CN107178930A - A kind of active downhole gauges heat management system and method - Google Patents
A kind of active downhole gauges heat management system and method Download PDFInfo
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- CN107178930A CN107178930A CN201710375593.3A CN201710375593A CN107178930A CN 107178930 A CN107178930 A CN 107178930A CN 201710375593 A CN201710375593 A CN 201710375593A CN 107178930 A CN107178930 A CN 107178930A
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- incubation cavity
- heat
- chip cartridges
- brasses
- fin
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of active downhole gauges heat management system and method, including pressure pocket, incubation cavity, fin, chip cartridges, semiconductor chilling plate, heat conduction copper billet and semi arch brasses；Incubation cavity has provided with a breach close to the position at top；Chip cartridges are installed in the breach；Semiconductor chilling plate, heat conduction copper billet and semi arch brasses are sequentially arranged with inside chip cartridges；The cold end of semiconductor chilling plate is close to chip cartridges；Heat conduction copper billet is close in semiconductor chilling plate hot junction, and heat conduction copper billet is close to semi arch brasses；Semi arch brasses is located at the outer surface of incubation cavity；Fin is arranged in incubation cavity；Fin top is fixed on outside chip cartridges；The two ends of incubation cavity are provided with end cover；Incubation cavity is installed on inside pressure pocket, and semi arch brasses is in contact with the inner surface of stainless steel pressure pocket.The present invention is protected normal temperature electronic device by built-in cooling device, realizes lasting cooling and heat management to the temperature field for gauge internal of logging well, High-Temperature Well Logging is realized using normal temperature chip.
Description
Technical field
The present invention relates to oil exploration and underground high temperature field of instrumentation technology, more particularly to a kind of active underground in exploitation
Instrument heat management system and method.
Background technology
In oil drilling industry, often the parameter such as geologic structure and oil reservoir resource is measured and analyzed.Generally
Need special electronic instrument to be extend into well the measurement for carrying out related physical quantity, to the stratum of each depth of underground
Parameter is recorded in detail.Here it is so-called well logging.In oil drilling and recovery process, it is often necessary to carry out substantial amounts of survey
Well activity.In addition, also often using well logging in the activity such as underground water, underground heat and mineral prospecting.
Usual well head is deeper, and down-hole ambient temperature is higher, and pressure is also bigger.Usually, downhole temperature is with well depth
Increase and raised with about 25 DEG C/km gradient, indivedual area thermogrades can also be larger.The high temperature and high pressure environment of underground is to surveying
Well instrument is huge test.Particularly high temperature problem, it is easy to cause the distorted signals of instrument and the mistake of electronic component
Cause thermal damage.For down-hole high pressure problem, additional pressure-bearing steel cylinder can be typically used, well logging instrument is wrapped in has wall thickness enough
Pressure pocket in.However, for underground high temperature problem, there is presently no especially ripe durable product.What current industrial quarters had
Electronic component is wrapped up using phase-change material, delays the rise of electronic component temperature using the principle of decalescence.Work as phase
The phase transition process of change material just loses the ability for continuing that high temperature protection is carried out to electronic component after being properly completed, so this
Scheme is only capable of realizing the transient protection of a few hours, can not still realize and continue underground high-temperature operation for a long time.Also someone in the world
It is directed to researching and developing resistant to elevated temperatures electronic material, develops resistant to elevated temperatures electronic component.Problem is that the price of high temperature chip is typically special
Not expensive, the life-span is general also shorter.Importantly, high temperature chip generally falls into protection product in the world, its export by
Strict control, purchase difficulty is very big.
The content of the invention
It is an object of the invention to provide a kind of active downhole gauges heat management system and method, to solve above-mentioned technology
Problem.The present invention is protected the normal temperature electronic device that in the market is readily available by built-in cooling device, to well logging instrument
Lasting cooling and heat management are realized in internal temperature field, go to realize the High-Temperature Well Logging function of high temperature chip using normal temperature chip.
To achieve these goals, the present invention is adopted the following technical scheme that：
A kind of active downhole gauges heat management system, including pressure pocket, incubation cavity, fin, chip cartridges, semiconductor refrigerating
Piece, heat conduction copper billet and semi arch brasses；Incubation cavity has provided with a breach close to the position at top；Chip cartridges are installed on described lack
In mouthful；Semiconductor chilling plate, heat conduction copper billet and semi arch brasses are sequentially arranged with inside chip cartridges；The cold end of semiconductor chilling plate is tight
Paste chip cartridges；Heat conduction copper billet is close in semiconductor chilling plate hot junction, and heat conduction copper billet is close to semi arch brasses；Semi arch brasses, which is located at, to be protected
The outer surface of warm chamber；Fin is arranged in incubation cavity；Fin top is fixed on outside chip cartridges；The two ends of incubation cavity are provided with sealing
End cap；Incubation cavity is installed on inside pressure pocket, and semi arch brasses is in contact with the inner surface of stainless steel pressure pocket.
Further, fin is copper ripple perforated fin；The length direction of fin and the well logging being installed in incubation cavity
The direction of instrument PCB main board is consistent.
Further, a step structure is arranged at the bottom of pressure pocket, and the bottom end seal end cap of incubation cavity and incubation cavity is existed
Axial restraint.
Further, the bottom end seal end cap of incubation cavity is made up of organic high temperature-resistant heat-insulating material, and its center, which is provided with, to be used for
The through hole that wire is drawn；A circular groove is provided with the inside of bottom end seal end cap, fin bottom portion inserts circular groove provided with a sharp mouth, sharp mouth
In.
Further, the end sealing end cap of incubation cavity includes the roundlet side face and and pressure pocket coordinated with insulation cavity wall
Inwall coordinate great circle side face；The end sealing end cap of warm chamber is made up of organic high temperature-resistant heat-insulating material；During thermal expansion, top
The swell increment of end cover is more than the thermal expansion amount that pressure pocket is made in metal, it is ensured that pressure-bearing cavity wall circumferential seal.
Further, the breach is sector notch；The head of chip cartridges is sector structure, the sector notch with incubation cavity
It is engaged, to prevent chip cartridges to be slipped to inside incubation cavity；The side of chip cartridges carries two row's barbs；Barb is inserted into incubation cavity
In two row's slits of sector notch, chip cartridges are fixed in sector notch.
Further, the top of fin is square bathtub construction；Square groove shape damascene is in the outside of chip cartridges and passes through line
Cylinder and gim peg are fixation；The inwall contact position of gim peg and spool and chip cartridges is sealed with the adiabatic glue of high temperature resistant.
Further, heat conduction copper billet is sector, and the big tail of head is small, and its top is circular arc, with semi arch brasses soldering one
Rise；The bottom of heat conduction copper billet is plane, is in close contact with the hot junction of cooling piece, between with the addition of heat-conducting silicone grease.
Further, chip cartridges top is pressed with a fan-shaped sealing frame；Fan-shaped sealing frame by chip cartridges and heat conduction copper billet with
And semi arch brasses is separated；Fan-shaped sealing frame is made up of high-temperature resistant thermal insulating material；Each edges and corners of its inner ring are provided with chamfering；Its
It is designed as being retracted structure at four sides, adds the resistant to elevated temperatures fluid sealant of painting at each retraction structure.
Further, pressure pocket is stainless steel cylinder-like structure, and top is provided with internal thread, and bottom is provided with external screw thread.
Further, pressure pocket is the circular stainless steel sleeve of one section of 0.6m length, can bear underground HTHP.It is first
Tail two ends are provided with screw thread, and longer pressure-bearing cylinder is constituted so as to which several sections of pressure pockets are connected.Every section of pressure pocket bottom has one small
The smaller annular stepped structure of section internal diameter, can play axial restraint to internal incubation cavity.
A kind of active downhole gauges thermal management algorithm, is produced using peltier effect of the semiconductor chilling plate when being powered
Cold and hot separation, hot junction, to chamber outer fluid heat loss through convection, consecutive low temperature is produced in underground by the whole outer surface of metal pressure pocket
Cold chamber environment, and the electronic component of downhole gauges is placed in the cold chamber environment carries out temperature protection.
Incubation cavity is made up of heat-insulating material, is nested in the inside of pressure pocket.Incubation cavity thermal resistance is larger, can effectively hinder
Only heat is quick to transmission inside incubation cavity from underground hot environment, and its external diameter is slightly less than the internal diameter of pressure pocket, to be inserted into
Pressure pocket bottom.Incubation cavity is provided with a sector notch close to the one end at top, for placing the fan-shaped chip cartridges of copper.Chip cartridges
Sector structure is consistent with the size of incubation cavity sector notch, and the small structure of this big tail of head can prevent chip cartridges from sliding into insulation
Intracavitary.Meanwhile, the side of chip cartridges carries two row's barbs.Barb is inserted into two row gaps of incubation cavity sector notch, can be with
Further chip cartridges are effectively fixed.
Cooling piece is placed in copper chip cartridges.Cooling piece profile is cuboid flake structure.Cooling piece typically uses twin-stage
Design, such as the first order contains 127 pairs of semiconductor particles, and 63 pairs of semiconductor particles are contained in the second level.According to semiconductor cooler
Peltier principle, semiconductor chilling plate produces cold and hot separation in the presence of outer making alive, one end heat absorption and other end heat release,
Form cold end and hot junction.Cold end is less than residing environment temperature, and the insulation effect one cold chamber in inside of formation for passing through incubation cavity
Environment.Hot junction is higher than environment temperature, it is possible to use the temperature difference effectively radiates to environment.
The cold end of the bottoms of copper chip cartridges and cooling piece is in close contact, also added with heat-conducting silicone grease to strengthen between two planes
Heat-conducting effect.When cooling piece is powered, cold end heat absorption can take away the heat in heat-insulated cavity, so that incubation cavity
It is internally formed a cold chamber.In order to ensure the uniformity of low temperature environment in heat-insulated cavity, the porous ripple in bottom outer one of chip cartridges
Corrugated fin.The both sides of chip cartridges are provided with 4 apertures, may be inserted into cylinder gim peg and cylinder spool comes the top of locked fin.
The sharp mouth structure of triangle is in the bottom of fin, in the aperture for being inserted into the bottom of incubation cavity, to fix the another of fin
End.
After applied voltage, the temperature in cooling piece hot junction is transferred heat to outside higher than environment temperature by hot junction heat transfer unit
Boundary's environment (drilling fluid outside such as pressure pocket).Hot junction heat transfer unit welded by the fan-shaped heat-conducting block of copper and semi arch brasses and
Into.One end of fan-shaped heat-conducting block is circular arc, and this end is brazed together with semi arch brasses.The opposite side of brasses and stainless steel pressure-bearing
The inwall contact of chamber, adds the area of dissipation in cooling piece hot junction.The other end of fan-shaped heat-conducting block is plane, the heat with cooling piece
End is in close contact, and two interplanars are added with heat-conducting silicone grease to strengthen heat-conducting effect.The advantage of this design is that whole stainless steel is held
The outer surface of pressure chamber all becomes the heat-delivery surface in cooling piece hot junction, substantially increases the area of dissipation (outer surface of pressure pocket
Drilling fluid is wrapped in, heat convection of the fluid on this surface effectively can take away heat).Have been previously mentioned, stratum is got over
Deep, temperature is higher.The axial thermal conductivity of stainless steel pressure pocket can also be effectively by the heat transfer of high temperature deep layer to shallow compared with low temperature
Layer.
It is pointed out that another ingenious part of this design is when device is in normal temperature, incubation cavity external diameter is smaller
In pressure pocket internal diameter, so there is a small gap between the two, it is convenient to install.Notice the thermal coefficient of expansion ratio of incubation cavity
The high an order of magnitude of stainless steel pressure pocket, by calculating, after pressure pocket enters underground hot environment, the radial direction heat of incubation cavity is swollen
The swollen hot-side heat dissipation unit (semi arch brasses, fan-shaped heat conduction copper billet) by automatic impaction cooling piece, it is ensured that the heat of cooling piece
Fan-shaped heat-conducting block can be effectively conducted to, then is effectively conducted to semi arch brasses, stainless steel pressure pocket is then conducted to, finally
By the whole outer wall of pressure pocket, effectively heat loss through convection gives drilling fluid (environment) again.
In order to prevent external heat from returning to cold chamber, a fan-shaped sealing frame has been installed additional around fan-shaped heat-conducting block.Fan
The material of shape sealing frame is consistent with incubation cavity, with very high thermal conduction resistance, effectively can prevent between heat-conducting block and chip cartridges
Heat transfer.Meanwhile, the seam crossing of all parts all adds painting high-temperature heat insulation glue to avoid any type of heat transfer and heat right
Stream.
Relative to prior art, the invention has the advantages that：
1st, the present invention is protected the normal temperature electronic device that in the market is readily available by built-in cooling device, to well logging
Lasting cooling and heat management are realized in the temperature field of gauge internal, go to realize the High-Temperature Well Logging work(of high temperature chip using normal temperature chip
Can, greatly reduce cost., thus can be with addition, the present apparatus can also protect inherently resistant to elevated temperatures expensive electronic device
Challenge deeper stratum at higher temperature.
2nd, the present invention can cause heat management system structure compact, fin direction and the direction one of well logging instrument PCB main board
Cause, greatly saved space；Fin as cooling piece extension low-temperature receiver, with the distance between PCB main board closer to can more have
The heat-shift of effect.
3rd, flexibility of the present invention is strong, both can apply to design new well logging instrument, can be used for transforming existing survey
Well instrument.
4th, the outer surface of whole pressure pocket is used as heat-delivery surface by the present invention, utilizes the convection current between the surface and drilling fluid
Exchange heat to cool down the hot junction of cooling piece, while from high temperature deep layer heat can also to be transmitted into low temperature shallow for the axial thermal conductivity of pressure pocket
Layer, radiating efficiency is higher.
5th, install very convenient at normal temperatures the invention enables each parts, while at high temperature can be swollen using material heat
Swollen otherness and play positioning and pressuring action, greatly reducing thermal contact resistance, there is provided radiating efficiency.In addition, of the invention
Dexterously reserve enough gaps and cause device failure to prevent excessive thermal stress.
For from Refrigeration Technique, the solutions for refrigeration of current technology more maturation has：Sweat cooling circularly cooling, thermoelectricity system
Cold, dense-air refrigeration cycle refrigeration and magnetic refrigeration etc..Sweat cooling circularly cooling and magnetic refrigeration have higher theoretical efficiency, still
Cost is high, system complex, it is relatively low for the feasibility under high temperature well.Dense-air refrigeration cycle is freezed in efficiency, volume, made
It is undesirable in terms of valency and feasibility.Thermoelectric cooling is without any refrigeration moving component, though current refrigerating efficiency is not most
Height, but has the advantages that small size, low cost, high feasibility etc..Therefore, a kind of active downhole instrument exterior heat of the present invention
Management system is exactly, using semiconductor thermoelectric refrigeration principle, to be proposed specifically designed for the cooling problem of logger, and setting
All being used during meter can be with resistant to elevated temperatures material, so that realizing can fill in the well logging protection of continuous firing in hot environment
Put.
Brief description of the drawings
Fig. 1 assembles exploded perspective view for a kind of each parts of active downhole gauges heat management system of the present invention；
Fig. 2 is a kind of stereochemical structure profile of active downhole gauges heat management system of the present invention；
Fig. 3 (a) is pressure pocket structural representation of the present invention；
Fig. 3 (b) is pressure pocket bottom step structure schematic diagram of the present invention；
Fig. 4 is present invention sealing bottom cover structure schematic；
Fig. 5 is incubation cavity structural representation of the present invention；
Fig. 6 is the sealing cooperation schematic diagram of top pressure closure of the present invention and pressure pocket and incubation cavity；
Fig. 7 (a) is copper chip cartridges structural representation of the present invention；
Fig. 7 (b) is copper chip cartridges of the present invention and incubation cavity cooperation schematic diagram；
Fig. 8 is used for the copper coin structural representation for suppressing chip cartridges for the present invention；
Fig. 9 (a) is porous ripple fin structure schematic diagram of the present invention；
Fig. 9 (b) is hollow spool of the invention and gim peg structural representation；
Fig. 9 (c) is porous ripple fin of the present invention and chip cartridges cooperation schematic diagram；
Figure 10 is hot-side heat dissipation unit of the present invention (fan-shaped copper billet and semi arch brasses) schematic diagram；
Figure 11 is the fan-shaped sealing frame schematic diagram near hot-side heat dissipation unit of the present invention；
The cross-sectional view that Figure 12 coordinates for the fan-shaped sealing frame of the present invention with chip cartridges and incubation cavity；
Figure 13 (a) is cooling piece of the present invention, chip cartridges and hot-side heat dissipation unit matching cross-sectional view；
Figure 13 (b) is cooling piece of the present invention, chip cartridges and hot-side heat dissipation unit matching Longitudinal cross section schematic；
Figure 14 is that hot-side heat dissipation unit of the present invention, fan-shaped sealing frame, chip cartridges, incubation cavity, top cover and bottom coordinate
Schematic diagram.
Embodiment
The present invention is proposed on the premise of practicable processing technology is solved.Below in conjunction with specific accompanying drawing pair
The present invention is described in further detail.
Shown in reference picture 1, a kind of active downhole gauges heat management system of the invention, including a pressure pocket 1, sealing
Bottom 2, incubation cavity 3, ripple perforated fin 4, fan-shaped sealing frame 5, chip cartridges 6, semiconductor chilling plate 7, fan-shaped heat conduction copper billet 8,
Spool 9, top pressure closure 10, semi arch brasses 11 and gim peg 12.
Referring to figs. 1 to shown in Fig. 5, incubation cavity 3 has a sector notch 16, copper sector chip cartridges 6 close to the position at top
With the big tail of head it is small the characteristics of, chip cartridges 6 can just be placed in the sector notch of incubation cavity 3 without slide；In chip cartridges 6
Portion is sequentially loaded into semiconductor chilling plate 7, fan-shaped sealing frame 5, fan-shaped heat conduction copper billet 8 and semi arch brasses 11.The outside of chip cartridges 6
Copper ripple perforated fin 4 is installed, fin 4 is fixed on outside chip cartridges 6 by the top of fin 4 by hollow spool 9 and gim peg 12；
Then sealing bottom 2 is tucked into the bottom of incubation cavity 3, while the triangled tip mouth of the bottom of fin 4 is inserted into the circle of sealing bottom 2
To fix the position of fin in shape groove.Incubation cavity 3 and bottom 2 are inserted into the bottom of pressure pocket 1 again, until bottom 2 is adjacent to
The step structure of the bottom of pressure pocket 1 and can not slide still further below；Top pressure closure 10 is finally tucked into the top of incubation cavity 1,
Complete a kind of assembling of active downhole gauges heat management system.Fin 4 as semiconductor chilling plate 7 extension low-temperature receiver, with PCB
The distance between mainboard is closer to ripple adds area of dissipation, porous to be conducive to free convection, can be more more effectively to PCB
Mainboard is cooled down, it is ensured that the uniformity of the inner cryogenic environment of incubation cavity 3.
Reference picture 3 (a), pressure pocket 1 is stainless steel cylinder-like structure, and top is provided with internal thread, and bottom is provided with external screw thread.Can
So that several pressure pockets 1 to be threadedly coupled from beginning to end so as to constitute the sufficiently large pressure-bearing cylinder of length.
One step structure 13 is arranged at reference picture 3 (b), the bottom of pressure pocket 1, so as to which incubation cavity 3 and bottom 2 is solid in axial direction
It is fixed so that they can not still further below slide and leave pressure pocket 1.
Reference picture 4, bottom 2 is organic high temperature-resistant heat-insulating material.Center is provided with through hole 15 to walk wire, and wire guide is direct
Sealed with high-temperature heat insulation glue.The side of bottom 2 is provided with a circular groove 14, and the sharp mouth of convenient insertion fin 4 is so as to fixed fin 4.
Reference picture 5, incubation cavity 3 is organic high temperature-resistant heat-insulating material, and it is provided with a sector notch 16 by top side；Breach
Both sides open and be respectively provided with rectangular shallow slot slit.
Reference picture 6, the structure of top cover 10 is similar to bottom 2, and its each edges and corners is provided with chamfering 20.Wherein, the side of chamfering 20
Just in normal temperature, top cover 10 inserts incubation cavity 3, and the convenient top cover 10 in normal temperature of chamfering 18 inserts pressure pocket 1, chamfering 19 and insulation
Effective sealing that the chamfering at the top of chamber 3 both coordinates to ensure when thermal expansion, the effect of chamfering 17 is convenient in normal temperature
Top cover 10 is skidded off from the dismounting of pressure pocket 1.The great circle side face of top cover 10 coordinates with the inwall of pressure pocket 1, due to organic material
Thermal expansion is more than metal, and top cover energy automatic impaction is to the inwall of pressure pocket 1 so as to ensure when the hot environment thermal expansion of underground
Circumferential seal.The roundlet side face of top cover 10 coordinates with the inwall of incubation cavity 3, and both materials are consistent, and thermal expansion is consistent, is conducive to close
Envelope.Top cover 10 can also be positioned with bottom 2 to incubation cavity 3.
Reference picture 7 (a), the head of copper chip cartridges 6 is sector structure 24, it is characterized in that the big tail of head is small, can prevent core
Film magazine is slipped to inside incubation cavity 3.The side of chip cartridges 6 carries two row's barbs 23.The both sides of chip cartridges 6 are provided with 4 circular holes 22,
The convenient hollow spool 9 of insertion and gim peg 12.
Reference picture 7 (b), the head of copper chip cartridges 6 is sector structure 24, is engaged with the sector notch 16 of incubation cavity 3,
Chip cartridges can be prevented to be slipped to inside incubation cavity 3.The side of chip cartridges 6 carries two row's barbs 23.Barb 23 is inserted into
In two row's slits of the sector notch 16 of incubation cavity 3, further chip cartridges effectively can be fixed.
Reference picture 8, copper chip cartridges 6 can be stamped to form as the scale copper shown in the figure, then in the seam crossing on four sides
Carry out soldering and shape.
Reference picture 9 (a), the main body of fin 4 is porous ripple structure, and loose structure 25 and waviness curve 26 are as shown in the figure；
The direction of fin 4 is consistent with the direction of the instrument mainboard of required Thermal protection, has both saved space, mainboard can be carried out again effective
Cooling；Loose structure can facilitate the free convection of the inner air of incubation cavity 3, promote radiating；Ripple struction can increase nature
The area of heat loss through convection, promotes radiating；The top of fin 4 is into square groove shape, and wall is provided with 4 circular holes 28, convenient insertion tubular wire
Cylinder 9 and gim peg 12；The bottom of fin 4 has in individual triangular structure 27, the circular groove 14 of convenient insertion bottom 2.
Reference picture 9 (b), spool 9 is hollow, and gim peg 12 is solid.
Reference picture 9 (c), the square groove shape at the top of fin 4 is stuck in the outside of chip cartridges 6, four circular holes 28 and core of fin 4
Four circular holes 22 of film magazine 6 align, and are inserted into two spools 9, and two gim pegs 12 fix them.Gim peg and
The inwall contact position of spool and chip cartridges 6 is sealed with the adiabatic glue of high temperature resistant.
Reference picture 10, fan-shaped heat conduction copper billet 8 is characterized as that the big tail of head is small, and its top is circular arc, with the pricker of semi arch brasses 11
It is welded together, it is ensured that effective heat-conducting area；The bottom of fan-shaped copper billet 8 is plane, is in close contact with the hot junction of cooling piece 7, it
Between with the addition of heat-conducting silicone grease, it is ensured that the effective in hot junction.
Reference picture 11, fan-shaped sealing frame 5 is made up of high-temperature resistant thermal insulating material, and the window frame of similar circular arc is characterized as head
Big tail is small；Each edges and corners of its inner ring are provided with the structure of chamfering 29, convenient that refractory seals glue is applied at chamfering；Its four sides
It is designed as being retracted structure 30 at face, it is convenient to apply resistant to elevated temperatures fluid sealant at retraction structure.
Reference picture 12, fan-shaped sealing frame 5 is embedded into the sector notch 16 of incubation cavity 3, and compresses chip cartridges 6.
Reference picture 13 (a), copper sector chip cartridges 6 have the characteristics of big tail of head is small, and chip cartridges 6 can just lay insulation
Without sliding in the sector notch of chamber 3；Semiconductor chilling plate 7 loads the bottom of chip cartridges 6, the bottoms of cold end and chip cartridges 6 it
Between heat-conducting silicone grease is added to ensure that thermal conduction resistance is minimum；Fan-shaped sealing frame 5 compresses chip cartridges 6；Fan-shaped heat conduction copper billet 8 and semi arch
The brazing member that brasses 11 is constituted is inserted into breach, and the bottom surface of fan-shaped copper billet 8 compresses the hot junction of cooling piece, fan-shaped copper billet 8
Lateral surface compressing sealing frame 5；Semi arch brasses 11 is in contact with the inner surface of stainless steel pressure pocket 1；Add painting resistance at gap 31 and 32
High-temperature heat insulation glue；When the ingenious part of the present invention is to work as normal temperature, each parts is easily installed and dismantled；When being
When system is in underground high temperature, because the thermal expansion of incubation cavity 3 is more order of magnitude greater than the thermal expansion of stainless steel pressure pocket 1,
The bottom of chip cartridges 6 in the presence of thermal stress, cooling piece 7, fan-shaped copper billet 8, semi arch brasses 11 and stainless steel pressure pocket 1
Inwall can be in close contact, while can add heat-conducting silicone grease between each contact surface, thermal contact resistance be minimized, it is ensured that heat conduction
Effectively carry out.In addition, using semi arch brasses 11 rather than full circle arc brasses, can cause incubation cavity 3 with pressure pocket 1 in semi arch
A gap is reserved on the opposite of brasses 11, so as to allow the elastic deformation of incubation cavity 3, can so avoid excessive thermal stress and
Cause the structural failure of chip cartridges 6；Another ingenious part of the present invention is that semi arch brasses 11 extends the hot junction of cooling piece 7
Area of dissipation, then stainless steel pressure pocket 1 be in close contact with semi arch brasses 11, more hot pressing must be tighter, further expands
Area of dissipation, heat convection is effectively radiated give drilling fluid (environment) finally by the outer wall of whole pressure pocket 1.Meanwhile, hold
Pressing the axial thermal conductivity of chamber 1 can also be conducted to the heat of cooling piece 7 from the deep layer of high temperature the shallow-layer of low temperature.In addition, adiabatic sealing
Frame 5, which is not only acted as, to be mechanically fixed and pressuring action, it is also possible that each cold/hot metal part is thoroughly separated, so as to avoid
The heat passback that any type of conduction and convection current are caused.
Semi arch brasses 11 extends the area of dissipation in the hot junction of cooling piece 7, while stainless steel pressure pocket 1 and semi arch brasses
11 are in close contact, and further expanded area of dissipation, effectively heat convection radiates finally by the outer wall of whole pressure pocket 1
Give drilling fluid (environment).Meanwhile, the heat of cooling piece 7 can also be conducted to low by the axial thermal conductivity of pressure pocket 1 from the deep layer of high temperature
The shallow-layer of temperature, radiating efficiency is higher.
Reference picture 13 (b), from another side (longitudinal section) illustrate chip cartridges 6, incubation cavity 3, semiconductor chilling plate 7,
Assembly relation between sealing frame 5, heat conduction copper billet 8, semi arch brasses 11；The adiabatic glue of painting high temperature resistant is added to keep away at gap 33 and 34
Exempt from convection heat caused by gas leakage to return.
Reference picture 14, the assembling illustrated between top cover 10, bottom 2, incubation cavity 3, sealing frame 5, semi arch brasses 11 is closed
System；Under the hot environment of underground, due to thermal expansion, incubation cavity 3 effectively can be positioned in pressure pocket 1 by top cover 10 and bottom 2；
Some gaps are reserved on the opposite of circular arc brasses 11, to the elastic deformation headspace of incubation cavity 2, can prevent excessive thermal stress from causing
Damage.
A kind of active downhole gauges thermal management algorithm of the present invention, based on a kind of active downhole gauges disclosed by the invention
Heat management system, produces cold and hot separation, hot junction passes through metal pressure-bearing using peltier effect of the semiconductor chilling plate when being powered
The whole outer surface of chamber produces the cold chamber environment of consecutive low temperature in underground to chamber outer fluid heat loss through convection, and by the electricity of downhole gauges
Sub- component is placed in the cold chamber environment and carries out temperature protection.
Claims (10)
1. a kind of active downhole gauges heat management system, it is characterised in that including pressure pocket (1), incubation cavity (3), fin
(4), chip cartridges (6), semiconductor chilling plate (7), heat conduction copper billet (8) and semi arch brasses (11)；
Incubation cavity (3) has provided with a breach close to the position at top；Chip cartridges (6) are installed in the breach；Chip cartridges (6)
Inside is sequentially arranged with semiconductor chilling plate (7), heat conduction copper billet (8) and semi arch brasses (11)；The cold end of semiconductor chilling plate (7)
It is close to chip cartridges (6)；Heat conduction copper billet (8) is close in semiconductor chilling plate (7) hot junction, and heat conduction copper billet (8) is close to semi arch brasses
(11)；Semi arch brasses (11) is located at the outer surface of incubation cavity (3)；
Fin (4) is arranged in incubation cavity (3)；Chip cartridges (6) are fixed at the top of fin (4) outside；
The two ends of incubation cavity (3) are provided with end cover；
Incubation cavity (3) is installed on pressure pocket (1) inside, and semi arch brasses (11) connects with the inner surface of stainless steel pressure pocket (1)
Touch.
2. a kind of active downhole gauges heat management system according to claim 1, it is characterised in that fin (4) is copper
Ripple perforated fin processed；The direction of well logging instrument PCB main board of the length direction of fin with being installed in incubation cavity (3) is consistent.
3. a kind of active downhole gauges heat management system according to claim 1, it is characterised in that pressure pocket (1)
One step structure (13) is arranged at bottom, by the bottom end seal end cap of incubation cavity (3) and incubation cavity in axial restraint.
4. a kind of active downhole gauges heat management system according to claim 1, it is characterised in that the bottom of incubation cavity
End cover is made up of organic high temperature-resistant heat-insulating material, and its center is provided with the through hole drawn for wire；Bottom end seal end cap
Inner side is provided with a circular groove (14), and fin (4) bottom is inserted in circular groove (14) provided with a sharp mouth, sharp mouth.
5. a kind of active downhole gauges heat management system according to claim 1 or 4, it is characterised in that incubation cavity
End sealing end cap includes the roundlet side face coordinated with incubation cavity (3) inwall and the big circumference with the inwall cooperation of pressure pocket (1)
Face；The end sealing end cap of warm chamber is made up of organic high temperature-resistant heat-insulating material；During thermal expansion, the swell increment of end sealing end cap is big
The thermal expansion amount of pressure pocket (1) is made in metal, it is ensured that pressure pocket (1) inwall circumferential seal.
6. a kind of active downhole gauges heat management system according to claim 1, it is characterised in that the breach is fan
V notch v (16)；The head of chip cartridges (6) is sector structure (24), is engaged with the sector notch (16) of incubation cavity (3), to prevent
Only chip cartridges are slipped to incubation cavity (3) inside；The side of chip cartridges (6) carries two row's barbs (23)；Barb (23) is inserted into guarantor
In two row's slits of warm chamber (3) sector notch (16), chip cartridges are fixed in sector notch (16).
7. a kind of active downhole gauges heat management system according to claim 1, it is characterised in that the top of fin (4)
Portion is square bathtub construction；Square groove shape damascene in the outside of chip cartridges (6) and is solid by spool (9) and gim peg (12)
It is fixed；The inwall contact position of gim peg (12) and spool (9) and chip cartridges (6) is sealed with the adiabatic glue of high temperature resistant.
8. a kind of active downhole gauges heat management system according to claim 1, it is characterised in that heat conduction copper billet (8)
For sector, the big tail of head is small, and its top is circular arc, is brazed together with semi arch brasses (11)；The bottom of heat conduction copper billet (8) is
Plane, is in close contact with the hot junction of cooling piece (7), between with the addition of heat-conducting silicone grease.
9. a kind of active downhole gauges heat management system according to claim 1, it is characterised in that in chip cartridges (6)
Portion is pressed with a fan-shaped sealing frame (5)；Fan-shaped sealing frame (5) is by chip cartridges (6) and heat conduction copper billet (8) and semi arch brasses
(11) separate；Fan-shaped sealing frame (5) is made up of high-temperature resistant thermal insulating material；Each edges and corners of its inner ring are provided with chamfering；Its four
It is designed as being retracted structure at side, adds the resistant to elevated temperatures fluid sealant of painting at each retraction structure；Pressure pocket (1) is that stainless steel is cylindric
Structure, top is provided with internal thread, and bottom is provided with external screw thread.
10. a kind of active downhole gauges thermal management algorithm, it is characterised in that utilize Paar of the semiconductor chilling plate when being powered
Note effect produces cold and hot separation, hot junction by the whole outer surface of metal pressure pocket (1) to chamber outer fluid heat loss through convection, in underground
The cold chamber environment of consecutive low temperature is produced, and the electronic component of downhole gauges is placed in the cold chamber environment carries out temperature protection.
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| CN201710375593.3A CN107178930B (en) | 2017-05-24 | 2017-05-24 | A kind of active downhole gauges heat management system and method |
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| CN201710375593.3A CN107178930B (en) | 2017-05-24 | 2017-05-24 | A kind of active downhole gauges heat management system and method |
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| CN107178930B (en) | 2019-10-29 |
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