CN107150168B - 激光处理设备和经由激光工具操作而处理工件的方法 - Google Patents

激光处理设备和经由激光工具操作而处理工件的方法 Download PDF

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Publication number
CN107150168B
CN107150168B CN201710092567.XA CN201710092567A CN107150168B CN 107150168 B CN107150168 B CN 107150168B CN 201710092567 A CN201710092567 A CN 201710092567A CN 107150168 B CN107150168 B CN 107150168B
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China
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workpiece
beam axis
laser
speed
axis
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CN201710092567.XA
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English (en)
Chinese (zh)
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CN107150168A (zh
Inventor
马克·A·昂瑞斯
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
CN201710092567.XA 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法 Active CN107150168B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361791160P 2013-03-15 2013-03-15
US201361791656P 2013-03-15 2013-03-15
US61/791,160 2013-03-15
US61/791,656 2013-03-15
CN201480014010.9A CN105121088B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480014010.9A Division CN105121088B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法

Publications (2)

Publication Number Publication Date
CN107150168A CN107150168A (zh) 2017-09-12
CN107150168B true CN107150168B (zh) 2019-06-21

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CN201710092567.XA Active CN107150168B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法
CN201480014010.9A Active CN105121088B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法

Family Applications After (1)

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Country Status (6)

Country Link
US (1) US9724782B2 (https=)
JP (2) JP6636417B2 (https=)
KR (1) KR102245812B1 (https=)
CN (2) CN107150168B (https=)
TW (1) TWI637803B (https=)
WO (1) WO2014152526A1 (https=)

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US10613513B2 (en) * 2013-02-11 2020-04-07 The Aerospace Corporation Systems and methods for modifying material substrates
US10286488B2 (en) * 2015-03-06 2019-05-14 Intel Corporation Acousto-optics deflector and mirror for laser beam steering
CN106794564B (zh) * 2015-06-22 2019-02-19 伊雷克托科学工业股份有限公司 多轴工具机及其控制方法
KR20250037607A (ko) * 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
CN116275467A (zh) * 2018-06-05 2023-06-23 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法以及使用其加工工件的方法
JP6684872B2 (ja) * 2018-08-17 2020-04-22 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
US11090765B2 (en) * 2018-09-25 2021-08-17 Saudi Arabian Oil Company Laser tool for removing scaling
TWI892641B (zh) 2019-01-31 2025-08-01 美商伊雷克托科學工業股份有限公司 光學系統
US20220168847A1 (en) 2019-06-10 2022-06-02 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
KR102864252B1 (ko) * 2020-03-04 2025-09-26 삼성디스플레이 주식회사 전자 장치 제조 방법
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Also Published As

Publication number Publication date
US9724782B2 (en) 2017-08-08
JP6636417B2 (ja) 2020-01-29
CN107150168A (zh) 2017-09-12
TW201446372A (zh) 2014-12-16
JP2020037135A (ja) 2020-03-12
CN105121088A (zh) 2015-12-02
CN105121088B (zh) 2017-03-08
US20140263223A1 (en) 2014-09-18
JP2016517352A (ja) 2016-06-16
KR102245812B1 (ko) 2021-04-30
TWI637803B (zh) 2018-10-11
KR20150130278A (ko) 2015-11-23
WO2014152526A1 (en) 2014-09-25

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