201229319 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及侧麟，特㈣及—種_裝置及姓刻方 法。 [先前技術] [0002] 隨著電子產業之飛速發展，作為電子產品基本構件之電 路板之製作技術祕愈來愈重要。電路板—般由覆銅基 板經裁切、鐵孔、鍍銅、曝光、_、_ H印 〇 刷、成型等-系列製程製作而成。具體可參閲c h.201229319 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a side lining, a special (four), and a _device and a surname method. [Prior Art] [0002] With the rapid development of the electronics industry, the secrets of the fabrication of circuit boards, which are the basic components of electronic products, are becoming more and more important. The board is made of a series of processes, such as cutting, iron hole, copper plating, exposure, _, _ H printing, molding, etc. For details, see c h.
Steer等人在Proceedings nf Tr, δδ 〇f the IEEE, Vol.39, N〇.2 (2002年8月）中發表之 “Dieiectric cha^ terization of printed circuit ^ strates” 一文。 [0003] 其中，蝕刻係電路板製作之重要製 王’具主要使用姓刻 衣置對電路板表面之㈣層進行選純軸㈣成線路 圖形。先前之_裝置包括_槽，糊槽内設置傳送 康輪組，祕傳祕_之電路板。傳拉輪組之上、 下方分別設置多根上、下噴管。 ,B上、下噴管分別設複數 、下喷嘴，収魏_崎電叫彳目狀兩表面之 銅镇層同時進行選擇祕刻。然而，由於該上、下噴嘴 與電路板之距_定，當電路板上、下㈣之銅落層需 要餘刻職之列絲线關_，尤其於電路板之 上、下兩面之_具有不同之厚度時，僅藉由調整上 、下喷嘴錢_狀喷―整傳1 錄組傳送電 路板之速度之方法並不能獲得要树寬之線路圖形。針 100100426 表單編號A0101 第5頁/共23頁 1002000719-0 201229319 對該問題，先前之做法主要有兩種··一係以犧牲某一面 線路圖形之品質調整喷壓與傳送速度，例如，以保證線 寬較細之一面之線路圖形為前提進行蝕刻，則可能會導 致另一面之線路圖形之線寬變粗或者蝕刻不足造成短路 ;二係先蝕刻形成第一面之線路圖形，再蝕刻形成另一 面之線路圖形，然而分兩次進行蝕刻需要形成兩次乾膜 且使得製作流程繁瑣，從而造成成本提升。 [0004] 有鑑於此，針對上述問題，提供一種可同時對電路板兩 面之銅箔層進行蝕刻形成兩種不同線寬之線路圖形，且 該兩面之線路圖形之線寬均滿足要求之蝕刻裝置及蝕刻 方法實屬必要。 【發明内容】 [0005] 下面將以具體實施例說明一種蝕刻裝置及蝕刻方法。 [0006] 一種蝕刻裝置，包括蝕刻槽、傳送滾輪組、上喷淋裝置 、下喷淋裝置、第一升降機構以及第二升降機構。該傳 送滾輪組、上喷淋裝置及下喷淋裝置均設置於蝕刻槽内 。該傳送滾輪組包括複數上傳送滾輪與複數下傳送滚輪 ，用於傳送位於複數上傳送滚輪與複數下傳送滾輪之間 之電路板。該上喷淋裝置位於複數上傳送滾輪之上方。 該下喷淋裝置位於複數下傳送滾輪之下方。該上噴淋裝 置與下喷淋裝置用於分別向電路板相對之兩表面喷灑蝕 刻液。該第一升降機構安裝於蝕刻槽，並與上喷淋裝置 相連接，用於驅動上喷淋裝置相對複數上傳送滚輪在垂 直於電路板傳送之方向移動。該第二升降機構亦安裝於 蝕刻槽，並與下喷淋裝置相連接，用於驅動下喷淋裝置 100100426 表單編號A0101 第6頁/共23頁 1002000719-0 201229319 [0007] Ο [0008] Ο [0009] 才。h贿下傳送滾輪在垂直於電純傳送之方向移動 刻包括步驟:提供電路板及如上所述之钱 ^電路板具有相對之第一表面與第二表面； 一工機構驅動上噴淋裝置移動至與傳送滾輪組相距第 送= ’第二升降機構驅動下喷淋裝置移動至與傳 輪⑽料二以距離；傳送滾輪組將電路板傳送 刻槽’該電路板位於複數上傳送滾輪與複數下傳 达κ之間，該電路板之第一表面與上喷淋 該電路板H面與下喷淋裝置相對；上嗜 _刻液對”路板之第-表面進行㈣，下噴淋气置 喷麗姓刻液對該電路板之第二表面進娜刻）以及傳送 滾輪組將_後之電路板傳送離祕刻槽。 相較於先前技術，本技術方案之蝕刻裝置及使用兮蝕列 裝置之蝕刻方法，其可利用第一升降機構與第二升降機 構分別將上喷淋裝置與下喷淋裝置移動至與傳送承幹組 合適之工作距離，從而可獲得合適之蝕刻距離對電路板 進行蝕刻’以滿足電路板相對之兩表面不同之起叫要求 ，從而提升電路板餘刻品質。 【實施方式】 下面將結合附圖與實施例對本技術方案之蝕刻, 1置及姓 刻方法作進一步詳細說明。 [0010] 100100426 請參閲圖1至圖3，本技術方案提供一種蝕刻袭署 我· i 0，用 於對電路板20進行蝕刻。該蝕刻裝置10包括餘刻槽^ 傳送滚輪組12、上噴淋裝置13、下噴淋裝置ι4 表單編號A0101 第7頁/共23頁 第一升 1002000719-0 201229319 降機構15與第二升降機構16。該傳送滾輪組12、上噴淋 裝置13下噴淋裝置14均設置於姓刻槽11内。該上噴淋 裝置13與下噴淋裝置丨4用於分別向電路板2〇相對之兩表 面喷灑蝕刻液。該第—升降機構15安裝於蝕刻槽u並與 上喷淋裝置13相連接，該第二升降機構16安裝於蝕刻槽 11並與下喷淋裝置14相連接。 [0011] [0012] [0013] 具體地，該蝕刻槽11具有相對之第一開口 1〇1與第二開口 102。該第一開口 101用於供電路板2〇進入蝕刻槽u，該 第二開口 102用於供電路板2〇離開蝕刻槽n。該蝕刻槽 11具有相對之頂壁11丨 ' 底壁112，以及連接於該頂壁 111與底壁11 2之間之第一谢壁η 3與第二側壁11 4。該第 一側壁113開設有第一開口 1〇1以供電路板進入蝕刻槽u ，该第二側壁Π4開設有第二開口 1〇2以供電路板離開蝕 刻槽11。該第一開口 1 〇 1與第二開口 ^ 〇 2位於同一水平線 上0 該傳送滾輪組12位於該第一開口 ！ 〇丨與第二開口 i 〇2之間 。該傳送滾輪組12包括複數上傳送滾輪121與複數下傳送 滾輪122，用於傳送位於複數上傳送滾輪121與複數下傳 送滾輪122之間之電路板2〇。 進一步地，該傳送滾輪組丨2還包括第一擋水滾輪123、第 二擋水滾輪124、第三擋水滾輪125及第四擋水滾輪126 。該第一擋水滾輪123與第三擋水滾輪125均靠近第一開 口 101，且上下相對，用於相互配合以阻擋蝕刻液從第一 開口 101濺出。該第二擋水滾輪124與第四擋水滾輪126 均罪近第二開口 102，且上下相對，用於相互配合以阻擋 100100426 表單編號Α0Ι0Ι 第8頁/共23頁 1002000719-0 201229319 蝕刻液從第二開口 102濺出。該複數上傳送滚輪121位於 第一擋水滚輪1 23與第二擋水滾輪124之間。該複數下傳 送滾輪122位於第三擋水滾輪125與第四擋水滾輪126之 間。 [(KM]該上噴淋裝置13位於複數上傳送滾輪121之上方。該上喷 淋裝置13包括上框架131、上噴管132與複數上喷嘴133 。該上喷管132設置在上框架131。該複數上喷嘴133安 裝在該上喷管132且與該上喷管132相連通。該複數上喷 嘴133與複數上傳送滾輪121相對。 ❹ [0015] 該上框架131開設有第一螺紋孔103。本實施例中，該上 框架131為一空心矩形框架該上框.架1.31具有第一邊框 1311、第一邊框13丨2、第三邊框13.13與第四邊框1314 。該第一邊框1311與第三邊框1313平行，該第二邊框 1312與第四邊框1314平行。該第一螺紋孔1〇3之數量為 兩個’該兩個第一螺紋孔1 〇3分別開設在第一邊框1311與 第三邊框1313上。 Ο [0016]該上喷管1 32設置在上框架1 31内’且與第二邊框1312平 行。本實施例中’該上喷淋裝置13包括複數相互平行之 上喷管132。每個上噴管132連通複數上喷嘴133。每個 上噴嘴133具有與上傳送滾輪121相對之上喷口 1 332以向 電路板表面喷灑蝕刻液。 [00Π]該下喷淋裝置14位於複數下傳送滾輪122之下方。該下噴 淋裝置14包括下框架141、下喷管142與複數下喷嘴143 。該下噴管142設置在下框架141。該複數下喷嘴143安 100100426 表單編號A0101 第9頁/共23頁 1002000719-0 201229319 裝在該下噴管142且與該下噴管142相連通。該複數下噴 嘴143與複數下傳送滾輪122相對。 [0018] [0019] [0020] [0021] 5亥下框架141開设有弟二螺紋孔1 〇 4。本實施例中，該下 框架1 41亦為一空心矩形框架。該下框架1 41與上框架 131之結構相同，在此不再贅述。 該下噴管142設置在下框架141内，且與上噴管132平行 。本實施例中，該下喷淋裝置14包括複數相互平行之下 喷管142。每個下喷管142連通複數下喷嘴143。每個下 喷嘴143具有與下傳送滚輪122相對之下噴口 1432以向電 路板表面噴灑蝕刻液。優選地，該複數上噴嘴133與複數 下噴嘴143均為直線喷射喷嘴，該直線噴射噴嘴可喷射出 直線狀之钱刻液，其可提高姓刻液之噴射壓力與喷射直 線度，蝕刻液喷射壓力之增加可減少蝕刻時由於電路板 20表面之中間區域排液不暢造成之水池效應，蝕刻液喷 射直線度之提高可有效減少電路板2〇之側蝕問題。 該第一升降機構15用於驅動上喷淋裝置13相對複數上傳 送滾輪121在垂直於電路板20傳送之方向移動。該第一升 降機構15與該上框架131機械連接。本實施例中，該上框 架m之第-邊框1311與第三邊框1313分別機械連接有 一個第一升降機構15。 具體地’該第一升降機構15包括機械連接之第一伺服馬 達⑸與第-滾珠絲桿152。該第—飼服馬達i5i用於驅 ^第废珠絲；^152轉動。該第—滾珠絲桿152具有與該 第一螺紋孔1G3相配合之外螺紋以與該上框架ΐ3ι旋合。 100100426 表單編號A0101 第10頁/共23頁 1002000719- 201229319 [0022]Ο [0023] Ο [0024] 100100426 本實施例中，該第一伺服馬達151固定在蝕刻槽11之頂壁 111 ’該第一滾珠絲桿丨52之軸向垂直於電路板傳送之方 向。當第一滾珠絲桿152在第一伺服馬達151之驅動下轉 動時’該上框架131便可沿第一滾珠絲桿152之軸向移動 ’從而帶動上噴淋裝置13在第一滾珠絲桿152之轴向上移 動，即上噴淋裝置13可在垂直於電路板傳送之方向移動 ’使得上喷淋裝置13可靠近或遠離傳送滾輪組丨2。 該第二升降機構16用於驅動下噴淋裝置14相對複數下傳 送滾輪122在垂直於電路板2〇傳送之方向移動。該第二升 降機構16與該下框架141機械連接。 具體地’該第二升降機構16包括機械連接之第二伺服馬 達161與第二滾珠絲桿162。該第二伺服馬達161用於驅 動第二滚珠絲桿162轉動》該第二滾珠絲桿162具有與該 第二螺紋孔10 4相配合之外螺紋以與該上框架131旋合。 本實施例中，該第一伺服馬達15〗固定在蝕刻槽u之頂壁 111，該第二滾珠絲捍162之軸向垂直於電路板傳送之方 向。當第二滾珠絲桿162在第二伺服馬達161之驅動下轉 動時，該下框架141便可沿第二滾珠絲桿162之軸向移動 ，從而帶動下噴淋裝置14在第二滾珠絲桿丨62之軸向上移 動，即下喷淋裝置14可在垂直於電路板傳送之方向移動 ’使得下噴淋裝置14可靠近或遠離傳送滚輪組12。 此外，該第一升降機構15與第二升降機構16還可以為其 他具有升降功能之結構。例如，第一升降機構丨5可包括 一個第一固定端與一個可相對該第一固定端做伸縮運動 之第一伸縮端。其中，該第一固定端固定在該蝕刻槽Η 表單編號Α0101 第11頁/共23頁 1002000719-0 201229319 之頂壁U1，該第—伸縮端固定在上喷淋裝置13之上框架 131。第二升降機構以可包括一個第二固定端與一個可相 對該第二固定端做伸縮運動之第二伸縮端。其t，該第 -固疋端固定在該蝕刻槽"之底壁112，該第二伸縮端固 疋在下喷林裝置Η之下框架⑷。優選地，該第一升降機 構15與第二升降機構16均為氣塵桿。該氣壓桿包括氣缸 與活塞’該氣缸為第―固定端與第二固定端，該活塞為 第一伸縮端與第二伸縮端。 [0025] [0026] [0027] [0028] π進步參閱圖4，本技術方案實施例提供一種利用上述 之姓刻裝置1 〇對電路板2〇進行钱刻之蚀刻方法，該電路 板20具有相對之第—表面21與第二表面22，祕刻方法 包括以下步驟： 步驟101，第一升降機構15驅動上喷淋裝置13移動至與傳 送滾輪組12相距第一工作距離，第二升降機構16驅動下 喷淋裝置14移動至與傳送滾輪組12相距第二工作距離。 具體地，該第一工作距離可根據電路板2〇與該上喷淋裝 置13相對之第一表面21之銅箔之厚度及需要蝕刻形成之 線路之線寬進行測試確定。該第二工作距離可根據電路 板20與該下噴淋裝置14相對之第二表面22之銅箔之厚度 及需要姓刻形成之線路之線寬進行測試確定。 步驟102，傳送滾輪組12將電路板2〇傳送進入蝕刻槽11 ，該電路板2〇位於複數上傳送滾輪121與複數下傳送滾輪 1。2之間，該電路板2 〇之第一表面21與上噴淋裳置1 3相 對’該電路板2〇之第二表面22與下噴淋裝置14相對。 100100426 表單編號Α0101 第12頁/共23頁 1002000719-0 201229319 [0029] 將待蝕刻之電路板20放到蝕刻槽11之第_開口1〇1，傳送 /袞輪組12以'一疋之傳送速度將電路板20失在上傳送宁輪 121與下傳送滾輪122之間並向第二開口 1〇2方向傳送移 動。該傳送滾輪組12之傳送速度可根據電路板2〇具體之 蝕刻要求確定。在蝕刻槽11内，電路板2〇相對之第一表 面21與第二表面22分別與上噴淋裝置13與下噴淋裝置14 相對。 闕㈣103，上喷淋裝置13喷讓餘刻液對該電路板2q之第〆 〇 纟面21進行㈣’下喷淋裝置14嘴壤姓刻液對該電路板 20之第二表面22進行敍刻。 _]在傳it錄組電路獅向第二開 口 102方向傳送過程中，上喷料置13以第—喷壓向與其 相對之電路板20之第-表面21噴讓餘刻液進行姓刻下 喷淋裝置14以第二喷壓向與其相對之電路⑽之第二表 面22噴灑蝕刻液進行蝕刻。該第—噴壓與第二噴壓可根 據電路板20之具體之蝕刻要求測試確定。 〇 國㈣1()4 ’傳送滾輪组12將蚀刻後之電路板別傳送離開蚀 刻槽11 » 闺傳送滾輪組12將電路板20自第-開〇1〇1向第二開口 1〇2 傳$ ’ Μ過上喷淋裝置13與下噴淋裝置14仙後，電路 板2〇被傳送滾輪組12傳送離開餘刻槽u。钱刻完成後， 電路板2 0進入下一道製作流程。 剛才目較於先前技術，本技術方案之敍刻裝置及使用該姓刻 刻U ’其可利用第—升降機構與第二升降機 100100426 塢蜣 A0101 第13頁/共23頁 1002000719-0 201229319 構分別將上噴淋裝置與下噴淋裝置移動至與傳送滾輪組 合適之工作距離，從而可獲得合適之蝕刻距離對電路板 進行蝕刻，以滿足電路板相對之兩表面不同之蝕刻要求 ，從而提升電路板蝕刻品質。 [0035] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。先前技術，以上所述者僅為本發明之較佳 實施方式，自不能以此限制本案之申請專利範圍。舉凡 熟悉本案技藝之人士援依本發明之精神所作之等效修飾 或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0036] 圖1係本技術方案實施例提供之蝕刻裝置之示意圖。 [0037] 圖2係圖1之蝕刻裝置沿II-II方向之剖視圖。 [0038] 圖3係圖1之钱刻裝置對電路板進行li刻之示意圖。 [0039] 圖4係本技術方案實施例提供之蝕刻方法之流程圖。 【主要元件符號說明】 100100426 表單編號 A0101 第 14 頁/共 23 頁 1002000719-0 [0040] 蝕刻裝置：10 [0041] 蝕刻槽：11 [0042] 傳送滾輪組： 12 [0043] 上喷淋裝置： 13 [0044] 下喷淋裝置： 14 [0045] 第一升降機構 ：15 [0046] 第二升降機構 ：16 201229319Steer et al., "Dieiectric cha ^ terization of printed circuit ^ strates", published in Proceedings nf Tr, δδ 〇f the IEEE, Vol. 39, N〇.2 (August 2002). [0003] Among them, the important system for the manufacture of an etched circuit board is to use a surname to place a (4) layer on the surface of the board to select a pure axis (four) into a line pattern. The previous _ device includes a _ trough, and a circuit board for transmitting the Kang wheel group and the secret secret _ is set in the paste tank. A plurality of upper and lower nozzles are respectively arranged above and below the transmission wheel set. The upper and lower nozzles of the B are respectively provided with a plurality of lower nozzles, and the copper town layers of the two surfaces of the Wei-Saki electric screaming are simultaneously selected for secret engraving. However, due to the distance between the upper and lower nozzles and the circuit board, when the copper layer on the board and the bottom (four) needs the remaining line of the wire, _, especially on the upper and lower sides of the board At different thicknesses, the line pattern of the tree width cannot be obtained only by adjusting the speed of the upper and lower nozzles. Needle 100100426 Form No. A0101 Page 5 / Total 23 Page 1002000719-0 201229319 There are two main methods for this problem. One is to adjust the injection pressure and transmission speed at the expense of the quality of a certain line pattern, for example, to ensure Etching on the line pattern of one side of the line width may cause the line width of the other side of the line pattern to become thicker or under-etched to cause a short circuit; the second line first etches the line pattern of the first side, and then etches to form another On one side of the line pattern, however, etching in two passes requires two dry films to be formed and the production process is cumbersome, resulting in cost increases. In view of the above, in view of the above problems, an etching apparatus capable of simultaneously etching a copper foil layer on both sides of a circuit board to form two different line widths, and having a line width of both sides of the line pattern satisfying the requirements is provided. And etching methods are necessary. SUMMARY OF THE INVENTION [0005] An etching apparatus and an etching method will be described below by way of specific embodiments. An etching apparatus includes an etching tank, a conveying roller set, an upper showering device, a lower showering device, a first lifting mechanism, and a second lifting mechanism. The transfer roller set, the upper spray device and the lower spray device are all disposed in the etching groove. The transport roller set includes a plurality of upper transport rollers and a plurality of lower transport rollers for transporting a circuit board between the plurality of transport rollers and the plurality of lower transport rollers. The upper spray device is located above the plurality of transfer rollers. The lower spray device is located below the plurality of transfer rollers. The upper shower device and the lower shower device are used to respectively spray etchant on opposite surfaces of the circuit board. The first elevating mechanism is mounted to the etching tank and is coupled to the upper sprinkler for driving the upper sprinkler to move relative to the plurality of upper transport rollers in a direction perpendicular to the transport of the board. The second lifting mechanism is also installed in the etching tank and is connected to the lower shower device for driving the lower shower device 100100426. Form No. A0101 Page 6 of 23 1002000719-0 201229319 [0007] Ο [0008] Ο [0009] Only. h bribing the transfer roller in a direction perpendicular to the transmission of pure electricity, including the steps of: providing a circuit board and the above-mentioned money ^ circuit board having a first surface and a second surface opposite; a mechanism driving the spray device to move To the transmission roller group, the first transmission = 'the second lifting mechanism drives the spray device to move to the distance from the transfer wheel (10); the transfer roller group transfers the circuit board to the groove> the circuit board is located on the plurality of transfer rollers and plural Under the transfer of κ, the first surface of the circuit board is sprayed on the H surface of the circuit board opposite to the lower shower device; the upper surface of the circuit board is subjected to the fourth surface, and the lower spray air is sprayed. The second surface of the circuit board is placed on the second surface of the circuit board, and the transfer roller group transports the circuit board of the circuit board away from the secret groove. Compared with the prior art, the etching device of the present invention and the use of the etching The etching method of the column device can use the first lifting mechanism and the second lifting mechanism to respectively move the upper shower device and the lower shower device to a suitable working distance with the transfer bearing group, thereby obtaining a suitable etching distance pair circuit Board The row etching is performed to meet the different requirements of the opposite surfaces of the circuit board, thereby improving the quality of the circuit board. [Embodiment] The etching, the first method and the last name method of the present technical solution will be described below with reference to the accompanying drawings and embodiments. [0010] 100100426 Referring to FIG. 1 to FIG. 3, the technical solution provides an etch attack on the circuit board 20. The etching device 10 includes a residual groove ^ transfer roller Group 12, upper spray device 13, lower spray device ι4 Form No. A0101 Page 7 / Total 23 pages First liter 1002000719-0 201229319 Down mechanism 15 and second lifting mechanism 16. The transfer roller group 12, sprayed on The spraying device 14 of the device 13 is disposed in the last slot 11. The upper shower device 13 and the lower shower device 4 are respectively used for spraying the etching liquid to the opposite surfaces of the circuit board 2, respectively. The mechanism 15 is mounted in the etching tank u and connected to the upper shower device 13, and the second lifting mechanism 16 is mounted on the etching tank 11 and connected to the lower shower device 14. [0011] [0013] Specifically, The etching groove 11 has a first opening 1〇1 And the second opening 102. The first opening 101 is used for the circuit board 2 to enter the etching groove u, and the second opening 102 is used for the circuit board 2 to leave the etching groove n. The etching groove 11 has an opposite top wall 11 a bottom wall 112, and a first wall η 3 and a second side wall 11 connected between the top wall 111 and the bottom wall 11 2 . The first side wall 113 defines a first opening 1 〇 1 for the circuit The plate enters the etching groove u, and the second side wall Π4 is provided with a second opening 1〇2 for the circuit board to leave the etching groove 11. The first opening 1 〇1 is located on the same horizontal line as the second opening ^2. Group 12 is located in the first opening! 〇丨 between the second opening and i 〇2. The transport roller set 12 includes a plurality of upper transport rollers 121 and a plurality of lower transport rollers 122 for transporting a circuit board 2 位于 between the plurality of transport rollers 121 and the plurality of lower transport rollers 122. Further, the transport roller set 丨2 further includes a first water retaining roller 123, a second water retaining roller 124, a third water retaining roller 125, and a fourth water retaining roller 126. The first water retaining roller 123 and the third water retaining roller 125 are both close to the first opening 101 and are vertically opposed to cooperate with each other to block the etchant from splashing from the first opening 101. The second water retaining roller 124 and the fourth water retaining roller 126 are both adjacent to the second opening 102 and are vertically opposed to each other to block 100100426. Form number Α0Ι0Ι Page 8/23 pages 1002000719-0 201229319 Etching solution from The second opening 102 is splashed. The plurality of upper conveying rollers 121 are located between the first water retaining roller 213 and the second water retaining roller 124. The plurality of transfer rollers 122 are located between the third water retaining roller 125 and the fourth water retaining roller 126. [(KM] The upper shower device 13 is located above the plurality of upper conveying rollers 121. The upper shower device 13 includes an upper frame 131, an upper nozzle 132 and a plurality of upper nozzles 133. The upper nozzle 132 is disposed in the upper frame 131 The plurality of upper nozzles 133 are mounted on the upper nozzle 132 and communicate with the upper nozzle 132. The plurality of upper nozzles 133 are opposed to the plurality of upper conveying rollers 121. [0015] The upper frame 131 is provided with a first threaded hole 103. In this embodiment, the upper frame 131 is a hollow rectangular frame. The upper frame 1. The frame 1.31 has a first frame 1311, a first frame 13丨2, a third frame 13.13 and a fourth frame 1314. The first frame 1311 Parallel to the third frame 1313, the second frame 1312 is parallel to the fourth frame 1314. The number of the first threaded holes 1〇3 is two 'the two first thread holes 1 〇3 are respectively opened on the first frame 1311 And the third frame 1313. [0016] The upper nozzle 1 32 is disposed in the upper frame 1 31 and parallel to the second frame 1312. In the present embodiment, the upper shower device 13 includes a plurality of parallel lines. Nozzle 132. Each upper nozzle 132 communicates with a plurality of upper nozzles 133. Each upper nozzle 133 The nozzle 1 332 is opposed to the upper transfer roller 121 to spray the etching liquid onto the surface of the circuit board. [00Π] The lower shower device 14 is located below the plurality of lower transfer rollers 122. The lower shower device 14 includes a lower frame 141. a lower nozzle 142 and a plurality of lower nozzles 143. The lower nozzle 142 is disposed in the lower frame 141. The plurality of lower nozzles 143A 100100426 Form No. A0101 Page 9 / 23 pages 1002000719-0 201229319 are mounted in the lower nozzle 142 The lower nozzle 143 is in communication with the lower lower conveying roller 122. [0018] [0020] [0012] The lower frame 141 is provided with the second threaded hole 1 〇4. In this embodiment, the lower frame 141 is also a hollow rectangular frame. The structure of the lower frame 141 is the same as that of the upper frame 131, and will not be described herein. The lower nozzle 142 is disposed in the lower frame 141, and The nozzles 132 are parallel. In the present embodiment, the lower spray device 14 includes a plurality of nozzles 142 that are parallel to each other. Each of the lower nozzles 142 is connected to a plurality of lower nozzles 143. Each of the lower nozzles 143 has a lower relative to the lower transfer rollers 122. Lower nozzle 1432 to spray etchant onto the surface of the board Preferably, the plurality of upper nozzles 133 and the plurality of lower nozzles 143 are linear jet nozzles, and the linear jet nozzles can eject a linear money engraving liquid, which can improve the ejection pressure and ejection straightness of the surname liquid, and the etching liquid The increase of the injection pressure can reduce the pool effect caused by poor liquid discharge in the middle region of the surface of the circuit board 20 during etching, and the improvement of the straightness of the etching liquid can effectively reduce the side etching problem of the circuit board 2 . The first elevating mechanism 15 is for driving the upper shower device 13 to move in a direction perpendicular to the transport of the circuit board 20 with respect to the plurality of transfer rollers 121. The first lift mechanism 15 is mechanically coupled to the upper frame 131. In this embodiment, the first frame 1311 and the third frame 1313 of the upper frame m are mechanically connected to a first lifting mechanism 15 respectively. Specifically, the first lifting mechanism 15 includes a first servo motor (5) and a first ball screw 152 that are mechanically coupled. The first feeding motor i5i is used to drive the first waste bead; The first ball screw 152 has a threaded engagement with the first threaded hole 1G3 to be screwed with the upper frame ΐ3ι. 100100426 Form No. A0101 Page 10 of 23 1002000719-201229319 [0022] Ο [0024] 100100426 In this embodiment, the first servo motor 151 is fixed to the top wall 111 of the etching tank 11 'The first The axial direction of the ball screw 52 is perpendicular to the direction in which the board is transported. When the first ball screw 152 is rotated by the first servo motor 151, the upper frame 131 can be moved along the axial direction of the first ball screw 152 to drive the upper spray device 13 on the first ball screw. The axial movement of 152, i.e., the upper spray device 13 is movable in a direction perpendicular to the transmission of the circuit board, so that the upper spray device 13 can be moved closer to or away from the transfer roller set 丨2. The second elevating mechanism 16 is configured to drive the lower sprinkler 14 to move relative to the plurality of lower transfer rollers 122 in a direction perpendicular to the transport of the circuit board 2. The second lift mechanism 16 is mechanically coupled to the lower frame 141. Specifically, the second lifting mechanism 16 includes a second servo motor 161 and a second ball screw 162 that are mechanically coupled. The second servo motor 161 is for driving the second ball screw 162 to rotate. The second ball screw 162 has a threaded engagement with the second threaded hole 104 to be screwed with the upper frame 131. In this embodiment, the first servo motor 15 is fixed to the top wall 111 of the etching groove u, and the axial direction of the second ball screw 162 is perpendicular to the direction in which the circuit board is transported. When the second ball screw 162 is driven by the second servo motor 161, the lower frame 141 can move along the axial direction of the second ball screw 162, thereby driving the lower spray device 14 at the second ball screw. The axial movement of the crucible 62, i.e., the lower sprinkler 14 can be moved in a direction perpendicular to the transmission of the board, such that the lower sprinkler 14 can be moved toward or away from the transport roller set 12. Further, the first elevating mechanism 15 and the second elevating mechanism 16 may have other structures having a lifting function. For example, the first elevating mechanism 丨 5 may include a first fixed end and a first telescopic end that is telescopically movable relative to the first fixed end. Wherein, the first fixed end is fixed to the top wall U1 of the etching groove 表单 Form No. Α0101, 11th, 23rd, 1002000719-0 201229319, and the first telescopic end is fixed to the upper frame 131 of the upper shower device 13. The second lifting mechanism may include a second fixed end and a second telescopic end that is telescopically movable relative to the second fixed end. And t, the first solid end is fixed to the bottom wall 112 of the etching groove, and the second telescopic end is fixed to the frame (4) below the lower spray device. Preferably, the first elevator mechanism 15 and the second lifting mechanism 16 are both air dust bars. The gas pressure bar includes a cylinder and a piston. The cylinder is a first fixed end and a second fixed end, and the piston is a first telescopic end and a second telescopic end. [0028] [0028] π Progress Referring to FIG. 4, an embodiment of the present technical solution provides a method for etching a circuit board 2 by using the above-described surname device 1 ,, the circuit board 20 has In contrast to the first surface 21 and the second surface 22, the secret engraving method comprises the following steps: Step 101, the first lifting mechanism 15 drives the upper shower device 13 to move to a first working distance from the conveying roller set 12, and the second lifting mechanism The 16-spray spray device 14 is moved to a second working distance from the transport roller set 12. Specifically, the first working distance can be determined according to the thickness of the copper foil of the first surface 21 of the circuit board 2 and the upper shower device 13 and the line width of the line to be etched. The second working distance can be determined according to the thickness of the copper foil of the second surface 22 of the circuit board 20 and the lower shower device 14 and the line width of the line formed by the surname. Step 102, the transport roller set 12 transports the circuit board 2 into the etching slot 11, the circuit board 2 is located between the plurality of upper transfer rollers 121 and the plurality of lower transfer rollers 1. 2, the first surface 21 of the circuit board 2 The second surface 22 of the circuit board 2 is opposed to the lower shower device 14 as opposed to the upper spray. 100100426 Form No. 1010101 Page 12 of 23 1002000719-0 201229319 [0029] The circuit board 20 to be etched is placed in the first opening 1〇1 of the etching bath 11, and the transmission/turning wheel set 12 is conveyed at a speed of one turn. The circuit board 20 is lost between the upper transfer wheel 121 and the lower transfer roller 122 and is moved in the direction of the second opening 1〇2. The transfer speed of the transfer roller set 12 can be determined in accordance with the specific etching requirements of the board 2. In the etching bath 11, the first surface 21 and the second surface 22 of the circuit board 2 are opposed to the upper shower unit 13 and the lower shower unit 14, respectively.阙 (4) 103, the upper sprinkler device 13 sprays the residual liquid on the second surface 21 of the circuit board 2q (4) 'the lower sprinkler device 14 mouth name engraving liquid to the second surface 22 of the circuit board 20 engraved. _] During the transfer of the circuit recording lion to the second opening 102, the upper spray device 13 sprays the remaining liquid onto the first surface 21 of the opposite circuit board 20 with the first spray pressure. The shower device 14 is etched by spraying an etchant onto the second surface 22 of the opposite circuit (10) with a second spray pressure. The first spray pressure and the second spray pressure can be determined according to the specific etching requirements of the circuit board 20. 〇国(4)1()4' Transfer roller set 12 transports the etched circuit board away from the etched slot 11 » 闺 Transfer roller set 12 transfers the circuit board 20 from the first opening 〇1 to the second opening 1 〇2 After the upper shower device 13 and the lower shower device 14 are passed, the circuit board 2 is transported away from the residual groove u by the transport roller group 12. After the money is completed, the board 20 enters the next production process. Just prior to the prior art, the sculpt device of the present technical solution and the use of the surname U' can be utilized by the first lifting mechanism and the second elevator 100100426 Dock A0101 page 13 / 23 pages 1002000719-0 201229319 respectively Move the upper spray device and the lower spray device to a suitable working distance from the transfer roller set, so that a suitable etching distance can be obtained to etch the circuit board to meet different etching requirements of the opposite surfaces of the circuit board, thereby improving the circuit Board etching quality. [0035] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. In the prior art, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0036] FIG. 1 is a schematic diagram of an etching apparatus provided by an embodiment of the present technical solution. 2 is a cross-sectional view of the etching apparatus of FIG. 1 taken along the II-II direction. [0038] FIG. 3 is a schematic diagram of the circuit board of FIG. 4 is a flow chart of an etching method provided by an embodiment of the present technical solution. [Main component symbol description] 100100426 Form No. A0101 Page 14 of 23 1002000719-0 [0040] Etching device: 10 [0041] Etching groove: 11 [0042] Transfer roller set: 12 [0043] Upper spray device: 13 [0044] Lower sprinkler: 14 [0045] First lifting mechanism: 15 [0046] Second lifting mechanism: 16 201229319
[0047] 頂壁：111 [0048] 底壁：112 [0049] 第一側壁：113 [0050] 第二側壁：114 [0051] 第一開口 ： 1 01 [0052] 第二開口 ： 1 〇 2 [0053] 第一螺紋孔：103 [0054] 第二螺紋孔：104 [0055] 上傳送滾輪：121 [0056] 下傳送滾輪：122 [0057] 第一擋水滚輪： 123 [0058] 第二擋水滚輪： 124 [0059] 第三擋水滾輪： 125 [0060] 第四擋水滾輪： 126 [0061] 上框架：131 [0062] 上喷管：132 [0063] 上喷嘴：133 [0064] 下框架：141 [0065] 下喷管：142 100100426 表單編號A0101 第15頁/共23頁 1002000719-0 201229319 [0066] 下喷嘴： 143 [0067] 第一邊框 :1311 [0068] 第二邊框 ••1312 [0069] 第三邊框 ：1313 [0070] 第四邊框 ：1314 [0071] 上喷口 ： 1332 [0072] 下喷口 ： 1432 [0073] 第一伺服馬達：1 51 [0074] 第一滾珠絲桿：1 5 2 [0075] 第二伺服馬達：161 [0076] 第二滾珠絲桿：162 [0077] 電路板： 20 [0078] 第一表面 ：21 [0079] 第二表面 ：22 100100426 表單編號A0101 第16頁/共23頁 1002000719-0[0047] Top wall: 111 [0048] Bottom wall: 112 [0049] First side wall: 113 [0050] Second side wall: 114 [0051] First opening: 1 01 [0052] Second opening: 1 〇 2 [ 0053] First threaded hole: 103 [0054] Second threaded hole: 104 [0055] Upper transfer roller: 121 [0056] Lower transfer roller: 122 [0057] First water stop roller: 123 [0058] Second water stop Roller: 124 [0059] Third water retaining roller: 125 [0060] Fourth water retaining roller: 126 [0061] Upper frame: 131 [0062] Upper nozzle: 132 [0063] Upper nozzle: 133 [0064] Lower frame :141 [0065] Lower nozzle: 142 100100426 Form number A0101 Page 15 / Total 23 pages 1002000719-0 201229319 [0066] Lower nozzle: 143 [0067] First border: 1311 [0068] Second border •• 1312 [ 0069] Third border: 1313 [0070] Fourth border: 1314 [0071] Upper spout: 1332 [0072] Lower spout: 1432 [0073] First servo motor: 1 51 [0074] First ball screw: 1 5 2 [0075] Second servo motor: 161 [0076] Second ball screw: 162 [0077] Circuit board: 20 [0078] First surface: 21 [0079] ] Second surface: 22 100100426 Form number A0101 Page 16 of 23 1002000719-0