CN107170870B - It is a kind of can the multi-panel of multimode bending go out the LED substrate of light - Google Patents
It is a kind of can the multi-panel of multimode bending go out the LED substrate of light Download PDFInfo
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- CN107170870B CN107170870B CN201610126585.0A CN201610126585A CN107170870B CN 107170870 B CN107170870 B CN 107170870B CN 201610126585 A CN201610126585 A CN 201610126585A CN 107170870 B CN107170870 B CN 107170870B
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- bending
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- 239000000758 substrate Substances 0.000 title claims abstract description 87
- 238000005452 bending Methods 0.000 title claims abstract description 22
- 229920006253 high performance fiber Polymers 0.000 claims abstract description 6
- 239000012779 reinforcing material Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 238000005728 strengthening Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses it is a kind of can the multi-panel of multimode bending go out the LED substrate of light, it is related to field.Substrate angle and substrate ear are provided on the outside of LED substrate ontology, substrate angle and substrate ear are bending structure, anode and cathode are provided on LED substrate ontology, and anode and cathode are connect with conducting wire respectively, and several LED light are evenly distributed with above LED substrate ontology.Substrate is transformed into can be with the plate of multimode bending, LED is welded on substrate, change the wrap direction of substrate, the light-emitting surface of LED changes correspondingly, LED multi-panel goes out light, this not only increases the light-emitting angles of product, also the luminous efficiency of product is improved, make product using it is more flexible extensively, and substrate is using high-performance fiber as a kind of laminate made of reinforcing material compacting,, with excellent mechanical property, high specific strength, high ratio modulus and excellent thermal stability, processing performance is good for it, can at 300 DEG C long-term stable operation.
Description
Technical field
The present invention relates to it is a kind of can the multi-panel of multimode bending go out the LED substrate of light, belong to LED substrate technical field.
Background technique
The appearance of LED aluminum base plate opens cooling application industry, since LED aluminum base plate has high heat dissipation, high voltage, low
The advantages that thermal resistance, long service life, is liked by vast producer.As increasingly consummate, tooling device the optimization of production technology improves,
Product price accelerates to rationalize, and the application field of LED product becomes more broad, as household appliances indicator light aluminum substrate,
Automobile lamp aluminum substrate, street lamp aluminum substrate and outdoor large billboard etc..LED aluminum base plate is succeeded in developing, and indoor photograph has been driven
The development of bright and outdoor brightening product keeps the market segment of the following LED industry more flexible extensively.
The LED aluminum base plate of mainstream is FR4 plate on the market at present, it is to be made with epoxy resin as adhesive with glass fibre
A kind of substrate of reinforcement material, such substrate have carried out extremely special processing in circuit design to thermal diffusion, can effectively drop
The temperature of low product, improves the reliability of product, to extend the service life of product, however, such substrate process disadvantage exists
In:
1.FR4 plate, thermal coefficient 1W/mk, at thermally conductive aspect, there is also some bottlenecks at present for the substrate.LED is welded in
After on substrate, when lighting for a long time, internal heat be will increase, since silica gel heatproof is limited, when LED internal temperature is excessively high
When, heat dissipation can be deteriorated, and the fluorescent powder inside fluorescent glue generates volatilization because heated, and the colour temperature (CCT) of LED generates drift, face
Color consistency be deteriorated, client using when will appear color difference and hot spot；
2.FR4 is also known as glass-epoxy, and material is harder and crisp, and stretching, bending strength are relatively low, bending strength
Generally (40-50) Mpa, due to the restriction by itself material characteristic, original LED substrate occurs in the form of plane
It is non-stretchable, not bent, can not also fold curling in face of masses, after LED is welded on substrate, because by board structure
Restriction, light-emitting surface, light emitting angle are also restrained, and light extraction efficiency is affected therewith, if having particular/special requirement need multi-panel,
When multi-angle goes out light, realized often by other helpers are increased；
Temperature tolerance≤150 DEG C of 3.FR4 plate, low chemical stability cause substrate that can expand with heat and contract with cold because of heated,
LED is linked together by tin cream and substrate, and when deformation occurs for basal plate heated, tin cream flatness changes, tin cream
Defect or gap can be generated, the thermal coefficient of LED is affected, and heat-sinking capability is deteriorated, the heat of part electronic component part
Amount is not led not go out, and is caused it to accelerate failure under high temperature environment, is affected the service life of product.
Summary of the invention
In view of the above-mentioned problems, the technical problem to be solved in the present invention is to provide it is a kind of can the multi-panel of multimode bending go out light
LED substrate.
The present invention can the multi-panel of multimode bending go out the LED substrate of light, it includes LED substrate ontology 1, substrate angle 2, substrate
Ear 3, conducting wire 4, anode 5, cathode 6 and LED light 7, the outside of LED substrate ontology 1 are provided with substrate angle 2 and substrate ear 3,
Substrate angle 2 and substrate ear 3 are bending structure, and anode 5 and cathode 6, and anode 5 and cathode 6 are provided on LED substrate ontology 1
It is connect respectively with conducting wire 4, the top of LED substrate ontology 1 is evenly distributed with several LED light 7.
Preferably, the LED substrate ontology 1 is using polyimide resin as substrate, using high-performance fiber as strengthening material
A kind of laminate made of material compacting.
Beneficial effects of the present invention: it can overcome the disadvantages of the prior art, and substrate is transformed by novelty reasonable in design
It can be welded on substrate with the plate of multimode bending, LED, change the wrap direction of substrate, the light-emitting surface of LED changes correspondingly, and LED is more
Face goes out light, and this not only increases the light-emitting angles of product, also improves the luminous efficiency of product, keeps the application of product cleverer
It is living extensively, and substrate be reinforcing material compacting using high-performance fiber made of a kind of laminate, with excellent mechanical property,
High specific strength, high ratio modulus and excellent thermal stability, processing performance is good, can at 300 DEG C long-term stable operation.
Detailed description of the invention:
Detailed description will be given by the following detailed implementation and drawings by the present invention for ease of explanation,.
Fig. 1 is the structural schematic diagram of the non-bending of LED substrate ontology of the present invention；
Fig. 2 is the structural schematic diagram of the substrate angle bending in the present invention in LED substrate ontology；
Fig. 3 is the structural schematic diagram of the substrate ear bending in the present invention in LED substrate ontology.
Specific embodiment:
As shown in Figure 1-3, present embodiment uses following technical scheme: it includes LED substrate ontology 1, substrate angle
2, substrate ear 3, conducting wire 4, anode 5, cathode 6 and LED light 7, the outside of LED substrate ontology 1 are provided with substrate angle 2 and substrate ear
Portion 3, substrate angle 2 and substrate ear 3 are bending structure, and anode 5 and cathode 6, and positive 5 Hes are provided on LED substrate ontology 1
Cathode 6 is connect with conducting wire 4 respectively, and the top of LED substrate ontology 1 is evenly distributed with several LED light 7.
Preferably, the LED substrate ontology 1 is using polyimide resin as substrate, using high-performance fiber as strengthening material
A kind of laminate made of material compacting.
First using polyimide resin as substrate when present embodiment makes, suppressed by reinforcing material of high-performance fiber
It is LED substrate ontology 1 at a kind of laminate, is then welded with several LED light 7 on LED substrate ontology 1, and by anode 5, negative
Pole 6 is connect with conducting wire 4, and the substrate angle 2 of LED substrate ontology 1 and substrate ear 3 are used bending machine bending.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (1)
1. one kind can the multi-panel of multimode bending go out the LED substrate of light, it is characterised in that: it includes LED substrate ontology (1), base
Plate angle (2), substrate ear (3), conducting wire (4), positive (5), cathode (6) and LED light (7), LED substrate ontology are set on the outside of (1)
It is equipped with substrate angle (2) and substrate ear (3), substrate angle (2) and substrate ear (3) are bending structure, on LED substrate ontology (1)
Be provided with positive (5) and cathode (6), and anode (5) and cathode (6) are connect with conducting wire (4) respectively, LED substrate ontology (1) it is upper
Side is evenly distributed with several LED light (7)；The LED substrate ontology (1) is using polyimide resin as substrate, with high-performance fibre
Dimension is a kind of laminate made of reinforcing material compacting；First using polyimide resin as substrate, using high-performance fiber as strengthening material
It is LED substrate ontology (1) that material, which is pressed into a kind of laminate, is then welded on LED substrate ontology (1) several LED light (7),
And connect positive (5), cathode (6) with conducting wire (4), the substrate angle (2) of LED substrate ontology (1) and substrate ear (3) are used
Bending machine bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610126585.0A CN107170870B (en) | 2016-03-07 | 2016-03-07 | It is a kind of can the multi-panel of multimode bending go out the LED substrate of light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610126585.0A CN107170870B (en) | 2016-03-07 | 2016-03-07 | It is a kind of can the multi-panel of multimode bending go out the LED substrate of light |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107170870A CN107170870A (en) | 2017-09-15 |
| CN107170870B true CN107170870B (en) | 2019-04-02 |
Family
ID=59848525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610126585.0A Active CN107170870B (en) | 2016-03-07 | 2016-03-07 | It is a kind of can the multi-panel of multimode bending go out the LED substrate of light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107170870B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1811264A (en) * | 2005-01-25 | 2006-08-02 | 奥斯兰姆施尔凡尼亚公司 | Automotive led bulb |
| CN201100918Y (en) * | 2007-10-15 | 2008-08-13 | 佳颖精密企业股份有限公司 | LED terminal bracket and its feeding belt |
| CN203150542U (en) * | 2013-03-08 | 2013-08-21 | 北京优格莱照明科技有限公司 | Wick plate |
| CN203192860U (en) * | 2013-04-26 | 2013-09-11 | 东莞市金达照明有限公司 | LED module substrate |
| CN203940376U (en) * | 2014-06-27 | 2014-11-12 | 李桂华 | A kind of for LED bulb lamp can bending aluminum substrate structure |
| CN203940373U (en) * | 2014-06-27 | 2014-11-12 | 李桂华 | A kind of for LED candle bubble lamp can bending aluminum substrate structure |
| CN205508865U (en) * | 2016-03-07 | 2016-08-24 | 深圳市斯迈得半导体有限公司 | LED base plate of multiaspect light -emitting that can multi -wayly buckle |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4076329B2 (en) * | 2001-08-13 | 2008-04-16 | エイテックス株式会社 | LED bulb |
-
2016
- 2016-03-07 CN CN201610126585.0A patent/CN107170870B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1811264A (en) * | 2005-01-25 | 2006-08-02 | 奥斯兰姆施尔凡尼亚公司 | Automotive led bulb |
| CN201100918Y (en) * | 2007-10-15 | 2008-08-13 | 佳颖精密企业股份有限公司 | LED terminal bracket and its feeding belt |
| CN203150542U (en) * | 2013-03-08 | 2013-08-21 | 北京优格莱照明科技有限公司 | Wick plate |
| CN203192860U (en) * | 2013-04-26 | 2013-09-11 | 东莞市金达照明有限公司 | LED module substrate |
| CN203940376U (en) * | 2014-06-27 | 2014-11-12 | 李桂华 | A kind of for LED bulb lamp can bending aluminum substrate structure |
| CN203940373U (en) * | 2014-06-27 | 2014-11-12 | 李桂华 | A kind of for LED candle bubble lamp can bending aluminum substrate structure |
| CN205508865U (en) * | 2016-03-07 | 2016-08-24 | 深圳市斯迈得半导体有限公司 | LED base plate of multiaspect light -emitting that can multi -wayly buckle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107170870A (en) | 2017-09-15 |
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