CN112376544B - Freezing device and method for freezing stratum in sections - Google Patents
Freezing device and method for freezing stratum in sections Download PDFInfo
- Publication number
- CN112376544B CN112376544B CN202011235665.2A CN202011235665A CN112376544B CN 112376544 B CN112376544 B CN 112376544B CN 202011235665 A CN202011235665 A CN 202011235665A CN 112376544 B CN112376544 B CN 112376544B
- Authority
- CN
- China
- Prior art keywords
- freezing
- pipe
- semiconductor
- heat
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007710 freezing Methods 0.000 title claims abstract description 87
- 230000008014 freezing Effects 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 65
- 238000005057 refrigeration Methods 0.000 claims abstract description 64
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims description 40
- 239000007788 liquid Substances 0.000 claims description 33
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 238000010257 thawing Methods 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000010276 construction Methods 0.000 abstract description 15
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- 239000008239 natural water Substances 0.000 abstract description 2
- 239000002689 soil Substances 0.000 description 24
- 239000012267 brine Substances 0.000 description 11
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000009412 basement excavation Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000005755 formation reaction Methods 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D3/00—Improving or preserving soil or rock, e.g. preserving permafrost soil
- E02D3/11—Improving or preserving soil or rock, e.g. preserving permafrost soil by thermal, electrical or electro-chemical means
- E02D3/115—Improving or preserving soil or rock, e.g. preserving permafrost soil by thermal, electrical or electro-chemical means by freezing
Landscapes
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Soil Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Agronomy & Crop Science (AREA)
- Mining & Mineral Resources (AREA)
- Paleontology (AREA)
- Civil Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
Abstract
The invention relates to a freezing device for freezing stratums in sections, which at least comprises a protection tube, a radiating tube and a solid-state refrigerating device, wherein the solid-state refrigerating device is composed of a plurality of semiconductor refrigerating sheets which are directionally arranged, and the semiconductor refrigerating sheets can be axially and/or circumferentially distributed between the protection tube and the radiating tube; under the condition that the control unit can independently control the circuit, the current magnitude and the direction of any group of semiconductor refrigeration pieces, the control unit can realize segmented freezing according to the mode of independently controlling the semiconductor refrigeration pieces with certain length in the protection pipe. The freezer can freeze the stratum directly after being electrified and refrigerated without building a freezing station, thereby greatly reducing the engineering cost and the construction period, reducing the cost and improving the working efficiency; segmented freezing, directional freezing and forced unfreezing can be realized according to engineering requirements, so that the refrigeration cost is saved and the construction period is shortened; natural water is adopted for cooling in a circulating way, so that the risk of environmental pollution caused by leakage does not exist.
Description
The invention relates to a split application of a thermoelectric refrigeration artificial stratum freezer, wherein the application number is 201910426509.5, the application date is 2019, 05 and 22, and the application type is the invention.
Technical Field
The invention belongs to the field of underground engineering design, and particularly relates to a freezing device and a freezing method for freezing a stratum in a segmented manner.
Background
The artificial stratum freezing method is to utilize the artificial refrigeration method, send the low-temperature refrigerant into the water-containing stratum around the excavation body, make the water in the stratum freeze into ice continuously in the temperature field below its freezing point and form a watertight integral structure by the soil granule in the stratum with ice-binding, and the integral strength and elastic modulus of this frozen soil structure are far greater than the non-frozen soil, will freeze the stratum around the excavation body into the closed continuum body (frozen soil wall), in order to resist the ground pressure and isolate the relation between underground water and excavation body, then can carry on excavation and construction supporting under the protection of the closed continuum frozen soil wall. The method is suitable for loose unstable flushing layers, fractured hydrous rock layers, soft mudstone and rock layers with extremely large water content and water pressure. The freezing method is characterized in that a freezer is buried in a stratum to be treated, a negative temperature refrigerant medium circulating in the freezer absorbs heat of the stratum to freeze water in the stratum around the freezer into ice from near to far, and rock and soil particles on the periphery are integrated through ice gel. If the freezing pipes are buried at proper intervals, the adjacent frozen soil columns are continuously enlarged and connected to form a continuous frozen soil wall or a closed frozen soil structure, so that the frozen soil wall has complete water stopping property and high strength and can be used as a protective measure for temporary excavation. The traditional freezer is mainly composed of an external freezing pipe and an internal liquid supply pipe, brine enters the liquid supply pipe through a liquid distribution ring, flows into an annular space formed by the liquid supply pipe and the freezing pipe after reaching the bottom, and then enters a liquid collection ring through a liquid return pipe, and the circulation sequence is called as positive circulation, and vice versa.
The conventional freezer has the following disadvantages:
1. the construction process is complicated and the time is too long. Firstly, a freezing station is required to be established, mainly an ammonia compression refrigerating unit, then a hole is drilled at a part to be frozen, a freezer is put down, the ammonia compression refrigerating unit is started, the temperature of brine is reduced, and then heat is continuously absorbed from a stratum by means of circulation of the brine in the freezer, so that the purpose of freezing is achieved. The time required for the construction preparation period and the freezing period is long.
2. The power requirement is excessive. In the freezing project mainly based on the negative temperature brine circulation, the electric energy needs to be converted into mechanical energy, the mechanical energy needs to be converted into heat energy, the conversion process is complex, and a large amount of electric energy is wasted in the middle.
3. Leakage is likely to cause pollution. Because the freezing pipe is precooled and contracted in the freezing process, the shrinkage stress is formed inside, the outside is frozen, and the extrusion force is caused, the freezing pipe is easy to break, the brine leakage is caused, the project progress is influenced, and the stratum is polluted.
4. The engineering construction cost is high. As the unit of the freezing station needs to be maintained by a special person, the construction time is long, a large amount of electric energy is consumed,
the construction cost of the existing freezing system is too high.
In addition, the single length of the brine freezers used in the existing urban underground engineering usually varies from several meters to ten and several meters, and in the freezing engineering of mines, the freezing depth often reaches hundreds of meters or even thousands of meters. In such a long freezing range, the conventional brine freezer needs to circularly cool a large amount of brine in the whole basin in a brine cooling period, and the longer the length of the freezing pipe is, the larger the volume of the brine is, the longer the cooling time is, and the construction period is seriously prolonged. On the other hand, the manual excavation and the support under the water sealing and the support of the frozen soil wall are performed in sections, and the saline water freezer synchronously freezes the soil bodies excavated at different periods in an active freezing stage without difference, so that the heat of the soil bodies excavated at a long period enters circulating saline water, and the workload of a compression refrigerating unit is increased. Therefore, the segmented freezing function of the freezer plays an important role in saving energy of the artificial floor freezing engineering. Therefore, a freezer capable of flexibly and reasonably adjusting the working states of different sections according to the tunneling speed of underground engineering is needed, so that energy waste is reduced as much as possible on the premise of meeting the safety requirement and the construction period requirement, and good economy is realized.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a thermoelectric refrigeration artificial stratum freezer which is simple in structure, short in construction period, low in cost and free of leakage; and segmented freezing, directional freezing and forced thawing can be realized according to engineering requirements.
In order to achieve the above purposes, the invention adopts the technical scheme that: provide for
A thermoelectric refrigeration artificial stratum freezer comprises a protection device arranged outside, a heat dissipation device arranged inside and a solid refrigeration device arranged between the protection device and the heat dissipation device, wherein the solid refrigeration device is a semiconductor refrigeration sheet, the semiconductor refrigeration sheet is provided with a heat absorption end and a heat dissipation end, the heat absorption end is attached to the protection device, the heat dissipation end is attached to the heat dissipation device, after the thermoelectric refrigeration artificial stratum freezer is powered on, the heat absorption end absorbs stratum heat, and the heat dissipation end takes away the stratum heat through the heat dissipation device; the semiconductor refrigerating sheet controls the circuit, the current and the direction of the semiconductor refrigerating sheet through the control unit.
Further, according to the thermoelectric refrigeration artificial stratum freezer, the semiconductor refrigeration sheet is of a sheet structure or an arc structure; the refrigeration level is single-stage refrigeration, two-stage refrigeration or multi-stage refrigeration.
Further, according to the thermoelectric refrigeration artificial stratum freezer, the plurality of semiconductor refrigeration pieces are uniformly distributed between the protection device and the heat dissipation device along the axial direction or the circumferential direction, and each semiconductor refrigeration piece is controlled by the control unit.
Further, as for the thermoelectric refrigeration artificial stratum freezer, the control unit comprises a single chip microcomputer and an H bridge, the single chip microcomputer is in data communication with a computer through an interface, receives a computer command and controls the H bridge to work; the H bridge receives the order of the singlechip and regulates and controls the current of the semiconductor refrigerating sheet.
Further, as mentioned above, a thermoelectric refrigeration artificial ground freezer, the heat abstractor is water-cooling double pipe radiator, including outside cooling tube and inside feed pipe, forms the space of returning the liquid between cooling tube and the feed pipe.
Further, as mentioned above, the heat radiation pipe is provided with a liquid discharge hole, and the liquid discharge hole is communicated with the liquid return space.
Further, as for the thermoelectric refrigeration artificial formation freezer, the protection device is a protection tube with good thermal conductivity and high strength, the protection tube is a closed thin tube, and the cross section of the closed thin tube is in a circular or polygonal structure.
Further, as above-mentioned a thermoelectric refrigeration artificial stratum freezer, the exterior structure of cooling tube and the inner structure looks adaptation of protection tube.
Further, according to the thermoelectric refrigeration artificial formation freezer, a temperature sensor for detecting the temperature of the protection device and the temperature of the heat dissipation device is arranged in a space formed among the protection device, the heat dissipation device and the solid-state refrigeration device, and the temperature sensor is arranged in a lead and a temperature sensor groove and connected with a computer.
The invention has the beneficial technical effects that:
(1) according to the freezer, the solid-state refrigerating device is arranged between the protection device and the heat dissipation device, and the solid-state refrigerating device is electrified for refrigerating, so that the stratum can be directly frozen, the need of building a freezing station in the early stage of a freezing project of a traditional brine system is avoided, and the project cost and the project period are greatly reduced.
(2) The solid-state refrigerating device can realize segmented freezing and directional freezing by controlling the circuit switch of the solid-state refrigerating device through the control unit, thereby saving electric energy; the freezing strength is changed by changing the current or voltage in the circuit, so that the digging time is shortened; through changing the current direction in the circuit, can force the unfreezing immediately after digging and building engineering is accomplished, can shorten the artifical time that freezes the stratum and melt, the slip casting construction in more reasonable arrangement later stage to better control subsides, very big meaning to control engineering risk and reduction of erection time, saving refrigeration and maintenance cost simultaneously can be by a wide margin.
(3) The heat dissipation device adopts natural water to circularly flow for heat dissipation, and the risk of environmental pollution after leakage does not exist.
Drawings
FIG. 1 is a cross-sectional view of the freezer of the present invention;
FIG. 2 is a front view of the freezer of the present invention;
FIG. 3 is a schematic diagram of the segmented freezing configuration of the freezer of the present invention;
FIG. 4 is a schematic diagram of the directional freezing configuration of the freezer of the present invention;
FIG. 5 is a layout view of the semiconductor chilling plates of the present invention;
FIG. 6 is a control schematic of the freezer of the present invention;
fig. 7 is a circuit diagram of a control unit of the present invention.
List of reference numerals
1: protecting the tube 2: semiconductor refrigeration piece 3: radiating pipe
4: a heat release end 5: a heat absorption end 6: liquid supply tube
7: wire and temperature sensor pocket 8: the control unit 9: drain hole
10: a pipe head 11: strong frozen soil area 12: weak frozen soil area
13: the area to be excavated 14: temperature sensor 15: freezing device
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
As shown in fig. 1-3, the invention provides a thermoelectric refrigeration artificial formation freezer which can be used for freezing artificial formations and other frozen bodies. The solid-state refrigeration device comprises a protection device, a solid-state refrigeration device, a heat dissipation device and a control unit 8, wherein the heat dissipation device is arranged in the protection device, the solid-state refrigeration device is arranged between the protection device and the heat dissipation device and tightly attached to the protection device and the heat dissipation device, and the control unit 8 is used for controlling a circuit, the current and the direction of the solid-state refrigeration device. A temperature sensor 14 for detecting the temperature of the protection device and the heat dissipation device is arranged in a space formed among the protection device, the heat dissipation device and the solid-state refrigeration device, and the temperature sensor 14 is arranged in the lead and temperature sensor groove 7 and is connected with a computer.
The protection device is a protection tube 1 with good heat conductivity and high strength, the protection tube 1 is a closed thin tube and is made of metal, and therefore heat can be efficiently transferred and internal components can be protected from being damaged. The pipe comprises a pipe body and a pipe head 10, wherein the cross section of the pipe body is of a circular structure or polygonal structures such as a triangle, a quadrangle, a pentagon, a hexagon and the like, and is determined according to actual use requirements, and the hexagonal structure is used for illustration; the pipe head 10 is of a conical configuration to facilitate drilling into the formation.
The heat dissipation device is a water-cooling sleeve type heat radiator, and comprises a heat dissipation pipe 3 arranged outside and a liquid supply pipe 6 arranged inside, a liquid return space is formed between the heat dissipation pipe 3 and the liquid supply pipe 6, a liquid discharge hole 9 is formed in the heat dissipation pipe 3, and the liquid discharge hole 9 is communicated with the liquid return space. During operation, the circulating cooling water flows in from the liquid supply pipe 6, reversely flows into the liquid return space at the end of the liquid supply pipe 6, and is discharged through the liquid discharge hole 9, thereby completing the heat dissipation operation, as shown in fig. 2, the arrow direction in the figure is the cooling water circulating flow direction, and it should be noted that the water flow may be reversed. For a better arrangement of the solid state refrigeration device the outer shape of the radiating pipe 3 is adapted to the inner shape of the protective pipe 1.
The solid-state refrigerating device is a semiconductor refrigerating piece 2, the semiconductor refrigerating piece 2 is also called a thermoelectric refrigerating piece, the thermoelectric refrigerating piece utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and therefore the refrigerating effect is achieved immediately. When the semiconductor refrigerating sheet 2 works, the temperature difference between the cold end and the hot end is fixed, so that the temperature of the cold end is reduced, and the temperature of the hot end is lower, thereby improving the refrigerating capacity of the refrigerating end.
The semiconductor refrigerating plate 2 is of a sheet structure, an arc structure or other structural shapes and is determined according to actual use requirements. The semiconductor refrigerating plate 2 can select single-stage refrigeration, two-stage refrigeration or multi-stage refrigeration, and the refrigeration level is selected according to the required freezing intensity to meet the refrigeration requirement.
The arrangement position, the number and the angle of the semiconductor refrigeration pieces 2 can be changed as required, and various arrangement modes can be selected while the structure of the protection tube and the radiating tube is met.
According to the freezer, the plurality of semiconductor refrigerating sheets 2 can be uniformly distributed between the protective pipe 1 and the radiating pipe 3 along the axial direction or the circumferential direction, and each semiconductor refrigerating sheet 2 is controlled by the control unit 8, so that segmented freezing, directional freezing, freezing strength adjustment and forced thawing are realized.
Freezing in a segmented mode: as shown in fig. 3, in the excavation process, the section a constructed and excavated first can be electrified and frozen first, and the section B can be electrified and frozen after a period of time according to the progress of the project. Therefore, the engineering requirements can be met, and the energy can be greatly saved. Of course, the freezing method can be divided into multiple segments according to the requirement of the actual freezing length (or depth) of the project, and only the simplest 2-segment freezing implementation method is demonstrated here.
Directional freezing: as shown in fig. 4 and 5, taking single-loop freezing as an example, by controlling the circuits of the semiconductor chilling plates 2, the freezer 15 absorbs heat from 3 semiconductor chilling plates 2 facing the strong frozen soil area 11, and freezes the stratum on the outer side; meanwhile, 3 semiconductor refrigerating sheet 2 circuits facing the weak moving soil area of the freezer 15 are closed by controlling the semiconductor refrigerating sheet 2 circuits, so that the freezing quantity of frozen soil entering the area to be excavated 13 is weakened. Therefore, a low-temperature high-strength outer ring frozen wall can be formed on the outer side of the freezer 15, the directional freezing effect of the thickness of the inner frozen wall can be reduced, the difficulty of soil excavation of the region 13 to be excavated can be reduced, and the cost and time of excavation operation can be reduced.
Adjusting freezing strength: in the positive freezing period, the maximum working current is adopted so as to obtain the optimal refrigeration effect, when the soil body reaches the freezing temperature requirement, the maintenance freezer is used, the current can be reduced, the freezing effect of the freezer just meets the condition that the frozen soil is not melted, and the electric energy consumption can be greatly saved.
Forced thawing: after the supporting structure is made, the embedded freezer can realize the exchange of the heat absorption end and the heat release end of the semiconductor refrigeration sheet by reversely connecting current, and the artificial frozen stratum is forcedly thawed. Therefore, the time for melting the frozen stratum by manual work can be greatly shortened, and the later grouting construction is more reasonably arranged, so that the settlement can be better controlled, and great significance is realized on controlling the engineering risk and shortening the construction period.
As shown in fig. 6, the control schematic diagram of the freezer is shown, in which a thick line is a signal line and a thin line is a power line. The freezer provides the required operating voltage of each part through direct current power DC, and control unit 8 regulates and control through the computer, and 8 semiconductor refrigeration pieces 2 of series connection can be controlled simultaneously to every control unit 8. When the device works, the temperature of the outer wall of the protection pipe and the temperature field information in the frozen soil collected by the temperature sensor 14 are returned to the computer, and the computer is assisted to regulate and control the control unit 8 through program operation. The control unit 8 changes the power of the semiconductor refrigerating sheet by controlling the duty ratio of the output PWM signal, so that the refrigerating intensity is adjusted. For example, during the active freezing period, full power refrigeration is adopted to obtain the best refrigeration effect; when the soil body reaches the freezing temperature requirement, the maintenance freezing period is started, the control unit 8 adjusts the duty ratio of the PWM signal sent by the control unit, and the refrigerating power of the semiconductor refrigerating sheet is reduced, so that the electric energy consumption is saved.
The control unit 8 may also control the closing and opening of the circuit.
As shown in fig. 7, the control unit 8 is mainly composed of a single chip microcomputer and an H-bridge. The single chip microcomputer is in data communication with the computer through the USB interface, and controls the H bridge to work after receiving a computer command. The H bridge receives the order of the single chip microcomputer and regulates and controls the current of the TEC semiconductor refrigerating plate 2, so that the freezer realizes the following working state conversion:
(1) freezing condition
The single chip microcomputer outputs high level to the two interfaces PWM1 and PWM4, and outputs low level to PWM2 and PWM3, so that MOS (metal oxide semiconductor) tubes Q1 and Q4 in the H bridge are switched on, MOS tubes Q2 and Q3 are switched off, the OUT1 end outputs high voltage, and the TEC semiconductor refrigeration piece is switched on in the forward direction and enters a refrigeration working state. The duty ratio of PWM1 and PWM4 signals is adjusted through the singlechip, the voltage of the output end is adjusted, and then the refrigerating power of the semiconductor refrigerating sheet is changed.
(2) Heating regime
The single chip microcomputer outputs high level to the two interfaces of PWM2 and PWM3, and outputs low level to PWM1 and PWM4, so that MOS (metal oxide semiconductor) tubes Q2 and Q3 in the H bridge are switched on, MOS tubes Q1 and Q4 are switched off, the OUT2 end outputs high voltage, the TEC semiconductor refrigeration piece is switched on reversely, and the TEC semiconductor refrigeration piece enters a heat release working state. The duty ratio of PWM1 and PWM4 signals is adjusted through the singlechip, the voltage of the output end is adjusted, and then the heat dissipation power of the semiconductor chilling plate is changed.
(3) Closed state
When four groups of PWM signals of the singlechip are all low level, the MOS tube is not conducted, the working voltage can not be provided for the TEC semiconductor refrigerating piece, and the semiconductor refrigerating piece stops working.
In summary, the freezer of the present invention utilizes the thermoelectric effect of the semiconductor material to refrigerate, dissipates heat through the heat dissipation device, and controls the current switch, direction and magnitude of the semiconductor refrigeration sheet by the control unit to realize the segmented freezing, directional freezing and forced thawing, thereby greatly reducing the engineering cost and construction period, reducing the cost, saving the energy and improving the working efficiency.
The thermoelectric refrigerating artificial formation freezer of the present invention is not limited to the above-mentioned embodiments, and those skilled in the art can derive other embodiments according to the technical solution of the present invention, and the embodiments also belong to the technical innovation scope of the present invention.
Claims (5)
1. The semiconductor refrigeration piece of the freezing device comprises a semiconductor refrigeration piece (2), and is characterized in that the semiconductor refrigeration piece (2) is used for adjusting the working states of different sections of the freezing device in a mode of being capable of being set to have a single-stage refrigeration level, a two-stage refrigeration level or a multi-stage refrigeration level so as to realize freezing and forced unfreezing in a segmented mode; the heat dissipation device is a water-cooling sleeve type heat dissipation device and comprises an external heat dissipation pipe (3) and an internal liquid supply pipe (6), a liquid return space is formed between the heat dissipation pipe (3) and the liquid supply pipe (6), a liquid discharge hole (9) is formed in the heat dissipation pipe (3), and the liquid discharge hole (9) is communicated with the liquid return space; the control unit comprises a singlechip and an H bridge, the singlechip is in data communication with the computer through an interface, receives a computer command and controls the H bridge to work; h bridge receives the order of single chip computer, regulate and control the current of semiconductor refrigerating chip; the control unit (8) can independently control the semiconductor refrigerating sheet (2) in a certain area or a certain length in the protection tube (1), so that segmented freezing and directional freezing are realized; the semiconductor refrigeration piece (2) is provided with a heat absorption end (5) and a heat release end (4), wherein the heat absorption end (5) is attached to the inner wall of the protection tube (1) of the freezing device, and the heat release end (4) is attached to the outer wall of the heat dissipation tube (3) of the freezing device; under the condition that the semiconductor refrigeration piece (2) is electrified, the heat absorption end (5) absorbs the formation heat, and the heat release end (4) takes away the formation heat through the radiating pipe (3).
2. A freezing device for freezing a ground layer in sections, comprising at least a protective pipe (1) and a radiating pipe (3), characterized by further comprising the semiconductor chilling plate (2) of claim 1, wherein the semiconductor chilling plate (2) can be distributed axially and/or circumferentially between the protective pipe (1) and the radiating pipe (3); under the condition that the control unit (8) can independently control the circuits, the current magnitude and the current direction of any group of semiconductor refrigerating pieces (2), the control unit (8) can realize segmented freezing according to the mode of independently controlling the semiconductor refrigerating pieces (2) with certain length in the protection tube (1).
3. The freezing apparatus for freezing a ground in sections as claimed in claim 2, wherein a temperature sensor (14) for sensing the temperature of the protection pipe (1) and the radiation pipe (3) is provided in a space formed between the protection pipe (1), the radiation pipe (3) and the semiconductor cooling fin (2), said temperature sensor (14) being installed in the wire and temperature sensor groove (7) and connected to the computer.
4. The unfreezing method of the freezing device is characterized by at least comprising a semiconductor refrigerating sheet (2), a control unit (8) and a heat dissipation device, wherein under the condition that circulating cooling water flows into the heat dissipation device, the semiconductor refrigerating sheet (2) realizes the exchange of a heat absorption end and a heat release end of the semiconductor refrigerating sheet (2) in a reverse current mode, so that the artificially frozen stratum is forcedly unfrozen;
the heat dissipation device is a water-cooling sleeve type heat dissipation device and comprises an external heat dissipation pipe (3) and an internal liquid supply pipe (6), a liquid return space is formed between the heat dissipation pipe (3) and the liquid supply pipe (6), a liquid discharge hole (9) is formed in the heat dissipation pipe (3), and the liquid discharge hole (9) is communicated with the liquid return space; the control unit comprises a single chip microcomputer and an H bridge, the single chip microcomputer is in data communication with the computer through an interface, receives a computer command and controls the H bridge to work; h bridge receives the order of single chip computer, regulate and control the current of semiconductor refrigerating chip;
the control unit (8) can independently control the semiconductor refrigerating sheet (2) in a certain area or a certain length in the protection tube (1), so that segmented freezing and directional freezing are realized;
the semiconductor refrigeration piece (2) is provided with a heat absorption end (5) and a heat release end (4), wherein the heat absorption end (5) is attached to the inner wall of the protection tube (1) of the freezing device, and the heat release end (4) is attached to the outer wall of the heat dissipation tube (3) of the freezing device; under the condition that the semiconductor refrigeration piece (2) is electrified, the heat absorption end (5) absorbs the formation heat, and the heat release end (4) takes away the formation heat through the radiating pipe (3).
5. Thawing method for freezing apparatuses, according to claim 4, wherein said control unit (8) controls the operating conditions of the solid state refrigeration apparatus for different sections of the freezing apparatus along its axial direction, respectively, according to the thawing requirements, thereby achieving the sectional thawing;
the solid-state refrigerating device is composed of a plurality of semiconductor refrigerating sheets which are directionally arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011235665.2A CN112376544B (en) | 2019-05-22 | 2019-05-22 | Freezing device and method for freezing stratum in sections |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011235665.2A CN112376544B (en) | 2019-05-22 | 2019-05-22 | Freezing device and method for freezing stratum in sections |
| CN201910426509.5A CN110106863B (en) | 2019-05-22 | 2019-05-22 | Thermoelectric refrigeration artificial stratum freezer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910426509.5A Division CN110106863B (en) | 2019-05-22 | 2019-05-22 | Thermoelectric refrigeration artificial stratum freezer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112376544A CN112376544A (en) | 2021-02-19 |
| CN112376544B true CN112376544B (en) | 2022-04-08 |
Family
ID=67491555
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910426509.5A Active CN110106863B (en) | 2019-05-22 | 2019-05-22 | Thermoelectric refrigeration artificial stratum freezer |
| CN202011235665.2A Active CN112376544B (en) | 2019-05-22 | 2019-05-22 | Freezing device and method for freezing stratum in sections |
| CN202011235664.8A Active CN112376543B (en) | 2019-05-22 | 2019-05-22 | Freezing device and method for directionally freezing stratum |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910426509.5A Active CN110106863B (en) | 2019-05-22 | 2019-05-22 | Thermoelectric refrigeration artificial stratum freezer |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011235664.8A Active CN112376543B (en) | 2019-05-22 | 2019-05-22 | Freezing device and method for directionally freezing stratum |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN110106863B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113089680B (en) * | 2021-04-16 | 2022-02-11 | 中国矿业大学 | Method for realizing excavation-following and supporting partitioned excavation of foundation pit by utilizing artificial freezing method |
| CN114109398B (en) * | 2021-11-29 | 2023-01-03 | 中国矿业大学(北京) | Thermoelectric refrigeration manual freezing shield cutter head |
| CN117044531B (en) * | 2023-08-11 | 2024-09-03 | 四川农业大学 | Desert greenhouse skeleton system and control method thereof |
| CN117722189B (en) * | 2024-02-07 | 2024-04-26 | 中煤科工开采研究院有限公司 | Tunneling method for soft broken coal seam by freezing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104061654A (en) * | 2014-06-16 | 2014-09-24 | 邯郸美的制冷设备有限公司 | Radiating control device and radiating control method of variable frequency air conditioner |
| CN207674758U (en) * | 2017-12-27 | 2018-07-31 | 宁波方太厨具有限公司 | A kind of water-cooling type semiconductor cooling device |
| CN208001072U (en) * | 2018-04-08 | 2018-10-23 | 北京华宇德信光电技术有限公司 | A kind of semiconductor refrigerating chip temperature control device for laser |
| CN108895764A (en) * | 2018-09-15 | 2018-11-27 | 乔燕春 | A kind of multistage overlay semiconductor ultralow temperature rapid cooling device |
| CN109788715A (en) * | 2019-01-21 | 2019-05-21 | 中国石油集团工程技术研究院有限公司 | One kind is with circuit semiconductor active cooling system and cool-down method under drilling well |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4487024A (en) * | 1983-03-16 | 1984-12-11 | Clawson Machine Company, Inc. | Thermoelectric ice cube maker |
| DE19625125C1 (en) * | 1996-06-13 | 1997-06-05 | Lla Umwelttechnische Analytik | Soil sample extraction method |
| JP3228728B2 (en) * | 1999-06-18 | 2001-11-12 | 錦城護謨株式会社 | Ground improvement method by board drain using freeze-thaw |
| JP4098653B2 (en) * | 2003-03-28 | 2008-06-11 | 譲 伊藤 | Purification method and purification body of contaminated ground by freezing and suction |
| KR20110001935U (en) * | 2009-08-19 | 2011-02-25 | 주식회사 영동테크 | The Cooling Sistem of Modulizing LED Lighting Apparatus |
| CN103726852B (en) * | 2013-12-17 | 2016-01-13 | 北京中煤矿山工程有限公司 | A kind of inclined shaft step-by-step movement frozen construction technique |
| CN104653185B (en) * | 2015-01-27 | 2016-06-29 | 中国矿业大学 | One freezes the adjustable frigo of segment length and freezing method thereof |
| CN205484141U (en) * | 2016-04-05 | 2016-08-17 | 西安科技大学 | Frozen soil freeze -thaw cycle experimental apparatus |
| CN106017744A (en) * | 2016-06-19 | 2016-10-12 | 杭州滨创能源科技有限公司 | Device and method for testing heat exchange amount and thermophysical performance in binary-state heat exchange of buried pipe and rock-soil |
| CN108121381A (en) * | 2016-11-28 | 2018-06-05 | 王明良 | A kind of semiconductor chilling plate thermostatic control system for driving circuit of being spoilt based on H |
| CN106644653A (en) * | 2017-02-07 | 2017-05-10 | 中国科学院寒区旱区环境与工程研究所 | Device and method for preparing and measuring frozen soil sample |
| CN107462594B (en) * | 2017-08-16 | 2020-03-31 | 内蒙古农业大学 | Indoor simulation method for soil freezing and thawing process |
| CN110055980B (en) * | 2019-04-15 | 2020-12-25 | 宁夏大学 | Thermoelectric refrigeration slide-resistant pile and construction method |
-
2019
- 2019-05-22 CN CN201910426509.5A patent/CN110106863B/en active Active
- 2019-05-22 CN CN202011235665.2A patent/CN112376544B/en active Active
- 2019-05-22 CN CN202011235664.8A patent/CN112376543B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104061654A (en) * | 2014-06-16 | 2014-09-24 | 邯郸美的制冷设备有限公司 | Radiating control device and radiating control method of variable frequency air conditioner |
| CN207674758U (en) * | 2017-12-27 | 2018-07-31 | 宁波方太厨具有限公司 | A kind of water-cooling type semiconductor cooling device |
| CN208001072U (en) * | 2018-04-08 | 2018-10-23 | 北京华宇德信光电技术有限公司 | A kind of semiconductor refrigerating chip temperature control device for laser |
| CN108895764A (en) * | 2018-09-15 | 2018-11-27 | 乔燕春 | A kind of multistage overlay semiconductor ultralow temperature rapid cooling device |
| CN109788715A (en) * | 2019-01-21 | 2019-05-21 | 中国石油集团工程技术研究院有限公司 | One kind is with circuit semiconductor active cooling system and cool-down method under drilling well |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110106863A (en) | 2019-08-09 |
| CN112376543B (en) | 2022-03-22 |
| CN110106863B (en) | 2020-11-06 |
| CN112376543A (en) | 2021-02-19 |
| CN112376544A (en) | 2021-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112376544B (en) | Freezing device and method for freezing stratum in sections | |
| CN100427853C (en) | Air conditioning and heating system with cold and warm gas operating simultaneously utilizing geothermal heat, and controlling means thereof | |
| CN101881492B (en) | Dynamic ice cold storing and refrigerating equipment | |
| KR101993627B1 (en) | Geothermal heating and cooling system for optimization of heat pump And That control method | |
| CN101736715A (en) | Energy stepped system of road heat collection and heat release by snow and ice melting | |
| CN108518894B (en) | Energy storage type buried pipe heat exchange system | |
| CN205154229U (en) | Attached water film board heat exchanger heat sink of high temperature mine tunnel wall | |
| TW201905391A (en) | Method for controlling heat exchange device, heat exchange device, and water-cooled heat pump device | |
| US20200096262A1 (en) | Latent heat accumulator system comprising a latent heat accumulator and method for operating a latent heat accumulator system | |
| CN106440131A (en) | Method for saving embedded pipes of ground source heat pump system | |
| CN117703432A (en) | Tunnel heat injury and freeze injury treatment system | |
| CN204460887U (en) | A kind of solar energy annular heat cast cold accumulation refrigerator | |
| CN106152612B (en) | A kind of heat pump heating and cooling system for extracting heat of solidification or ice making | |
| CN109944626B (en) | Tunnel phase change cold accumulation cooling system | |
| CN110410131B (en) | Mine heat damage treatment and comprehensive utilization system | |
| CN110067588B (en) | Tunnel cold air system based on phase change cold storage | |
| CN201302325Y (en) | Production equipment water cooling system | |
| RU2435904C2 (en) | System of soils freezing | |
| CN215718951U (en) | Large-scale gravity-assisted loop heat pipe anti-freezing system for tunnel in alpine region | |
| CN201555316U (en) | Cooling energy-saving device of unmanned engine room and base station | |
| CN110080817B (en) | Tunnel aeration cooling system based on phase change cold storage | |
| CN211572297U (en) | Water falling system capable of preventing icing | |
| KR101993628B1 (en) | A geothermal heating / cooling device capable of coping with a variable load with a preheating function | |
| CN108332450B (en) | Closed circulation heat exchange capacity lifting system device for middle-deep ground source well | |
| CN113007905A (en) | Solar energy and middle-deep layer geothermal energy composite snow-melting and ice-melting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |