CN110044519A - A kind of lead frame copper strip stress test method - Google Patents
A kind of lead frame copper strip stress test method Download PDFInfo
- Publication number
- CN110044519A CN110044519A CN201910336842.7A CN201910336842A CN110044519A CN 110044519 A CN110044519 A CN 110044519A CN 201910336842 A CN201910336842 A CN 201910336842A CN 110044519 A CN110044519 A CN 110044519A
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- CN
- China
- Prior art keywords
- lead frame
- pin
- copper strips
- raw material
- stress test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
Abstract
The invention discloses a kind of lead frame copper strip stress test methods, it is related to semiconductor integrated circuit technology field, simulated production is practical, by carrying out stress test to copper strips raw material in advance, effectively reduce due to copper strips raw material unbalanced stress leads to deformation of products and wasting probability, effectively control cost of goods manufactured, product quality is effectively ensured, product yield is improved significantly, and is particularly suitable for the detection of the copper strips raw material stress of 0.05~0.50mm thickness, great popularization.
Description
Technical field
The present invention relates to semiconductor integrated circuit technology fields, and in particular to a kind of lead frame copper strip stress test side
Method.
Background technique
Chip carrier of the lead frame as semiconductor integrated circuit realizes that chip internal circuits draw by means of bonding gold wire
The electrical connection of outlet and outer lead is the key structure part to form electric loop, plays the bridge connecting with outer lead and makees
With lead frame is base components important in electronics and information industry.The production technology of lead frame has mould punching method and change
Two kinds of etching method are learned, pressing production technology mainly has four punching press, plating, molding, sorting processes, and stamping procedure is by rolling
Raw material copper strips go out the processes of product contour structures by mould punching, then the semi-finished product of punching are taken in after charging tray carries out
The production of process；Chemical method for etching mainly has exposure development, etching, plating, the several processes of sorting, rotten by development and chemistry
Erosion, etching solution and copper material occur chemical reaction and etch required lead frame shape.
The problem of there is unbalanced stresses due to copper strips raw material in actual production, punching course can be to the materials of unbalanced stress
Material generates stress release and machining stress, can also release stress after copper strips etching, elongated lead frame pin is caused to be easy to send out
Change shape, causes product bad, so needing the detection method of a kind of pair of copper strips raw material stress, is not rushed also in copper strips
Pressure, etching work procedure production when, in advance carry out stress deformation test, when stress deformation test value within the specified scope when carry out again
Production, that overruns does not put into producing line, to reduce the bad and production cost of product.
Summary of the invention
It is an object of the invention to: a kind of lead frame copper strip stress test method is provided, copper strips do not carry out also punching press,
When etching work procedure produces, the test of stress deformation is carried out in advance to it, as stress deformation test value Shi Zaijin within the specified scope
Row production, that overruns does not put into producing line, to reduce the bad and production cost of product.
The technical solution adopted by the invention is as follows:
A kind of lead frame copper strip stress test method, the lead frame include pin, even muscle, a word hole and positioning
Hole, comprising the following steps:
1. removing copper strips portion after the structure of copper strips raw material analog leads frame used for lead frame is carried out punching press or etching
Divide material, surplus material forms test sample structure；
2., then according to test sample structure fabrication test fixture, test fixture is mounted on punching according to mould punching method
On bed, punching goes out test sample structure；It sends out according to chemical etching, then according to test sample structure fabrication mold, passes through
Mold chemical etching goes out test sample structure；
3. measuring the deformation quantity of each pin respectively: by pin on the basis of one end A that even muscle is connect, the other end of pin
Initial position is B, and the position after stamped or etching is that B ', B and B ' variable quantity on copper strips material stock thickness direction are
C。
4. taking the maximum C value measured, to determine the stress intensity of material, when C≤specified value, then stress test meets and makes
With requiring；Conversely, not meeting requirement then.
The working principle of the invention: before copper strips raw material put into production, copper strips raw material analog leads frame is first used
Test sample structure is made in structure, further according to test sample structure fabrication test fixture or mold, then punching press or etching
Test sample structure out, and the deformation quantity of its each pin is measured, copper strips raw material are judged according to deformation quantity size
Stress intensity, when deformation quantity within the specified scope when produced again, overrun not investment producing line, to reduce product
Bad and production cost.
Further, the thickness of the copper strips raw material is between 0.05~0.5mm.
Further, the number of the pin is set as 3~5, and axis direction where each pin is different.
Further, the proportionate relationship between the thickness c of the length a of the pin, width b and copper strips raw material are as follows: a >=
2b、b≥0.5c。
Further, the even ratio between the width d of muscle and the width b of pin and the thickness c of copper strips raw material is closed
System are as follows: d≤2b, d >=0.5c.
Further, the proportionate relationship between the long e in word hole, width f and pin widths b, copper strips material stock thickness c
Are as follows: e >=2b, f >=c.
Further, the location hole is set as round.
In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:
Structure of the invention is ingenious, and simulated production is practical, by carrying out stress test to copper strips raw material in advance, is effectively reduced
Due to copper strips raw material unbalanced stress leads to deformation of products and wasting probability, effectively control cost of goods manufactured, make
Product quality is effectively ensured, and product yield is improved significantly, and is particularly suitable for the copper strips former material of 0.05~0.50mm thickness
Expect the detection of stress, great popularization.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of test sample structure of the invention；
Fig. 2 is the top view of test sample structure of the invention；
Fig. 3 is the partial enlargement diagram of pin of the invention along its length；
Fig. 4 is the size marking schematic diagram of test sample structure of the invention.
In the figure, it is marked as 1- pin, 2- connect muscle, the mono- word hole 3-, 4- location hole, 5- copper strips raw material；
The length of a- pin, the width of b- pin, c- copper strips raw material thickness, d- connect the width of muscle, e- mono- word hole
Length, the mono- word hole f- width.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention 1~Fig. 4, technical solution in the embodiment of the present invention carry out clear
Chu is fully described by, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts all
Other embodiments shall fall within the protection scope of the present invention.
Embodiment 1
A kind of lead frame copper strip stress test method, the lead frame include pin 1, connect muscle 2, a word hole 3 and determine
Position hole 4, comprising the following steps:
1. removing copper strips after the structure of 5 analog leads frame of copper strips raw material used for lead frame is carried out punching press or etching
Some materials, surplus material form test sample structure；
2., then according to test sample structure fabrication test fixture, test fixture is mounted on punching according to mould punching method
On bed, punching goes out test sample structure；It sends out according to chemical etching, then according to test sample structure fabrication mold, passes through
Mold chemical etching goes out test sample structure；
3. measuring the deformation quantity of each pin 1 respectively: by pin 1 on the basis of the even one end A that connect of muscle 2, pin 1 it is another
The initial position at end is B, and the position after stamped or etching is B ', B and B ' variable quantity on 5 thickness direction of copper strips raw material
As C.
4. taking the maximum C value measured, to determine the stress intensity of material, when C≤specified value, then stress test meets and makes
With requiring；Conversely, not meeting requirement then.
Test fixture used in the present invention and mold, the technical staff in punching machine and etching industry are well aware of
Also it is readily devised and is made.
In the present invention, copper strips raw material 5 are smooth planes when not carrying out punching press or etching, when by punching press or etching
Afterwards, copper strips some materials are removed, and remaining some materials form test sample structure, due to the presence of material stress, pin 1
It can deform, then deformation is big greatly for stress, and stress is small, deforms small or stress uniformly without deformation, in the feelings of not stress deformation
Under condition, pin 1 with even muscle 2 connect one end A, pin 1 the other end initial position B and copper strips in the same plane,
It is deformed in the case where having stress, 1 end of pin is caused to deviate original plan-position B to position B ', B and B ' in copper strips former material
Expect that the variable quantity C on 5 thickness directions is the foundation of identified sign size, pin 1 is to be upwardly deviated from the present embodiment, practical
There is also be deflected downwardly.
The working principle of the invention: before copper strips raw material 5 put into production, 5 analog leads frame of copper strips raw material is first used
Test sample structure is made in frame structure, further according to test sample structure fabrication test fixture or mold, then punching press or erosion
Test sample structure is carved, and the deformation quantity of its each pin 1 is measured, copper strips former material is judged according to deformation quantity size
Material 5 stress intensity, when deformation quantity within the specified scope when produced again, overrun not investment producing line, with reduce
The bad and production cost of product.
Structure of the invention is ingenious, and simulated production is practical, by carrying out stress test to copper strips raw material 5 in advance, effectively drops
It is low due to 5 unbalanced stress of copper strips raw material leads to deformation of products and wasting probability, effectively control cost of goods manufactured,
Product quality is effectively ensured, product yield is improved significantly, and the copper strips for being particularly suitable for 0.05~0.50mm thickness is former
The detection of 5 stress of material, great popularization.
Embodiment 2
On the basis of embodiment 1, further, the number of the pin 1 is set as 4, and each pin 1 to the present embodiment
Place axis direction is different, can test the stress intensity of 4 different directions.
Embodiment 3
On the basis of embodiment 1, further, the location hole 4 is set as round to the present embodiment, in exemplar test from
The effect of positioning, but the shape of the location hole 4 is not limited to circle, can be other equivalent patterns other than circle.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is equal
Replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this hair
Within bright protection scope.
Claims (7)
1. a kind of lead frame copper strip stress test method, the lead frame includes pin (1), even muscle (2), a word hole (3)
And location hole (4), which comprises the following steps:
1., will copper strips raw material (5) analog leads frame used for lead frame structure carry out punching press or etching after, remove copper strips portion
Divide material, surplus material forms test sample structure；
2., according to mould punching method, then according to test sample structure fabrication test fixture, test fixture is mounted on punching machine
On, punching goes out test sample structure；It is sent out according to chemical etching, then according to test sample structure fabrication mold, passes through erosion
Die sinking tool chemical etching goes out test sample structure；
3., measure the deformation quantity of each pin (1) respectively: by pin (1) on the basis of one end A that even muscle (2) are connect, pin (1)
The other end initial position be B, it is stamped or etching after position be B ', B and B ' on copper strips raw material (5) thickness direction
Variable quantity be C.
4., take the maximum C value measured, to determine the stress intensity of material, when C≤specified value, then stress test meets use and wants
It asks；Conversely, not meeting requirement then.
2. a kind of lead frame copper strip stress test method according to claim 1, which is characterized in that the copper strips former material
Expect the thickness of (5) between 0.05~0.5mm.
3. a kind of lead frame copper strip stress test method according to claim 1, which is characterized in that the pin (1)
Number be set as 3~5, and axis direction where each pin (1) is different.
4. a kind of lead frame copper strip stress test method according to claim 3, which is characterized in that the pin (1)
Length a, width b and copper strips raw material (5) thickness c between proportionate relationship are as follows: a >=2b, b >=0.5c.
5. a kind of lead frame copper strip stress test method according to claim 4, which is characterized in that described to connect muscle (2)
Width d and pin (1) width b and copper strips raw material (5) thickness c between proportionate relationship are as follows: d≤2b, d >=0.5c.
6. a kind of lead frame copper strip stress test method according to claim 5, which is characterized in that word hole
(3) the proportionate relationship between long e, width f and pin (1) width b, copper strips raw material (5) thickness c are as follows: e >=2b, f >=c.
7. a kind of lead frame copper strip stress test method according to claim 1, which is characterized in that the location hole
(4) it is set as round.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910336842.7A CN110044519B (en) | 2019-04-25 | 2019-04-25 | Lead frame copper strip stress testing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910336842.7A CN110044519B (en) | 2019-04-25 | 2019-04-25 | Lead frame copper strip stress testing method |
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| Publication Number | Publication Date |
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| CN110044519A true CN110044519A (en) | 2019-07-23 |
| CN110044519B CN110044519B (en) | 2020-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910336842.7A Active CN110044519B (en) | 2019-04-25 | 2019-04-25 | Lead frame copper strip stress testing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113776715A (en) * | 2021-09-10 | 2021-12-10 | 中铜华中铜业有限公司 | Method for detecting residual stress of lead frame material |
| CN114166381A (en) * | 2021-11-25 | 2022-03-11 | 厦门捷昕精密科技股份有限公司 | Method for detecting internal stress of semiconductor IC lead frame material |
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| CN206947328U (en) * | 2017-05-27 | 2018-01-30 | 中国电子科技集团公司第十三研究所 | Lead frame |
| CN208507663U (en) * | 2018-07-26 | 2019-02-15 | 天水华洋电子科技股份有限公司 | A kind of lead frame |
| CN209745669U (en) * | 2019-01-30 | 2019-12-06 | 天水华洋电子科技股份有限公司 | Test sample piece for testing stress of copper strip of lead frame |
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2019
- 2019-04-25 CN CN201910336842.7A patent/CN110044519B/en active Active
Patent Citations (3)
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|---|---|---|---|---|
| CN206947328U (en) * | 2017-05-27 | 2018-01-30 | 中国电子科技集团公司第十三研究所 | Lead frame |
| CN208507663U (en) * | 2018-07-26 | 2019-02-15 | 天水华洋电子科技股份有限公司 | A kind of lead frame |
| CN209745669U (en) * | 2019-01-30 | 2019-12-06 | 天水华洋电子科技股份有限公司 | Test sample piece for testing stress of copper strip of lead frame |
Non-Patent Citations (2)
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| 张文芹: "引线框架用铜带产品现状及研发进展", 《有色金属加工》 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113776715A (en) * | 2021-09-10 | 2021-12-10 | 中铜华中铜业有限公司 | Method for detecting residual stress of lead frame material |
| CN114166381A (en) * | 2021-11-25 | 2022-03-11 | 厦门捷昕精密科技股份有限公司 | Method for detecting internal stress of semiconductor IC lead frame material |
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| Publication number | Publication date |
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| CN110044519B (en) | 2020-12-18 |
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