CN107089050B - Metamaterial laminated plate and preparation method thereof - Google Patents
Metamaterial laminated plate and preparation method thereof Download PDFInfo
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- CN107089050B CN107089050B CN201610091035.XA CN201610091035A CN107089050B CN 107089050 B CN107089050 B CN 107089050B CN 201610091035 A CN201610091035 A CN 201610091035A CN 107089050 B CN107089050 B CN 107089050B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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Abstract
The invention provides a metamaterial laminated plate and a preparation method thereof, wherein the method comprises the steps of sequentially superposing and laying a composite material substrate, a composite material prepreg and a metal foil and laminating the composite material substrate, the composite material prepreg and the metal foil for molding; machining a predetermined conductive geometry on the metal foil; covering a transparent film on the surface of the metal foil to obtain a metamaterial layer; and curing and molding the composite material prepreg and the metamaterial layer to obtain the metamaterial laminated plate. The metamaterial laminated plate prepared by the method increases the bonding area between different layers of the metamaterial laminated plate, reduces the thermal expansion stress between different materials, enhances the structural stability of the metamaterial laminated plate, avoids the lamination of the laminated plate, reduces metal material carriers, and greatly improves the strength of the laminated plate under the condition of not changing important properties such as electrical property, stealth property and the like.
Description
Technical Field
The invention relates to the field of a metamaterial laminated plate, in particular to a metamaterial laminated plate and a preparation method thereof.
Background
In the prior art, the face plates of the laminated plate adopt material interfaces with different properties, the bonding degree of the face plates is weaker when no bonding agent exists between the face plates, particularly, the bonding strength between the fiber polymer composite face plate and a metal material structure and between the composite face plate and a metal material carrier can directly influence the strength of the laminated plate, and the delamination can be caused in the using process seriously.
The existing metamaterial laminate is generally prepared by etching a carrier (flexible board) material with a metal material panel to obtain a carrier flexible board with a required metal structure, and then laminating and curing the carrier flexible board and a composite material prepreg according to a certain sequence. The metamaterial laminated plate prepared by the method has the following defects: 1. thermal stress caused by mismatch of thermal expansion coefficients of the composite panel, the metal structure and the carrier causes delamination to fail at high temperature; 2. the bonding strength between the composite material panel and the metal structure does not meet the requirement, and stress concentration is easy to generate to cause product delamination; 3. the properties of the carrier (flexible sheet) itself also affect the overall performance of the laminate.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
In view of this, the invention provides a metamaterial laminate and a preparation method thereof, which enhance the structural stability of the metamaterial laminate and avoid the lamination of the laminate.
The preparation method of the metamaterial laminated plate provided by the invention comprises the following steps: sequentially overlapping and laying a composite material substrate, a composite material prepreg and a metal foil and laminating for molding; machining a predetermined conductive geometry on the metal foil; covering a transparent film on the surface of the metal foil to obtain a metamaterial layer; and curing and molding the composite material prepreg and the metamaterial layer to obtain the metamaterial laminated plate.
In the above production method, in the step of sequentially stacking and laminating the composite substrate, the composite prepreg, and the metal foil, the lamination is performed at a temperature of 60 to 100 ℃.
In the preparation method, in the step of sequentially overlapping and laying the composite material substrate, the composite material prepreg and the metal foil and laminating the composite material substrate, the lamination is carried out by using a hot roller press, and the rolling pressure is 2-30 kg/cm2The rolling speed is 1-10 m/min.
In the preparation method, the composite prepreg and the metamaterial layer are cured and molded at 120-260 ℃.
In the preparation method, the pressure of the solidification molding is-0.1 MPa to-0.6 MPa.
In the above production method, the thickness of the metal foil is 10 μm to 200 μm.
In the preparation method, the thickness of the composite material substrate is 0.5 mm-2 mm.
In the preparation method, the heat-resistant temperature of the transparent film is between 80 and 100 ℃.
In the preparation method, the transparent film is made of polyethylene terephthalate release film.
In the above production method, the thickness of the transparent film is 5 μm to 30 μm.
In the preparation method, the thickness of the composite prepreg is 0.1mm-1 mm.
The invention also provides the metamaterial laminated board prepared by the method.
The metal foil and the prepreg are firstly pressed and molded, then the conductive geometric structure is formed on the metal foil, and the co-curing integral molding process is adopted, so that the bonding area between different layers of the metamaterial laminated plate is increased, the thermal expansion stress between different materials is reduced, the structural stability is enhanced, the laminated plate is not layered, the metal material carriers are reduced, and the strength of the laminated plate is greatly improved under the condition of not changing important performances such as electrical performance and stealth performance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a flow diagram of a method of making a metamaterial laminate panel in accordance with a particular embodiment;
FIG. 2 is a schematic diagram of a metamaterial laminate panel made in accordance with a particular embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Preparation method of metamaterial laminated plate
As shown in step S101 of fig. 1, a composite substrate, a composite prepreg, and a metal foil are sequentially stacked and laminated. In step S101, the lamination is performed at a temperature between 60 ℃ and 100 ℃, preferably at a temperature between 80 ℃ and 100 ℃, thereby improving the efficiency of the lamination. In step S101, lamination is performed by using a hot roller press at a pressure of 2 to 30kg/cm2The rolling speed is 1-10 m/min. In step S101, the thickness of the composite substrate is 0.5mm to 2 mm. In step S101, the thickness of the composite prepreg is 0.1mm to 1 mm.
As shown in step S103 of fig. 1, a predetermined conductive geometry is machined on the metal foil. In step S103, a predetermined conductive geometry is machined on the metal foil using a microetching technique or laser engraving. In step S103, the metal foil is a copper foil, a silver foil, an aluminum foil, or an iron foil, and the metal foil has a thickness of 10-200 μm. In step S103, the conductive geometric structure has a preset geometric pattern, and the size of the microstructure can be changed (increased or decreased) during the preparation of the metamaterial layer by using the curing shrinkage characteristic of the prepreg of the composite material according to actual requirements, so as to improve the dimensional stability of the metamaterial layer after final molding.
As shown in step S105 of fig. 1, a transparent film is coated on the surface of the metal foil to obtain a metamaterial layer. In step S105, the material of the transparent film is a polyethylene terephthalate (PET) release film, and the thickness of the transparent film is 5 to 30 μm. In step S105, the transparent film has a heat resistant temperature of 80 to 100 ℃.
As shown in step S107 of fig. 1, the composite prepreg and the metamaterial layer are cured and molded to obtain the metamaterial laminate, and as shown in fig. 2, the metamaterial laminate provided by the invention includes a composite substrate 1, a composite prepreg 2, a metal foil 3 and a transparent film 4. In step S107, the composite prepreg and the metamaterial layer are cured and molded at 120 to 260 ℃, preferably, the above-mentioned curing and molding are performed at 200 ℃, so that the curing and molding efficiency is improved, and the time required for curing and molding is reduced. In step S107, the pressure for the solidification molding is-0.1 MPa to-0.6 MPa. In step S107, the curing time is 2 to 8 hours, and preferably 5 hours, so that the prepared metamaterial laminate has strong stability.
The metamaterial laminated plate prepared by the method can also be applied to the aspects of aerospace structural members/functional members, high-frequency/ultrahigh-frequency circuit printing, metamaterial packaging, stealth structural members and the like.
Example 1
Sequentially laminating a composite material substrate with a thickness of 0.5mm, a composite material prepreg with a thickness of 0.1mm and a silver foil with a thickness of 10 μm, and performing lamination molding at 80 ℃ by using a hot roller press with a roller pressure of 30kg/cm2The rolling speed is 10 m/min; processing a preset conductive geometric structure on the silver foil by using laser engraving; covering a transparent polyethylene terephthalate (PET) release film with the thickness of 5 mu m and the heat resistance of 100 ℃ on the surface of the silver foil to prepare a metamaterial layer; and curing and molding the composite prepreg and the metamaterial layer for 8 hours under the conditions that the pressure is-0.1 MPa and the temperature is 260 ℃ to obtain the metamaterial laminated plate.
Example 2
Sequentially laminating a composite material substrate with the thickness of 2mm, a composite material prepreg with the thickness of 1mm and a copper foil with the thickness of 200 mu m, and performing lamination molding at 60 ℃ by using a hot roller press with the roller pressure of 18kg/cm2The rolling speed is 5 m/min; processing a predetermined conductive geometric structure on the copper foil by using a microetching technology; covering a polyethylene terephthalate (PET) release film with the thickness of 30 μm and the heat resistance of 80 ℃ on the surface of the copper foil to prepare a metamaterial layer, and performing composite material prepreg and the metamaterial layer under the pressure of-0.6And curing and forming the layers for 5 hours under the conditions of MPa and 200 ℃ to obtain the metamaterial laminated plate.
Example 3
Sequentially laminating a composite material substrate with the thickness of 1mm, a composite material prepreg with the thickness of 0.5mm and an aluminum foil with the thickness of 100 mu m, and performing lamination molding at 100 ℃ by using a hot roller press with the roller pressure of 2kg/cm2The rolling speed is 1/min; processing a preset conductive geometric structure on the aluminum foil by using laser engraving; covering a transparent polyethylene terephthalate release film with the thickness of 20 mu m and the heat resistance of 90 ℃ on the surface of the aluminum foil to obtain a metamaterial layer; and curing and molding the composite material prepreg and the metamaterial layer for 2 hours under the conditions that the pressure is-0.3 MPa and the temperature is 120 ℃ to obtain the metamaterial laminated plate.
Example 4
Sequentially laminating a composite material substrate with the thickness of 1.5mm, a composite material prepreg with the thickness of 0.8mm and an iron foil with the thickness of 80 μm, and performing lamination molding at 90 ℃ by using a hot roller press with the roller pressure of 20kg/cm2The rolling speed is 8 m/min; processing a preset conductive geometric structure on the iron foil by using laser engraving; covering a transparent polyethylene terephthalate (PET) release film with the thickness of 25 mu m and the heat resistance of 95 ℃ on the surface of the iron foil to obtain a metamaterial layer; and (3) curing and molding the composite prepreg and the metamaterial layer by 6 time layers under the conditions that the pressure is-0.4 MPa and the temperature is 260 ℃ to obtain the metamaterial laminated plate.
The invention firstly presses the metal foil and the prepreg layer, then forms the conductive geometric structure on the metal foil, and prepares the metamaterial laminated plate by the co-curing integral forming process. The metamaterial laminated plate prepared by the method increases the bonding area between different layers of the metamaterial laminated plate, reduces the thermal expansion stress between different materials, enhances the structural stability of the metamaterial laminated plate, avoids the lamination of the laminated plate, reduces metal material carriers, and greatly improves the strength of the laminated plate under the condition of not changing important properties such as electrical property, stealth property and the like.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (12)
1. A preparation method of a metamaterial laminated plate is characterized by comprising the following steps:
sequentially overlapping and laying a composite material substrate, a composite material prepreg and a metal foil and laminating for molding;
machining a predetermined conductive geometry on the metal foil;
covering a transparent film on the surface of the metal foil to obtain a metamaterial layer, wherein the size of the microstructure of the conductive geometric structure is changed by utilizing the curing shrinkage characteristic of the prepreg of the composite material when the metamaterial layer is prepared;
and co-curing the composite prepreg and the metamaterial layer to be integrally formed, so as to obtain the metamaterial laminated plate.
2. The production method according to claim 1, wherein the lamination is performed at a temperature of 60 to 100 ℃ in the step of sequentially stacking and laminating the composite substrate, the composite prepreg, and the metal foil.
3. The production method according to claim 1, wherein in the step of laying up the composite substrate, the composite prepreg and the metal foil in layers in this order and laminating them, the laminating is performed using a hot roll press at a roll pressure of 2 to 30kg/cm2The rolling speed is 1-10 m/min.
4. The preparation method according to claim 1, wherein the composite prepreg and the metamaterial layer are cured and molded at 120-260 ℃.
5. The method according to claim 4, wherein the pressure for the solidification molding is from-0.1 MPa to-0.6 MPa.
6. The production method according to claim 1, wherein the metal foil has a thickness of 10 μm to 200 μm.
7. The method according to claim 1, wherein the composite substrate has a thickness of 0.5mm to 2 mm.
8. The method according to claim 1, wherein the transparent film has a heat resistance temperature of 80 ℃ to 100 ℃.
9. The manufacturing method according to claim 1, wherein the material of the transparent film is a polyethylene terephthalate release film.
10. The production method according to claim 1, wherein the transparent film has a thickness of 5 μm to 30 μm.
11. The method of claim 1, wherein the composite prepreg has a thickness of 0.1mm to 1 mm.
12. A metamaterial laminate produced using the method of any one of claims 1 to 11.
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| CN201610091035.XA CN107089050B (en) | 2016-02-18 | 2016-02-18 | Metamaterial laminated plate and preparation method thereof |
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| CN201610091035.XA CN107089050B (en) | 2016-02-18 | 2016-02-18 | Metamaterial laminated plate and preparation method thereof |
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