CN107098689A - 一种弱电触头复合导电材料及其生产工艺 - Google Patents
一种弱电触头复合导电材料及其生产工艺 Download PDFInfo
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- CN107098689A CN107098689A CN201710467113.6A CN201710467113A CN107098689A CN 107098689 A CN107098689 A CN 107098689A CN 201710467113 A CN201710467113 A CN 201710467113A CN 107098689 A CN107098689 A CN 107098689A
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- 239000004020 conductor Substances 0.000 title claims abstract description 37
- 239000002131 composite material Substances 0.000 title claims abstract description 36
- 238000005516 engineering process Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 41
- 238000005245 sintering Methods 0.000 claims abstract description 31
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 19
- 239000000956 alloy Substances 0.000 claims abstract description 18
- 238000000227 grinding Methods 0.000 claims abstract description 18
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 claims abstract description 18
- 229910000480 nickel oxide Inorganic materials 0.000 claims abstract description 18
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims abstract description 18
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 18
- 150000002910 rare earth metals Chemical class 0.000 claims abstract description 18
- 229910000018 strontium carbonate Inorganic materials 0.000 claims abstract description 18
- 229910001928 zirconium oxide Inorganic materials 0.000 claims abstract description 18
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 17
- DQMUQFUTDWISTM-UHFFFAOYSA-N O.[O-2].[Fe+2].[Fe+2].[O-2] Chemical compound O.[O-2].[Fe+2].[Fe+2].[O-2] DQMUQFUTDWISTM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 11
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 11
- 239000003230 hygroscopic agent Substances 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 239000002002 slurry Substances 0.000 claims description 14
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 claims description 11
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 238000005119 centrifugation Methods 0.000 claims description 7
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- 239000004250 tert-Butylhydroquinone Substances 0.000 claims description 7
- 235000019281 tert-butylhydroquinone Nutrition 0.000 claims description 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- 230000003292 diminished effect Effects 0.000 claims description 6
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 claims description 5
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 5
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 4
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 4
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- BHKAWXZKFKVZLK-UHFFFAOYSA-N 2,3-ditert-butyl-6-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(C(C)(C)C)=C1O BHKAWXZKFKVZLK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 2
- 235000011152 sodium sulphate Nutrition 0.000 claims description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- 235000001465 calcium Nutrition 0.000 claims 1
- 238000005660 chlorination reaction Methods 0.000 claims 1
- 230000008033 biological extinction Effects 0.000 abstract description 3
- 230000004927 fusion Effects 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 2
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 4
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910001628 calcium chloride Inorganic materials 0.000 description 3
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- 238000005260 corrosion Methods 0.000 description 3
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
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- 229910010038 TiAl Inorganic materials 0.000 description 1
- 230000003026 anti-oxygenic effect Effects 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
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- 235000011148 calcium chloride Nutrition 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 metals compound Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
本发明公开了一种弱电触头复合导电材料及其生产工艺,所述复合导电材料包括如下重量份的原料:三氧化二铁60~80份、二氧化硅10~20份、氧化锆1~6份、氧化镍1~5份、TiAl基合金3~6份、稀土材料1~3份、碳酸锶1~3份、抗氧化剂0.6~1.5份、吸湿剂0.5~1.6份。该导电材料的生产工艺包括预烧、球磨粉碎、生坯成型、烧结等步骤。本发明的复合导电材料成本低廉、导电率高,具有优良的抗熔焊性能、灭弧性能、防腐蚀性、抗氧化性、力学性能,适合作为弱电低压开关中电触头的材料。
Description
技术领域
本发明涉及弱电设备材料技术领域,具体涉及一种弱电触头复合导电材料及其生产工艺。
背景技术
弱电触头材料是仪器仪表的关键部分,对仪器仪表的工作可靠性和寿命起着非常重要的作用。通常为了保证弱电触头的工作可靠性,国内外普遍采用贵金属银及其合金材料。金属银由于价格昂贵且导电率较低,使用上受到了限制。铜是银的最合适的替代金属,但是作为弱电触头材料表面容易被氧化,其氧化物氧化亚铜和氧化铜会急剧增大元件的接触电阻,使材料发热漏电,影响电接触开关的工作性能。
目前,市场上急需一种成本低廉、导电率高、接触电阻低且稳定、抗氧化性能佳的弱电触头材料。
发明内容
本发明的目的在于克服上述现有技术的不足,提供一种弱电触头复合导电材料及其生产工艺,该复合导电材料成本低廉、导电率高,具有优良的抗熔焊性能、灭弧性能、防腐蚀性、抗氧化性、力学性能,适合作为弱电低压开关中电触头的材料。
本发明解决技术问题采用如下技术方案:
一种弱电触头复合导电材料,包括如下重量份的原料:三氧化二铁60~80份、二氧化硅10~20份、氧化锆1~6份、氧化镍1~5份、TiAl基合金3~6份、稀土材料1~3份、碳酸锶1~3份、抗氧化剂0.6~1.5份、吸湿剂0.5~1.6份。
优选地,所述复合导电材料包括如下重量份的原料:三氧化二铁72份、二氧化硅15份、氧化锆3份、氧化镍2份、TiAl基合金5份、稀土材料2份、碳酸锶2份、抗氧化剂1份、吸湿剂1.3份。
优选地,所述抗氧化剂选自2,6-二叔丁基化羟基甲苯、特丁基对苯二酚、二丁基羟基甲苯、叔丁基对苯二酚中的一种或多种的组合。
优选地,所述吸湿剂选自氯化钙、硫酸镁、硫酸钠、硅胶、硫酸铜中的一种或多种的组合。
上述弱电触头复合导电材料的生产工艺,包括如下步骤:
(1)预烧:按照重量份将三氧化二铁、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶混合均匀,送入粉碎机粉碎后,过200~300目筛,在氧气含量70~80%的条件下预烧20~30min得到混合物a;
(2)球磨粉碎:将混合物a、二氧化硅、抗氧化剂、吸湿剂混合,放入球磨机中,加入适量乙醇,湿法球磨得到浆液;
(3)生坯成型:浆液置于离心机中离心分离3~8min,静置沉淀8~10小时后,减压过滤,滤饼放置于500~700Mt的成型磁场中40~50min,得到成型的生坯;
(4)烧结:将生坯置于氧含量20~30%的条件下烧结,恒速升温至620~680℃,保持温度1~2小时后,继续恒速升温至1000~1200℃,保持温度2~3小时后,取出并放置于通风干燥处,自然降至室温得到该弱电触头材料。
优选地,所述步骤(1)预烧的温度为450~480℃。
优选地,所述步骤(2)湿法球磨时混合物料、钢球、乙醇的质量比为1:3~6:2~5。
优选地,所述步骤(4)恒速升温的速率为60~80℃/min。
与现有技术相比,本发明具有如下的有益效果:
(1)本发明的弱电触头复合导电材料,选用常见的三氧化二铁、二氧化硅为主要成分,成本低廉、导电率高,具有优良的抗熔焊性能、灭弧性能、防腐蚀性、抗氧化性、力学性能,适合作为弱电低压开关中电触头的材料。
(2)本发明的弱电触头复合导电材料,以三氧化二铁为主要成分,在自然状态下,氧化铁属于α型晶胞结构,并不具有磁性,但通过加入二氧化硅、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶等多种金属化合物,可以改变其晶胞结构,大大提高磁性能和取向性,结合抗氧化剂和吸湿剂,能够使该材料隔绝空气中的水分和化学试剂的腐蚀,并且导电性能优良,大大延长了使用寿命。
(3)本发明的弱电触头复合导电材料的生产工艺,主要有预烧、球磨粉碎、生坯成型、烧结等步骤,球磨法使得各成分充分混合均匀,减少了各成分间的气孔,放置磁场中生坯成型后,恒速升温并降温进一步改善了均匀度和取向性。
具体实施方式
以下结合具体实施例对发明作进一步详细的描述。
实施例1
一种弱电触头复合导电材料,包括如下重量份的原料:
三氧化二铁 66份;
二氧化硅 12份;
氧化锆 2份;
氧化镍 1份;
TiAl基合金 3份;
稀土材料 2份;
碳酸锶 1.5份;
特丁基对苯二酚 0.8份;
硅胶 1.2份。
上述弱电触头复合导电材料的生产工艺,包括如下步骤:
(1)预烧:按照重量份将三氧化二铁、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶混合均匀,送入粉碎机粉碎后,过200~300目筛,在氧气含量70~80%、460℃条件下预烧22min得到混合物a。
(2)球磨粉碎:将混合物a、二氧化硅、抗氧化剂、吸湿剂混合,放入球磨机中,加入适量乙醇,湿法球磨得到浆液。混合物料、钢球、乙醇的质量比为1:5:3。
(3)生坯成型:浆液置于离心机中离心分离6min,静置沉淀8小时后,减压过滤,滤饼放置于500~700Mt的成型磁场中40~50min,得到成型的生坯。
(4)烧结:将生坯置于氧含量20~30%的条件下烧结,恒速升温至630℃,保持温度1.5小时后,继续恒速升温至1100℃,保持温度2~3小时后,恒速升温的速率为60~80℃/min,取出并放置于通风干燥处,自然降至室温得到该弱电触头材料。
实施例2
一种弱电触头复合导电材料,包括如下重量份的原料:
三氧化二铁 70份;
二氧化硅 16份;
氧化锆 3份;
氧化镍 1份;
TiAl基合金 4份;
稀土材料 1份;
碳酸锶 0.8份;
2,6-二叔丁基化羟基甲苯 0.6份;
硫酸镁 0.8份。
上述弱电触头复合导电材料的生产工艺,包括如下步骤:
(1)预烧:按照重量份将三氧化二铁、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶混合均匀,送入粉碎机粉碎后,过200~300目筛,在氧气含量70~80%、460℃条件下预烧25min得到混合物a。
(2)球磨粉碎:将混合物a、二氧化硅、2,6-二叔丁基化羟基甲苯、硫酸镁混合,放入球磨机中,加入适量乙醇,湿法球磨得到浆液。混合物料、钢球、乙醇的质量比为1:5:3。
(3)生坯成型:浆液置于离心机中离心分离6min,静置沉淀9小时后,减压过滤,滤饼放置于500~700Mt的成型磁场中40~50min,得到成型的生坯。
(4)烧结:将生坯置于氧含量20~30%的条件下烧结,恒速升温至660℃,保持温度1.6小时后,继续恒速升温至1150℃,保持温度2.4小时后,恒速升温的速率为60~80℃/min,取出并放置于通风干燥处,自然降至室温得到该弱电触头材料。
实施例3
一种弱电触头复合导电材料,包括如下重量份的原料:
三氧化二铁 75份;
二氧化硅 18份;
氧化锆 2份;
氧化镍 2份;
TiAl基合金 5份;
稀土材料 2份;
碳酸锶 1.3份;
二丁基羟基甲苯 0.8份;
硫酸铜 1.2份。
上述弱电触头复合导电材料的生产工艺,包括如下步骤:
(1)预烧:按照重量份将三氧化二铁、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶混合均匀,送入粉碎机粉碎后,过200~300目筛,在氧气含量70~80%、465℃条件下预烧28min得到混合物a。
(2)球磨粉碎:将混合物a、二氧化硅、二丁基羟基甲苯、硫酸铜混合,放入球磨机中,加入适量乙醇,湿法球磨得到浆液。混合物料、钢球、乙醇的质量比为1: 6:4。
(3)生坯成型:浆液置于离心机中离心分离6min,静置沉淀9.5小时后,减压过滤,滤饼放置于500~700Mt的成型磁场中40~50min,得到成型的生坯。
(4)烧结:将生坯置于氧含量20~30%的条件下烧结,恒速升温至670℃,保持温度1.8小时后,继续恒速升温至1200℃,保持温度3小时后,恒速升温的速率为60~80℃/min,取出并放置于通风干燥处,自然降至室温得到该弱电触头材料。
实施例4
一种弱电触头复合导电材料,包括如下重量份的原料:
三氧化二铁 65份;
二氧化硅 14份;
氧化锆 3份;
氧化镍 3份;
TiAl基合金 6份;
稀土材料 3份;
碳酸锶 1.8份;
叔丁基对苯二酚 1.0份;
氯化钙 1.5份。
上述弱电触头复合导电材料的生产工艺,包括如下步骤:
(1)预烧:按照重量份将三氧化二铁、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶混合均匀,送入粉碎机粉碎后,过200~300目筛,在氧气含量70~80%、480℃条件下预烧20min得到混合物a。
(2)球磨粉碎:将混合物a、二氧化硅、叔丁基对苯二酚、氯化钙混合,放入球磨机中,加入适量乙醇,湿法球磨得到浆液。混合物料、钢球、乙醇的质量比为1:5:2。
(3)生坯成型:浆液置于离心机中离心分离8min,静置沉淀10小时后,减压过滤,滤饼放置于500~700Mt的成型磁场中50min,得到成型的生坯。
(4)烧结:将生坯置于氧含量20~30%的条件下烧结,恒速升温至680℃,保持温度1小时后,继续恒速升温至1200℃,保持温度2小时后,恒速升温的速率为60~80℃/min,取出并放置于通风干燥处,自然降至室温得到该弱电触头材料。
实施例5
一种弱电触头复合导电材料,包括如下重量份的原料:
三氧化二铁 80份;
二氧化硅 20份;
氧化锆 5份;
氧化镍 3份;
TiAl基合金 5份;
稀土材料 3份;
碳酸锶 2.6份;
二丁基羟基甲苯 1.2份;
硫酸铜 1.6份。
上述弱电触头复合导电材料的生产工艺,包括如下步骤:
(1)预烧:按照重量份将三氧化二铁、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶混合均匀,送入粉碎机粉碎后,过200~300目筛,在氧气含量70~80%、450~480℃条件下预烧20~30min得到混合物a。
(2)球磨粉碎:将混合物a、二氧化硅、二丁基羟基甲苯、硫酸铜混合,放入球磨机中,加入适量乙醇,湿法球磨得到浆液。混合物料、钢球、乙醇的质量比为1:3:5。
(3)生坯成型:浆液置于离心机中离心分离3~8min,静置沉淀8~10小时后,减压过滤,滤饼放置于500~700Mt的成型磁场中46min,得到成型的生坯。
(4)烧结:将生坯置于氧含量20~30%的条件下烧结,恒速升温至670℃,保持温度1小时后,继续恒速升温至1100℃,保持温度2.8小时后,恒速升温的速率为60~80℃/min,取出并放置于通风干燥处,自然降至室温得到该弱电触头材料。
实施例6
性能测试:对实施例1-5生产的复合导电材料进行了性能测试,具体结果见下表。
表1. 复合导电材料性能测试结果
实施例 | 密度(g/cm3) | 电阻率(μΩ/cm) | 硬度(Hv) | 拉伸率(%) |
1 | 7.62 | 1.6 | 179 | 36 |
2 | 7.68 | 1.8 | 175 | 34 |
3 | 7.68 | 1.7 | 169 | 32 |
4 | 7.64 | 1.8 | 168 | 29 |
5 | 7.70 | 1.9 | 162 | 30 |
由上表可以看出,本发明的复合导电材料密度较小,电阻率较低,拥有良好的导电性能,硬度和拉伸率较可观,适合作为弱电低压开关中电触头的材料。
以上所述仅是本发明的优选实施方式,本发明的保护范围并不仅局限于上述实施例,凡属于本发明思路下的技术方案均属于本发明的保护范围。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理前提下的若干改进和润饰,也应视为本发明的保护范围。
Claims (8)
1.一种弱电触头复合导电材料,其特征在于,包括如下重量份的原料:三氧化二铁60~80份、二氧化硅10~20份、氧化锆1~6份、氧化镍1~5份、TiAl基合金3~6份、稀土材料1~3份、碳酸锶1~3份、抗氧化剂0.6~1.5份、吸湿剂0.5~1.6份。
2.根据权利要求1所述的弱电触头复合导电材料,其特征在于,所述复合导电材料包括如下重量份的原料:三氧化二铁72份、二氧化硅15份、氧化锆3份、氧化镍2份、TiAl基合金5份、稀土材料2份、碳酸锶2份、抗氧化剂1份、吸湿剂1.3份。
3.根据权利要求1所述的弱电触头复合导电材料,其特征在于,所述抗氧化剂选自2,6-二叔丁基化羟基甲苯、特丁基对苯二酚、二丁基羟基甲苯、叔丁基对苯二酚中的一种或多种的组合。
4.根据权利要求1所述的弱电触头复合导电材料,其特征在于,所述吸湿剂选自氯化钙、硫酸镁、硫酸钠、硅胶、硫酸铜中的一种或多种的组合。
5.根据权利要求1-4任意一项所述的弱电触头复合导电材料的生产工艺,其特征在于,包括如下步骤:
(1)预烧:按照重量份将三氧化二铁、氧化锆、氧化镍、TiAl基合金、稀土材料、碳酸锶混合均匀,送入粉碎机粉碎后,过200~300目筛,在氧气含量70~80%的条件下预烧20~30min得到混合物a;
(2)球磨粉碎:将混合物a、二氧化硅、抗氧化剂、吸湿剂混合,放入球磨机中,加入适量乙醇,湿法球磨得到浆液;
(3)生坯成型:浆液置于离心机中离心分离3~8min,静置沉淀8~10小时后,减压过滤,滤饼放置于500~700Mt的成型磁场中40~50min,得到成型的生坯;
(4)烧结:将生坯置于氧含量20~30%的条件下烧结,恒速升温至620~680℃,保持温度1~2小时后,继续恒速升温至1000~1200℃,保持温度2~3小时后,取出并放置于通风干燥处,自然降至室温得到该弱电触头材料。
6.根据权利要求5所述的弱电触头复合导电材料的生产工艺,其特征在于,所述步骤(1)预烧的温度为450~480℃。
7.根据权利要求5所述的弱电触头复合导电材料的生产工艺,其特征在于,所述步骤(2)湿法球磨时混合物料、钢球、乙醇的质量比为1:3~6:2~5。
8.根据权利要求5所述的弱电触头复合导电材料的生产工艺,其特征在于,所述步骤(4)恒速升温的速率为60~80℃/min。
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CN105418061A (zh) * | 2014-09-17 | 2016-03-23 | Tdk株式会社 | 电波吸收体用的铁氧体组合物以及电波吸收体 |
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CN101106024A (zh) * | 2007-08-07 | 2008-01-16 | 济南大学 | 一种弱电铜基电触头复合材料及其制备方法 |
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