CN109968551B - Pneumatic stable semiconductor wafer cutting device based on magnetic pole pressurization principle - Google Patents
Pneumatic stable semiconductor wafer cutting device based on magnetic pole pressurization principle Download PDFInfo
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- CN109968551B CN109968551B CN201910165888.7A CN201910165888A CN109968551B CN 109968551 B CN109968551 B CN 109968551B CN 201910165888 A CN201910165888 A CN 201910165888A CN 109968551 B CN109968551 B CN 109968551B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 57
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000001816 cooling Methods 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000005484 gravity Effects 0.000 claims abstract description 9
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 230000006698 induction Effects 0.000 claims description 8
- 239000002994 raw material Substances 0.000 abstract description 12
- 239000000110 cooling liquid Substances 0.000 abstract description 10
- 239000000498 cooling water Substances 0.000 abstract description 6
- 238000005457 optimization Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a pneumatic and stable semiconductor wafer cutting device based on a magnetic pole pressurization principle, which structurally comprises an observation shaft seat, a moving platform, a gantry guide frame, a fixed base, a processing rotary table and a cutter, wherein the processing rotary table is arranged in the middle of the surface of the fixed base in a buckling mode, the gantry guide frame is arranged at the rear end of the top of the fixed base, and the bottom of the moving platform is arranged at the upper end of the gantry guide frame in a buckling mode. The cutter ensures the angle of the gravity cooler through the gravity guiding box, performs pressurization output on gas through the rotary pressure disc, and performs pneumatic operation on the bottom of the cutting sheet, thereby solving the problem that the raw material of a chip is stripped by cooling water in the cutting process, and the water cooling head is designed to be cooled at two sides, thereby effectively avoiding the situation that the raw material of the chip is washed away by cooling liquid, and improving the integrity of the cut wafer.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a pneumatic and stable semiconductor wafer cutting device based on a magnetic pole pressurization principle.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, the wafer is a basic material for manufacturing a semiconductor chip, and during manufacturing, a silicon wafer plate is obtained through a long crystal growing process, and the silicon wafer plate is separated from the wafer plate through cutting, rolling, slicing, chamfering, polishing and laser engraving to form a chip raw material of an integrated circuit factory. The existing wafer cutting device in the market has the following problems in the use process:
the chip raw materials and the plate body on the silicon crystal plate are separated through transverse cutting in the prior art, so that the chip raw materials and the plate body are extracted, the cutting points are directly cooled by the cooling liquid commonly adopted at present, the cooling of the cutting piece is achieved, the chip raw materials after cutting are washed away by the cooling liquid, and the integrity of the wafer after cutting is limited and needs to be optimized.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a pneumatic and stable semiconductor wafer cutting device based on a magnetic pole pressurization principle, so as to solve the problems that in the prior art, chip raw materials on a silicon crystal plate are separated from the plate body through transverse cutting, so that extraction is carried out, and because cooling liquid is generally adopted to directly cool a cutting point so as to achieve cooling of a cutting piece, the cut chip raw materials are washed away by the cooling liquid, the integrity of a cut wafer is limited, and optimization is needed.
In order to achieve the purpose, the invention is realized by the following technical scheme: the pneumatic stable semiconductor wafer cutting device based on the magnetic pole pressurization principle structurally comprises an observation shaft seat, a moving platform, a gantry guide frame, a fixed base, a processing rotary table and a cutter, wherein the processing rotary table is installed in the middle of the surface of the fixed base in a buckling mode, the gantry guide frame is arranged at the rear end of the top of the fixed base, the bottom of the moving platform is installed at the upper end of the gantry guide frame in a buckling mode, the rear end of the observation shaft seat is embedded with the front end of the moving platform, and the cutter is installed at the bottom of the observation shaft seat in a.
As the further optimization of the technical scheme, the cutter comprises an attractive force cooler, a driving arm and a cutting blade, wherein the cutting blade is arranged at the front end of the driving arm, and the attractive force cooler is arranged in the middle of the upper end of the cutting blade in a sleeving manner.
As the further optimization of the technical scheme, the gravity cooler comprises the weight guiding box, the water cooling head and the rotary pressing plate, the water cooling head is installed at the left end and the right end of the rotary pressing plate in a buckling mode, the weight guiding box is arranged at the bottom of the rotary pressing plate, the two ends of the weight guiding box are respectively connected with the water cooling head, and the rotary pressing plate is buckled with the middle part of the cutting plate.
As the further optimization of this technical scheme, the commentaries on classics pressure disk includes the drive shaft, the smooth pearl, the counter weight ring, the pressure boost groove, the induced air mouth, the pressure boost piece, the nozzle is located heavy box bottom portion of guide through the lock mode, the inside lower extreme of heavy box of guide is equipped with the induced air mouth, the induced air mouth is equipped with two, and the top is connected with the drive shaft is inside, the pressure boost groove is located heavy box lower extreme middle part of guide perpendicularly, and be integral structure, the pressure boost piece is located inside the pressure boost groove through the embedding mode, and be connected with the drive shaft, the counter weight ring is connected with the drive shaft registrate through smooth pearl, the inside and counter weight ring of.
As the further optimization of this technical scheme, the drive shaft includes axle center, the piece that repels, leads to ring, swing arm, fan blade, and the swing arm is equipped with threely, and the head end is connected with the axle center through the lock mode, and the piece that repels is installed in the swing arm end through the registrate mode, and the fan blade is equipped with more than two, and even equidistance distributes around the axle center, and the ring that leads is circular structure, and installs in the inside outside of drive shaft, and the piece that repels is located the ring that leads inside.
As a further optimization of the technical scheme, the driving arm comprises a belt, an injection pipe and an axis back sleeve, the axis back sleeve is installed at the rear end of the axis in a sleeving mode, the bottom of the belt is meshed with the axis back sleeve, the injection pipe is arranged inside the driving arm, and the rear end of the axis back sleeve is communicated with the bottom of the injection pipe.
As the further optimization of this technical scheme, draw heavy bottom of the case portion and be equipped with the balancing weight, formed the effect of dragging to drawing heavy bottom of the case portion through the gravity principle, the condition that appears following the commentaries on classics when avoiding the cutting piece to rotate.
As the further optimization of this technical scheme, pressure boost piece bottom is equipped with sealed piston to can form pressure seal in pressure boost inslot portion, conveniently carry out the pressure boost and carry.
As the further optimization of this technical scheme, the piece that repels is the magnetic material with the pressure boost piece, and for the design of repelling mutually, repels through magnetic force and makes the pressure boost piece remove when the contact to for the inside effect that plays gaseous pressure boost of pressure boost groove.
Advantageous effects
The invention relates to a pneumatic stable semiconductor wafer cutting device based on the magnetic pole pressurization principle, which can magnify and observe the cutting work of a cutter through an observation shaft seat, is provided with a processing turntable for placing a processed wafer plate, a driving arm for driving the cutting blade to rotate, can effectively cool the cutting blade through an attraction cooler in the processing process, a guide weight box for placing cooling water to play a role in backflow, and cools the left end and the right end of the cutting blade through water cooling heads on two sides, when a driving shaft rotates, a pressurization block is pressurized, wind power can be increased through an internal wind guide element, a nozzle is led out through a wind induction port, the pressurization block pushes the pressurization block downwards through thrust generated by magnetic repulsion, so that discontinuous air injection is generated in a pressurization groove, the cut chip material is smoothed, and falling caused by lifting is avoided, the sliding bead is used for increasing the sliding property of the counterweight ring and the driving shaft, the rotation along with the sliding bead is avoided, the fan blade can be driven to form air flow when the axis rotates, the swing arm rotates along with the swinging arm, then the repulsion block is driven to move circularly, when the repulsion block passes through the pressurizing block, the pushing is carried out according to the principle that magnetism repels each other, the belt is used for driving the axis back cover to rotate, the hollow position is reserved in the middle of the axis back cover so as to be connected with the injection pipe, and therefore cooling liquid is guided into the weight guiding box.
Based on the prior art, the invention can achieve the following advantages after operation:
the cutter ensures the angle of the gravity cooler through the gravity guiding box, performs pressurization output on gas through the rotary pressure disc, and performs pneumatic operation on the bottom of the cutting sheet, thereby solving the problem that the raw material of a chip is stripped by cooling water in the cutting process, and the water cooling head is designed to be cooled at two sides, thereby effectively avoiding the situation that the raw material of the chip is washed away by cooling liquid, and improving the integrity of the cut wafer.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a pneumatically stable semiconductor wafer cutting device based on the magnetic pole pressurization principle.
Fig. 2 is a schematic view of a cutter structure of the pneumatically stabilized semiconductor wafer cutting device based on the pole pressurization principle according to the present invention.
FIG. 3 is a front view of a cutter of the pneumatically stabilized semiconductor wafer cutting device according to the present invention based on the pole pressurization principle.
FIG. 4 is a sectional view of the front view of the gravitational cooler of the semiconductor wafer cutting device based on the magnetic pole pressurization principle.
Fig. 5 is a sectional view showing the front view of the driving shaft of the pneumatically stabilized semiconductor wafer dicing apparatus according to the magnetic pole pressurization principle of the present invention.
Fig. 6 is a perspective view of the internal structure of a rotary pressing plate of the pneumatically stable semiconductor wafer cutting device based on the magnetic pole pressurization principle.
Fig. 7 is a side view of the internal structure of the driving arm of the pneumatically stable semiconductor wafer dicing apparatus according to the magnetic pole pressurization principle of the present invention.
Reference numerals in the drawings indicate: observation shaft seat-1, moving platform-2, gantry guide frame-3, fixed base-4, processing rotary table-5, cutter-6, gravitation cooler-601, driving arm-602, cutting piece-603, weight guiding box-6011, water cooling head-6012, pressure rotating disc-6013, driving shaft-60131, sliding ball-60132, counterweight ring-60133, pressurizing groove-60134, air guiding opening-60135, pressurizing block-60136, nozzle-60137, shaft center-601311, repulsion block-601312, guiding ring-601313, swinging arm-601314, fan blade-601315, belt-6021, injection pipe-6022 and shaft center back sleeve-6023.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
The upper and lower, inner and outer, front and rear, and left and right in the present invention are referred to with reference to the orientation in fig. 1.
Examples
Referring to fig. 1-7, the present invention provides a pneumatically stable semiconductor wafer cutting device based on the principle of magnetic pole pressurization, the structure of which includes an observation shaft seat 1, a moving platform 2, a gantry guide frame 3, a fixed base 4, a processing turntable 5 and a cutter 6, wherein the processing turntable 5 is mounted in the middle of the surface of the fixed base 4 in a buckling manner, the gantry guide frame 3 is arranged at the rear end of the top of the fixed base 4, the bottom of the moving platform 2 is mounted at the upper end of the gantry guide frame 3 in a buckling manner, the rear end of the observation shaft seat 1 is embedded with the front end of the moving platform 2, the cutter 6 is mounted at the bottom of the observation shaft seat 1 in a buckling manner, the cutting work of the cutter 6 can be observed in an enlarged manner through the observation shaft seat 1, and the processing turntable 5 is provided.
The cutter 6 comprises an attraction cooler 601, a driving arm 602 and a cutting blade 603, wherein the cutting blade 603 is arranged at the front end of the driving arm 602, the attraction cooler 601 is arranged in the middle of the upper end of the cutting blade 603 in a sleeving manner, the driving arm 602 is used for driving the cutting blade 603 to rotate, and in the machining process, the attraction cooler 601 can effectively cool the cutting blade 603.
The gravity cooler 601 comprises a weight guiding box 6011, a water cooling head 6012 and a pressure transferring plate 6013, wherein the water cooling head 6012 is installed at the left end and the right end of the pressure transferring plate 6013 in a buckling mode, the weight guiding box 6011 is arranged at the bottom of the pressure transferring plate 6013, the two ends of the weight guiding box 6011 are respectively connected with the water cooling head 6012, the pressure transferring plate 6013 is buckled with the middle part of a cutting piece 603, the weight guiding box 6011 is used for containing cooling water to play a role in backflow, and the left end and the right end of the cutting piece 603 are cooled through the water cooling heads 6012 on the two sides.
The pressure-conversion plate 6013 comprises a driving shaft 60131, a sliding ball 60132, a counterweight ring 60133, a pressurizing groove 60134, an air induction port 60135, a pressurizing block 60136 and a nozzle 60137, wherein the nozzle 60137 is arranged at the bottom of the weight guiding box 6011 in a buckling manner, the lower end of the inside of the weight guiding box 6011 is provided with the air induction port 60135, the two air induction ports 60135 are arranged, the top of the air induction port 60135 is connected with the inside of the driving shaft 60131, the pressurizing groove 60134 is vertically arranged in the middle of the lower end of the weight guiding box 6011 and is of an integrated structure, the pressurizing block 60136 is arranged inside the pressurizing groove 60134 in an embedding manner and is connected with the driving shaft 60131, the weight guiding ring 60133 is connected with the driving shaft 60131 in a sleeving manner through the sliding ball 60132, the inside of the weight guiding box 6011 is connected with the counterweight ring 60133 in a sleeving manner, when the driving shaft 60131 rotates, the pressurizing block 60136 is pressurized, wind power can be increased through an internal wind force, the air guiding hole 60135 leads out the nozzle 60137, the inside of the pressurizing groove 60134 is subjected to intermittent air injection, and the sliding balls 60132 are used for increasing the sliding performance of the counterweight ring 60133 and the driving shaft 60131 so as to avoid follow-up rotation.
The driving shaft 60131 includes axle center 601311, repulsion piece 601312, leads to ring 601313, swing arm 601314, fan blade 601315, swing arm 601314 is equipped with three, and the head end is connected with axle center 601311 through the lock mode, repulsion piece 601312 is installed in swing arm 601314 end through the registrate mode, fan blade 601315 is equipped with more than two, and even equidistance distributes around axle center 601311, it is circular structure to lead to ring 601313, and installs in the inside outside of driving shaft 60131, repulsion piece 601312 is located and leads to inside ring 601313, can drive fan blade 601315 formation air current when axle center 601311 rotates, and swing arm 601314 follows the rotation, then drives repulsion piece 601312 circulation and removes, when repulsion piece 601312 passes through pressure boost block 60136, has carried out the promotion through the principle of magnetic repulsion.
The driving arm 602 comprises a belt 6021, an injection tube 6022 and an axial center back sleeve 6023, wherein the axial center back sleeve 6023 is arranged at the rear end of the axial center 601311 in a sleeving manner, the bottom of the belt 6021 is engaged with the axial center back sleeve 6023, the injection tube 6022 is arranged inside the driving arm 602, the rear end of the axial center back sleeve 6023 is communicated with the bottom of the injection tube 6022, the belt 6021 is used for driving the axial center back sleeve 6023 to rotate, and the middle part of the axial center back sleeve 6023 is provided with a hollow position so as to be connected with the injection tube 6022, so that the cooling liquid is guided into the weight guiding box 6011.
The bottom of the weight guiding box 6011 is provided with a balancing weight, a dragging effect is formed at the bottom of the weight guiding box 6011 through the gravity principle, and the follow-up rotation of the cutting blade 603 is avoided.
The bottom of the pressurizing block 60136 is provided with a sealing piston, so that a pressure seal can be formed inside the pressurizing tank 60134, and pressurizing and conveying are facilitated.
The repulsive block 601312 and the pressurizing block 60136 are both made of magnetic materials and are designed to repel each other, and when they contact each other, the pressurizing block 60136 is moved by the repulsion of magnetic force, so that the inside of the pressurizing tank 60134 is pressurized by gas.
The principle of the invention is as follows: the cutting work of the cutter 6 can be observed in an enlarged manner by observing the shaft seat 1, the processing turntable 5 is arranged for placing a processed wafer plate, the driving arm 602 is used for driving the cutting blade 603 to rotate, in the processing process, the cutting blade 603 can be effectively cooled by the gravitation cooler 601, the weight guiding box 6011 is used for placing cooling water to play a role in backflow, the left end and the right end of the cutting blade 603 are cooled by the water cooling heads 6012 on two sides, when the driving shaft 60131 rotates, the pressurizing block 60136 is pressurized, wind power can be increased by the internal wind guiding element, the nozzle 60137 is led out from the wind guiding opening 60135, the pressurizing block 60136 is pushed downwards by the thrust generated by magnetic repulsion, intermittent air injection is generated inside the pressurizing groove 60134, the cut chip material is leveled, the falling caused by lifting is avoided, the sliding ball 60132 is used for increasing the sliding performance of the counterweight ring 60133 and the driving shaft 60131, the rotation is avoided, the fan blade 601315 can be driven to form air flow when the shaft center 601311 rotates, the swing arm 601314 rotates along with the rotation, then the repulsion block 601312 is driven to move circularly, when the repulsion block 601312 passes through the pressurizing block 60136, the pushing is carried out through the magnetic repulsion principle, the belt 6021 is used for driving the shaft center back cover 6023 to rotate, the middle part of the shaft center back cover 6023 is provided with a hollow position so as to be connected with the injection pipe 6022, and therefore cooling liquid is guided into the weight guiding box 6011.
The cutter ensures the angle of an gravitation cooler through a weight guiding box, and performs pressurization output on gas through a rotary pressure disc and performs pneumatic operation on the bottom of the cutting piece, thereby solving the problem that the chip raw material is peeled by cooling water in the cutting process, and the water cooling head is designed to be cooled at two sides, effectively avoiding the situation that the chip raw material is washed away by the cooling liquid, and improving the integrity of the cut wafer.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (2)
1. Pneumatic steady semiconductor wafer cutting device based on magnetic pole pressure boost principle, its structure is including observing axle bed (1), moving platform (2), longmen guide frame (3), unable adjustment base (4), processing revolving stage (5), cutterbar (6), its characterized in that:
the processing rotary table (5) is arranged in the middle of the surface of the fixed base (4), the top of the fixed base (4) is provided with a gantry guide frame (3), the bottom of the moving platform (2) is arranged at the upper end of the gantry guide frame (3), the rear end of the observation shaft seat (1) is connected with the front end of the moving platform (2), and the cutter (6) is arranged at the bottom of the observation shaft seat (1);
the cutter (6) comprises an attraction cooler (601), a driving arm (602) and a cutting blade (603), the cutting blade (603) is arranged at the front end of the driving arm (602), and the attraction cooler (601) is arranged in the middle of the upper end of the cutting blade (603);
the gravity cooler (601) comprises a weight guiding box (6011), a water cooling head (6012) and a pressure rotating disc (6013), wherein the water cooling head (6012) is installed at the left end and the right end of the pressure rotating disc (6013), the weight guiding box (6011) is arranged at the bottom of the pressure rotating disc (6013), the two ends of the weight guiding box (6011) are connected with the water cooling head (6012), and the pressure rotating disc (6013) is buckled with the middle part of a cutting disc (603);
the rotary pressure plate (6013) comprises a driving shaft (60131), a sliding ball (60132), a counterweight ring (60133), a pressurizing groove (60134), an air induction port (60135), a pressurizing block (60136) and a nozzle (60137), wherein the nozzle (60137) is arranged at the bottom of a weight guiding box (6011), the air induction port (60135) is arranged at the lower end of the inside of the weight guiding box (6011), the top of the air induction port (60135) is connected with the inside of the driving shaft (60131), the pressurizing groove (60134) is arranged in the middle of the lower end of the weight guiding box (6011), the pressurizing block (60136) is arranged inside the pressurizing groove (60134), the driving shaft (60131) is connected with the pressurizing block (60136), the counterweight ring (60133) is connected with the driving shaft (60131) through the sliding ball (60132), and the inside of the weight guiding box (6011) is connected with the counterweight ring (60133);
the driving shaft (60131) comprises a shaft center (601311), a repulsion block (601312), a guide ring (601313), a swing arm (601314) and fan blades (601315), the swing arm (601314) is connected with the shaft center (601311), the repulsion block (601312) is installed at the tail end of the swing arm (601314), the fan blades (601315) are distributed around the shaft center (601311), the guide ring (601313) is installed on the outer side of the inside of the driving shaft (60131), and the repulsion block (601312) is located inside the guide ring (601313).
2. The pneumatically stabilized semiconductor wafer dicing apparatus according to claim 1, wherein: the driving arm (602) comprises a belt (6021), an injection tube (6022) and an axis back sleeve (6023), wherein the axis back sleeve (6023) is arranged at the rear end of the axis (601311), the bottom of the belt (6021) is connected with the axis back sleeve (6023), the injection tube (6022) is arranged inside the driving arm (602), and the rear end of the axis back sleeve (6023) is communicated with the bottom of the injection tube (6022).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910165888.7A CN109968551B (en) | 2019-03-06 | 2019-03-06 | Pneumatic stable semiconductor wafer cutting device based on magnetic pole pressurization principle |
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| CN201910165888.7A CN109968551B (en) | 2019-03-06 | 2019-03-06 | Pneumatic stable semiconductor wafer cutting device based on magnetic pole pressurization principle |
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| CN109968551B true CN109968551B (en) | 2021-04-09 |
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| CN207503921U (en) * | 2017-09-26 | 2018-06-15 | 合肥新汇成微电子有限公司 | A kind of cutter device of semiconductor crystal wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6705331B2 (en) * | 2000-11-20 | 2004-03-16 | Dainippon Screen Mfg., Co., Ltd. | Substrate cleaning apparatus |
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|---|---|---|---|---|
| CN101590669A (en) * | 2008-05-30 | 2009-12-02 | 株式会社迪思科 | Topping machanism |
| CN203527673U (en) * | 2013-11-15 | 2014-04-09 | 英利能源（中国）有限公司 | Silicon block slicer |
| CN207503921U (en) * | 2017-09-26 | 2018-06-15 | 合肥新汇成微电子有限公司 | A kind of cutter device of semiconductor crystal wafer |
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| CN109968551A (en) | 2019-07-05 |
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Effective date of registration: 20210322 Address after: 314000 West floor, 4-7 floor, building 4, Jiaxing photovoltaic technology innovation park, 1288 Kanghe Road, Gaozhao street, Xiuzhou District, Jiaxing City, Zhejiang Province Applicant after: Zhejiang jichengxing Technology Co.,Ltd. Address before: No.30, Shengda Xinghuo Zhongchuang space, Xingxiu Road, Dongyuan Town, Taiwan investment zone, Quanzhou City, Fujian Province, 362100 Applicant before: Open cloud network science service Co.,Ltd. in Quanzhou |
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Denomination of invention: Semiconductor wafer cutting device based on the principle of magnetic pole pressurization Effective date of registration: 20221116 Granted publication date: 20210409 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing Economic Development Zone sub branch Pledgor: Zhejiang jichengxing Technology Co.,Ltd. Registration number: Y2022330003081 |