CN107081855A - Chuck table mechanism - Google Patents
Chuck table mechanism Download PDFInfo
- Publication number
- CN107081855A CN107081855A CN201710070775.XA CN201710070775A CN107081855A CN 107081855 A CN107081855 A CN 107081855A CN 201710070775 A CN201710070775 A CN 201710070775A CN 107081855 A CN107081855 A CN 107081855A
- Authority
- CN
- China
- Prior art keywords
- chuck table
- fixing axle
- rotating part
- sealing plate
- sealing ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Jigs For Machine Tools (AREA)
- Sawing (AREA)
Abstract
A kind of chuck table mechanism is provided, simplifies the replacement operation of sealing ring and shortens maintenance time.Chuck table mechanism (50) has：Chuck table (51), it carries out attracting holding to machined object (W)；Rotating part (81), it has workbench mounting surface (82)；The fixing axle (71) of drum, it is disposed in the pivot of chuck table；And electric rotating motivation (94), it makes rotating part be rotated around fixing axle.The sealing plate (91) of the ring-type of the upper end of covering fixing axle is installed on rotating part in the way of freely assembling and disassembling, the groove (73) for the toroidal installed for sealing ring (75) is formed with the upper end of fixing axle.The gap of sealing plate and fixing axle is sealed by installing sealing plate on rotating part, so as to suppress the leakage of the air in fixing axle, by the way that sealing plate is pulled down from rotating part, the replacement operation of sealing ring is simplified.
Description
Technical field
The present invention relates to the chuck table mechanism kept in processing unit (plant) to machined object.
Background technology
The front of the machined objects such as semiconductor wafer is divided into multiple regions by the spacing track of clathrate, is marked off at this
The devices such as IC, LSI are formed with region.In device fabrication, formed by the way that machined object is cut off along spacing track
Each device chip.The segmentation of the machined object is implemented by processing unit (plant)s such as topping machanism or laser processing devices.
The chuck table mechanism that attracting holding is carried out to machined object is provided with each processing unit (plant).In chuck table mechanism
In, chuck table in the way of it can rotate and can attract via rotatable connection be arranged on fixing axle on (for example, referring to
Patent document 1).
Patent document 1：Japanese Unexamined Patent Publication 2010-089234 publications
In the rotatable connection of the chuck table mechanism described in patent document 1, generally, in order to prevent letting out for attraction
Leak and arrange sealing ring between the medial surface of movable axis (rotating part) and the lateral surface of fixing axle of chuck table.Due to close
Seal ring is slided with the rotation of chuck table on movable axis or fixing axle, so being needed because of aged deterioration regularly more
Change.In this case, if the movable axis of chuck table not pulled down from fixing axle, sealing ring can not be changed, is existed close
The replacement operation of seal ring is cumbersome and the problem of needing prolonged safeguard.
The content of the invention
The present invention be in view of the point and complete, its object is to provide chuck table mechanism, sealing ring can be simplified
Replacement operation and shorten maintenance time.
The chuck table mechanism of the present invention has：Chuck table, it carries out attracting holding to machined object；And rotation
Turn unit, the chuck table is installed on the top of the rotary unit, and chuck table supporting is by the rotary unit
It can rotate, the chuck table mechanism is characterised by, the rotary unit has：The fixing axle of drum, it is disposed in
Pivot is simultaneously internally formed with fluid path；Rotating part, it is arranged to rotate around the periphery of the fixing axle,
The top of the rotating part has the mounting surface for the ring-type installed for chuck table；And electric rotating motivation, it makes the rotating part
Rotation, has the sealing plate of ring-type, the sealing plate covers the upper end of the fixing axle on the rotating part in the way of freely assembling and disassembling
And formed across the upper surface to the rotating part, the upper surface of the sealing plate is the mounting surface of the chuck table, solid at this
The upper end of dead axle is formed with the groove of toroidal, and sealing ring is provided with the groove, and the sealing plate is arranged on into the rotating part
Upper surface on and the sealing ring is pressed against in the groove of the upper end of the fixing axle using the sealing plate and sealed.
According to the structure, rotating part can be rotated using the fixing axle of drum as pivot, to fixing axle
The sealing plate that upper end is covered is arranged on rotating part in the way of freely assembling and disassembling.Pacify in the upper surface of rotating part and sealing plate
Equipped with chuck table, attraction is applied to chuck table by the fluid path of the pivot of fixing axle, and make
Chuck table is rotated by pivot of fixing axle.Also, the groove of the toroidal in the upper end for being formed at fixing axle
Sealing ring is inside installed, using sealing ring to being sealed between sealing plate and fixing axle.In this case, by chuck table
Pulled down from the upper surface of rotating part and sealing plate, and sealing plate is pulled down from rotating part, thus, make the sealing of the upper end of fixing axle
Ring is exposed to outside.Therefore, it is possible to by the simple operation for pulling down chuck table, sealing plate come easily from top pair
Sealing ring is changed, and can significantly shorten maintenance time.
According to the present invention, due to can by the simple operation of pulling down chuck table, sealing plate come easily from
Top is changed to sealing ring, so can significantly shorten the maintenance time needed for the replacement operation of sealing ring.
Brief description of the drawings
Fig. 1 is the stereogram of the topping machanism of present embodiment.
Fig. 2 is the schematic cross-sectional view of the chuck table mechanism of comparative example.
Fig. 3 is the schematic cross-sectional view of the chuck table mechanism of present embodiment.
Fig. 4 (A), (B) and (C) is the explanation figure of the replacement operation of the sealing ring of present embodiment.
Label declaration
50：Chuck table mechanism；51：Chuck table；52：Workbench main body；61：Workbench base；70：Rotation is single
Member；71：Fixing axle；72：Fluid path；73：The groove of toroidal；75：Sealing ring；81：Rotating part；82：Workbench mounting surface
(mounting surface)；84：Plate mounting surface；91：Sealing plate；94：Electric rotating motivation；W：Machined object.
Embodiment
Hereinafter, the topping machanism of the chuck table mechanism with present embodiment is illustrated referring to the drawings.Fig. 1 is
The stereogram of the topping machanism of present embodiment.Fig. 2 is the schematic cross-sectional view of the chuck table mechanism of comparative example.In addition,
In the following description, illustrated exemplified with having the structure of chuck table mechanism in topping machanism, but simultaneously not only limit
In the structure.For example, it is also possible to which there is chuck table in other processing unit (plant)s such as laser processing device or grinding attachment
Mechanism.
As shown in figure 1, topping machanism 1 is configured to add discoideus on chuck table 51 using cutting tool 46
Work thing W is cut and is divided into each device chip.Machined object W is rectangular package substrate, and substrate front side is by grid
The spacing track of shape divides and forms various devices in each region marked off by spacing track.In addition, machined object W and not only limiting
In CSP (Chip Size Package：Chip size packages) substrate, wafer level chip size package (Wafer Level Chip Size
Package：Wafer-level chip scale package) the small-sized package substrate such as substrate or the size envelope bigger than csp substrate etc.
Fill substrate.
The opening of the rectangle extended in the X-axis direction is formed with the upper surface of the shell 10 of topping machanism 1, the opening quilt
The movable plate 11 and undulatory bucker 12 that can be moved together with chuck table 51 are covered.Set in the lower section of bucker 12
It is equipped with the travel mechanism for the ball screw type (not shown) for making chuck table 51 move in the X-axis direction.In chuck table
51 front is formed through the retaining surface 53 that multiple suction ports carry out attracting holding to machined object W.Retaining surface 53 passes through card
Fluid path in disk workbench 51 and be connected with attracting source, and machined object W is entered by the negative pressure for resulting from retaining surface 53
Row attracting holding.
Back and forth moved between delivery position that chuck table 51 is entreated in a device and the Working position for closing on cutting unit 45
It is dynamic.Fig. 1 shows the state standby at delivery position of chuck table 51.It is adjacent with the delivery position in shell 10
The recessed one-level in one corner, mounting workbench 14 is arranged in the way of it can lift in recessed position.In mounting workbench 14
On be placed with the box C for having stored machined object W.Mounting workbench 14 is lifted in the state of box C is placed with, thus,
Machined object W pull-out location and push-in position are adjusted in short transverse.
The rear of mounting workbench 14 is provided with a pair of centring guides 21 parallel with Y direction and makes machined object
The push-pull mechanism 22 that W comes in and goes out between a pair of centring guides 21 and box C.Push-and-pull machine is guided by a pair of centring guides 21
The machined object W's that structure 22 is carried out comes in and goes out and machined object W X-direction is positioned.Also, except by push-and-pull
Machined object W before processing is drawn out to outside a pair of centring guides 21 by mechanism 22 from box C, will also be added by push-pull mechanism 22
The complete machined object W of work is from a pair of centring guides 21 are pushed into box C.
The 1st carrying arm 25 is provided with the vicinity of a pair of centring guides 21, the 1st carrying arm 25 is in centring guides 21
Machined object W is transported between chuck table 51.The arm of L-shaped is utilized by the convolution of the 1st carrying arm 25
The conveyance pad 27 of 26 front end is transported to machined object W.Also, the rear of the chuck table 51 in delivery position is set
There is rotary cleaning mechanism 31.It is right in the jet cleaning water of rotary table 32 towards in rotating in rotary cleaning mechanism 31
After machined object W is cleaned, dry air is blowed instead of rinse water so that machined object W is dried.
Supporting station 16 is provided with shell 10,16 pairs of cutting units 45 with cutting tool 46 of the supporting station are propped up
Hold.Cutting unit 45 is configured to being arranged on cutting tool 46 into the front end for being supported by the main shaft that platform 16 is supported.On cutting tool
46, for example, diamond abrasive grain is fixed using bonding agent and is configured to discoideus.Also, cutting unit 45 is with making cutting tool
46 travel mechanisms (not shown) moved in Y direction and Z-direction link.In cutting unit 45, from multiple injection sprays
Mouth jet cleaning liquid, and the cutting tool 46 rotated at a high speed is relatively moved relative to chuck table 51 so as to machined object
W is cut.
The 2nd carrying arm 35 is provided with the side 17 of supporting station 16, the 2nd carrying arm 35 is in chuck table 51 and rotation
Machined object W is transported between wiper mechanism 31.Utilized by the advance and retreat movement of the 2nd carrying arm 35 from supporting station 16
The conveyance pad 37 of the front end of 17 arms 36 extended towards diagonally forward is transported to machined object W sideways.Also, in supporting station
The unilateral support 19 of the top for the mobile route for being transverse in chuck table 51 is provided with 16, machined object W is clapped
The coverlet side electrode support 19 of shoot part 41 taken the photograph is supported.Shooting portrait captured by shoot part 41 is applied to cutting unit 45 and card
The alignment of disk workbench 51.Also, the monitor 42 shown to processing conditions etc. is placed with supporting station 16.
(the reference of chuck table mechanism 50 for only making chuck table 51 expose on shell 10 is accommodated with shell 10
Fig. 3).Chuck table mechanism 50 makes the rotation of chuck table 51 so as to be positioned at cutting tool 46 on vertical spacing track,
And the negative pressure for being kept to machined object W is acted in the retaining surface 53 of chuck table 51.Therefore, chucking work
In platform mechanism 50, following rotatable connection construction is employed relative to the fixing axle for being formed with fluid path：While to air
Leakage is suppressed, while chuck table 51 is connected in the way of it can rotate.
For example, as shown in Fig. 2 the rotatable connection on the chuck table mechanism 100 of comparative example is constructed, to chucking work
The rotating part 111 that platform 101 is supported is adapted to the fixing axle 103 around drum.In rotating part 111 and fixing axle
Bearing 114 is installed, chuck table 101 is supported to rotate by bearing 114 by fixing axle 103 between 103.And
And, born in the fluid path 104 that is centrally formed with of fixing axle 103 to be produced in the retaining surface 102 of chuck table 101
Pressure.The circular groove 107 installed for sealing ring 115 is formed with the lateral surface 105 of fixing axle 103.
Sealing ring 115 is contacted with the medial surface 112 of rotating part 111, and the gap of fixing axle 103 and rotating part 111 is carried out
Sealing and the leakage to air suppresses.The meeting aged deterioration of sealing ring 115 thus needs periodic replacement, but be not easy from so
Rotatable connection construction in sealing ring 115 is changed.If that is, not by chuck table 101 from rotating part 111 pull down into
And pull down the entirety of rotating part 111 from fixing axle 103, then sealing ring 115 can not be made to expose from the lateral surface 105 of fixing axle 103
In outside.Accordingly, there exist the problem of the replacement operation of sealing ring 115 complexity and elongated maintenance time.
Therefore, in the present embodiment, the rotatable connection construction of above-mentioned comparative example is changed, set on rotating part 81
The sealing plate 91 of the upper end of covering fixing axle 71 is put, using sealing ring 75 to the lower surface of sealing plate 91 and the upper end of fixing axle 71
Between gap sealed (reference picture 3).And then, sealing plate 91 is arranged on rotating part 81 in the way of freely assembling and disassembling,
Pulling down and make sealing ring 75 expose upward by sealing plate 91.Thereby, it is possible to by by chuck table 51, sealing plate 91
Sealing ring 75 is changed in the simple operation pulled down, so can significantly shorten maintenance time.
Hereinafter, the chuck table mechanism of present embodiment is illustrated.Fig. 3 is the chuck table of present embodiment
The schematic cross-sectional view of mechanism.In addition, chuck table mechanism is can be by the assembly and disassembly of sealing plate from top replacing sealing ring
Structure, be not limited in the example shown in Fig. 3.For example, in the following description, exemplified with the chuck of package substrate
Table mechanism, but can also use same knot for the chuck table mechanism of semiconductor wafer or optical device wafer
Structure.
As shown in figure 3, in chuck table mechanism 50, pacifying to the machined object W chuck tables 51 for carrying out attracting holding
Mounted in the top of rotary unit 70, chuck table 51 is supported by rotary unit 70 to rotate.Chuck table 51
Employ by workbench main body 52 in the way of freely assembling and disassembling installed in Workbench base 61 upper surface up and down to point construction.
In workbench main body 52, the top section for being formed with multiple suction ports 54 circumferential flange shape be formed with and be fixed on workbench
The underclad portion of pedestal 61.Multiple suction ports 54 are formed with the top section of workbench main body 52 and guarantor is formed with upper surface
Face 53 is held, the mounting hole 55 ((A) of reference picture 4) of bolt 56 is formed with the underclad portion of workbench main body 52.
Also, Workbench base 61 is formed as the annular plate-like of central opening, in the mounting hole 55 with workbench main body 52
((A) of reference picture 4) corresponding position is formed with screwed hole 62 ((A) of reference picture 4).By making the peace from workbench main body 52
The front end of bolt 56 that dress hole 55 is protruded is screwed togather with the screwed hole 62 of the Workbench base 61, and workbench main body 52 is freely to assemble and disassemble
Mode be arranged on Workbench base 61 on.By the installment work platform main body 52 on Workbench base 61, formation makes multiple suctions
Draw the communication chamber 57 that mouth 54 is connected with the fluid path 72 of fixing axle 79.Also, in the (ginseng of ratio screwed hole 62 of Workbench base 61
According to Fig. 4) lean on the mounting hole 63 that bolt 64 is formed with the position of radially inner side.
On rotary unit 70, the fixing axle 71 of drum is disposed in the pivot of chuck table 51, rotating part
81 arrange in the way of around the periphery of fixing axle 71.In the inside of fixing axle 71, it is formed with communication chamber in the vertical direction
57 fluid path 72 with attracting source 77 to be connected.The ring for chuck for installing workbench 51 is formed with the upper surface of rotating part 81
The workbench mounting surface 82 of shape, on workbench mounting surface 82, in position shape corresponding with the mounting hole 63 of Workbench base 61
Into there is screwed hole 83.By the front end and the spiral shell of the rotating part 81 that make the bolt 64 from the protrusion of mounting hole 63 of Workbench base 61
Pit 83 is screwed togather, and Workbench base 61 is arranged on the top of rotating part 81 in the way of freely assembling and disassembling.
Radially inner side in the upper surface of rotating part 81, is forming to obtain low 1 grade of plate mounting surface than workbench mounting surface 82
Sealing plate 91 is installed on 84.Sealing plate 91 is formed as from rotating part 81 across to fixing axle 71, the radial outside of sealing plate 91
Supported by plate mounting surface 84, the radially inner side of sealing plate 91 covers the upper end of fixing axle 71.The thickness of sealing plate 91 is with work
Jump between platform mounting surface 82 and plate mounting surface 84 is consistent, and the upper surface of workbench mounting surface 82 and sealing plate 91 is formed as same
One plane.Therefore, the upper surface of sealing plate 91 also turns into the workbench mounting surface 82 installed for chuck table 51.
The mounting hole 92 ((C) of reference picture 4) of bolt 93 is formed with the radial outside of sealing plate 91, in plate mounting surface
On 84, screwed hole 86 ((C) of reference picture 4) is being formed with the corresponding position of mounting hole 92.By making the peace from sealing plate 91
The front end of bolt 93 that dress hole 92 is protruded is screwed togather with the screwed hole 86 of the plate mounting surface 84, and sealing plate 91 is in the way of freely assembling and disassembling
On plate mounting surface 84.Also, the lower surface of sealing plate 91 is relative with the upper end (upper surface) of fixing axle 71 and vacates micro-
Small gap.The groove 73 of toroidal is formed with the upper end of fixing axle 71, sealing ring is installed in the groove 73 of toroidal
75。
Therefore, when sealing plate 91 is arranged on the plate mounting surface 84 of rotating part 81, the lower surface of sealing plate 91 is passed through
Sealing ring 75 is pressed against in the groove 73 of toroidal.Sealing ring 75 is in the lower surface of sealing plate 91 and the groove 73 of toroidal
It is crushed between bottom surface, the lower surface of sealing plate 91 is sealed with the gap of the upper end of fixing axle 71.Thus, air will not be from close
Shrouding 91 and the clearance leakage of fixing axle 71, it is suppressed that the reduction of the attraction of chuck table 51.In addition, being used as sealing ring
75, use the motion seal such as O-ring or pad.
Also, by the way that sealing plate 91 is pulled down from the plate mounting surface 84 of rotating part 81, make the sealing ring 75 as running stores
It is exposed to outside.Therefore, without being pulled down rotating part 81 is overall from fixing axle 71, groove 73 that can easily only to toroidal
Interior sealing ring 75 is changed.Bearing is installed between the medial surface 87 of rotating part 81 and the lateral surface 79 of fixing axle 71
76, rotating part 81 is supported to rotate by bearing 76 by fixing axle 71.Also, in rotary unit 70, in rotating part
81 and fixing axle 71 lower portion be provided with make rotating part 81 rotate electric rotating motivation 94.
Electric rotating motivation 94 be configured to rotating part 81 link rotor 98 the stator 95 for being fixed on fixing axle 71 week
Spinning turns.On the outer peripheral face of stator 95, multiple teeth 96 are radially oriented protrusion, and coil windings 97 are provided with each tooth 96.
The medial surface of rotor 98 is provided with multiple magnet 99, and the coil windings 97 of the plurality of magnet 99 and stator 95 vacate small gap
And it is relative.Also, by being powered to coil windings 97, rotor 98 is that pivot is rotated with fixing axle 71.Thus, with turning
The rotating part 81 and chuck table 51 that son 98 links are rotated integrally.
So, the rotatable connection on chuck table mechanism 50, chuck table 51 is supported as that can rotate, and
Air is leaked, the attraction for coming self-gravitation source 77 can be applied to the retaining surface 53 of chuck table 51.Also, due to close
Shrouding 91 is contacted with fixing axle 71 by sealing ring 75, so sealing ring 75 can be damaged because of slip.But, due to sealing plate
91 are arranged on rotating part 81 in the way of freely assembling and disassembling, so can be by the way that sealing plate 91 is pulled down and easy from rotating part 81
Ground is changed by sealing ring 75.
Reference picture 4, the replacement operation to sealing ring is illustrated.Fig. 4 is the replacement operation of the sealing ring of present embodiment
Explanation figure.Wherein, Fig. 4 (A) shows the operation of pulling down of workbench main body, and Fig. 4 (B) shows tearing open for Workbench base
Lower operation, what Fig. 4 (C) showed sealing plate pulls down operation.
As shown in Fig. 4 (A), in the replacement operation of sealing ring, workbench main body 52 is backed out by operating personnel first
Each bolt 56 of outer peripheral portion, and workbench main body 52 is pulled down from the upper surface of Workbench base 61.Thus, it is hidden in work
The bolt 64 of the fixation of Workbench base 61 of the inner side of platform main body 52 is exposed to outside.Then, as shown in Fig. 4 (B), by grasping
Each bolt 64 of Workbench base 61 is backed out as personnel, and Workbench base 61 is torn open from the workbench mounting surface 82 of rotating part 81
Under.Thus, the bolt 93 for being hidden in the fixation of sealing plate 91 of the inner surface side of Workbench base 61 is exposed to outside.
Then, as shown in Fig. 4 (C), each bolt 93 of sealing plate 91 is backed out by operating personnel, and by sealing plate 91 from rotation
The plate mounting surface 84 of transfer part 81 is pulled down.Thus, the sealing ring 75 installed in the groove 73 of the toroidal of the upper end of fixing axle 71 reveals
For outside.Then, the sealing ring 75 of the damage in the groove 73 by toroidal pull down and install new sealing ring 75 it
Afterwards, by pacifying with the above-mentioned opposite step of action of pulling down to sealing plate 91, Workbench base 61, workbench main body 52
Dress.So, simplify the replacement operation of sealing ring 75 and shorten maintenance time.
As described above, in the chuck table mechanism 50 of present embodiment, rotating part 81 being capable of consolidating with drum
Dead axle 71 is that pivot is rotated, and the sealing plate 91 for covering the upper end of fixing axle 71 is arranged on rotation in the way of freely assembling and disassembling
On transfer part 81.Also, sealing ring 75 is installed in the groove 73 for being formed at the toroidal of upper end of fixing axle 71, sealing is utilized
Ring 75 between sealing plate 91 and fixing axle 71 to sealing.In this case, by by chuck table 51 from rotating part 81
Pulled down with sealing plate 91, and sealing plate 91 is pulled down from rotating part 81, thus the sealing ring 75 of the upper end of fixing axle 71 is exposed to
It is outside.Therefore, it is possible to by the simple operation for pulling down chuck table 51, sealing plate 91 come easily from top to sealing
Ring 75 is changed, and can significantly shorten maintenance time.
In addition, the present invention is not limited in above-mentioned embodiment, various changes can be carried out and implemented.In above-mentioned embodiment party
In formula, for size or shape for illustrating in the accompanying drawings etc., be not limited to that, can the effect for playing the present invention scope
It is interior suitably to be changed.As long as in addition, just can suitably be changed and be implemented in the range of the purpose of the present invention is not departed from.
For example, in the above-described embodiment, multiple suction ports 54 are formed with the retaining surface 53 of chuck table 51, but
It is not limited in the structure.The retaining surface 53 of chuck table 51 can also be formed as Porous by porous ceramics.And, although
Chuck table 51 employs workbench main body 52 relative to the structure that Workbench base 61 is freely assembled and disassembled, but Workbench base 61
It can also be formed as one with workbench main body 52.
Also, in the above-described embodiment, illustrated exemplified with electric rotating motivation 94 is electromagnetic motor, but
It is not limited in the structure.As electric rotating motivation 94, electrostatic motor or ultrasonic type motor can also be used.
And, although in the above-described embodiment, sealing plate 91 is formed as toroidal, it is not limited to the knot
Structure.Sealing plate 91 is formed as the upper end to covering fixing axle 71 and does not hinder the shape of the fluid path 72 of fixing axle 71 i.e.
Can, for example, it is also possible to be formed as rectangular ring.
And, although in the above-described embodiment, employ using bolt 93 and sealing plate 91 is threadedly secured in rotation
Structure in portion 81, it is not limited to the structure.Sealing plate 91 is used to be arranged on rotating part 81 in the way of freely assembling and disassembling
Structure, can install in any way.
Also, in the above-described embodiment, as machined object W exemplified with package substrate, but machined object W is conduct
The workpiece of processing object can or semiconductor wafer or optical device wafer.
As described above, the present invention shortens the effect of maintenance time with the replacement operation that can simplify sealing ring
Really, especially to the chuck table kept to machined object in the processing unit (plant) such as topping machanism or laser processing device
Mechanism is useful.
Claims (1)
1. a kind of chuck table mechanism, it has：Chuck table, it carries out attracting holding to machined object；And rotation
Unit, the chuck table is installed on the top of the rotary unit, and chuck table supporting is energy by the rotary unit
Enough to rotate, the chuck table mechanism is characterised by,
The rotary unit has：
The fixing axle of drum, it is disposed in pivot and is internally formed with fluid path；
Rotating part, it is arranged to rotate around the periphery of the fixing axle, has on the top of the rotating part and supply chuck work
Make the mounting surface of the ring-type of platform installation；And
Electric rotating motivation, it rotates the rotating part,
There is the sealing plate of ring-type on the rotating part in the way of freely assembling and disassembling, the sealing plate covers the upper end of the fixing axle simultaneously
Formed across the upper surface to the rotating part, the upper surface of the sealing plate is the mounting surface of the chuck table,
The groove of toroidal is formed with the upper end of the fixing axle, sealing ring is installed in the groove,
The sealing plate is arranged on the upper surface of the rotating part and the sealing ring is pressed against the fixing axle using the sealing plate
Upper end the groove in and sealed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016025975A JP6726473B2 (en) | 2016-02-15 | 2016-02-15 | Chuck table mechanism |
| JP2016-025975 | 2016-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107081855A true CN107081855A (en) | 2017-08-22 |
| CN107081855B CN107081855B (en) | 2020-06-19 |
Family
ID=59615018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710070775.XA Active CN107081855B (en) | 2016-02-15 | 2017-02-09 | Chuck worktable mechanism |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6726473B2 (en) |
| KR (1) | KR102466078B1 (en) |
| CN (1) | CN107081855B (en) |
| TW (1) | TWI716523B (en) |
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|---|---|---|---|---|
| CN108127488A (en) * | 2017-12-25 | 2018-06-08 | 崔红宝 | Pneumatic ultrasonic polishing grinding device and pneumatic ultrasonic polishing milling apparatus |
| TWI714497B (en) * | 2020-04-14 | 2020-12-21 | 盛方源科技股份有限公司 | Vacuum suction cup structure capable of continuous rotation |
| WO2021239055A1 (en) * | 2020-05-29 | 2021-12-02 | 北京鲁汶半导体科技有限公司 | Rotating platform for ion beam etching |
| CN117198971A (en) * | 2023-11-07 | 2023-12-08 | 沈阳和研科技股份有限公司 | Wafer chuck table |
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| CN109604874A (en) * | 2019-01-24 | 2019-04-12 | 晶澳（邢台）太阳能有限公司 | A kind of string welding machine absorption cleaning plant and absorption method for cleaning |
| JP7349247B2 (en) * | 2019-02-05 | 2023-09-22 | 株式会社ディスコ | inspection table |
| CN114975207B (en) * | 2022-07-13 | 2022-09-30 | 上海隐冠半导体技术有限公司 | Turntable with lifting vacuum claw and handover method |
| CN115890275B (en) | 2023-02-20 | 2023-07-14 | 中国机械总院集团宁波智能机床研究院有限公司 | Static pressure composite turntable and protection method thereof |
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Also Published As
| Publication number | Publication date |
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| KR102466078B1 (en) | 2022-11-10 |
| TWI716523B (en) | 2021-01-21 |
| JP6726473B2 (en) | 2020-07-22 |
| KR20170095736A (en) | 2017-08-23 |
| CN107081855B (en) | 2020-06-19 |
| JP2017144493A (en) | 2017-08-24 |
| TW201730945A (en) | 2017-09-01 |
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