CN107172818B - Full-automatic etching device and control method thereof - Google Patents

Full-automatic etching device and control method thereof Download PDF

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Publication number
CN107172818B
CN107172818B CN201710565278.7A CN201710565278A CN107172818B CN 107172818 B CN107172818 B CN 107172818B CN 201710565278 A CN201710565278 A CN 201710565278A CN 107172818 B CN107172818 B CN 107172818B
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China
Prior art keywords
spraying
etching
roller
circuit board
controller
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CN201710565278.7A
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CN107172818A (en
Inventor
马卓
杜林峰
杨中正
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Xinfeng Xunjiexing Circuit Technology Co ltd
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Xinfeng Xunjiexing Circuit Technology Co ltd
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Publication of CN107172818A publication Critical patent/CN107172818A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a full-automatic etching device, which belongs to the field of etching devices, and comprises an etching box, wherein a spraying mechanism is arranged at the top of the etching box and comprises a first swinging cylinder, a spraying bin is fixed on an output shaft of the first swinging cylinder, two guide rails are arranged below the spraying mechanism, a manipulator is arranged between the two guide rails and comprises a base and a lifting cylinder positioned on the base, an output shaft of the lifting cylinder is connected with a second swinging cylinder through a fixing piece, an output shaft of the second swinging cylinder is connected with a telescopic cylinder through a fixing piece, and an output shaft of the telescopic cylinder is connected with a gas claw through a fixing piece. The invention also discloses a control method for the full-automatic etching device, and the full-automatic etching device disclosed by the invention can realize that etching liquid covers all areas needing etching, and meanwhile, the etching liquid left on the surface area of the circuit board can be removed, so that the circuit board is contacted with new etching liquid.

Description

Full-automatic etching device and control method thereof
Technical Field
The present invention relates to the field of etching apparatuses, and more particularly, to a fully automatic etching apparatus and a control method for the same.
Background
In the prior art, a spray pipe for spraying etching liquid on a circuit board is a linear spray pipe with a plurality of spray nozzles, gaps between adjacent spray nozzles are the same, and the spray angles of the spray nozzles are fixed, so that the etching liquid cannot cover all areas needing etching easily, the etching of the circuit board is uneven, after the etching liquid is sprayed for a period of time, the etching liquid can remain on the surface area of the circuit board, the circuit board is difficult to contact with new etching liquid, and the etching effect is affected. In addition, the degree of automation of the existing etching device is not high, manual auxiliary operation is often needed, and production efficiency is reduced.
Disclosure of Invention
In order to overcome the defects of the prior art, the technical problem to be solved by the invention is to provide a full-automatic etching device which can realize that etching liquid covers all areas needing etching, so that the etching of a circuit board is uniform, and meanwhile, the etching liquid left on the surface area of the circuit board can be removed, so that the circuit board is contacted with new etching liquid.
To achieve the purpose, the invention adopts the following technical scheme:
the invention provides a full-automatic etching device, which comprises an etching box, wherein a spraying mechanism for spraying etching liquid is arranged at the top of the etching box, the spraying mechanism comprises a first swinging cylinder, a spraying bin is fixed on an output shaft of the first swinging cylinder, the spraying bin comprises a first spraying area and a second spraying area, the second spraying area surrounds the first spraying area, the density of nozzles in the first spraying area is greater than that of nozzles in the second spraying area, two guide rails are arranged below the spraying mechanism, an objective table which moves along the guide rails is arranged on the guide rails, the objective table is driven by a servo motor, a manipulator for grabbing and overturning a circuit board is arranged between the two guide rails, the manipulator comprises a base, and a lifting cylinder which is positioned on the base, the output shaft of the lifting cylinder is connected with a second swinging cylinder through a fixing piece, the output shaft of the second swinging cylinder is connected with a telescopic cylinder through a fixing piece, the output shaft of the telescopic cylinder is connected with a pneumatic claw through the fixing piece, and the first swinging motor, the lifting cylinder, the second swinging cylinder and the telescopic cylinder are electrically connected with a pneumatic claw.
In a preferred embodiment of the present invention, the second spray zone comprises four sub-spray zones, each of which communicates with the second infusion tube.
In a preferred embodiment of the invention, the four sub-spray zones are separated by four baffles.
In a preferred embodiment of the invention, the first spraying area is communicated with a first infusion tube, the first infusion tube and the second infusion tube are communicated with a total infusion tube, a heater and a temperature sensor positioned at the downstream of the heater are arranged on the total infusion tube, and the heater and the temperature sensor are electrically coupled with the controller.
In a preferred embodiment of the present invention, a first electric valve is disposed on the first infusion tube, a second electric valve is disposed on the second infusion tube, and the first electric valve and the second electric valve are electrically coupled with the controller.
In a preferred embodiment of the invention, the side walls at two ends of the etching box are provided with an inlet and an outlet, the inlet is positioned above the objective table, the outlet and the objective table are positioned at the same height, and a proximity switch is arranged above the inlet and electrically connected with the controller.
In a preferred embodiment of the invention, a first roller, a second roller at the same height as the first roller, a third roller obliquely below the second roller and a fourth roller at the same height as the third roller are arranged in the etching box, the upper surface of the first roller, the upper surface of the second roller and the inlet are positioned at the same height, the third roller is positioned at one side of the second roller far away from the inlet, the lower surface of the third roller is higher than the upper surface of the object stage, and a conveyor belt sequentially penetrates through the first roller, the second roller, the third roller and the fourth roller, and is driven by a conveyor motor, and the conveyor motor is electrically connected with the controller.
In a preferred embodiment of the present invention, the upper surface of the stage is provided with a guide plate.
In a preferred embodiment of the invention, a photoelectric switch is arranged on the guide rail, and the photoelectric switch is positioned right below the edge position of one side of the spraying bin close to the outlet.
The invention also provides a control method for the full-automatic etching device, which can realize that the etching liquid covers all areas needing to be etched, so that the etching of the circuit board is uniform, and meanwhile, the etching liquid left on the surface area of the circuit board can be removed, so that the circuit board is contacted with the new etching liquid, and the automatic control of the etching process of the circuit board is realized. The method comprises the following steps:
s1, the controller controls the servo motor to drive the objective table to move towards the inlet of the etching box, so that the objective table receives a circuit board;
s2, the controller controls the servo motor to drive the objective table to convey the circuit board to the position right below the spraying mechanism;
s3, the controller controls the first swing cylinder, the first spraying area and the second spraying area spray etching liquid to the circuit board, the spraying time is set, and the first spraying process is finished;
s4, the controller controls the air claw to clamp the circuit board, the controller controls the second swing cylinder to swing for a preset angle, after the second swing cylinder swings for a preset number of times, the controller controls the second swing cylinder to place the circuit board on the objective table, the controller controls the air claw to loosen the circuit board, and the first overturning process is finished;
s5, repeating the step S3 and the step S4 until the ideal etching effect is achieved;
and S6, the controller controls the servo motor to drive the objective table to convey the circuit board to an outlet of the etching box.
The beneficial effects of the invention are as follows:
according to the full-automatic etching device provided by the invention, the spraying bin is arranged on the first swinging cylinder, so that etching liquid can cover all areas needing etching; the arrangement of the claws is convenient for clamping the circuit board, the claws are connected with the second swinging air cylinder, the circuit board is turned over, etching liquid accumulated on the circuit board is convenient to remove, and the circuit board is contacted with new etching liquid; the guide rail and the objective table are arranged, so that the circuit board can be conveniently conveyed; the first swing cylinder, the servo motor, the lifting cylinder, the second swing cylinder, the telescopic cylinder and the air claw are electrically connected with the controller, so that automatic control of etching of the circuit board is realized.
Drawings
FIG. 1 is a front view of a fully automatic etching apparatus according to a first embodiment of the present invention;
fig. 2 is a top view of a spray booth provided in accordance with an embodiment of the present invention.
In the figure:
100. an etching box; 101. an inlet; 102. an outlet; 103. a proximity switch; 104. a first roller; 105. a second roller; 106. a third roller; 107. a fourth roller; 200. a spraying mechanism; 210. a first swing cylinder; 220. a spraying bin; 230. a first spray zone; 231. a first infusion tube; 232. a first electrically operated valve; 240. a second spray zone; 241. a second infusion tube; 242. a baffle; 243. a main infusion tube; 244. a heater; 245. a temperature sensor; 246. a second electrically operated valve; 310. a guide rail; 311. an optoelectronic switch; 320. an objective table; 321. a servo motor; 322. a guide plate; 400. a manipulator; 410. a base; 420. a lifting cylinder; 430. a second swing cylinder; 440. a telescopic cylinder; 450. a gas claw; 500. and a controller.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
Example 1
As shown in fig. 1 and 2, the full-automatic etching device provided in this embodiment includes an etching box 100, a spraying mechanism 200, a guide rail 310, a mechanical arm 400, and a controller 500, where the spraying mechanism 200 is disposed at the top of the etching box 100, the spraying mechanism 200 includes a first swing cylinder 210, a spraying cabin 200 is disposed on an output shaft of the first swing cylinder 210, the spraying cabin 200 includes a first spraying area 230 and a second spraying area 240, the second spraying area 240 is disposed around the first spraying area 230, a density of nozzles in the first spraying area 230 is greater than a density of nozzles in the second spraying area 240, two guide rails 310 are disposed below the spraying cabin 200, a stage 320 moving along the guide rail 310 is disposed on the guide rail 310, the stage 320 is driven by a servo motor 321, the mechanical arm 400 is disposed between the two guide rails 310, the mechanical arm 400 includes a base 410, and a lifting cylinder 420 disposed on the base 410, an output shaft of the lifting cylinder 420 is connected with the second swing cylinder 430 through a fixing element, an output shaft of the second swing cylinder 430 is connected with a telescopic cylinder 440 through the fixing element, an output shaft of the telescopic cylinder 440 is connected with the telescopic cylinder 450 through the fixing element, and the output shaft of the telescopic cylinder 450 is connected with the output shaft of the lifting cylinder 420 through the fixing element, and the output shaft of the lifting cylinder 420, the telescopic cylinder 430 is electrically connected with the first swing cylinder 430, the second swing cylinder 430, and the telescopic cylinder 440 is electrically controlled by the telescopic cylinder 430. The spray booth 220 is disposed on the first swing cylinder 210 such that the etching liquid covers all areas to be etched. The provision of the finger 450 facilitates the gripping of the circuit board, and the provision of the second swing cylinder 430 facilitates the overturning of the circuit board, facilitates the removal of the etching liquid deposited on the circuit board, and allows the circuit board to be in contact with the new etching liquid. The first spraying area 230 is convenient for spraying more etching liquid to the central area of the circuit board, which is beneficial to quickening the updating of the etching liquid in the central area of the circuit board, and the second spraying area 240 is convenient for spraying less etching liquid to the edge area of the circuit board, which is beneficial to preventing the edge area of the circuit board from being excessively etched, so that the etching of the circuit board is more uniform. The provision of the guide rail 310 and the stage 320 facilitates the transportation of the circuit board.
The controller 500 controls the actions of the first swing cylinder 210, the servo motor 321, the lifting cylinder 420, the second swing cylinder 430, the telescopic cylinder 440 and the air claw 450, and realizes automatic control of etching of the circuit board. The specific control process is as follows: the controller 500 controls the servo motor 321, the object stage 320 is driven to drive the circuit board to reach the lower part of the spraying bin 200, the controller 500 controls the servo motor 321 to stop, the controller 500 controls the first swing cylinder 210, the first spraying area 230 and the second spraying area 240 spray the circuit board, the area, which is needed to be etched, of the circuit board is completely covered by etching liquid, the set spraying time is reached, the controller 500 controls the lifting cylinder to ascend to a certain height, the central axis of the air claw 450 and the object stage 320 are located at the same height, the air claw 450 clamps the circuit board conveniently, the controller 500 controls the telescopic cylinder 440 to extend for a distance, the air claw 450 moves to the position near the circuit board, the controller 500 controls the air claw 450 to clamp, the circuit board is clamped, the controller 500 controls the telescopic cylinder 440 to retract for a distance, the controller 500 controls the second swing cylinder 430 to swing, the circuit board is overturned, the etching liquid accumulated on the circuit board is removed, the preset overturning times is reached, the controller 500 controls the telescopic cylinder 440 to extend, the second swing cylinder 430 controls the circuit board to be placed on the object stage 320, the controller 500 controls the air claw 450 to control the air claw 450 to move, the whole process of the circuit board is repeatedly overturned, the circuit board is carried by the object stage to the preset, the object stage is overturned, the overall time is controlled to reach the position of the output of the etching chamber 102, and the overall time is controlled to reach the position of the object stage 100, and the lifting stage is controlled to drive the etching, and the overall time is controlled to move to drive the circuit board to move up and the circuit board to move up down, and the circuit board is moved to the up down to the circuit board to the etching.
In order to ensure the uniformity of the spraying amount in the second spraying area 240, further, a fully automatic etching device comprises four sub-spraying areas, the four sub-spraying areas form the second spraying area 240, the four sub-spraying areas are communicated with the second infusion tube 241, and the four sub-spraying areas are respectively provided with a sub-infusion tube communicated with the second infusion tube, so that the spraying flow of each sub-spraying area is ensured to be uniform.
In order to avoid the mutual influence among the four sub-spraying areas, further, a full-automatic etching device and a control method thereof comprise four baffles 242, and the four baffles 242 are arranged to separate the four sub-spraying areas, so that the mutual influence of the spraying effects of the four sub-spraying areas is avoided, and the excessive spraying to the edge of the circuit board is avoided.
In order to realize the temperature control of the etching solution, further, a fully automatic etching device comprises a first infusion tube 231, a total infusion tube 243, a heater 244, a temperature sensor 245 and a controller 500, wherein the first infusion tube 231 is communicated with the first spraying area 230, the first infusion tube 231 and the second infusion tube 241 are both communicated with the total infusion tube 243, the heater 244 is arranged on the total infusion tube 243, the temperature sensor 245 is arranged at the downstream position of the heater 244, and the heater 244 and the temperature sensor 245 are electrically connected with the controller 500. The controller 500 receives the temperature signal transmitted from the temperature sensor 245, controls the heater 244 to heat the etching solution on the total infusion tube 243, enables the etching solution to reach the set temperature, and the heated etching solution flows through the first infusion tube 231 and the second infusion tube 241 through the total infusion tube 243 to reach the first spraying area 230 and the second spraying area 240 to spray the circuit board. The etching solution is heated intensively on the total infusion tube 243, so that the energy is saved and the control is easy.
In order to realize the control of the spraying times of the circuit board, further, a fully automatic etching device comprises a first electric valve 232, a second electric valve 246 and a controller 500, wherein the first electric valve 232 is arranged on a first infusion tube 231, the second electric valve 246 is arranged on a second infusion tube 241, and the first electric valve 232 and the second electric valve 246 are electrically connected with the controller 500. The first electric valve 232 and the second electric valve 246 are arranged to respectively control the spraying conditions of the first spraying region 230 and the second spraying region 240, the spraying conditions of the central region and the edge region of the circuit board are separately controlled, the controller 500 controls the times of spraying etching liquid to the circuit board by controlling the opening and closing of the first electric valve 232 and the second electric valve 246, and the opening and closing times of the first electric valve 232 and the second electric valve 246 can be reasonably set according to the distribution and the complex condition of a circuit diagram on the circuit board, so that the etching of the circuit board is more uniform, and the width of the circuit board is more uniform.
In order to facilitate the automatic control of the stage 320 to receive the circuit board, further, a fully automatic etching device includes an inlet 101, an outlet 102, a proximity switch 103, and a controller 500, wherein the inlet 101 and the outlet 102 are respectively disposed on the side walls of two ends of the etching box 100, the inlet 101 is disposed above the stage 320, the outlet 102 and the stage 320 are disposed at the same height, the proximity switch 103 is disposed above the inlet 101, and the proximity switch 103 is electrically connected with the controller 500. The provision of inlet 101 and outlet 102 facilitates the entry and exit of the circuit board into and from the etch chamber 100. When the proximity switch 103 senses a signal, the controller 500 is informed to control the servo motor 321, so as to drive the stage 320 to move towards the inlet 101 of the etching chamber 100, so that the stage 320 receives the circuit board from the conveyor belt, and automatic receiving of the circuit board by the stage 320 is realized.
In order to facilitate the stage 320 to receive the circuit board smoothly, further, a fully automatic etching device comprises a first roller 104, a second roller 105, a third roller 106, a fourth roller 107 and a controller 500, wherein the second roller 105 is arranged at the same height as the first roller 104, the third roller 106 is arranged obliquely below the second roller 105 and is positioned at one side of the second roller 105 which is farther away from the inlet 101, the fourth roller 107 is arranged at the same height as the third roller 106, the lower surface of the third roller 106 is higher than the upper surface of the stage 320, the upper surface of the first roller 104, the upper surface of the second roller 105 and the upper surface of the inlet 101 are positioned at the same height, a conveyor belt sequentially passes through the upper surfaces of the first roller 104, the second roller 105, the third roller 106 and the fourth roller 107, and is driven by a conveyor motor, and the conveyor motor is electrically connected with the controller 500. By providing a conveyor belt and four rollers for moving the conveyor belt, smooth transport of the circuit board onto the stage 320 is facilitated.
In order to prevent the circuit board from deviating from the upper surface of the stage 320 during transportation, further, a fully automatic etching device comprises a guide plate 322, wherein the guide plate 322 is relatively arranged on the upper surface of the stage 320, and the guide plate 322 is arranged to guide the circuit board onto the stage 320 conveniently, so that the circuit board is prevented from tilting during transportation, and the etching effect is affected.
In order to facilitate the transportation of the circuit board to the position right below the spraying bin 220, further, a fully automatic etching device comprises a photoelectric switch 311, wherein the photoelectric switch 311 is arranged on a guide rail 310 right below the edge position of one side of the spraying bin close to the outlet 102, a signal detected by the photoelectric switch is transmitted to the controller 500, and the controller 500 drives the servo motor to stop, so that the circuit board is transported to the position right below the spraying bin 220, and the circuit board is transported to the spraying region of the spraying bin 220.
In a first embodiment, a control method for a fully automatic etching apparatus is provided, where the control method for the fully automatic etching apparatus is as follows:
s1, a controller 500 controls a servo motor 321 to drive an objective table 320 to move towards an inlet 101 of an etching box 100, so that the objective table 320 receives a circuit board, and the circuit board is conveniently transported by the follow-up objective table 320;
s2, the controller 500 controls the servo motor 321 to drive the objective table 320 to convey the circuit board to the position right below the spraying bin 220, so that the spraying bin can conveniently spray etching liquid to the circuit board;
s3, the controller 500 controls the first swing cylinder 210 and the spraying bin 220 to spray etching liquid on the circuit board, so that the spraying time is set, the first spraying process is finished, and the subsequent overturning of the circuit board is facilitated;
s4, the controller 500 controls the gas claw to clamp the circuit board, the controller 500 controls the second swing cylinder 430 to swing for a preset angle, after the second swing cylinder 430 swings for a preset number of times, the controller 500 controls the second swing cylinder 430 to place the circuit board on the object stage 320, the controller 500 controls the gas claw 450 to loosen the circuit board, and the first overturning process is finished;
s5, repeating the step S3 and the step S4 until the ideal etching effect is achieved;
s6, the controller 500 controls the servo motor 321 to drive the stage 320 to convey the circuit board to the outlet 102 of the etching chamber 100.
In the S1 process, a proximity switch 103 is disposed above the inlet 101 of the etching chamber 100, and when the proximity switch 103 senses a signal, the signal is transmitted to the controller 500, the controller 500 controls the servo motor 321, and the driving stage 320 receives the circuit board.
In the S2 process, the guide rail 310 is provided with the photoelectric switch 311, the photoelectric switch 311 is located under the edge position of the side of the spray bin 220 close to the outlet 102, and when the controller 500 receives a signal from the photoelectric switch 311, the servo motor 321 is controlled to stop, and the stage 320 is conveyed to the position under the spray bin 220.
In the S3 process, the second spraying area 240 includes four sub-spraying areas, each of which is communicated with the second infusion tube 241, the first spraying area 230 is communicated with the first infusion tube 231, the first infusion tube 231 and the second infusion tube 241 are communicated with the total infusion tube 243, the heater 244 is disposed on the total infusion tube 243, the temperature sensor 245 is disposed at a downstream position of the heater 244, and the heater 244, the temperature sensor 245 and the controller 500 are electrically connected. The controller 500 receives the temperature signal transmitted from the temperature sensor 245, controls the heater 244 to heat the etching solution on the total infusion tube 243, enables the etching solution to reach the set temperature, and the heated etching solution flows through the first infusion tube 231 and the second infusion tube 241 through the total infusion tube 243 to reach the first spraying area 230 and the second spraying area 240 to spray the circuit board.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The invention is not to be limited by the specific embodiments disclosed herein, and other embodiments are within the scope of the invention as defined by the claims of the present application.

Claims (8)

1. A fully automatic etching apparatus, characterized in that:
the etching device comprises an etching box (100), wherein a spraying mechanism (200) for spraying etching liquid is arranged at the top of the etching box (100), the spraying mechanism (200) comprises a first swinging cylinder (210), a spraying bin (220) is fixed on an output shaft of the first swinging cylinder (210), the spraying bin (220) comprises a first spraying region (230) and a second spraying region (240), the second spraying region (240) is arranged around the first spraying region (230), and the density of nozzles of the first spraying region (230) is greater than that of nozzles of the second spraying region (240);
two guide rails (310) are arranged below the spraying bin (200), an objective table (320) moving along the guide rails (310) is arranged on the guide rails (310), and the objective table (320) is driven by a servo motor (321);
a manipulator (400) for grabbing and overturning a circuit board is arranged between the two guide rails (310), the manipulator (400) comprises a base (410) and a lifting cylinder (420) arranged on the base (410), an output shaft of the lifting cylinder (420) is connected with a second swinging cylinder (430) through a fixing piece, an output shaft of the second swinging cylinder (430) is connected with a telescopic cylinder (440) through a fixing piece, and an output shaft of the telescopic cylinder (440) is connected with an air claw (450) through a fixing piece;
the first swing cylinder (210), the servo motor (321), the lifting cylinder (420), the second swing cylinder (430), the telescopic cylinder (440) and the air claw (450) are electrically connected with a controller (500);
the second spraying area (240) comprises four sub-spraying areas, and the four sub-spraying areas are communicated with a second infusion tube (241);
the side walls at two ends of the etching box (100) are respectively provided with an inlet (101) and an outlet (102), the inlet (101) is higher than the upper part of the objective table (320), the outlet (102) and the objective table (320) are located at the same height, a proximity switch (103) is arranged above the inlet (101), and the proximity switch (103) is electrically connected with the controller (500).
2. A fully automated etching apparatus according to claim 1, wherein:
the four sub-spray zones are separated by four baffles (242).
3. A fully automated etching apparatus according to claim 1, wherein:
the first spraying area (230) is communicated with a first infusion tube (231), the first infusion tube (231) and the second infusion tube (241) are both communicated with a total infusion tube (243), a heater (244) and a temperature sensor (245) positioned at the downstream of the heater (244) are arranged on the total infusion tube (243), and the heater (244) and the temperature sensor (245) are electrically connected with the controller (500).
4. A fully automated etching apparatus according to claim 3, wherein:
the infusion device is characterized in that a first electric valve (232) is arranged on the first infusion tube (231), a second electric valve (246) is arranged on the second infusion tube (241), and the first electric valve (232) and the second electric valve (246) are electrically connected with the controller (500).
5. A fully automated etching apparatus according to claim 1, wherein:
a first roller (104), a second roller (105) which is at the same height with the first roller (104), a third roller (106) which is positioned obliquely below the second roller (105) and a fourth roller (107) which is at the same height with the third roller (106) are arranged in the etching box (100), the upper surface of the first roller (104), the upper surface of the second roller (105) and the inlet (101) are positioned at the same height,
the third roller (106) is located one side of the second roller (105) which is far away from the inlet (101), the lower surface of the third roller (106) is higher than the upper surface of the objective table (320), a conveyor belt sequentially penetrates through the first roller (104), the second roller (105), the third roller (106) and the fourth roller (107), the conveyor belt is driven by a conveyor motor, and the conveyor motor is electrically connected with the controller (500).
6. The apparatus of claim 1, wherein
The upper surface of the objective table (320) is oppositely provided with a guide plate (322).
7. A fully automated etching apparatus according to claim 1, wherein:
the guide rail (310) is provided with a photoelectric switch (311), and the photoelectric switch (311) is positioned right below the edge position of one side of the spray bin (220) close to the outlet (102).
8. A control method for a fully automatic etching apparatus according to any one of claims 1 to 7, characterized by:
s1, the controller (500) controls a servo motor (321) to drive the objective table (320) to move towards an inlet (101) of the etching box (100), so that the objective table (320) receives a circuit board;
s2, the controller (500) controls the servo motor (321) to drive the objective table (320) to convey the circuit board to the position right below the spraying bin (200);
s3, the controller (500) controls the first swing cylinder (210), the spraying bin (200) sprays etching liquid on the circuit board to reach the set spraying time, and the first spraying process is finished;
s4, the controller (500) controls the air claw (450) to clamp the circuit board, the controller (500) controls the second swing cylinder (430) to swing by a preset angle, and after the second swing cylinder swings for a preset number of times, the controller (500) controls the second swing cylinder (430) to place the circuit board on the object stage
(320) The controller (500) controls the air claw (450) to loosen the circuit board, and the process of turning over for the first time is finished;
s5, repeating the step S3 and the step S4 until the ideal etching effect is achieved;
s6, the controller (500) controls the servo motor (321) to drive the objective table (320) to convey the circuit board to the outlet (102) of the etching box (100).
CN201710565278.7A 2017-07-12 2017-07-12 Full-automatic etching device and control method thereof Active CN107172818B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710565278.7A CN107172818B (en) 2017-07-12 2017-07-12 Full-automatic etching device and control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710565278.7A CN107172818B (en) 2017-07-12 2017-07-12 Full-automatic etching device and control method thereof

Publications (2)

Publication Number Publication Date
CN107172818A CN107172818A (en) 2017-09-15
CN107172818B true CN107172818B (en) 2023-06-16

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CN108811348B (en) * 2018-06-28 2021-03-02 深圳市吉瑞达电路科技有限公司 Positioning device for etching electronic circuit board
CN111556661B (en) * 2020-05-22 2021-04-23 广州冰钫商贸有限公司 PCB etching machine
CN113225926B (en) * 2021-03-30 2022-05-03 广东兴达鸿业电子有限公司 PCB board production is with two etching equipment that sway
CN114760764B (en) * 2022-05-09 2023-11-28 江西鸿宇电路科技有限公司 Circuit board etching device and etching method

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