CN109788715B - Active cooling system of downhole circuit while drilling - Google Patents
Active cooling system of downhole circuit while drilling Download PDFInfo
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- CN109788715B CN109788715B CN201910052557.2A CN201910052557A CN109788715B CN 109788715 B CN109788715 B CN 109788715B CN 201910052557 A CN201910052557 A CN 201910052557A CN 109788715 B CN109788715 B CN 109788715B
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Abstract
The invention relates to a while-drilling downhole circuit semiconductor active cooling system and a cooling method. Including the casing and set up the multistage semiconductor refrigeration piece in the casing, the semiconductor refrigeration piece includes: the hot end of the first-stage semiconductor refrigerating piece is connected with the shell through a first heat conducting plate, and the cold end of the first-stage semiconductor refrigerating piece is connected with the hot end of the second-stage semiconductor refrigerating piece through a second heat conducting plate; the cold end of the second-stage semiconductor refrigerating piece is connected with the hot end of the third-stage semiconductor refrigerating piece through a third heat conducting plate; and the cold end of the third-stage semiconductor refrigerating piece is connected with the underground circuit through a fourth heat conducting plate. Therefore, the invention has the following technical effects: 1. the temperature of the underground circuit is reduced by adopting a method of actively reducing the temperature by using a semiconductor refrigerating sheet, and the passive 'temperature resistance' of an element is not required; 2. the underground generator provides power, so that the continuous cooling of the underground circuit can be ensured, and the service life and the stability of the underground circuit are improved.
Description
Technical Field
The invention relates to a cooling system and a cooling method, belongs to the technical field of drilling, and particularly relates to a while-drilling downhole circuit semiconductor active cooling system and a cooling method.
Background
The formation of a well bore in an oil and gas well is produced by rotating a drill string to drive a drill bit or a downhole power drill to drive a drill bit to cut an underground formation, the drill bit and downhole tools need to extend several kilometers in the well bore.
During drilling, in order to mitigate the risk factors associated with the drilling operation, it is necessary to obtain as much as possible of various information about the downhole environment, such as: geological parameters, engineering parameters, technological parameters and the like. The drill string bottom near bit attachment is therefore fitted with various measuring tools, such as: measurement while drilling tools (MWD) and logging while drilling tools (LWD). The circuitry on these tools includes various electronic or sensing elements to perform data acquisition, processing, storage, and transmission functions. These downhole circuits themselves generate heat during operation; meanwhile, high temperature in the well during drilling can also affect the drilling process.
Generally, there are two modes of high temperature induced circuitry failure. First, thermal stress on the circuitry reduces its useful life; second, when the temperature reaches a critical value, the circuitry fails and stops operating. Failure due to overheating not only results in increased costs for replacement of the failed circuitry, but also interrupts drilling activities, requires tripping the drill string to replace the circuitry, consumes drilling time and increases drilling costs.
Currently, there are three measures in the petroleum industry to address high temperature resistance of downhole circuits: firstly, screening out components which can be used at high temperature through high-temperature examination; secondly, customizing a high-temperature resistant component; thirdly, invest in huge expenses, independently research and develop the high temperature resistant downhole circuit. The measures are all used for solving the problem from the perspective of passive temperature resistance of the components, and the high-temperature resistance effect is limited; meanwhile, the high-temperature packaging technology of the components is still a bottleneck problem.
Therefore, it is important and highly desirable to provide an efficient and stable active cooling system for downhole circuitry.
Disclosure of Invention
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
The invention mainly aims to solve the technical problems in the prior art and provides a system and a method for actively cooling a circuit semiconductor while drilling in a well. The system and the method adopt a semiconductor refrigeration piece active cooling method to reduce the temperature of the underground circuit, so that the underground circuit is always maintained in a bearable temperature range and keeps normal work.
In order to solve the problems, the scheme of the invention is as follows:
the utility model provides a along with boring circuit semiconductor initiative cooling system, includes the casing and sets up the multistage semiconductor refrigeration piece in the casing, the semiconductor refrigeration piece includes:
the hot end of the first-stage semiconductor refrigerating piece is connected with the shell through a first heat conducting plate, and the cold end of the first-stage semiconductor refrigerating piece is connected with the hot end of the second-stage semiconductor refrigerating piece through a second heat conducting plate;
the cold end of the second-stage semiconductor refrigerating piece is connected with the hot end of the third-stage semiconductor refrigerating piece through a third heat conducting plate;
the cold end of the third-stage semiconductor refrigerating sheet is connected with the underground circuit through a fourth heat conducting plate;
in at least one embodiment of the invention, each stage of semiconductor refrigeration piece is arranged along the axial direction of the drill collar, the plane of the cold end and the hot end of each stage of semiconductor refrigeration piece is parallel to the axial direction of the drill collar, and the heat dissipation plate connected with each stage of semiconductor refrigeration piece is arranged along the axial direction of the drill collar.
In at least one embodiment of the invention, the housing is placed in a water hole and is of beryllium copper alloy construction.
In at least one embodiment of the invention, the housing is placed in the drill collar, and the housing and the drill collar wall are connected by heat-conducting silica gel bonding.
In at least one embodiment of the invention, the housing is filled with a thermally insulating material.
In at least one embodiment of the present invention, the thermally conductive material is a nanoporous thermal insulation mat.
In at least one embodiment of the invention, heat-conducting grease is smeared at the connecting positions of the underground circuit, the semiconductor refrigerating sheet, the heat-conducting plate and the inner surface of the shell.
In at least one embodiment of the invention, the device further comprises a downhole generator which is arranged in a water hole adjacent to the shell and used for providing electric energy for the semiconductor refrigeration sheet.
A method for cooling a downhole circuit while drilling by using any one of the cooling systems is characterized in that when the temperature of the downhole circuit exceeds a threshold value, the cooling system is started; and when the downhole circuit does not exceed the threshold value, the cooling system is not started.
Therefore, the invention has the following technical effects: 1. the temperature of the underground circuit is reduced by adopting a method of actively reducing the temperature by using a semiconductor refrigerating sheet, and the passive 'temperature resistance' of an element is not required; 2. the underground generator provides power, so that the continuous cooling of the underground circuit can be ensured, and the service life and the stability of the underground circuit are improved.
Drawings
The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present invention and, together with the description, further serve to explain the principles of the invention and to enable a person skilled in the pertinent art to make and use the disclosure.
FIG. 1-1 is a schematic representation of a downhole tool incorporating an active cooling system according to example 1; FIGS. 1-2 are cross-sectional views of the cooling system of embodiment 1; FIGS. 1-3 are sectional views taken along line 1-1 of FIGS. 1-2; FIGS. 1-4 are sectional views taken along line 2-2 of FIGS. 1-2; FIGS. 1-5 are block diagrams of the cooling system startup;
in the figure, 1-1: an earth formation; 1-2: a wellbore; 1-3: drilling fluid in the annulus; 1-4: a drill bit; 1-5: a drill collar; 1-6: a stirling active cooling system; 1-7: drilling fluid in the water hole; 1-8: a drill collar body; 1-9: a hot end hatch cover; 1-10: the upper part of the heat radiation body; 1-11: the lower part of the heat radiation body; 1-12: a hot end of the Stirling refrigerator; 1-13: a Stirling refrigerator split pipe; 1-14: a hot end compartment; 1-15: a cold end of the Stirling refrigerator; 1-16: a fixing device; 1-17: a circuit compartment; 1-18: a circuit hatch; 1-19: a Stirling refrigerator cold finger; 1-20: a T-shaped heat conducting block; 1-21: an electronic or sensing element; 1-22: a downhole circuit.
FIG. 2-1 is a schematic illustration of a downhole tool incorporating an active cooling system according to example 2; FIG. 2-2 is a cross-sectional view of the cooling system of embodiment 2; FIG. 2-3 is a cross-sectional view taken along line 1-1 of FIG. 2-2; FIGS. 2-4 are cross-sectional views taken along line 2-2 of FIGS. 2-2; FIGS. 2-5 are cross-sectional views of the cooling system taken along line 3-3 of FIGS. 2-2;
in the figure: 2-1: an earth formation; 2-2: a wellbore; 2-3: a drill stem; 2-4: a drill collar; 2-5: a drill bit; 2-6: drilling fluid in the water hole; 2-7: an active cooling system; 2-8: a fixing device; 2-9: drilling fluid in the annulus; 2-10: a first-stage semiconductor refrigerating sheet; 2-11: a second-stage semiconductor refrigerating sheet; 2-12: a third-stage semiconductor refrigerating sheet; 2-13: a first heat-conducting plate; 2-14: the hot end of the first-stage semiconductor refrigerating sheet; 2-15: a cold end of the first-stage semiconductor refrigerating sheet; 2-16: a second heat-conducting plate; 2-17: a thermally insulating material; 2-18: a housing; 2-19: the cold end of the second-stage semiconductor refrigerating sheet; 2-20: the hot end of the second-stage semiconductor refrigerating sheet; 2-21: a third heat-conducting plate; 2-22: the hot end of the third-stage semiconductor refrigerating sheet; 2-23: a third stage semiconductor refrigeration sheet cold end; 2-24: a fourth heat-conducting plate; 2-25: a downhole circuit.
FIG. 3-1 is a schematic illustration of a downhole tool including a semiconductor and phase change integrated cooling system of example 3; FIG. 3-2 is a cross-sectional view of the cooling system of embodiment 3; FIG. 3 is a cross-sectional view taken along line 1-1 of FIG. 3-2; FIG. 3-4 is a cross-sectional view taken along line 2-2 of FIG. 3-2; FIGS. 3-5 are cross-sectional views taken along line 3-3 of FIG. 3-2;
in the figure: 3-1: an earth formation; 3-2: a wellbore; 3-3: drilling fluid in the annulus; 3-4: a drill bit; 3-5: a drill collar; 3-6: a combined cooling system; 3-7: drilling fluid in the water hole; 3-8: a drill collar body; 3-9: an end conductor plate; 3-10: a circuit hatch; 3-11: a circuit cabin body; 3-12: a vacuum flask; 3-13: a semiconductor refrigeration sheet; 3-14: an inner heat-conducting plate; 3-15: a thermally insulating material; 3-16: a phase change material; 3-17: a phase change material container; 3-18: an electronic or sensing element; 3-19: a thermally conductive material; 3-20: a downhole circuit; 3-21: and (4) a fixing device.
Embodiments of the present invention will be described with reference to the accompanying drawings.
Detailed Description
Example 1
This example 1 uses a stirling cooler to reduce downhole circuit temperature. The Stirling refrigerator adopts a gas regenerative refrigeration principle and has the structural characteristics that: the compression part and the expansion part are integrated without valve distribution, and are coupled by corresponding mechanisms to operate at the same frequency. The structure realizes the refrigeration cycle processes of isothermal compression, isothermal heat release, isothermal expansion and isothermal heat absorption. In the refrigerating cycle process, the cold load generated by the cold finger of the Stirling refrigerator is uniformly transmitted to each electronic element or sensing element through the T-shaped heat conducting block, so that the temperature of the whole circuit is reduced, and the phenomenon of shortening the service life or losing efficacy is avoided.
Based on the above principle, the scheme of the embodiment is as follows: a Stirling active cooling system for a while-drilling downhole circuit comprises:
the drill collar body is internally provided with a hot end cabin and a circuit cabin;
the Stirling refrigerator is a split type refrigerator, the cold end of the Stirling refrigerator is connected with an underground circuit element in a circuit cabin, and the hot end of the Stirling refrigerator is connected with a heat radiator arranged in the hot end cabin.
The hot end of the Stirling refrigerator is positioned in the hot end cabin, the cold end of the Stirling refrigerator is positioned in the circuit cabin and connected with the circuit element, and the middle of the Stirling refrigerator is connected with the circuit element through the Stirling refrigerator separate-arranged tube.
The present embodiment will be described in detail with reference to fig. 1-1 to 1-5.
Fig. 1-1 is a schematic diagram of a downhole tool including an active cooling system according to the present embodiment.
FIGS. 1-2 are cross-sectional views of a cooling system. As shown in fig. 1-2, the cooling system of the present embodiment includes: 1-8 parts of a drill collar body, 1-16 parts of a Stirling refrigerator, a radiator combination, 1-20 parts of a fixing device, 1-22 parts of a T-shaped heat conducting block, 1-22 parts of an underground circuit, a heat insulating material, an underground generator and a temperature measuring device;
wherein, the drill collar body 1-8 is designed to be a water hole eccentric structure, and the side wall of the drill collar body is provided with a hot end cabin 1-14 and a circuit cabin 1-17; the hot end cabin 1-14 is used for placing the combination of the hot end 1-12 of the Stirling refrigerator and the heat radiation body; the circuit cabin body 1-17 is used for placing a cold end 1-15 of the Stirling refrigerator, a fixing device, a downhole circuit 1-22 and a heat insulating material, and is arranged separately for the purpose of heat insulation; a connecting hole is formed between the hot end cabin 1-14 and the circuit cabin 1-17 and is used for a Stirling refrigerator separate pipe to pass through and then carrying out heat insulation treatment;
in this embodiment, the stirling cooler is a split-type stirling cooler, that is: the hot end and the cold end of the Stirling refrigerator are separated, and the middle of the Stirling refrigerator is connected through a separate pipe, so that the distance between the hot end and the cold end is effectively prolonged; helium is filled in the middle of the branch pipe and serves as a refrigerant.
In the embodiment, the heat radiation body combination is divided into the upper part and the lower part of the heat radiation body; the middle of the upper part of the heat radiation body and the middle of the lower part of the heat radiation body are respectively provided with a semi-circular surface which is used for being connected with a heat radiation surface at the hot end of the Stirling refrigerator; the outer surface of the heat radiation body is connected with the inner wall surface of the hot end cabin body, and the connecting part is coated with heat conduction grease with high heat conductivity; the upper part and the lower part of the radiator have two functions, which are respectively as follows: the heat generated by the hot end of the Stirling refrigerator is transferred to the drill collar body, and the hot end of the Stirling refrigerator is supported and fixed. The heat radiating body is made of T1 material with high heat conductivity so as to facilitate the heat dissipation of the hot end of the Stirling refrigerator.
The fixing device is used for fixing the cold finger of the Stirling refrigerator, and meanwhile, the fixing device adopts a T1 material with high heat conductivity so as to facilitate the heat dissipation of the end part of the cold finger; the heat conducting block is a T-shaped heat conducting block 1-20 and is used for uniformly and efficiently transferring a cold load generated by a cold finger of the Stirling refrigerator to an underground circuit; the heat conducting block adopts a structure with a T-shaped cross section; the heat conducting block is made of T1 material with high heat conductivity;
the downhole circuit comprises various electronic elements or sensing elements to realize the functions of acquisition, processing, storage, transmission and the like of drilling data; the heat insulating material adopts a nano micropore heat insulating felt with low heat conductivity; filling heat insulating materials in the place with the gap in the circuit cabin body to establish high heat resistance; the underground generator is used for providing power for the Stirling refrigerator; the Stirling refrigerator is arranged in a drill string water hole adjacent to the drill collar body and is connected with the Stirling refrigerator in the drill collar body through a lead;
in this embodiment, a temperature measuring device is also provided in the downhole circuit. The temperature measuring device is used for detecting the temperature of the downhole circuit. A temperature threshold value can be set, and when the temperature of the downhole circuit exceeds the threshold value, a signal is sent to start the cooling system; when the underground circuit does not exceed the threshold value, a signal for starting the cooling system is not sent out; whether the cooling system is started or not, the underground circuit is required to work normally;
fig. 1 to 5 are schematic diagrams illustrating a method for cooling a stirling cryocooler according to this embodiment.
During drilling, a temperature measuring device (not shown in the drawing) of the Stirling active cooling system 1-6 detects that the temperature of the downhole circuit 1-22 exceeds a set temperature threshold value, and then the cooling system is started. The underground generator provides electric energy for the Stirling refrigerator, and the cold load generated by the cold finger of the Stirling refrigerator is uniformly transmitted to each electronic element or sensing element through the T-shaped heat conducting block, so that the temperature of the whole circuit is reduced, and the phenomenon of shortening the service life or losing efficacy is avoided. Meanwhile, heat generated by the hot end 1-12 of the Stirling refrigerator is transferred to the inner surface of the hot end chamber 1-14 of the drill collar body through the upper radiator and the lower radiator, then transferred to the outer surface of the drill collar body through heat conduction, and then exchanged with drilling fluid in the annulus or in a water hole to take away the heat. Through the process, under the action of the Stirling active cooling system, the heat of the downhole circuit 1-22 is transferred into the drilling fluid, so that the electronic element or the sensing element 1-21 is maintained in a temperature range capable of working normally;
during drilling, the temperature measuring device (not shown in the drawing) of the Stirling active cooling system 1-6 detects that the temperature of the downhole circuit 22 does not exceed the set temperature threshold, and the cooling system is not started.
Example 2
This embodiment 2 uses semiconductor cooling fins to reduce downhole circuit temperature. The working principle is as follows: after the semiconductor refrigerating sheet is powered on, electrons start from a negative electrode and firstly pass through the P-type semiconductor to absorb heat; the electrons then move to the N-type semiconductor, which in turn gives off heat. Every time the heat passes through one PN module, the heat is transferred from one side to the other side; a large number of N-type and P-type semiconductors are mutually arranged to form a whole to form a semiconductor refrigerating sheet, and the overall effect is that heat is transferred from one surface of the semiconductor refrigerating sheet to the other surface, so that temperature difference is generated, and a cold end and a hot end are formed. By means of the refrigerating effect of the semiconductor refrigerating piece, heat generated by the underground circuit is transferred to the shell through the interaction of the heat conducting plate and the semiconductor refrigerating piece and finally transferred to the drilling fluid.
Based on the above principle, the scheme of the embodiment is as follows:
the utility model provides a along with boring circuit semiconductor initiative cooling system, includes the casing and sets up the multistage semiconductor refrigeration piece in the casing, wherein, the semiconductor refrigeration piece includes:
the hot end of the first-stage semiconductor refrigerating piece is connected with the shell through a first heat conducting plate, and the cold end of the first-stage semiconductor refrigerating piece is connected with the hot end of the second-stage semiconductor refrigerating piece through a second heat conducting plate;
the cold end of the second-stage semiconductor refrigerating piece is connected with the hot end of the third-stage semiconductor refrigerating piece through a third heat conducting plate;
the cold end of the third-stage semiconductor refrigerating sheet is connected with the underground circuit through a fourth heat conducting plate;
the plane where the cold end and the hot end of each stage of semiconductor refrigeration piece are located is parallel to the axial direction of the drill collar, and the heat dissipation plate connected with each stage of semiconductor refrigeration piece is arranged along the axial direction of the drill collar.
The present embodiment will be described in detail with reference to fig. 2-1 to 2-5.
Fig. 2-1 is a schematic diagram of a downhole tool including an active cooling system according to the present embodiment. As shown in fig. 2-2 to fig. 2-5, the active cooling system for the while-drilling downhole circuit semiconductor of the present embodiment includes: the device comprises a shell, a semiconductor refrigerating sheet, a heat conducting plate, an underground circuit 2-25, a heat insulating material, heat conducting grease, an underground generator and a temperature measuring device;
in the embodiment, if the shell is placed in a water hole, the shell is a pressure-bearing shell and can bear the sum of hydrostatic column pressure of underground drilling fluid and pressure applied to the drilling fluid by a surface pump without deformation, and the shell is fixed on the inner wall of a drill collar through a fixing device; the housing has a high thermal conductivity, such as: the shell is made of beryllium copper alloy; if the shell is arranged in the drill collar, the place where the shell is connected with the wall of the drill collar needs to be bonded by heat-conducting silica gel; the housing has a high thermal conductivity, such as: the shell is made of beryllium copper alloy;
in this embodiment, the semiconductor refrigeration piece adopts the structure of three-level series connection, namely: the cold end of the first-stage semiconductor refrigerating sheet is connected with the hot end of the second-stage semiconductor refrigerating sheet through a heat conducting plate; the cold end of the second-stage semiconductor refrigerating piece is connected with the hot end of the third-stage semiconductor refrigerating piece through a heat conducting plate; the serial structure is adopted to prolong the distance between the cold end and the hot end and manufacture larger temperature difference; the heat conducting plate is made of high-heat-conductivity materials, such as T1 materials; the heat conducting plate is used for uniformly and efficiently transferring heat;
in this embodiment, the downhole circuit includes various electronic components or sensing components to achieve the functions of acquisition, processing, storage, transmission, and the like of drilling data; the heat insulating material adopts a nano micropore heat insulating felt with low heat conductivity; the space in the housing where no components are placed should be filled with a thermally insulating material to establish a high thermal resistance. The places where the underground circuit, the semiconductor refrigerating sheet, the heat conducting plate and the inner surface of the shell are connected are coated with heat conducting grease with high heat conductivity; the underground generator is used for providing electric energy for the semiconductor refrigerating sheet; the device is arranged in the water hole of the adjacent drill column and is connected with the semiconductor refrigerating sheet through a lead;
the heat transfer path is: the underground circuit, the fourth heat-conducting plate, the cold end of the third-stage semiconductor refrigerating piece, the hot end of the third-stage semiconductor refrigerating piece, the third heat-conducting plate, the cold end of the second-stage semiconductor refrigerating piece, the hot end of the second-stage semiconductor refrigerating piece, the second heat-conducting plate, the cold end of the first-stage semiconductor refrigerating piece, the hot end of the first-stage semiconductor refrigerating piece, the first heat-conducting plate, the (pressure-bearing) shell, the drilling fluid/the drill collar wall and the drilling fluid;
in the embodiment of the invention, the temperature measuring device is used for detecting the temperature of the downhole circuit and setting a temperature threshold value. When the temperature of the downhole circuit exceeds the threshold value, sending a signal to start a cooling system; when the underground circuit does not exceed the threshold value, a signal for starting the cooling system is not sent out; whether the cooling system is started or not, the underground circuit is required to work normally;
when the active cooling system 2-7 goes into the borehole along with the drill collar 2-4, the active cooling system 2-7 starts the active cooling system 2-7 when the temperature of the downhole circuit 2-25 is detected to exceed the set temperature threshold by a temperature measuring device (not shown in the figure) carried by the active cooling system 2-7; the underground generator supplies power to the first-stage semiconductor chilling plates 2-10, the second-stage semiconductor chilling plates 2-11 and the third-stage semiconductor chilling plates 2-12. Heat generated by the underground circuits 2-25 is transferred to the cold ends 2-23 of the third-stage semiconductor chilling plates through the fourth heat conduction plates 2-24, and the heat is transferred to the hot ends 2-22 of the third-stage semiconductor chilling plates from the cold ends 2-23 of the third-stage semiconductor chilling plates under the action of PN type semiconductors of the third-stage chilling plates; the heat is transferred to the cold end 2-19 of the second-stage semiconductor refrigerating piece through the third heat conduction plate 2-21, and the heat is transferred to the hot end 2-20 of the second-stage semiconductor refrigerating piece from the cold end 2-19 of the second-stage semiconductor refrigerating piece under the action of the PN type semiconductor of the second-stage refrigerating piece; the heat is transferred to the second heat conduction plate 2-16, then transferred to the cold end 2-15 of the first-stage semiconductor refrigerating piece, under the action of the PN type semiconductor of the first-stage refrigerating piece, the heat is transferred from the cold end 2-15 of the first-stage semiconductor refrigerating piece to the hot end 2-14 of the first-stage semiconductor refrigerating piece, and finally the heat is transferred to the shell 2-18 through the first heat conduction plate 2-13; the heat on the shells 2-18 is transferred to the outside drilling fluid, completing the heat transfer. Through the process, the heat of the downhole circuit 2-25 is transferred into the drilling fluid, so that the downhole circuit 2-25 is maintained in a temperature range capable of working normally;
when the active cooling system 2-7 is lowered into the borehole along with the drill collar 2-4, and a temperature measuring device (not shown in the figure) carried by the active cooling system 2-7 detects that the temperature of the downhole circuit 2-25 is lower than a set temperature threshold, the active cooling system 2-7 is not started.
Example 3
In this embodiment 3, the temperature of the downhole circuit is reduced by using the semiconductor chilling plate and the phase-change material. The working principle is as follows: after the semiconductor refrigerating sheet is powered on, electrons start from a negative electrode and firstly pass through the P-type semiconductor to absorb heat; the electrons then move to the N-type semiconductor, which in turn gives off heat. Every time the heat passes through one PN module, the heat is transferred from one side to the other side; a large number of N-type and P-type semiconductors are mutually arranged to form a whole to form a semiconductor refrigerating sheet, and the overall effect is that heat is transferred from one surface of the semiconductor refrigerating sheet to the other surface, so that temperature difference is generated, and a cold end and a hot end are formed. In heat that circuit produced in the pit got into phase change material through the heat conduction material, had phase change material container terminal surface and semiconductor refrigeration piece cold junction again and contacted, the effect of semiconductor refrigeration piece is gone out the heat transfer to reduce circuit's in the pit temperature.
Based on the above principle, the scheme of the embodiment is as follows: a while-drilling downhole circuit semiconductor and phase change combined cooling system comprises:
a phase change material container having a phase change material disposed therein and contacting the downhole circuit through a thermally conductive material;
the semiconductor refrigeration piece is arranged on the end face of the phase-change material container, the cold end of the semiconductor refrigeration piece is connected with the phase-change material, the hot end of the semiconductor refrigeration piece is in contact with the end heat-conducting plate, and the end heat-conducting plate is connected with the drill collar body.
The phase change material container is internally provided with a circuit cavity for placing a circuit along the axial direction, the circuit cavity is filled with a heat conduction material, and the underground circuit is wrapped by the heat conduction material.
The scheme of this example is further illustrated below with reference to FIGS. 3-1 to 3-5:
as shown in fig. 3-2, the present embodiment includes: the drill collar comprises a drill collar body, a heat insulating material, a heat conducting plate, a semiconductor refrigerating sheet, a vacuum flask, a phase-change material container, a phase-change material, a heat conducting material, an underground circuit, a fixing device, an underground generator and a temperature measuring device;
the drill collar body is designed to be of a water hole eccentric structure, and a circuit cabin body is arranged on the side wall of the drill collar body; the circuit chamber body is used for placing heat insulating materials, heat conducting plates, semiconductor refrigerating sheets, vacuum bottles, phase change materials, containers, heat conducting materials, underground circuits, fixing devices and the like;
the heat insulating material adopts a nano micropore heat insulating felt with low heat conductivity; the heat insulating material should be filled in the space in the circuit cabin where no device is placed to establish high thermal resistance; the heat-insulating material has high elasticity, can play a role in shock absorption in the drilling process and protect a circuit semiconductor and a phase change combined cooling system in the well while drilling;
the heat conducting plate is divided into an end heat conducting plate and an inner heat conducting plate; the heat conducting plate at the end part is square so as to increase the contact area with the inner wall of the circuit cabin body; the inner heat conducting plate is circular, and the circumference of the inner heat conducting plate is provided with threads, so that the heat-insulating bottle mouth can be conveniently sealed; the heat conducting plate is made of a high-thermal-conductivity material, such as a T1 material; the heat conducting plate is used for uniformly and efficiently transferring heat;
the semiconductor refrigerating sheet is made of Bismuth-Telluride, has the characteristic of high temperature resistance and can normally work in a high-temperature environment; (ii) a The hot end of the semiconductor refrigerating sheet is connected with the end heat-conducting plate, so that heat generated by the hot end is uniformly and efficiently transferred to the drill collar body; the cold end of the semiconductor refrigerating sheet is connected with the internal heat conducting plate; heat-conducting grease with high heat conductivity is smeared at the contact part of the semiconductor refrigerating sheet and the heat-conducting plate and the contact part of the end heat-conducting plate and the inner wall of the circuit cabin body;
the vacuum flask is a metal double-opening vacuum flask; the wall of the thermos bottle adopts the heat insulation technology of an ultrahigh vacuum and multilayer binding structure to prevent heat from entering the interior of the thermos bottle from the side surface; the mouth of the vacuum flask is connected with the internal heat conducting plate through threads;
the phase-change material container is made of special-shaped materials; the arc-shaped surface material of the phase-change material container is a heat-insulating material, such as ceramic, and high thermal resistance prevents heat from entering the phase-change material from the arc-shaped surface; the planar material of the phase-change material container is a high-heat-conduction material, such as T1, and the low heat resistance enables heat generated by a downhole circuit to easily enter the phase-change material; the part of the phase-change material container, which is contacted with the inner wall of the vacuum flask, is filled with an elastic heat-insulating material; the part of the phase change material container, which is in contact with the underground circuit, is filled with an elastic heat conduction material;
the phase change material is low-melting-point alloy; the high latent heat of fusion of the low-melting-point alloy is utilized to absorb heat generated in the working process of the underground circuit;
the heat conduction material is heat conduction silicone grease with high heat conduction coefficient and composed of oil-based nano particles; the downhole circuit comprises various electronic elements or sensing elements to realize the functions of acquisition, processing, storage, transmission and the like of drilling data; the fixing device is used for fixing the vacuum flask in the circuit cabin body and has high thermal resistance; the underground generator is used for providing electric energy for the semiconductor refrigerating sheet; the device is arranged in the water hole of the adjacent drill column and is connected with the semiconductor refrigerating sheet through a lead;
the present embodiment provides a temperature measuring device in the electrical circuit for detecting the temperature of the downhole electrical circuit. A temperature threshold may be set. When the temperature of the downhole circuit exceeds the threshold value, sending a signal to start a cooling system; when the underground circuit does not exceed the threshold value, a signal for starting the cooling system is not sent out; whether the cooling system is started or not, the underground circuit is required to work normally;
during the drilling process, a temperature measuring device (not shown in the drawing) of the semiconductor and phase change combined cooling system 3-6 detects that the temperature of the downhole circuit 3-20 exceeds a set temperature threshold value, and then the cooling system is started. The underground generator provides electric energy for the semiconductor refrigerating sheets 3-13, the semiconductor refrigerating sheets 3-13 are used for absorbing heat generated in the working process of the underground circuit 3-20 under the Peltier effect, and the specific heat transfer path is as follows: the underground circuit comprises 3-20 parts of an underground circuit, 3-19 parts of heat conducting materials, 3-17 parts of phase change material container walls, 3-16 parts of phase change materials, 3-17 parts of phase change material container end faces and 3-13 parts of semiconductor refrigerating sheets; then the heat end of the semiconductor refrigerating sheet transfers heat to the end heat-conducting plate 3-9, and further transfers the heat to the drill collar body 3-8; meanwhile, due to the effects of the heat insulating materials 3-15 and the vacuum bottles 3-12 in the circuit cabin bodies 3-11, underground high temperature cannot enter the vacuum bottles 3-12, and the influence on the underground circuits 3-20 is avoided. In the whole process, when the semiconductor refrigerating sheets 3-13 are failed or suddenly powered off, the phase-change materials 3-16 absorb heat generated by the underground circuits 3-20 in a short time so as to prevent the underground circuits from being damaged due to the influence of high temperature, and then the drill string is lifted to the ground for maintenance or waits for the starting of a standby power supply.
Example 4
Example 4 is a comprehensive cooling based on examples 1-3. The idea is to combine the schemes of the embodiment 1, the embodiment 2 and the embodiment 3 and comprehensively cool.
Therefore, the scheme of the embodiment is as follows:
an active cooling system for a downhole while drilling circuit, comprising: the temperature control system comprises one or more of a while-drilling downhole circuit Stirling active cooling system, a while-drilling downhole circuit semiconductor and a phase change combined cooling system.
In this embodiment, the while-drilling downhole circuit stirling active cooling system includes:
the drill collar body is internally provided with a hot end cabin and a circuit cabin;
the Stirling refrigerator is a split type refrigerator, the cold end of the Stirling refrigerator is connected with an underground circuit element in a circuit cabin, and the hot end of the Stirling refrigerator is connected with a heat radiator arranged in the hot end cabin.
The hot end of the Stirling refrigerator is positioned in the hot end cabin, the cold end of the Stirling refrigerator is positioned in the circuit cabin and connected with the circuit element, and the middle of the Stirling refrigerator is connected with the circuit element through the Stirling refrigerator separate-arranged tube.
In this embodiment, along with boring circuit semiconductor initiative cooling system, including the casing and set up a plurality of semiconductor refrigeration pieces in the casing, wherein, the semiconductor refrigeration piece includes:
the hot end of the first-stage semiconductor refrigerating piece is connected with the shell through a first heat conducting plate, and the cold end of the first-stage semiconductor refrigerating piece is connected with the hot end of the second-stage semiconductor refrigerating piece through a second heat conducting plate;
the cold end of the second-stage semiconductor refrigerating piece is connected with the hot end of the third-stage semiconductor refrigerating piece through a third heat conducting plate;
the cold end of the third-stage semiconductor refrigerating sheet is connected with the underground circuit through a fourth heat conducting plate;
in this embodiment, the system for cooling down while drilling downhole circuit semiconductor and phase change jointly comprises:
a phase change material container having a phase change material disposed therein and contacting the downhole circuit through a thermally conductive material;
the semiconductor refrigeration piece is arranged on the end face of the phase-change material container, the cold end of the semiconductor refrigeration piece is connected with the phase-change material, the hot end of the semiconductor refrigeration piece is in contact with the end heat-conducting plate, and the end heat-conducting plate is connected with the drill collar body.
The specific implementation of the while-drilling downhole circuit stirling active cooling system is shown in embodiment 1, the specific implementation of the while-drilling downhole circuit semiconductor active cooling system is shown in embodiment 2, and the specific implementation of the while-drilling downhole circuit semiconductor and phase change combined cooling system is shown in fig. 3, which is not described herein again.
The foregoing is a detailed description of the invention, and it is noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (3)
1. An active cooling system of a downhole circuit while drilling, comprising: the system comprises a while-drilling underground circuit semiconductor active cooling system, a while-drilling underground circuit Stirling active cooling system, a while-drilling underground circuit semiconductor and phase change combined cooling system;
wherein, the while-drilling downhole circuit semiconductor active cooling system comprises: the casing and set up the multistage semiconductor refrigeration piece in the casing, the semiconductor refrigeration piece includes: the hot end of the first N-stage semiconductor refrigerating piece is connected with the shell through a first heat conducting plate, and the cold end of the first N-stage semiconductor refrigerating piece is connected with the hot end of the second-stage semiconductor refrigerating piece through a second heat conducting plate; the cold end of the second-stage semiconductor refrigerating piece is connected with the hot end of the third-stage semiconductor refrigerating piece through a third heat conducting plate; the cold end of the third-stage semiconductor refrigerating sheet is connected with the underground circuit through a fourth heat conducting plate;
wherein, circuit stirling initiative cooling system in pit includes along with boring: the drill collar body is internally provided with a hot end cabin and a circuit cabin; the Stirling refrigerator is a split refrigerator, the cold end of the Stirling refrigerator is connected with an underground circuit element in a circuit cabin, and the hot end of the Stirling refrigerator is connected with a heat radiator arranged in the hot end cabin; the hot end of the Stirling refrigerator is positioned in the hot end cabin, the cold end of the Stirling refrigerator is positioned in the circuit cabin and connected with the circuit element, and the middle of the Stirling refrigerator is connected with the circuit element through a Stirling refrigerator separate pipe;
wherein, it jointly cools down the system to follow drilling downhole circuit semiconductor and phase transition includes: a phase change material container having a phase change material disposed therein and contacting the downhole circuit through a thermally conductive material; a circuit cavity for placing a circuit is axially arranged in the phase-change material container, a heat conduction material is filled in the circuit cavity, and the underground circuit is wrapped by the heat conduction material; the phase-change container semiconductor refrigeration piece is arranged on the end face of the phase-change material container, the hot end of the phase-change container semiconductor refrigeration piece is in contact with the end heat-conducting plate, the end heat-conducting plate is connected with the drilling boat body, the phase-change material container is arranged in a heat-insulating bottle, the bottle cap of the heat-insulating bottle is a round inner heat-conducting plate, one end of the inner heat-conducting plate is in contact with the phase-change material, and one end of the inner heat.
2. The active cooling system of the while-drilling downhole circuit is characterized in that in the active cooling system of the Stirling of the while-drilling downhole circuit, the hot end of a Stirling refrigerator is located in the hot end chamber, the cold end of the Stirling refrigerator is located in the circuit chamber and connected with a circuit element, and the middle of the Stirling refrigerator is connected with a Stirling refrigerator separate pipe.
3. The active cooling system of the downhole circuit while drilling as recited in claim 1, wherein in the active cooling system of the downhole circuit while drilling semiconductor, the cooling and heating ends of the cooling and heating pieces are arranged along the axial direction of the drill collar, and the cooling plate connected with the cooling and heating pieces is arranged along the axial direction of the drill collar.
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| CN201910052557.2A CN109788715B (en) | 2019-01-21 | 2019-01-21 | Active cooling system of downhole circuit while drilling |
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| CN201910052557.2A CN109788715B (en) | 2019-01-21 | 2019-01-21 | Active cooling system of downhole circuit while drilling |
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| CN112376544B (en) * | 2019-05-22 | 2022-04-08 | 中国矿业大学(北京) | Freezing device and method for freezing stratum in sections |
| CN111219181B (en) * | 2019-11-05 | 2023-07-11 | 中国石油天然气集团有限公司 | Gas-driven cooling system and method for while-drilling instrument circuit system |
| CN114526034A (en) * | 2021-12-31 | 2022-05-24 | 中国石油天然气集团有限公司 | Cooling and heat-preserving device, method and application thereof, and underground circuit cooling and heat-preserving system |
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