CN107172818A - A kind of full automatic Etaching device and its control method - Google Patents
A kind of full automatic Etaching device and its control method Download PDFInfo
- Publication number
- CN107172818A CN107172818A CN201710565278.7A CN201710565278A CN107172818A CN 107172818 A CN107172818 A CN 107172818A CN 201710565278 A CN201710565278 A CN 201710565278A CN 107172818 A CN107172818 A CN 107172818A
- Authority
- CN
- China
- Prior art keywords
- spray
- controller
- full automatic
- objective table
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1563—Reversing the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of full automatic Etaching device, belong to Etaching device field, full automatic Etaching device includes etching case, spraying mechanism is provided with the top of etching case, spraying mechanism includes the first oscillating cylinder, spray storehouse is fixed with the output shaft of first oscillating cylinder, two guide rails are provided with below spraying mechanism, manipulator is provided between two guide rails, manipulator includes pedestal, and the lift cylinder on pedestal, the output shaft of lift cylinder is connected by fixture with the second oscillating cylinder, the output shaft of second oscillating cylinder is connected by fixture with telescopic cylinder, the output shaft of telescopic cylinder is connected by fixture with jaw.The invention also discloses a kind of control method for a kind of above-mentioned full automatic Etaching device, a kind of full automatic Etaching device disclosed by the invention, realize etching solution covering etching in need region, the etching solution that PCB surface is accumulated can be removed simultaneously, so as to wiring board and new etching solution contact.
Description
Technical field
The present invention relates to Etaching device field, more particularly to a kind of full automatic Etaching device and for full automatic erosion
The control method of engraving device.
Background technology
In the prior art, the jet pipe to wiring board spray etching liquid is typically the linear jet pipe containing multiple nozzles, phase
Gap between adjacent nozzle is the same, and the spray angles of nozzle are fixed, so easily cause etching solution can not cover institute it is in need
The region of etching, makes circuit board etching uneven, and spray etching liquid for a period of time after, etching solution can assist side surface area
Stay so that wiring board is difficult to the contact with new etching solution, influence etch effect.In addition, the automation of existing Etaching device
Degree is not high, it is often necessary to which human assistance is operated, and reduces production efficiency.
The content of the invention
In order to overcome the defect of prior art, the technical problems to be solved by the invention are to propose a kind of full automatic erosion
Engraving device, can realize etching solution covering institute etching in need region, make wiring board etching uniformly, while line can be removed
The etching solution that road plate surface is accumulated, so as to wiring board and new etching solution contact.
For up to this purpose, the present invention uses following technical scheme：
The invention provides a kind of full automatic Etaching device, including etching case, use is provided with the top of the etching case
In the spraying mechanism of spray etching liquid, the spraying mechanism includes the first oscillating cylinder, the output shaft of first oscillating cylinder
On be fixed with spray storehouse, the spray storehouse includes the first spray region, the second spray region, and the second spray region is around institute
The setting of the first spray region is stated, the density of the first spray region nozzle is more than the density of the described second spray region nozzle,
It is provided with below the spraying mechanism on two guide rails, the guide rail and is provided with the objective table moved along the guide rail, the load
Thing platform is driven by servomotor, is provided between two guide rails for capturing the manipulator with flipflop plate, the machine
Tool hand includes pedestal, and the lift cylinder on the pedestal, and the output shaft of the lift cylinder passes through fixture and the
Two oscillating cylinders are connected, and the output shaft of second oscillating cylinder is connected by fixture with telescopic cylinder, the telescopic cylinder
Output shaft be connected by fixture with jaw, it is first oscillating cylinder, the servomotor, the lift cylinder, described
Second oscillating cylinder, the telescopic cylinder and the jaw are electrically connected with controller.
In the present invention preferably embodiment, the second spray region includes four son spray regions, described four
Son spray region is connected with the second woven hose.
In the present invention preferably embodiment, four sons spray region is separated by four baffle plates.
In the present invention preferably embodiment, the first spray region is connected with the first woven hose, and described first is defeated
Liquid pipe and second woven hose are connected with total woven hose, and having heaters is set on total woven hose, and positioned at described
The temperature sensor in the downstream of heater, the heater, the temperature sensor are electrically connected with the controller.
In the present invention preferably embodiment, the first motor-driven valve is provided with first woven hose, described second is defeated
The second motor-driven valve is provided with liquid pipe, first motor-driven valve, second motor-driven valve are electrically connected with the controller.
In the present invention preferably in embodiment, be provided with import, outlet on the side wall at the etching case two ends, it is described enter
Mouth is located at the top of the objective table, and the outlet, the objective table, which are located to be provided with above sustained height, the import, to be connect
Nearly switch, the proximity switch is electrically connected with the controller.
In the present invention preferably embodiment, it is provided with the first roller in the etching case, exists with first roller
Second roller of sustained height, the third roll positioned at the second roller obliquely downward and with the third roll in sustained height
The 4th roller, the upper surface of first roller, the upper surface of second roller and the import be located at sustained height, institute
Third roll is stated positioned at second roller further from the side of the import, and the lower surface of the third roll is higher than institute
The upper surface of objective table is stated, conveyer belt sequentially passes through first roller, second roller, the third roll and described
Four rollers, the conveyer belt is driven by transmission motor, and the transmission motor is electrically connected with the controller.
In the present invention preferably embodiment, the upper surface of the objective table is provided with guide plate.
In the present invention preferably embodiment, optoelectronic switch is provided with the guide rail, the optoelectronic switch is located at institute
Spray storehouse is stated close to the underface of the marginal position of the outlet side.
Present invention also offers a kind of control method for a kind of above-mentioned full automatic Etaching device, etching solution is realized
The region of covering institute etching in need, makes the etching of wiring board uniformly, while the etching solution that PCB surface is accumulated can be removed,
So as to wiring board and new etching solution contact, the Automated condtrol to circuit board etching process is realized.Comprise the following steps：
S1, the controller controls the servomotor, drives the import of the objective table to the etching case to move, makes
The objective table receiving circuit plate；
S2, the controller controls the servomotor, drives the objective table that wiring board is transported into the spray thrower
The underface of structure；
S3, the controller controls first oscillating cylinder, the first spray region and the second spray region
To wiring board spray etching liquid, setting spray time is reached, the process of spray terminates for the first time；
S4, the controller controls the jaw to grip wiring board, and the controller control described second is swung
Cylinder swings predetermined angular, swings after pre-determined number, and the controller controls second oscillating cylinder to be placed on wiring board
On the objective table, the controller controls the jaw to unclamp wiring board, and the process of upset terminates for the first time；
S5, repeats S3 steps and S4 steps, until reaching desired etch effect；
S6, the controller controls the servomotor, drives the objective table that wiring board is transported into the etching case
Outlet.
Beneficial effects of the present invention are：
A kind of full automatic Etaching device that the present invention is provided, spray storehouse is arranged on the first oscillating cylinder, makes etching
Liquid energy enough cover etching in need region；Set paw to be easy to grip wiring board, paw be connected with the second oscillating cylinder,
The upset to wiring board is realized, is easy to remove the etching solution accumulated in the circuit board so that wiring board is contacted with new etching solution；
Guide rail and objective table are set, are easy to transport wiring board；First oscillating cylinder, servomotor, lift cylinder, the second oscillating cylinder,
Telescopic cylinder and jaw are electrically connected with controller, and realization is automatically controlled to circuit board etching.
Brief description of the drawings
Fig. 1 is a kind of front view of the full automatic Etaching device provided in the embodiment of the present invention one；
Fig. 2 is the top view in the spray storehouse that the embodiment of the present invention one is provided.
In figure：
100th, case is etched；101st, import；102nd, export；103rd, proximity switch；104th, the first roller；105th, the second roller；
106th, third roll；107th, the 4th roller；200th, spraying mechanism；210th, the first oscillating cylinder；220th, storehouse is sprayed；230th, the first spray
Drench region；231st, the first woven hose；232nd, the first motor-driven valve；240th, the second spray region；241st, the second woven hose；242nd, keep off
Plate；243rd, total woven hose；244th, heater；245th, temperature sensor；246th, the second motor-driven valve；310th, guide rail；311st, photoelectricity is opened
Close；320th, objective table；321st, servomotor；322nd, guide plate；400th, manipulator；410th, pedestal；420th, lift cylinder；430th,
Two oscillating cylinders；440th, telescopic cylinder；450th, jaw；500th, controller.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one
As shown in Figure 1 and Figure 2, a kind of full automatic Etaching device provided in the present embodiment, including etching case 100, spray
Mechanism 200, guide rail 310, manipulator 400, controller 500, spraying mechanism 200 are arranged on the top of etching case 100, spraying mechanism
200 include being provided with spray storehouse 200 on the first oscillating cylinder 210, the output shaft of the first oscillating cylinder 210, and spray storehouse 200 includes
First spray region 230, second spray region 240, the second spray region 240 is set around the first spray region 230, the first spray
The density for drenching the nozzle of region 230 is more than the density of the second spray nozzle of region 240, and two guide rails 310 are arranged on spray storehouse 200
The objective table 320 moved along guide rail 310 is provided with lower section, guide rail 310, objective table 320 is driven by servomotor 321, machinery
Hand 400 is arranged between two guide rails 310, and manipulator 400 includes pedestal 410, and the lift cylinder on pedestal 410
420, the output shaft of lift cylinder 420 is connected by fixture with the second oscillating cylinder 430, second oscillating cylinder 430
Output shaft is connected by fixture with telescopic cylinder 440, and the output shaft of telescopic cylinder 440 is connected by fixture with jaw 450,
It is mutually perpendicular between the output shaft of the output shaft of lift cylinder 420, the output shaft of the second oscillating cylinder 430 and telescopic cylinder 440,
First oscillating cylinder 210, servomotor 321, lift cylinder 420, the second oscillating cylinder 430, telescopic cylinder 440, jaw 450 are equal
Electrically connected with controller 500.Spray storehouse 220 is arranged on the first pendulum cylinder 210 so that the etching in need of etching solution covering institute
Region.Set paw 450 to be easy to grip wiring board, set the second oscillating cylinder 430 to be easy to implement to wiring board
Upset, is easy to remove the etching solution accumulated in the circuit board, wiring board is contacted with new etching solution.First spray region 230
It is easy to spray wiring board central area more etching solution, is conducive to accelerating the renewal of wiring board central area etching solution, if
Put the second spray region 240 to be easy to spray less etching solution to wiring board fringe region, be conducive to preventing wiring board fringe region
Over etching, makes circuit board etching evenly.Guide rail 310 and objective table 320 is set to be easy to the transport to wiring board.
Controller 500 control the first oscillating cylinder 210, servomotor 321, lift cylinder 420, the second oscillating cylinder 430,
The action of telescopic cylinder 440 and jaw 450, realization is automatically controlled to circuit board etching.Specific control process is as follows：Controller
500 control servomotors 321, driving objective table 320 drives wiring board to reach the lower section of spray storehouse 200, the control servo of controller 500
Motor 321 stops, and controller 500 controls the first oscillating cylinder 210, and the first spray region 230, second sprays region 240 to line
Road plate is sprayed, and the region for etching wiring board needs is etched liquid all coverings, reaches setting spray time, controller
500 control lift cylinders rise certain altitude, and the central axis and objective table 320 for making jaw 450 are located at sustained height, facilitate gas
Pawl 450 grips wiring board, and the control telescopic cylinder 440 of controller 500 stretches out one end distance, jaw 450 is moved to wiring board attached
Near position, the control of controller 500 jaw 450 is clamped, and by circuit board clamping, the control telescopic cylinder 440 of controller 500 is retracted one section
Distance, controller 500 controls the second oscillating cylinder 430 to swing, and wiring board is overturn, makes to accumulate etching in the circuit board
Liquid is eliminated, and reaches default upset number of times, and the control telescopic cylinder 440 of controller 500 is stretched out, and the control of controller 500 second is swung
Wiring board is placed on objective table 320 by cylinder 430, controller 500 control jaw 450 unclamp, repeat spray, gripping, upset,
The process of wiring board is unclamped, until reaching default total etching period, the control lift cylinder of controller 500 declines a segment distance,
Controller 500 controls servomotor 321, and driving objective table 320 carries wiring board to the outlet 102 of etching case 100.
In order to ensure the uniform of spray flux in the second spray region 240, further, a kind of full automatic Etaching device bag
Four son spray regions are included, four son spray regions form second and spray region 240, four son spray regions and the second woven hose
241 connections, four son spray regions have a sub- woven hose to be connected with the second woven hose, it is ensured that the spray in every sub- spraying zone domain
Uniform flow.
In order to avoid four son spray regions between influence each other, further, a kind of full automatic Etaching device and its
Control method includes four baffle plates 242, sets four baffle plates 242 that four sons are sprayed into region and separates, prevents four sub- spraying zones
The spraying effect in domain is influenced each other, it is to avoid the edge transition of wiring board is sprayed.
In order to realize the temperature control to etching solution, further, a kind of full automatic Etaching device includes the first transfusion
Pipe 231, total woven hose 243, heater 244, temperature sensor 245, controller 500, the first woven hose 231 connection first are sprayed
Region 230, the first woven hose 231, the second woven hose 241 are connected with total woven hose 243, and heater 244 is arranged on total transfusion
On pipe 243, temperature sensor 245 is arranged on the downstream position of heater 244, heater 244, temperature sensor 245 and control
Device 500 is electrically connected.Controller 500 receives the temperature signal transmitted from temperature sensor 245, and 244 pairs of control heater is total defeated
Etching solution in liquid pipe 243 is heated, and etching solution is reached design temperature, the etching solution after heating by total woven hose 243,
The first woven hose 231, the second woven hose 241 are flowed separately through, first is reached and sprays the spray region 240 of region 230, second to circuit
Plate is sprayed.Concentrated on total woven hose 243 and etching solution is heated, save energy, and be easily controlled.
In order to realize the control that number of times is sprayed to wiring board, further, a kind of full automatic Etaching device includes first
Motor-driven valve 232, the second motor-driven valve 246, controller 500, the first motor-driven valve 232 are arranged on the first woven hose 231, and second is electronic
Valve 246 is arranged on the second woven hose 241, and the first motor-driven valve 232, the second motor-driven valve 246 are electrically connected with controller 500.It is logical
Cross the spray for setting the first motor-driven valve 232, the second motor-driven valve 246 to control the first spray region 230, second to spray region 240 respectively
Pouring situation, the spray situation of the central area of wiring board and fringe region is separately controlled, and controller 500 passes through the electricity of control first
Dynamic valve 232, the opening and closing of the second motor-driven valve 246, can be according to circuit on-board circuitry to control the number of times toward wiring board spray etching liquid
The distribution of figure and complex situations, rationally set the first motor-driven valve 232, the opening and closing number of times of the second motor-driven valve 246 so that wiring board loses
Carve evenly so that the width of wiring board is evenly.
For the ease of automatically controlling the receiving circuit plate of objective table 320, further, a kind of full automatic Etaching device includes
Import 101, outlet 102, proximity switch 103, controller 500, import 101, outlet 102 are separately positioned on etching case 100 two ends
Side wall on, import 101 be located at objective table 320 top, outlet 102 with objective table 320 be located at sustained height, proximity switch
103 are arranged on the top of import 101, and proximity switch 103 is electrically connected with controller 500.Import 101 and outlet 102 is set to be easy to
Wiring board enters and leaves etching case 100.When the proximity switch 103 senses signal, the controller 500 is notified to control
The servomotor 321, so as to drive the import 101 of the objective table 320 to the etching case 100 to move so that described to carry
Thing platform 320 receives the wiring board on the conveyer belt, realizes automatic reception of the objective table 320 to wiring board.
For the ease of the smooth receiving circuit plate of objective table 320, further, a kind of full automatic Etaching device includes first
Roller 104, the second roller 105, third roll 106, the 4th roller 107, controller 500, the second roller 105 are arranged on and first
The sustained height of roller 104, third roll 106 is arranged on the obliquely downward of the second roller 105, and positioned at second roller 105 more
Side away from import 101, the 4th roller 107 is arranged on and the sustained height of third roll 106, the lower surface of third roll 106
The upper surface higher than objective table 320, the upper surface of the first roller 104, the upper surface of the second roller 105 and import 101 are located at
Sustained height, conveyer belt sequentially passes through the first roller 104, the second roller 105, the upper table of the roller 107 of third roll 106 and the 4th
Face, conveyer belt is driven by transmission motor, and transmission motor is electrically connected with controller 500.By setting conveyer belt, and for driving
Four rollers of Tape movement are transmitted, are easy to wiring board being transported on objective table 320 smoothly.
In order to prevent deviateing the upper surface of objective table 320 in wiring board transportation, further, a kind of full automatic etching
Device includes guide plate 322, and guide plate 322 is oppositely arranged on the upper surface of objective table 320, sets guide plate 322 to be easy to line
Road plate is directed on objective table 320, prevents wiring board run-off the straight in transportation, influences etch effect.
For the ease of transporting the underface that wiring board reaches spray storehouse 220, further, a kind of full automatic Etaching device
Including optoelectronic switch 311, optoelectronic switch 311 is arranged on guide rail of the spray storehouse close to the underface of 102 side marginal positions of outlet
On 310, optoelectronic switch detects signal and sends controller 500 to, and the driving servomotor of controller 500 stops so that circuit
Plate is transported to the underface in spray storehouse 220, wiring board is transported in the spray region in spray storehouse 220.
A kind of control method for a kind of above-mentioned full automatic Etaching device provided in embodiment one, one kind is complete certainly
The control method of dynamic Etaching device is as follows：
S1, the control servomotor 321 of controller 500, the import 101 of driving objective table 320 to etching case 100 is moved, made
The receiving circuit plate of objective table 320, is easy to follow-up objective table 320 to transport wiring board；
Wiring board is being transported to spray storehouse 220 just by S2, the control servomotor 321 of controller 500, driving objective table 320
Lower section, is easy to spray storehouse to wiring board spray etching liquid；
S3, first oscillating cylinder 210 of the control control of controller 500, spray storehouse 220 reach to wiring board spray etching liquid
Spray time is set, the process of spray terminates for the first time, be easy to the follow-up upset to wiring board；
S4, the control of controller 500 jaw is gripped to wiring board, and controller 500 controls the second oscillating cylinder 430 to swing
Predetermined angular, swings after pre-determined number, controller 500 controls second oscillating cylinder 430 that wiring board is placed on into objective table
On 320, the control jaw 450 of controller 500 unclamps wiring board, and the process of upset terminates for the first time；
S5, repeats S3 steps and S4 steps, until reaching desired etch effect；
Wiring board is transported to going out for etching case 100 by S6, the control servomotor 321 of controller 500, driving objective table 320
Mouth 102.
During S1, the top of the etching import 101 of case 100 is provided with proximity switch 103, when proximity switch 103 is felt
When should arrive signal, and send controller 500, the control servomotor 321 of controller 500, the receiving circuit of driving objective table 320 to
Plate.
During S2, optoelectronic switch 311 is provided with guide rail 310, it is close that optoelectronic switch 311 is located at spray storehouse 220
The underface of 102 side marginal positions is exported, when controller 500 receives the signal from optoelectronic switch 311, control servo electricity
Machine 321 stops, and objective table 320 is transported to the underface in spray storehouse 220.
During S3, the second spray region 240 includes four son spray regions, and four son spray regions are defeated with second
Liquid pipe 241 is connected, and the first spray region 230 is communicated with the first woven hose 231, and the first woven hose 231, the second woven hose 241 are equal
Connected with total woven hose 243, heater 244 is arranged on total woven hose 243, and temperature sensor 245 is arranged on heater 244
Downstream position, heater 244, temperature sensor 245 are electrically connected with controller 500.Controller 500, which is received, comes from temperature sensor
Etching solution on the temperature signal of 245 transmission, the control total woven hose 243 of 244 pairs of heater is heated, and is reached etching solution and is set
Constant temperature degree, the etching solution after heating flows separately through the first woven hose 231, the second woven hose 241 by total woven hose 243, reaches
First spray region 230, second spray region 240 is sprayed to wiring board.
The present invention is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from the present invention's
In the case of spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.The present invention is not by this
The limitation of specific embodiment disclosed in place, other embodiments fallen into claims hereof belong to protection of the present invention
Scope.
Claims (10)
1. a kind of full automatic Etaching device, it is characterised in that：
Including etching case (100), the spraying mechanism (200) for spray etching liquid is provided with the top of the etching case (100),
The spraying mechanism (200) includes being fixed with the first oscillating cylinder (210), the output shaft of first oscillating cylinder (210)
Spray storehouse (220), the spray storehouse (220) includes the first spray region (230) and the second spray region (240), described second
Spray region (240) to set around the described first spray region (230), the density of described first spray region (230) nozzle is big
In the density of described second spray region (240) nozzle；
It is provided with two guide rails (310), the guide rail (310) and is provided with along the guide rail below the spray storehouse (200)
(310) mobile objective table (320), the objective table (320) is driven by servomotor (321)；
It is provided between two guide rails (310) for capturing the manipulator (400) with flipflop plate, the manipulator
(400) pedestal (410), and the lift cylinder (420) on the pedestal (410) are included, the lift cylinder (420)
Output shaft is connected by fixture with the second oscillating cylinder (430), and the output shaft of second oscillating cylinder (430) passes through fixation
Part is connected with telescopic cylinder (440), and the output shaft of the telescopic cylinder (440) is connected by fixture with jaw (450)；
First oscillating cylinder (210), the servomotor (321), the lift cylinder (420), described second swing gas
Cylinder (430), the telescopic cylinder (440) and the jaw (450) are electrically connected with controller (500).
2. a kind of full automatic Etaching device according to claim 1, it is characterised in that：
It is described second spray region (240) include four son spray regions, it is described four son spray regions with the second woven hose
(241) connect.
3. a kind of full automatic Etaching device according to claim 2, it is characterised in that：
Four sons spray region is separated by four baffle plates (242).
4. a kind of full automatic Etaching device according to claim 2, it is characterised in that：
First spray region (230) is connected with the first woven hose (231), first woven hose (231) and described second
Woven hose (241) is connected with total woven hose (243), and having heaters (244), Yi Jiwei are set on total woven hose (243)
Temperature sensor (245) in the downstream of the heater (244), the heater (244), the temperature sensor (245)
Electrically connected with the controller (500).
5. a kind of full automatic Etaching device according to claim 4, it is characterised in that：
It is provided with first woven hose (231) on the first motor-driven valve (232), second woven hose (241) and is provided with
Two motor-driven valves (246), first motor-driven valve (232), second motor-driven valve (246) with the controller (500) Electricity Federation
Connect.
6. a kind of full automatic Etaching device according to claim 1, it is characterised in that：
The side wall at described etching case (100) two ends is respectively arranged with import (101), outlet (102), and the import (101) is higher than
The top of the objective table (320), the outlet (102), the objective table (320) are located at sustained height, the import (101)
Top be provided with proximity switch (103), the proximity switch (103) electrically connects with the controller (500).
7. a kind of full automatic Etaching device according to claim 6, it is characterised in that：
The first roller (104) and first roller (104) are provided with the etching case (100) the second of sustained height
Roller (105), the third roll (106) positioned at the second roller (105) obliquely downward and with the third roll (106) same
4th roller (107) of one height, upper surface, the upper surface of second roller (105) and the institute of first roller (104)
Import (101) is stated positioned at sustained height, the third roll (106) is located at second roller (105) further from the import
(101) side, and the upper surface higher than the objective table (320) of the lower surface of the third roll (106), conveyer belt according to
It is secondary to pass through first roller (104), second roller (105), the third roll (106) and the 4th roller
(107), the conveyer belt is driven by transmission motor, and the transmission motor is electrically connected with the controller (500).
8. a kind of full automatic Etaching device according to claim 1, it is characterised in that：
The upper surface of the objective table (320) is relatively set with guide plate (322).
9. a kind of full automatic Etaching device according to claim 1, it is characterised in that：
Optoelectronic switch (311) is provided with the guide rail (310), the optoelectronic switch (311) is leaned on positioned at the spray storehouse (220)
The underface of the marginal position of nearly described outlet (102) side.
10. a kind of a kind of control method of full automatic Etaching device for described in any one of claim 1 to 9, its feature
It is：
S1, controller (500) the control servomotor (321) drives the objective table (320) to the etching case (100)
Import (101) it is mobile, make the objective table (320) receiving circuit plate；
S2, the controller (500) controls the servomotor (321), drives the objective table (320) to be transported to wiring board
The underface of the spray storehouse (200)；
S3, controller (500) the control control first oscillating cylinder (210), spray storehouse (200) is sprayed to wiring board to be lost
Liquid is carved, setting spray time is reached, the process of spray terminates for the first time；
S4, the controller (500) controls the jaw (450) to grip wiring board, and the controller (500) controls institute
State the second oscillating cylinder (430) and swing predetermined angular, swing after pre-determined number, controller (500) control second pendulum
Wiring board is placed on the objective table (320) by cylinder (430) of taking offence, and the controller (500) controls jaw (450) pine
Wiring board is opened, the process of upset terminates for the first time；
S5, repeats S3 steps and S4 steps, until reaching desired etch effect；
S6, the controller (500) controls the servomotor (321), drives the objective table (320) to be transported to wiring board
The outlet (102) of the etching case (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710565278.7A CN107172818B (en) | 2017-07-12 | 2017-07-12 | Full-automatic etching device and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710565278.7A CN107172818B (en) | 2017-07-12 | 2017-07-12 | Full-automatic etching device and control method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107172818A true CN107172818A (en) | 2017-09-15 |
| CN107172818B CN107172818B (en) | 2023-06-16 |
Family
ID=59823806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710565278.7A Active CN107172818B (en) | 2017-07-12 | 2017-07-12 | Full-automatic etching device and control method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107172818B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811348A (en) * | 2018-06-28 | 2018-11-13 | 深圳市吉瑞达电路科技有限公司 | A kind of electronic circuit board etching positioning device |
| CN111556661A (en) * | 2020-05-22 | 2020-08-18 | 广州冰钫商贸有限公司 | PCB etching machine |
| CN113225926A (en) * | 2021-03-30 | 2021-08-06 | 广东兴达鸿业电子有限公司 | PCB board production is with two etching equipment that sway |
| CN114760764A (en) * | 2022-05-09 | 2022-07-15 | 江西鸿宇电路科技有限公司 | Circuit board etching method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000064066A (en) * | 1998-06-11 | 2000-02-29 | Nippon Micron Kk | Shower injection device for electronic device and shower injection |
| JP2000096264A (en) * | 1998-09-21 | 2000-04-04 | Hitachi Ltd | Etching device and method |
| JP2007242833A (en) * | 2006-03-08 | 2007-09-20 | Sumitomo Precision Prod Co Ltd | Substrate traeting apparatus |
| CN102560494A (en) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| TW201229319A (en) * | 2011-01-06 | 2012-07-16 | Foxconn Advanced Tech Inc | Etching device and teching method using the same |
| JP2013074031A (en) * | 2011-09-27 | 2013-04-22 | Tokyo Electron Ltd | Plasma etching method and plasma etching equipment |
| US20140148016A1 (en) * | 2012-11-27 | 2014-05-29 | Hitachi High-Technologies Corporation | Plasma processing apparatus and plasma processing method |
| JP2016207882A (en) * | 2015-04-24 | 2016-12-08 | 三菱電機株式会社 | Wet etching device, wet etching method, and manufacturing method using the same |
| CN207150953U (en) * | 2017-07-12 | 2018-03-27 | 信丰迅捷兴电路科技有限公司 | A kind of full automatic Etaching device |
-
2017
- 2017-07-12 CN CN201710565278.7A patent/CN107172818B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000064066A (en) * | 1998-06-11 | 2000-02-29 | Nippon Micron Kk | Shower injection device for electronic device and shower injection |
| JP2000096264A (en) * | 1998-09-21 | 2000-04-04 | Hitachi Ltd | Etching device and method |
| JP2007242833A (en) * | 2006-03-08 | 2007-09-20 | Sumitomo Precision Prod Co Ltd | Substrate traeting apparatus |
| CN102560494A (en) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| TW201229319A (en) * | 2011-01-06 | 2012-07-16 | Foxconn Advanced Tech Inc | Etching device and teching method using the same |
| JP2013074031A (en) * | 2011-09-27 | 2013-04-22 | Tokyo Electron Ltd | Plasma etching method and plasma etching equipment |
| US20140148016A1 (en) * | 2012-11-27 | 2014-05-29 | Hitachi High-Technologies Corporation | Plasma processing apparatus and plasma processing method |
| JP2016207882A (en) * | 2015-04-24 | 2016-12-08 | 三菱電機株式会社 | Wet etching device, wet etching method, and manufacturing method using the same |
| CN207150953U (en) * | 2017-07-12 | 2018-03-27 | 信丰迅捷兴电路科技有限公司 | A kind of full automatic Etaching device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811348A (en) * | 2018-06-28 | 2018-11-13 | 深圳市吉瑞达电路科技有限公司 | A kind of electronic circuit board etching positioning device |
| CN108811348B (en) * | 2018-06-28 | 2021-03-02 | 深圳市吉瑞达电路科技有限公司 | Positioning device for etching electronic circuit board |
| CN111556661A (en) * | 2020-05-22 | 2020-08-18 | 广州冰钫商贸有限公司 | PCB etching machine |
| CN111556661B (en) * | 2020-05-22 | 2021-04-23 | 广州冰钫商贸有限公司 | PCB etching machine |
| CN113225926A (en) * | 2021-03-30 | 2021-08-06 | 广东兴达鸿业电子有限公司 | PCB board production is with two etching equipment that sway |
| CN113225926B (en) * | 2021-03-30 | 2022-05-03 | 广东兴达鸿业电子有限公司 | PCB board production is with two etching equipment that sway |
| CN114760764A (en) * | 2022-05-09 | 2022-07-15 | 江西鸿宇电路科技有限公司 | Circuit board etching method |
| CN114760764B (en) * | 2022-05-09 | 2023-11-28 | 江西鸿宇电路科技有限公司 | Circuit board etching device and etching method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107172818B (en) | 2023-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107172818A (en) | A kind of full automatic Etaching device and its control method | |
| CN204769304U (en) | Automatic snakelike flush coater | |
| CN204585501U (en) | The framed releasing agent automatic spray apparatus of a kind of air entrained concrete | |
| CN207150953U (en) | A kind of full automatic Etaching device | |
| CN103936462A (en) | Automatic glaze spraying device | |
| CN203997761U (en) | A kind of automatic charging machine | |
| CN105457806B (en) | A kind of automatic paint-spraying machine and its control unit | |
| CN109722514B (en) | High-temperature quenching heat treatment device and method for multilayer composite semi-steel roll collar | |
| CN105013841A (en) | Strip steel cooling system | |
| CN201543577U (en) | Machine of coating steelbar surfaces | |
| CN110344057A (en) | A kind of etching machines | |
| CN206316523U (en) | A kind of argon arc welding machine welding system with refrigerating function | |
| CN108507331A (en) | A kind of high-pressure wash vacuum drying system | |
| CN106694292A (en) | Workpiece integrated automation device | |
| CN206603134U (en) | A kind of numerical control egg liquid sprinkling equipment | |
| CN107245750A (en) | A kind of copper bar continuous tin plating production line | |
| CN208374432U (en) | Efficient full-automatic dip-soldering machine | |
| CN216655694U (en) | Full-automatic cleaning machine for liquid crystal glass substrate | |
| CN210966798U (en) | High-hardness martensite heat-resistant stainless steel production equipment | |
| CN106824641B (en) | A kind of workpiece slope production line | |
| CN206543677U (en) | A kind of workpiece integrated automation device | |
| CN203390173U (en) | Three-pack amorphous belt spraying machine | |
| CN210497000U (en) | Roller spraying dual-purpose artificial board formaldehyde-removing and anion-purifying equipment | |
| CN106925454A (en) | A kind of high efficiency workpiece surface electrostatic powder coating machine | |
| CN208402231U (en) | The two-sided anti-oxidation pcb board automated production equipment of high-performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |