CN102900397B - Underground semiconductor refrigerating device - Google Patents
Underground semiconductor refrigerating device Download PDFInfo
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- CN102900397B CN102900397B CN201210410672.0A CN201210410672A CN102900397B CN 102900397 B CN102900397 B CN 102900397B CN 201210410672 A CN201210410672 A CN 201210410672A CN 102900397 B CN102900397 B CN 102900397B
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Abstract
The invention provides an underground semiconductor refrigerating device which comprises a base pipe, a lower connector, a heat-insulating box, a heat-conducting block, a semiconductor refrigerating sheet, a radiating block, a heat-insulating box cover and an upper connector, wherein the lower connector and the upper connector are respectively sleeved on the base pipe from the lower end and upper end of the base pipe; extending parts of the lower connector and the upper connector are lap-jointed; the heat-insulating box is sleeved between the base pipe and the lower connector or the upper connector; a heat-conducting through hole matched with the heat-conducting block is arranged on an outer wall of the heat-insulating box; the heat-conducting block, the semiconductor refrigerating sheet and the radiating block are embedded into the heat-conducting through hole in turn from outer to inner; and the semiconductor refrigerating sheet is used for forming a refrigerating surface on an inner surface and a radiating surface on an outer surface under a working state. According to the underground semiconductor refrigerating device, a temperature difference of the inner and outer surfaces is formed on the semiconductor refrigerating sheet and a heat conducting flow from inner to outer is formed at the heat-conducting through hole by the heat-insulating box, so that the real-time control on the required temperature in the heat-insulating box is realized.
Description
Technical field
The present invention relates to petroleum production engineering equipment field, particularly a kind of down-hole semiconductor cooling device.
Background technology
Along with oil-gas field development is gradually to deep layer, nontraditional reservoir development, subsurface environment is more and more severe, and especially in deep-well, downhole temperature can reach 200 DEG C.In addition in the application of the high temperature oil extraction methods such as high temperature gas injection, baked wheaten cake, downhole temperature will be higher, have higher requirement to the heatproof of downhole tool.
Along with the development of pit shaft control technology, underground monitoring and control system are more and more applied.In these control systems, inevitably need to use electronic circuit and large scale integrated circuit (IC) chip to realize the functions such as parameter monitoring, control decision, ground communications, one of key link that to be also oil recovery technique develop to modularization, intellectuality and becoming more meticulous.In addition along with the development of logging technique, in logger, also there is different IC chips, to complete the collection of data, record and processing capacity.Therefore, how realizing the long-term stability use of IC chip in the hot environment of down-hole is the key issue needing to solve.
IC chip is generally divided into bussiness class, technical grade and army's grade Three Estate by its Performance And Reliability, the environment temperature nominal value of its long-term stable operation is respectively 55 DEG C, 85 DEG C and 125 DEG C, even and army's grade device, be also difficult to long-term stable operation in high temperature environments.At present at well logging field, generally select import military project level device, then by strict high temperature ageing and chip select, finally obtaining can at the product being no more than short-term job under 125 DEG C of environment.And in the deep-well of some temperature more than 125 DEG C and high temperature well, also need by using thermal insulation material and designing insulation construction, ensure (to be generally less than 4 hours) at short notice, logger internal temperature raises limited, can ensure the normal work of IC device.In other industrial application, the device larger to calorific value carries out end-face heat sinking, and radiating mode mainly comprises heat loss through convection and refrigeration, and wherein semiconductor refrigerating is widely used, and has relevant radiator structure patent.But it is the application of room temperature mainly for environment temperature, and its structure and volume are difficult to be applied in downhole tool.
In sum, at present in the application scenario that the downhole temperatures such as deep-well, high temperature well, thermal production well are higher, still there is no the Circuits System that can realize long term high temperature application, must be realized by insulation and refrigeration structure.
Summary of the invention
Main purpose of the present invention is to solve problems of the prior art, provides a kind of down-hole semiconductor cooling device.
The object of the invention is to be achieved by following technical proposals:
A kind of down-hole semiconductor cooling device, is characterized in that, comprising: base tube, lower contact, thermal-insulating body, heat-conducting block, semiconductor chilling plate, radiating block, insulation case lid and top connection;
Described base tube, for being connected mutually with oil pipe;
Described lower contact and top connection, be socketed in the outside of base tube respectively from the lower end of base tube and upper end, described lower contact and described top connection and described base tube are threaded connection; The extension of described lower contact and top connection overlaps mutually, makes base tube, lower contact and top connection form bearing shell;
Described thermal-insulating body, in annulus column tube tubular, is socketed between base tube and lower contact or top connection; Described insulation case lid is covered on the openend of thermal-insulating body, forms keeping warmth space; The heat conduction through hole matched with heat-conducting block is offered at the outer wall of described thermal-insulating body; In described heat conduction through hole, be embedded with described heat-conducting block, semiconductor chilling plate and radiating block successively from outside to inside;
Described heat-conducting block, for deriving the heat of thermal-insulating body inside;
Described semiconductor chilling plate, under in working order, forms chill surface in inner surface, forms radiating surface in external surface;
Described radiating block, is arranged in keeping warmth space, for being absorbed heat by thermal-insulating body inside.
Also be provided with underground pipelines and upper pipeline;
Described underground pipelines and upper pipeline insert in the through hole of described lower contact and top connection respectively, for being electrically connected with the electronic device in keeping warmth space.
Described heat-conducting block, between semiconductor chilling plate and radiating block by heat-conducting glue bonding.
Described heat-conducting block is connected with described lower contact or top connection by screw.
Described radiating block is multilayer chip.
Adiabatic gluingly to connect is adopted between described insulation case lid and thermal-insulating body.
Sealing ring is adopted to seal at described base tube, joining place between lower contact and top connection.
Fin is provided with in the end of described lower contact and top connection.
Described thermal-insulating body adopts heat insulating material or heat-barrier material to make.
Beneficial effect of the present invention is:
1, semiconductor refrigerating is adopted, can permanently effective control chamber temperature while insulation, be applicable to the long-term placement of downhole instrument;
2, overall structure adopts tubular to arrange, is more suitable for down-hole application, and can makes full use of mineshaft annulus space;
3, easy with the connection of existing instrument and instrument, highly versatile;
4, only need a control cable or one group of down-hole power can realize temperature to control, and the communication with ground can be realized;
5, temperature controls effectively simple, and power is lower;
6, passing through of cable or optical cable can be realized.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, forms a application's part, does not form limitation of the invention.In the accompanying drawings:
Fig. 1 is down-hole semiconductor cooling device structural representation;
Fig. 2 is the stereogram of down-hole semiconductor cooling device.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with embodiment and accompanying drawing, the present invention is described in further details.At this, exemplary embodiment of the present invention and illustrating for explaining the present invention, but not as a limitation of the invention.
Down-hole semiconductor refrigeration structure involved in the present invention is by down-hole sheathed cable or Power supply, the low temperature cavity that a relative temperature is lower can be provided, and can be connected with other downhole tools, the circuit modules such as the observing and controlling in instrument, computing, communication are put into low temperature cavity, and connect controlled parts by sheathed cable, for the electronic device in the measurement and control instrument of down-hole, IC chip etc. provide the environment of relative low temperature, ensure that it can long-term stable operation.This down-hole semiconductor cooling device can provide modular temperature control instrument for down-hole permanent monitoring system, downhole control system, intelligent injection and extraction system etc., to improve downhole electronics reliability, to extend its life-span significant.
Fig. 1 is this down-hole semiconductor cooling device structural representation, and Fig. 2 is the stereogram of this down-hole semiconductor cooling device.As shown in the figure, this down-hole semiconductor cooling device, comprising: base tube 1, lower contact 2, thermal-insulating body 3, heat-conducting block 4, semiconductor chilling plate 5, radiating block 6, insulation case lid 7 and top connection 8.
Described base tube 1 is cylindrical socket, for being connected mutually with oil pipe.
Described lower contact 2 and top connection 8, be socketed in the outside of base tube 1 respectively from the lower end of base tube 1 and upper end.The extension of described lower contact 2 and top connection 8 overlaps mutually, thus makes base tube 1, lower contact 2 and top connection 8 form bearing shell, and forms pressure-bearing space in the inner.Wherein, described lower contact 2 and top connection 8 with base tube 1 by being threaded.Further, sealing ring is adopted to seal at this base tube 1, joining place between lower contact 2 and top connection 8.
Described thermal-insulating body 3, in annulus column tube tubular, is socketed between base tube 1 and lower contact 2 or top connection 8 (in lower contact 2 and top connection 8 internal diameter less one), is namely placed in described pressure-bearing space.Described insulation case lid 7 is covered on the openend of thermal-insulating body 3, forms keeping warmth space to make thermal-insulating body 3 inside.The heat conduction through hole matched with heat-conducting block 4 is offered at the outer wall of described thermal-insulating body 3.In described heat conduction through hole, be embedded with described heat-conducting block 4, semiconductor chilling plate 5 and radiating block 6 from outside to inside successively.
Described heat-conducting block 4, seals for being formed with thermal-insulating body 3, and is derived by the heat of thermal-insulating body 3 inside.
Described semiconductor chilling plate 5, under in working order, forms chill surface in inner surface, forms radiating surface in external surface.Namely this semiconductor chilling plate 5 is when by armored cable or Power supply, and within it between surface and external surface, formation temperature is poor, and internal surface temperature is lower, and hull-skin temperature is higher.
Described radiating block 6, is arranged in keeping warmth space, for being absorbed heat by thermal-insulating body 3 inside.
The working method of the down-hole semiconductor cooling device of said structure is: base tube 1, lower contact 2 and top connection 8 form bearing shell, bears stratum fluid pressure and makes its inner formation cavity; When cavity temperature rises by ground layer for heating, after forming a fixed difference difference with thermal-insulating body inside, semiconductor chilling plate 5 is started working, and forms chill surface at its soffit, by radiating block 6 by the heat absorption of thermal-insulating body inside; Simultaneously surface forms radiating surface thereon, by heat-conducting block 4 by temperature conduction to top connection 8.Owing to forming the temperature difference of surfaces externally and internally on semiconductor chilling plate 5, make thermal-insulating body 3 at heat conduction through hole formation heat conduction stream from the inside to the outside.Along with the flowing of stratum liquid, the heat conducting to thermal-insulating body inside is carried to top connection 8 and is taken away by stratum liquid by semiconductor chilling plate 5, and final formation heat balance also keeps thermal-insulating body internal temperature lower than ground environment temperature.Further, the heat radiation power of this semiconductor chilling plate 5 and the temperature difference can be adjusted by control circuit, realize the real-time control that thermal-insulating body is inner temperature required.
Compared to existing well logging insulation construction and industrial semiconductor refrigeration structure, advantage of the present invention is mainly reflected in: 1, adopt semiconductor refrigerating, can permanently effective control chamber temperature while insulation, is applicable to the long-term placement of downhole instrument; 2, overall structure adopts tubular to arrange, is more suitable for down-hole application, and can makes full use of mineshaft annulus space; 3, easy with the connection of existing instrument and instrument, highly versatile; 4, only need a control cable or one group of down-hole power can realize temperature to control, and the communication with ground can be realized; 5, temperature controls effectively simple, and power is lower; 6, passing through of cable or optical cable can be realized.Therefore, down-hole semiconductor refrigeration structure involved in the present invention can provide functional module for the temperature controlled instrument of needs, to improving the reliability of underground equipment and life-span, the temperature index of reduction is high temperature resistant device, reduces electronic circuit cost and all has obvious facilitation and important practical value.
As shown in the figure, this down-hole semiconductor cooling device is also provided with underground pipelines 9, on pipeline 10.Described underground pipelines 9 and upper pipeline 10 insert in the through hole of described lower contact 2 and top connection 8 respectively, for being electrically connected with the electronic device in keeping warmth space.Can make to be placed in electronic device in keeping warmth space by this underground pipelines 9, upper pipeline 10 to be connected with the superior and the subordinate electrical equipment.
Described heat-conducting block 4, between semiconductor chilling plate 5 and radiating block 6 by heat-conducting glue bonding.This heat-conducting block 4, heat transmission between semiconductor chilling plate 5 and radiating block 6 can be made more efficient by this heat-conducting glue.
In addition, described heat-conducting block 4 is also connected by screw and lower contact 2 or top connection 8 (one that lower contact 2 and internal diameter in top connection 8 are less).
Further, described radiating block 6 is multilayer chip, to strengthen its heat absorption capacity.
Adiabatic gluingly to connect, to reduce keeping warmth space and space outerpace heat transfer is herein adopted between described insulation case lid 7 and thermal-insulating body 3.
This down-hole semiconductor cooling device can also be provided with fin in the end of described lower contact 2 and top connection 8, to improve lower contact 2 and top connection 8 heat-sinking capability to stratum liquid further.As seen from Figure 2.
Described thermal-insulating body 3 adopts the very low heat insulating material of coefficient of thermal conductivity or heat-barrier material to make, and to guarantee that inside and outside thermal-insulating body, hot-fluid power is minimum under certain temperature difference, reduces the refrigeration work consumption of semiconductor chilling plate 5, improves the temperature difference of its cold and hot surface.
In sum, the invention provides a kind of down-hole semiconductor cooling device.This down-hole semiconductor cooling device, by forming the temperature difference of surfaces externally and internally on semiconductor chilling plate, makes thermal-insulating body at heat conduction through hole formation heat conduction stream from the inside to the outside, thus realizes the real-time control temperature required to thermal-insulating body inside.This down-hole semiconductor cooling device can provide modular temperature control instrument for down-hole permanent monitoring system, downhole control system, intelligent injection and extraction system etc., to improve downhole electronics reliability, to extend its life-span significant.Persons skilled in the art under this design philosophy do any not creative transformation, all should be considered as within protection scope of the present invention.
Claims (9)
1. a down-hole semiconductor cooling device, is characterized in that, comprising: base tube, lower contact, thermal-insulating body, heat-conducting block, semiconductor chilling plate, radiating block, insulation case lid and top connection;
Described base tube, for being connected mutually with oil pipe;
Described lower contact and top connection, be socketed in the outside of base tube respectively from the lower end of base tube and upper end, described lower contact and described top connection and described base tube are threaded connection; The extension of described lower contact and top connection overlaps mutually, makes base tube, lower contact and top connection form bearing shell;
Described thermal-insulating body, in annulus column tube tubular, is socketed between base tube and lower contact or top connection; Described insulation case lid is covered on the openend of thermal-insulating body, forms keeping warmth space; The heat conduction through hole matched with heat-conducting block is offered at the outer wall of described thermal-insulating body; In described heat conduction through hole, be embedded with described heat-conducting block, semiconductor chilling plate and radiating block successively from outside to inside;
Described heat-conducting block, for deriving the heat of thermal-insulating body inside;
Described semiconductor chilling plate, under in working order, forms chill surface in inner surface, forms radiating surface in external surface;
Described radiating block, is arranged in keeping warmth space, for being absorbed heat by thermal-insulating body inside.
2. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: be also provided with underground pipelines and upper pipeline;
Described underground pipelines and upper pipeline insert in the through hole of described lower contact and top connection respectively, for being electrically connected with the electronic device in keeping warmth space.
3. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: described heat-conducting block, bonding by heat-conducting glue between semiconductor chilling plate and radiating block.
4. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: described heat-conducting block is connected with described lower contact or top connection by screw.
5. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: described radiating block is multilayer chip.
6. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: between described insulation case lid and thermal-insulating body, adopts that thermal insulation is gluing to be connect.
7. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: adopt sealing ring to seal at described base tube, joining place between lower contact and top connection.
8. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: be provided with fin in the end of described lower contact and top connection.
9. down-hole as claimed in claim 1 semiconductor cooling device, is characterized in that: described thermal-insulating body adopts heat insulating material or heat-barrier material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210410672.0A CN102900397B (en) | 2012-10-24 | 2012-10-24 | Underground semiconductor refrigerating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210410672.0A CN102900397B (en) | 2012-10-24 | 2012-10-24 | Underground semiconductor refrigerating device |
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| CN102900397A CN102900397A (en) | 2013-01-30 |
| CN102900397B true CN102900397B (en) | 2015-04-08 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105422046B (en) * | 2015-11-25 | 2018-12-11 | 中国石油集团钻井工程技术研究院 | Underground high-efficient electricity refrigerating plant |
| CN105823272B (en) * | 2016-03-16 | 2018-06-05 | 王少斌 | A kind of refrigerating plant for downhole instrument |
| CN105952440B (en) * | 2016-05-04 | 2017-06-20 | 中国石油大学(华东) | Downhole electronics force cooling insulated hold |
| CN107178930B (en) * | 2017-05-24 | 2019-10-29 | 彭波涛 | A kind of active downhole gauges heat management system and method |
| CN109323482B (en) * | 2018-10-24 | 2020-08-11 | 中国石油天然气集团有限公司 | Semiconductor refrigerator and refrigeration control method thereof |
| CN109577914A (en) * | 2018-12-05 | 2019-04-05 | 西安石油大学 | Active Cooling System and method in a kind of underground hot environment |
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| US7874250B2 (en) * | 2005-02-09 | 2011-01-25 | Schlumberger Technology Corporation | Nano-based devices for use in a wellbore |
| US7638761B2 (en) * | 2007-08-13 | 2009-12-29 | Baker Hughes Incorporated | High temperature downhole tool |
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Patent Citations (4)
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| CN101328800A (en) * | 2007-03-14 | 2008-12-24 | 普拉德研究及开发股份有限公司 | Cooling systems for downhole tools |
| CN101906959A (en) * | 2010-08-04 | 2010-12-08 | 北京天形精钻科技开发有限公司 | One-way cooling device of down-hole drilling tester |
| CN102709266A (en) * | 2012-05-18 | 2012-10-03 | 苏州旭创科技有限公司 | Inexpensive surface mount packaging structure of semiconductor optical device and method for packaging inexpensive surface mount packaging structure |
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