CN107148164B - Two-sided etching steel mesh and its manufacture craft - Google Patents
Two-sided etching steel mesh and its manufacture craft Download PDFInfo
- Publication number
- CN107148164B CN107148164B CN201710456423.8A CN201710456423A CN107148164B CN 107148164 B CN107148164 B CN 107148164B CN 201710456423 A CN201710456423 A CN 201710456423A CN 107148164 B CN107148164 B CN 107148164B
- Authority
- CN
- China
- Prior art keywords
- mesh
- thickness
- halftone
- etching
- steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Abstract
The present invention relates to a kind of two-sided etching steel meshes, including halftone, several mesh are etched on halftone, the thickness of each mesh with its corresponding to the thickness of tin cream to be printed it is equal, mesh include by halftone upper surface etch the first mesh, by halftone lower surface etch the second mesh corresponding with the first mesh, connect the first mesh and the second mesh aperture.A kind of manufacture craft of above-mentioned two-sided etching steel mesh, includes the following steps: that (1) is performed etching in the upper surface of halftone, forms the first mesh;(2) it is performed etching on the lower surface of halftone, forms the second mesh.The present invention, to avoid etching process tolerance excessive, improves the etching precision of steel mesh so that the etch thicknesses of steel mesh single side reduce using two-sided etching mode, and then the printing precision of soft printed circuit board can be improved and improve product yield.
Description
Technical field
The invention belongs to the print fields of flexible circuit board (soft printed circuit board), and in particular to a kind of printing is used
High-accuracy steel mesh and the steel mesh manufacture craft.
Background technique
It is influenced by electronics industry to the trend development of highly-integrated functions, the frivolous miniaturization of part, it is existing soft
For printed circuit board in SMT production, can often encounter must carry a variety of size specification parts in the same surface the case where, this requires
FPC is in print solder paste, it is necessary to different paste solder printing thickness is set to solder demand according to different parts.
Currently, tradition SMT steel mesh is stepped design, need to make different-thickness in one by single side etch process
Steel mesh, i.e., on a surface of halftone 1 by etching generate required thickness c mesh 2, as shown in Fig. 1.At this stage,
, can be because of chemical concentration when steel mesh manufacturer is more than 0.1mm to the thickness that steel mesh etches, etching period, temperature and other reasons and shadow
Ring etching precision, to influence the printing precision of required steel mesh, single side etched thickness is bigger, tolerance it is bigger (etching Hou Du≤
When 0.06mm, tolerance can be within 0.01mm, and etched thickness exceeds 0.1mm, and tolerance is within 0.03mm), it is unable to meet production
Required precision influences production yield.
Summary of the invention
The object of the present invention is to provide one kind to have degree of precision, so as to meet the production essence of soft printed circuit board
Spend desired two-sided etching steel mesh.
In order to achieve the above objectives, the technical solution adopted by the present invention is that:
A kind of two-sided etching steel mesh is used for print solder paste in the SMT processing procedure of soft printed circuit board comprising halftone,
Be etched with several mesh on the halftone, the thickness of each mesh with its corresponding to tin cream to be printed thickness phase
Deng, the mesh include the first mesh etched by the upper surface of the halftone, etched by the lower surface of the halftone with institute
State the aperture of corresponding second mesh of the first mesh, connection first mesh and second mesh, first mesh
Thickness and second mesh the sum of thickness be the mesh thickness.
Preferably, the thickness of first mesh is equal with the thickness of second mesh.
The present invention also provides one kind can be improved etching precision, to produce above-mentioned high-precision two-sided etching steel mesh
Manufacture craft.
A kind of manufacture craft of above-mentioned two-sided etching steel mesh comprising following steps: (1) the upper surface of the halftone into
Row etching, forms it into first mesh;(2) it is performed etching on the lower surface of the halftone, forms it into described second
Mesh, and the sum of the thickness of the thickness of first mesh and second mesh be formed by the thickness of the mesh with it is described
The thickness of tin cream to be printed corresponding to mesh is equal.
Preferably, the manufacture craft further includes that (3) open up the aperture for connecting first mesh and second mesh.
Due to the above technical solutions, the present invention has the following advantages over the prior art: the present invention is using two-sided
Etching mode, to avoid etching process tolerance excessive, improves the etching of steel mesh so that the etch thicknesses of steel mesh single side reduce
Precision, and then the printing precision of soft printed circuit board can be improved and improve product yield.
Detailed description of the invention
Attached drawing 1 is the schematic structural cross-sectional view that existing single side etches steel mesh.
Attached drawing 2 is the schematic structural cross-sectional view of two-sided etching steel mesh of the invention.
In the figures above: 1, halftone;2, mesh;3, aperture;4, the first mesh;5, the second mesh.
Specific embodiment
The invention will be further described for embodiment shown in reference to the accompanying drawing.
Embodiment one: referring to shown in attached drawing 2, it is a kind of in the SMT processing procedure of soft printed circuit board for print solder paste
Two-sided etching steel mesh, including halftone 1 are etched with several mesh 2 on halftone 1.For each mesh 2, thickness c and its institute
The thickness of corresponding tin cream to be printed is equal.When the two-sided etching steel mesh is used to print tin cream needed for the part of different size,
The thickness c of each mesh 2 is different.
For a mesh 2 comprising by the first mesh 4 of upper surface (face the Top) etching of halftone 1, by under halftone 1
Second mesh 5 corresponding with the first mesh 4 of surface (face Bot) etching, the aperture for connecting the first mesh 4 and the second mesh 5
The sum of thickness b of 3, the thickness a of the first mesh 4 and the second mesh 5 is the thickness c of mesh 2.In general, the thickness a of the first mesh 4
It is equal with the thickness b of the second mesh 5.
The manufacture craft of above-mentioned two-sided etching steel mesh is achieved by the steps of: (1) being carved in the upper surface of halftone 1
Erosion, forms it into the first mesh 4, the first mesh 4 with a thickness of a;(2) it performs etching, forms it on the lower surface of halftone 1
Second mesh 5, the second mesh 5 with a thickness of b, and the sum of the thickness a of the first mesh 4 and the thickness b of the second mesh 5 are formed by
The thickness c of mesh 2 is equal with the thickness of tin cream to be printed corresponding to mesh 2;(3) the first mesh 4 of connection and the second net are opened up
The aperture 3 in hole 5, the longitudinal section of aperture 3 are trapezoidal.
Such as in attached drawing 2, the thickness h of halftone 1 is 200 μm, and a mesh 2 design of two-sided etching steel mesh needs to etch thick
Degree, i.e. the thickness c of mesh 2 are 120 μm, then the first mesh 4 for being 60 μm in the upper surface etch thicknesses a of halftone 1, in halftone 1
Lower surface etch thicknesses b be 60 μm of the second mesh 5, then remaining thickness is 80 μm between the first mesh 4 and the second mesh 5
Halftone 1, and aperture 3 is opened up at this.
The present invention makes different-thickness mesh 2 in the steel mesh of one, to reduce single side by two-sided small size etch process
Due to the problem that the excessive brought accuracy tolerance of etch thicknesses is big, after the two-sided etching technics, steel mesh when continuous etching
Etching precision can be controlled within ± 10 μm, guarantee the printing precision of required steel mesh, avoid traditional single side from substantially etching and make
Lead to part failure welding after furnace at FPC tin cream amount inaccuracy when printing, and improves the printing of soft printed circuit board FPC
And welding quality, it can save Production Time and required manpower, improve production efficiency, effectively save cost, guaranteed quality.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (3)
1. a kind of two-sided etching steel mesh is used for print solder paste comprising halftone, institute in the SMT processing procedure of soft printed circuit board
State and be etched with several mesh on halftone, the thickness of each mesh with its corresponding to the thickness of tin cream to be printed it is equal,
It is characterized by: the mesh includes the first mesh etched by the upper surface of the halftone, the lower surface quarter by the halftone
The aperture of the second mesh corresponding with first mesh, connection first mesh and second mesh of erosion, it is described
The sum of thickness of the thickness of first mesh and second mesh is the thickness of the mesh.
2. two-sided etching steel mesh according to claim 1, it is characterised in that: the thickness of first mesh and described second
The thickness of mesh is equal.
3. a kind of manufacture craft of two-sided etching steel mesh as claimed in claim 1 or 2, it is characterised in that: the manufacture craft
Include the following steps: that (1) is performed etching in the upper surface of the halftone, forms it into first mesh;(2) in the halftone
Lower surface on perform etching, form it into second mesh, and the thickness of first mesh and second mesh
The thickness that the sum of thickness is formed by the mesh is equal with the thickness of tin cream to be printed corresponding to the mesh;(3) it opens up
Connect the aperture of first mesh and second mesh.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710456423.8A CN107148164B (en) | 2017-06-16 | 2017-06-16 | Two-sided etching steel mesh and its manufacture craft |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710456423.8A CN107148164B (en) | 2017-06-16 | 2017-06-16 | Two-sided etching steel mesh and its manufacture craft |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107148164A CN107148164A (en) | 2017-09-08 |
CN107148164B true CN107148164B (en) | 2019-05-14 |
Family
ID=59781502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710456423.8A Active CN107148164B (en) | 2017-06-16 | 2017-06-16 | Two-sided etching steel mesh and its manufacture craft |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107148164B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
CN112339409B (en) * | 2020-09-30 | 2022-09-02 | 格力电器(合肥)有限公司 | Steel mesh for increasing local tin paste amount |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595805A (en) * | 2012-02-23 | 2012-07-18 | 昆山元崧电子科技有限公司 | Novel steel plate and manufacturing process of novel steel plate |
CN202475956U (en) * | 2012-02-23 | 2012-10-03 | 昆山元崧电子科技有限公司 | Novel steel plate |
CN203040031U (en) * | 2012-12-04 | 2013-07-03 | 精华电子(苏州)有限公司 | Trepanning structure used for printed circuit board printing processing step steel board |
CN203680992U (en) * | 2014-01-06 | 2014-07-02 | 歌尔声学股份有限公司 | PCB screen printing plate |
CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
-
2017
- 2017-06-16 CN CN201710456423.8A patent/CN107148164B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595805A (en) * | 2012-02-23 | 2012-07-18 | 昆山元崧电子科技有限公司 | Novel steel plate and manufacturing process of novel steel plate |
CN202475956U (en) * | 2012-02-23 | 2012-10-03 | 昆山元崧电子科技有限公司 | Novel steel plate |
CN203040031U (en) * | 2012-12-04 | 2013-07-03 | 精华电子(苏州)有限公司 | Trepanning structure used for printed circuit board printing processing step steel board |
CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
CN203680992U (en) * | 2014-01-06 | 2014-07-02 | 歌尔声学股份有限公司 | PCB screen printing plate |
Also Published As
Publication number | Publication date |
---|---|
CN107148164A (en) | 2017-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103619125B (en) | A kind of PCB electro-plating method for improving electroplating evenness | |
CN107148164B (en) | Two-sided etching steel mesh and its manufacture craft | |
CN100531526C (en) | Metal photo-etching product and production method therefor | |
JP5335893B2 (en) | Manufacturing method of gas electron multiplier | |
WO2017071394A1 (en) | Printed circuit board and fabrication method therefor | |
CN103582317B (en) | Flexible printed wiring board leakage stannum semicircle orifice manufacture method | |
CN202857137U (en) | Printed circuit board with character identifiers | |
CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
CN102014580B (en) | Manufacturing technology of whole-plate gold-plated plate | |
CN103702526A (en) | Method for treating leadless electroplated golden finger | |
CN105451454B (en) | A kind of production method of plating gold finger plate | |
CN106455343B (en) | A kind of minimizing technology of gold finger lead | |
CN104023483A (en) | Gold finger three-surface plating method | |
CN103974548A (en) | Method for manufacturing mask plate | |
CN111787708A (en) | Manufacturing method of high-low copper PAD circuit board | |
CN105072824A (en) | Manufacture method of embedded circuit board | |
CN104684277A (en) | Method for manufacturing gold fingers of printed circuit board | |
CN205249700U (en) | Shield cover and shielding system | |
CN103203984B (en) | A kind of printing Three-dimensional mask plate | |
CN206725638U (en) | The terminal current sensing component of noncontinuous electrode four | |
CN104968158A (en) | Thick copper foil fine line fine pitch circuit board outer line processing method | |
CN110044519A (en) | A kind of lead frame copper strip stress test method | |
CN109219253B (en) | Manufacturing process of PCB without suspended nickel and lead | |
CN103204013B (en) | A kind of printing Three-dimensional mask plate with figure opening | |
CN103203983B (en) | A kind of printing Three-dimensional mask plate with figure opening |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |