area, porous to be conducive to free convection, can be more more effectively to PCB
Mainboard is cooled down, and guarantees the uniformity of 3 inner cryogenic environment of incubation cavity.
Referring to Fig. 3 (a), pressure pocket 1 is stainless steel cylinder-like structure, and top is provided with internal screw thread, and bottom end is provided with external screw thread.It can
Several pressure pockets 1 to be threadedly coupled from beginning to end to form the sufficiently large pressure-bearing cylinder of length.
Referring to Fig. 3 (b), a step structure 13 is arranged at the bottom of pressure pocket 1, so that incubation cavity 3 and bottom cover 2 is solid in axial direction
It is fixed, so that they can not slide still further below and leave pressure pocket 1.
Referring to Fig. 4, bottom cover 2 is organic high temperature-resistant heat-insulating material.Center is provided with through-hole 15 to walk conducting wire, and wire guide is direct
It is sealed with high-temperature heat insulation glue.The side of bottom cover 2 is provided with a circular groove 14, facilitates the sharp mouth of insertion fin 4 to fixed fin 4.
Referring to Fig. 5, incubation cavity 3 is organic high temperature-resistant heat-insulating material, is provided with a sector notch 16 by top side；Notch
Two sides open and be respectively provided with rectangular shallow slot slit.
Referring to Fig. 6, the structure of top cover 10 is similar to bottom cover 2, and each edges and corners are provided with chamfering 20.Wherein, 20 side of chamfering
Just top cover 10 is inserted into incubation cavity 3 at room temperature, and the convenient top cover 10 at room temperature of chamfering 18 is inserted into pressure pocket 1, chamfering 19 and heat preservation
Effective sealing both when the chamfering cooperation at 3 top of chamber is to guarantee thermal expansion, the effect of chamfering 17 is convenient at room temperature
Top cover 10 is skidded off from the disassembly of pressure pocket 1.The great circle circumferential surface of top cover 10 and the inner wall of pressure pocket 1 cooperate, due to organic material
Thermal expansion is greater than metal, and top cover energy automatic impaction is to the inner wall of pressure pocket 1 to guarantee when underground hot environment thermally expands
Circumferential seal.The roundlet circumferential surface of top cover 10 and the inner wall of incubation cavity 3 cooperate, and the two material is consistent, and thermal expansion is consistent, are conducive to close
Envelope.Top cover 10 and bottom cover 2 can also be positioned to incubation cavity 3.
Referring to Fig. 7 (a), the head of copper chip cartridges 6 can prevent core it is characterized in that the big tail of head is small for sector structure 24
Film magazine is slipped to inside incubation cavity 3.The side of chip cartridges 6 has two rows of barbs 23.The two sides of chip cartridges 6 are provided with 4 circular holes 22,
Facilitate the hollow spool 9 of insertion and fixing bolt 12.
Referring to Fig. 7 (b), the head of copper chip cartridges 6 is sector structure 24, is matched with the sector notch 16 of incubation cavity 3,
Chip cartridges can be prevented to be slipped to inside incubation cavity 3.The side of chip cartridges 6 has two rows of barbs 23.Barb 23 is inserted into
It, can be further effectively fixed by chip cartridges in two rows of slits of 3 sector notch 16 of incubation cavity.
Referring to Fig. 8, copper chip cartridges 6 can be stamped to form with scale copper shown in the figure, then in the seam crossing on four sides
It is brazed and is shaped.
Referring to Fig. 9 (a), the main body of fin 4 is porous ripple structure, and porous structure 25 and waviness curve 26 are as shown in the figure；
The direction of fin 4 is consistent with the direction of instrument mainboard of required Thermal protection, has not only saved space, but also can carry out to mainboard effective
It is cooling；Porous structure can be convenient the free convection of 3 inner air of incubation cavity, promote heat dissipation；Ripple struction can increase nature
The area of heat loss through convection promotes heat dissipation；At square groove shape, wall surface is provided with 4 circular holes 28 at the top of fin 4, facilitates insertion tubular wire
Cylinder 9 and fixing bolt 12；A triangular structure 27 is arranged at the bottom of fin 4, in the circular groove 14 for facilitating insertion bottom cover 2.
Referring to Fig. 9 (b), spool 9 be it is hollow, fixing bolt 12 is solid.
Referring to Fig. 9 (c), the square groove shape at the top of fin 4 is stuck in the outside of chip cartridges 6, four circular holes 28 and core of fin 4
Four circular holes 22 of film magazine 6 are aligned, and are inserted into two spools 9 and two fixing bolts 12 fix them.Fixing bolt and
The inner wall contact position of spool and chip cartridges 6 is insulated glue sealing with high temperature resistant.
Referring to Fig.1 0, fan-shaped thermally conductive 8 feature of copper billet is that the big tail of head is small, top be it is arc-shaped, with 11 pricker of semi arch brasses
It is welded together, guarantees effective heat-conducting area；The bottom of fan-shaped copper billet 8 is plane, is in close contact with the hot end of cooling piece 7, it
Between be added to heat-conducting silicone grease, guarantee the effective in hot end.
Referring to Fig.1 1, fan-shaped sealing frame 5 is made of high-temperature resistant thermal insulating material, and similar arc-shaped window frame, feature is head
Big tail is small；Each edges and corners of its inner ring are provided with the structure of chamfering 29, convenient that refractory seals glue is applied at chamfering；Its four sides
Retraction structure 30 is designed as at face, it is convenient to apply sealant resistant to high temperature at retraction structure.
Referring to Fig.1 2, fan-shaped sealing frame 5 is embedded into the sector notch 16 of incubation cavity 3, and compresses chip cartridges 6.
Referring to Fig.1 3 (a), copper sector chip cartridges 6 have the characteristics that the big tail of head is small, and chip cartridges 6 can just place heat preservation
Without sliding in the sector notch of chamber 3；Semiconductor chilling plate 7 is packed into the bottom of chip cartridges 6, the bottoms of cold end and chip cartridges 6 it
Between be added heat-conducting silicone grease with guarantee thermal conduction resistance minimum；Fan-shaped sealing frame 5 compresses chip cartridges 6；Fan-shaped thermally conductive copper billet 8 and semi arch
The brazing member that brasses 11 forms is inserted into notch, and the bottom surface of fan-shaped copper billet 8 compresses the hot end of cooling piece, fan-shaped copper billet 8
Lateral surface compressing sealing frame 5；Semi arch brasses 11 is in contact with the inner surface of stainless steel pressure pocket 1；Add painting resistance at gap 31 and 32
High-temperature heat insulation glue；An ingenious place of the invention is that each components are easily installed and dismantle when room temperature；When being
When system is in underground high temperature, since the thermal expansion of incubation cavity 3 is more order of magnitude greater than the thermal expansion of stainless steel pressure pocket 1, In
The bottom of chip cartridges 6 under the action of thermal stress, cooling piece 7, fan-shaped copper billet 8, semi arch brasses 11 and stainless steel pressure pocket 1
Inner wall can be in close contact, while heat-conducting silicone grease can be added between each contact surface, and thermal contact resistance is minimized, and ensure that thermally conductive
Effectively carry out.In addition, using semi arch brasses 11 rather than full circle arc brasses, incubation cavity 3 and pressure pocket 1 can be made in semi arch
A gap is reserved on the opposite of brasses 11, to allow the flexible deformation of incubation cavity 3, in this way can to avoid excessive thermal stress and
Cause the structural failure of chip cartridges 6；Another ingenious place of the invention is that semi arch brasses 11 extends 7 hot end of cooling piece
Heat dissipation area, then stainless steel pressure pocket 1 and semi arch brasses 11 are in close contact, and more hot pressing must be tighter, further expands
Heat convection is effectively radiated finally by the outer wall of entire pressure pocket 1 and gives drilling fluid (environment) by heat dissipation area.Meanwhile it holding
Press the axial thermal conductivity of chamber 1 that the heat of cooling piece 7 can also be conducted to the shallow-layer of low temperature from the deep layer of high temperature.In addition, insulation sealing
Frame 5, which not only acts as, to be mechanically fixed and pressuring action, it is also possible that each cold/hot metal component thoroughly separates, to avoid
Heat caused by any type of conduction and convection current returns.
Semi arch brasses 11 extends the heat dissipation area in 7 hot end of cooling piece, while stainless steel pressure pocket 1 and semi arch brasses
11 are in close contact, and have further expanded heat dissipation area, effectively heat convection radiates finally by the outer wall of entire pressure pocket 1
Give drilling fluid (environment).Meanwhile the axial thermal conductivity of pressure pocket 1 heat of cooling piece 7 can also be conducted to from the deep layer of high temperature it is low
The shallow-layer of temperature, radiating efficiency are higher.
Referring to Fig.1 3 (b), from another side (longitudinal section) illustrate chip cartridges 6, incubation cavity 3, semiconductor chilling plate 7,
Sealing frame 5, thermally conductive copper billet 8, the assembly relation between semi arch brasses 11；Add at gap 33 and 34 and applies high temperature resistant insulation glue to keep away
Exempt from the passback of convection heat caused by gas leakage.
Referring to Fig.1 4, illustrate top cover 10, bottom cover 2, incubation cavity 3, sealing frame 5, the assembly between semi arch brasses 11 are closed
System；Under the hot environment of underground, due to thermal expansion, incubation cavity 3 can be effectively located in pressure pocket 1 by top cover 10 and bottom cover 2；
Some gaps are reserved on 11 opposite of circular arc brasses, to the flexible deformation reserved space of incubation cavity 2, can prevent excessive thermal stress from causing
Damage.
A kind of active downhole gauges thermal management algorithm of the present invention, is based on a kind of active downhole gauges disclosed by the invention
Heat management system generates cold and hot separation using peltier effect of the semiconductor chilling plate when being powered, and hot end passes through metal pressure-bearing
The entire outer surface of chamber generates the cold chamber environment of consecutive low temperature to chamber outer fluid heat loss through convection, in underground, and by the electricity of downhole gauges
Sub- component is placed in the cold chamber environment and carries out temperature protection.
Claims (9)
1. a kind of active downhole gauges heat management system, which is characterized in that including pressure pocket (1), incubation cavity (3), fin
(4), chip cartridges (6), semiconductor chilling plate (7), thermally conductive copper billet (8) and semi arch brasses (11)；
Incubation cavity (3) has close to the position at top equipped with a notch；Chip cartridges (6) are installed in the notch；Chip cartridges (6)
Inside is sequentially arranged with semiconductor chilling plate (7), thermally conductive copper billet (8) and semi arch brasses (11)；The cold end of semiconductor chilling plate (7)
It is close to chip cartridges (6)；Thermally conductive copper billet (8) is close in semiconductor chilling plate (7) hot end, and thermally conductive copper billet (8) is close to semi arch brasses
(11)；Semi arch brasses (11) is located at the outer surface of incubation cavity (3)；
Fin (4) is set in incubation cavity (3)；It is external that chip cartridges (6) are fixed at the top of fin (4)；
The both ends of incubation cavity (3) are equipped with end cover；
Pressure pocket (1) is stainless steel cylinder-like structure, and top is provided with internal screw thread, and bottom end is provided with external screw thread；Incubation cavity (3) is installed on
Pressure pocket (1) is internal, and semi arch brasses (11) is in contact with the inner surface of stainless steel pressure pocket (1)；
The end sealing end cap of incubation cavity includes the inner wall with the roundlet circumferential surface of incubation cavity (3) inner wall cooperation and with pressure pocket (1)
The great circle circumferential surface of cooperation；The end sealing end cap of incubation cavity is made of organic high temperature-resistant heat-insulating material；When thermal expansion, end sealing
The swell increment of end cap is greater than the thermal expansion amount that pressure pocket (1) is made in metal, guarantees pressure pocket (1) inner wall circumferential seal.
2. a kind of active downhole gauges heat management system according to claim 1, which is characterized in that fin (4) is copper
Ripple perforated fin processed；The length direction of fin is consistent with the direction for the well logging instrument PCB main board being installed in incubation cavity (3).
3. a kind of active downhole gauges heat management system according to claim 1, which is characterized in that pressure pocket (1)
One step structure (13) are arranged at bottom, by the bottom end seal end cap of incubation cavity (3) and incubation cavity in axial restraint.
4. a kind of active downhole gauges heat management system according to claim 1, which is characterized in that the bottom end of incubation cavity
End cover is made of organic high temperature-resistant heat-insulating material, and center is provided with the through-hole drawn for conducting wire；Bottom end seal end cap
Inside is provided with a circular groove (14), and fin (4) bottom is equipped with a sharp mouth, and sharp mouth is inserted into circular groove (14).
5. a kind of active downhole gauges heat management system according to claim 1, which is characterized in that the notch is fan
V notch v (16)；The head of chip cartridges (6) is sector structure (24), is matched with the sector notch (16) of incubation cavity (3), to prevent
Only it is internal to be slipped to incubation cavity (3) for chip cartridges；The side of chip cartridges (6) has two rows of barbs (23)；Barb (23) is inserted into guarantor
In two rows of slits of warm chamber (3) sector notch (16), chip cartridges are fixed in sector notch (16).
6. a kind of active downhole gauges heat management system according to claim 1, which is characterized in that the top of fin (4)
Portion is square bathtub construction；Square groove shape damascene chip cartridges (6) outside and be solid by spool (9) and fixing bolt (12)
It is fixed；The inner wall contact position of fixing bolt (12) and spool (9) and chip cartridges (6) is insulated glue sealing with high temperature resistant.
7. a kind of active downhole gauges heat management system according to claim 1, which is characterized in that thermally conductive copper billet (8)
For sector, the big tail of head is small, top be it is arc-shaped, be brazed together with semi arch brasses (11)；The bottom of thermally conductive copper billet (8) is
Plane is in close contact with the hot end of cooling piece (7), between be added to heat-conducting silicone grease.
8. a kind of active downhole gauges heat management system according to claim 1, which is characterized in that in chip cartridges (6)
Portion is pressed with a fan-shaped sealing frame (5)；Fan-shaped sealing frame (5) is by chip cartridges (6) and thermally conductive copper billet (8) and semi arch brasses
(11) it separates；Fan-shaped sealing frame (5) is made of high-temperature resistant thermal insulating material；Each edges and corners of its inner ring are provided with chamfering；Its four
Lateral position is designed as retraction structure, adds at each retraction structure and applies sealant resistant to high temperature.
9. a kind of active downhole gauges thermal management algorithm, which is characterized in that based on described in any item of the claim 1 to 8
A kind of active downhole gauges heat management system generates cold and hot point using peltier effect of the semiconductor chilling plate when being powered
From hot end to chamber outer fluid heat loss through convection, generates the cold chamber of consecutive low temperature in underground by the entire outer surface of metal pressure pocket (1)
Environment, and the electronic component of downhole gauges is placed in the cold chamber environment and carries out temperature protection.
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| CN201710375593.3A CN107178930B (en) | 2017-05-24 | 2017-05-24 | A kind of active downhole gauges heat management system and method |
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| CN107178930B true CN107178930B (en) | 2019-10-29 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788715B (en) * | 2019-01-21 | 2020-12-01 | 中国石油天然气集团有限公司 | Active cooling system of downhole circuit while drilling |
| CN113853100A (en) * | 2021-09-13 | 2021-12-28 | 吉林大学 | Heat management system of deep well long-term continuity detection electronic instrument |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4241592A (en) * | 1977-10-03 | 1980-12-30 | Schlumberger Technology Corporation | Cryostat for borehole sonde employing semiconductor detector |
| CN1641185A (en) * | 2003-11-06 | 2005-07-20 | 施卢默格海外有限公司 | Downhole tools with a stirling cooler system |
| CN201141298Y (en) * | 2007-11-01 | 2008-10-29 | 大庆石油管理局 | Heat preserving structure for logger |
| CN201176872Y (en) * | 2008-04-09 | 2009-01-07 | 任文浩 | Down-hole parameter detector |
| CN101906959A (en) * | 2010-08-04 | 2010-12-08 | 北京天形精钻科技开发有限公司 | One-way cooling device of down-hole drilling tester |
| CN102840706A (en) * | 2012-09-14 | 2012-12-26 | 山东省科学院海洋仪器仪表研究所 | Refrigerating device for adjusting temperature of working environment of well measuring instrument |
| CN102900397A (en) * | 2012-10-24 | 2013-01-30 | 中国石油天然气股份有限公司 | Underground semiconductor refrigerating device |
| CN105492718A (en) * | 2013-06-26 | 2016-04-13 | 贝克休斯公司 | Downhole cooling with electrocaloric effect |
| CN105846598A (en) * | 2016-05-04 | 2016-08-10 | 中国石油大学(华东) | Downhole motor refrigeration cabin |
| CN105952440A (en) * | 2016-05-04 | 2016-09-21 | 中国石油大学(华东) | Forced cooling thermal insulation cabin for underground electronic devices |
| CN205980426U (en) * | 2016-06-08 | 2017-02-22 | 西安威尔罗根能源科技有限公司 | Logging instrument electronic refrigerating device in pit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100024436A1 (en) * | 2008-08-01 | 2010-02-04 | Baker Hughes Incorporated | Downhole tool with thin film thermoelectric cooling |
-
2017
- 2017-05-24 CN CN201710375593.3A patent/CN107178930B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4241592A (en) * | 1977-10-03 | 1980-12-30 | Schlumberger Technology Corporation | Cryostat for borehole sonde employing semiconductor detector |
| CN1641185A (en) * | 2003-11-06 | 2005-07-20 | 施卢默格海外有限公司 | Downhole tools with a stirling cooler system |
| CN201141298Y (en) * | 2007-11-01 | 2008-10-29 | 大庆石油管理局 | Heat preserving structure for logger |
| CN201176872Y (en) * | 2008-04-09 | 2009-01-07 | 任文浩 | Down-hole parameter detector |
| CN101906959A (en) * | 2010-08-04 | 2010-12-08 | 北京天形精钻科技开发有限公司 | One-way cooling device of down-hole drilling tester |
| CN102840706A (en) * | 2012-09-14 | 2012-12-26 | 山东省科学院海洋仪器仪表研究所 | Refrigerating device for adjusting temperature of working environment of well measuring instrument |
| CN102900397A (en) * | 2012-10-24 | 2013-01-30 | 中国石油天然气股份有限公司 | Underground semiconductor refrigerating device |
| CN105492718A (en) * | 2013-06-26 | 2016-04-13 | 贝克休斯公司 | Downhole cooling with electrocaloric effect |
| CN105846598A (en) * | 2016-05-04 | 2016-08-10 | 中国石油大学(华东) | Downhole motor refrigeration cabin |
| CN105952440A (en) * | 2016-05-04 | 2016-09-21 | 中国石油大学(华东) | Forced cooling thermal insulation cabin for underground electronic devices |
| CN205980426U (en) * | 2016-06-08 | 2017-02-22 | 西安威尔罗根能源科技有限公司 | Logging instrument electronic refrigerating device in pit |
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|---|---|
| CN107178930A (en) | 2017-09-19 |
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