CN203192860U - LED module substrate - Google Patents
LED module substrate Download PDFInfo
- Publication number
- CN203192860U CN203192860U CN 201320219415 CN201320219415U CN203192860U CN 203192860 U CN203192860 U CN 203192860U CN 201320219415 CN201320219415 CN 201320219415 CN 201320219415 U CN201320219415 U CN 201320219415U CN 203192860 U CN203192860 U CN 203192860U
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- led
- pad
- power supply
- bonding pad
- supply bonding
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Abstract
The utility model relates to the technical field of LED parts, and especially relates to an LED module substrate. The module substrate is provided with crease areas. An aluminum base layer is not arranged at the crease areas, such that bending ability is provided. The LED module substrate is bent along the crease areas, such that the planar LED module substrate is changed into a three-dimensional module substrate which can fit a heat conduction column. During assembly, the substrate is directly sleeved in the heat conduction column. Also, the substrate is provided with a power source connection zone. An LED weld pad set on the LED substrate can take power from a power source connection zone electrode pad through a circuit layer. Compared with prior art, the LED module substrate provided by the utility model is simple to assemble. One-step fitting can be achieved after bending, and errors such as assembly missing or reverse assembly are avoided. Also, wiring is easy. A connection wire is simply connected with a power source module, and the other parts are connected through the built-in circuit layer. Therefore, work load is greatly reduced, and the final LED product has the advantages of simple circuit and less failure.
Description
Technical field
The utility model relates to LED accessory technical field, particularly a kind of LED module group substrates.
Background technology
In the LED light fixture, the LED module group substrates is main building block, and the LED lamp generally is welded on the module group substrates, simultaneously from the module group substrates power taking.Corresponding, LED pad and corresponding power taking circuit with LED to be welded coupling also must be set on the module group substrates.
In existing LED light fixture, many light fixtures, generally all adopt heating column to be set and around the heating column side a plurality of LED substrates to be set as candle lamp in order to obtain 360 ° light angle, simultaneously at the LED substrate LED lamp is set, thereby makes that 360 ° of light fixture energy are luminous.Yet but there is following a plurality of problem in this method: (1) needs respectively each LED substrate to be installed on the heating column when assembling LED lamp, and the duplication of labour is many, and efficiency of assembling is low; Also need to beat through wires hole to each LED substrate when (2) assembling, connecting line is set, complicated operation is made mistakes easily; (3) because each LED substrate all independently draws connecting line to the power supply module of power supply, so wiring is complicated in the LED light fixture, breaks down easily, and is unfavorable for maintenance after the fault; (4) parts are many, the cost height.
Therefore, for solving weak point of the prior art, provide a kind of and have a plurality of LED substrates and can disposablely be assembled into each side of heating column, the simple LED that connects up simultaneously module group substrates seems particularly important.
Summary of the invention
The purpose of this utility model is to avoid above-mentioned weak point of the prior art and a kind of a plurality of LED substrates and can disposablely be assembled into each side of heating column, the simple LED that connects up simultaneously module group substrates of having is provided.
The purpose of this utility model is achieved through the following technical solutions:
A kind of LED module group substrates is provided, comprise polygonal power supply bonding pad and the LED substrate zone that is connected with the power supply bonding pad that is no less than two, the junction of described power supply bonding pad and LED substrate zone is provided with the folding line district, described power supply bonding pad and LED substrate zone include aluminum base layer successively, insulating barrier and circuit layer, described folding line district comprises insulating barrier and circuit layer, insulation layer is offered in described power supply bonding pad, insulate and offer through wires hole in described insulation layer bottom surface, the circuit layer at described through wires hole place is provided with electrode pad, the circuit layer of described LED substrate zone is provided with LED pad group, and described LED pad group is through the electrode pad power taking.
Wherein, described LED pad group is connected the back from the electrode pad power taking.
Wherein, described power supply bonding pad or LED substrate zone offer fixing hole.
Wherein, described power supply bonding pad is regular pentagon, and each equal correspondence in bar limit of the power supply bonding pad of described regular pentagon is connected with a rectangular LED substrate zone.
Wherein, described power supply bonding pad is square, and each equal correspondence in bar limit of the power supply bonding pad of described square is connected with a rectangular LED substrate zone.
Wherein, described power supply bonding pad is provided with the pad through the LED of electrode pad power taking.
Wherein, each LED pad group is provided with the LED pad that is no less than two, and the LED pad in the same pad group is connected in parallel.
The beneficial effects of the utility model: the utility model provides a kind of LED module group substrates, during use, because the folding line district does not have aluminum base layer, therefore has the bendable folding endurance, the LED module group substrates is bent along the folding line district, the LED module group substrates on plane can be changed to the module group substrates of the solid of the heating column of can fitting, directly being inserted in heating column during assembling gets final product, in addition, owing to also be provided with the power supply bonding pad, this zone is provided with the bottom surface insulation and offers the insulation layer of through wires hole, therefore through wires hole is also passed in bottom surface that can be from this power supply module outconnector to insulation layer, electrode pad welding with the circuit layer of power supply bonding pad, the power supply power supply namely is provided at the electrode pad place, the folding line district includes circuit layer simultaneously, be that LED pad group on the LED substrate can be by circuit layer from the electrode pad power taking, compared with prior art, the LED module group substrates assembling that the utility model provides is simple, and disposable the putting in place in bending back neglected loading can not occur, mistakes such as anti-dress, wiring simultaneously easily, only a connecting line need be set and be connected with the power supply module, all the other circuit layers by itself connect, and have both reduced workload in a large number, make that also the interior circuit of final LED product is simple, fault is few.
Description of drawings
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in the accompanying drawing does not constitute any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the following drawings.
Fig. 1 is the Facad structure schematic diagram of the embodiment 1 of a kind of LED module group substrates of the utility model.
Fig. 2 is the reverse side structural representation of the embodiment 1 of a kind of LED module group substrates of the utility model.
Fig. 3 is the LED substrate zone schematic cross-section of the embodiment 1 of a kind of LED module group substrates of the utility model.
Fig. 4 is the Facad structure schematic diagram of the embodiment 2 of a kind of LED module group substrates of the utility model.
Fig. 5 is the bending state schematic diagram of the embodiment 2 of a kind of LED module group substrates of the utility model.
Fig. 6 is the Facad structure schematic diagram of the embodiment 3 of a kind of LED module group substrates of the utility model.
Embodiment
With the following Examples the utility model is further described.
One of embodiment of a kind of LED module group substrates of the utility model, as shown in Figure 1 to Figure 3, comprise: the power supply bonding pad 1 of square, each equal correspondence in bar limit of the power supply bonding pad 1 of described square is connected with a rectangular LED substrate zone 2, described power supply bonding pad 1 is provided with folding line district 3 with the junction of LED substrate zone 2, described power supply bonding pad 1 and LED substrate zone 2 comprise aluminum base layer 5 successively, insulating barrier 6 and circuit layer 7, described folding line district 3 comprises insulating barrier 6 and circuit layer 7, insulation layer 11 is offered in described power supply bonding pad 1, insulate and offer through wires hole 12 in described insulation layer 11 bottom surfaces, the circuit layer 7 at described through wires hole 12 places is provided with electrode pad 13, the circuit layer 7 of described LED substrate zone 2 is provided with LED pad group 21, each LED pad group 21 comprise one can be to the LED pad of a led chip 8 power supply, described LED pad is through electrode pad 13 power takings.
During use, because folding line district 3 does not have aluminum base layer 5, therefore has the bendable folding endurance, with 3 bendings along the folding line district of LED module group substrates, the LED module group substrates on plane can be changed to the module group substrates of the solid of the heating column of can fitting, directly being inserted in heating column during assembling gets final product, in addition, owing to also be provided with power supply bonding pad 1, this zone is provided with the bottom surface insulation and offers the insulation layer 11 of through wires hole 12, therefore through wires hole 12 is also passed in bottom surface that can be from this power supply module outconnector to insulation layer 11, electrode pad 13 welding with the circuit layer 7 of power supply bonding pad 1, the power supply power supply namely is provided at electrode pad 13 places, folding line district 3 includes circuit layer 7 simultaneously, be on the LED substrate LED pad group 21 can by circuit layer 7 from electrode pad 13 power takings, compared with prior art, the LED module group substrates assembling that the utility model provides is simple, disposable the putting in place in bending back, neglected loading can not appear, mistakes such as anti-dress, wiring simultaneously only need arrange a connecting line and be connected with the power supply module easily, all the other circuit layers 7 by itself connect, both reduced workload in a large number, and made that also the interior circuit of final LED product was simple, fault is few.
In the present embodiment, employing is removed the aluminum base layer 5 in folding line district 3 by erosion carver skill at original substrate (as shown in Figure 3) that includes aluminum base layer 5, insulating barrier 6 and circuit layer 7, can realize that folding line district 3 only keeps insulating barrier 6 and circuit layer 7, thereby realize bent.Wherein, the insulation layer 11 that bottom surface insulation is set be for guarantee connecting line can only by electrode pad 13 discharge and not can with other partially conductives of LED module group substrates, guarantee the reliability of LED substrate module, and the big I of this insulation layer 11 is according to the actual conditions settings such as shape of connecting line, as shown in Figure 2, can be that a circle insulation layer 11 only is set around through wires hole 12, also whole power supply bonding pad 1 can also be set to insulation layer 11 certainly.In addition, 11 insulation of realization insulation layer also can be adopted several different methods, and present embodiment adopts the way realization insulation of aluminum base layer 5 erosion carvings being fallen to expose insulating barrier 6, can also adopt methods such as resetting a layer insulating 6 certainly, as long as realize insulation, do not repeat them here.
Described LED pad group 21 series connection backs are from electrode pad 13 power takings.Can make circuit layer 7 wirings simple from electrode pad 13 power takings in the series connection back earlier the LED pad group 21 on each LED substrate, certainly, according to actual needs, the factors such as supply power voltage of the voltage request of LED lamp and power supply module for example, the pad group on the LED substrate also can adopt other way to take power power takings.
Described LED substrate zone 2 offers fixing hole 4, is convenient to the LED module group substrates and is fixed on the heating column.
Two of the embodiment of a kind of LED module group substrates of the utility model, the main technical schemes of present embodiment is identical with embodiment 1, and unaccounted feature adopts the explanation among the embodiment 1 in the present embodiment, no longer gives unnecessary details at this.As shown in Figure 4 and Figure 5, the difference of present embodiment and embodiment 1 is, described power supply bonding pad 1 is regular pentagon, each equal correspondence in bar limit of the power supply bonding pad 1 of described regular pentagon is connected with a rectangular LED substrate zone 2, and described power supply bonding pad 1 also is provided with the LED pad through electrode pad 13 power takings, and described power supply offers fixing hole in the bonding pad.By the shape of change power supply bonding pad 1 and the quantity of LED substrate zone 2, thereby it is more even that led chip 8 is distributed, and improves the illuminating effect of final LED lamp.Certainly, according to the practical factors such as shape of heating column, power supply bonding pad 1 can also be other shapes, and the quantity of LED substrate zone 2 can correspondingly be adjusted.
Three of the embodiment of a kind of LED module group substrates of the utility model, the main technical schemes of present embodiment is identical with embodiment 1, and unaccounted feature adopts the explanation among the embodiment 1 in the present embodiment, no longer gives unnecessary details at this.As shown in Figure 6, the difference of present embodiment and embodiment 1 is that the LED pad group 21 on the described LED substrate zone 2 includes two LED pad, and the LED pad in the same pad group is connected in parallel.By increasing the number of pads of each LED pad group 21, and in power supply bonding pad 1 the LED pad is set, thereby significantly increases the LED lamp quantity that can arrange, improve the illumination intensity of final LED lamp.Certainly the number of pads that comprises in the LED pad group 21 also can be adjusted according to actual conditions (as LED substrate zone 2 sizes etc.).
Should be noted that at last; above embodiment is only in order to illustrate the technical solution of the utility model; but not to the restriction of the utility model protection range; although with reference to preferred embodiment the utility model has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.
Claims (7)
1. LED module group substrates, it is characterized in that: comprise polygonal power supply bonding pad and the LED substrate zone that is connected with the power supply bonding pad that is no less than two, the junction of described power supply bonding pad and LED substrate zone is provided with the folding line district, described power supply bonding pad and LED substrate zone all comprise aluminum base layer successively, insulating barrier and circuit layer, described folding line district comprises insulating barrier and circuit layer, insulation layer is offered in described power supply bonding pad, insulate and offer through wires hole in described insulation layer bottom surface, the circuit layer at described through wires hole place is provided with electrode pad, the circuit layer of described LED substrate zone is provided with LED pad group, and described LED pad group is through the electrode pad power taking.
2. a kind of LED module group substrates as claimed in claim 1 is characterized in that: described LED pad group series connection back is from the electrode pad power taking.
3. a kind of LED module group substrates as claimed in claim 1, it is characterized in that: described power supply bonding pad or LED substrate zone offer fixing hole.
4. a kind of LED module group substrates as claimed in claim 1, it is characterized in that: described power supply bonding pad is regular pentagon, each equal correspondence in bar limit of the power supply bonding pad of described regular pentagon is connected with a rectangular LED substrate zone.
5. a kind of LED module group substrates as claimed in claim 1, it is characterized in that: described power supply bonding pad is square, each equal correspondence in bar limit of the power supply bonding pad of described square is connected with a rectangular LED substrate zone.
6. a kind of LED module group substrates as claimed in claim 1, it is characterized in that: described power supply bonding pad is provided with the pad through the LED of electrode pad power taking.
7. a kind of LED module group substrates as claimed in claim 1, it is characterized in that: each LED pad group is provided with the LED pad that is no less than two, and the LED pad in the same pad group is connected in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320219415 CN203192860U (en) | 2013-04-26 | 2013-04-26 | LED module substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320219415 CN203192860U (en) | 2013-04-26 | 2013-04-26 | LED module substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203192860U true CN203192860U (en) | 2013-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320219415 Expired - Fee Related CN203192860U (en) | 2013-04-26 | 2013-04-26 | LED module substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203192860U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142349A (en) * | 2015-10-19 | 2015-12-09 | 厦门利德宝电子科技有限公司 | Circuit board capable of being assembled stereoscopically and making method thereof |
| CN107170870A (en) * | 2016-03-07 | 2017-09-15 | 深圳市斯迈得半导体有限公司 | It is a kind of can multimode bending multiaspect light extraction LED-baseplate |
-
2013
- 2013-04-26 CN CN 201320219415 patent/CN203192860U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142349A (en) * | 2015-10-19 | 2015-12-09 | 厦门利德宝电子科技有限公司 | Circuit board capable of being assembled stereoscopically and making method thereof |
| CN107170870A (en) * | 2016-03-07 | 2017-09-15 | 深圳市斯迈得半导体有限公司 | It is a kind of can multimode bending multiaspect light extraction LED-baseplate |
| CN107170870B (en) * | 2016-03-07 | 2019-04-02 | 深圳市斯迈得半导体有限公司 | It is a kind of can the multi-panel of multimode bending go out the LED substrate of light |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GUANGDONG KAMTATLIGHTING CO., LTD. Free format text: FORMER NAME: DONGGUAN KAMTATLIGHTING CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 523000 Guangdong province Hengli village Wangniudun Dongguan JINDA Industrial Park Patentee after: GUANGDONG KAMTATLIGHTING CO., LTD. Address before: 523047 Guangdong province Dongguan City Wanjiang Valley Yongzi to Fang Gu Huawan Patentee before: Dongguan Kamtatlighting Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20200426 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |