CN110450050B

CN110450050B - Clamping and feeding mechanism for adjusting semiconductor silicon rod based on veneering transposition principle

Info

Publication number: CN110450050B
Application number: CN201910592126.5A
Authority: CN
Inventors: 刘良国
Original assignee: Individual
Current assignee: Jiangsu Hongshun Silicon Based Semiconductor Technology Co ltd
Priority date: 2019-07-03
Filing date: 2019-07-03
Publication date: 2020-12-08
Anticipated expiration: 2039-07-03
Also published as: CN110450050A

Abstract

The invention discloses a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on a veneering transposition principle. According to the invention, the silicon rod main body is fixed by the clamping mechanism through the clamping upright post, then the synchronous pull rod is positioned by the parallel guide sleeve, so that the cladding mechanism can be attached to the right side of the silicon rod main body, the flatness of the silicon rod main body can be judged according to the cladding mechanism, and finally the vertical cutting mechanism is driven to synchronously move, so that the real-time adjustment can be realized according to the flatness in the processing process, the timely feeding compensation is realized, the phenomenon that part of the surface area can not be contacted in the polishing and cutting process is effectively avoided, the processing accuracy is improved, and the roundness of the cut silicon wafer is ensured.

Description

Clamping and feeding mechanism for adjusting semiconductor silicon rod based on veneering transposition principle

Technical Field

The invention relates to the field of semiconductors, in particular to a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on a veneering transposition principle.

Background

When the semiconductor silicon wafer is manufactured, the adopted material is a silicon material with the quality meeting the requirements of a semiconductor device, the silicon material is also called a silicon rod, the silicon rod is ground, sliced and polished through equipment to manufacture the silicon wafer, the difference of the surface flatness of the silicon rod caused by various factors of poor incoming materials in the grinding process of the silicon rod is large, the head end and the tail end of the silicon rod need to be divided and fixed through a clamping device, then the silicon rod is driven to rotate by the equipment, and finally the silicon rod is matched with a cutting mechanism to be ground and sliced. The prior art on the market has the following problems in the using process:

in the clamping mechanism in the prior art, only the center of a circle at the head end and the tail end of the silicon rod can be ensured, but the other parts on the surface can not be ensured to be positioned at the center of the circle during polishing, so that the situation that part of the surface area of the cutting mechanism can not be contacted during polishing and cutting can be caused, and therefore, the clamping mechanism capable of quickly adjusting polishing direction feeding is urgently needed to be invented.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on a veneering transposition principle, so as to solve the problem that the clamping mechanism in the prior art can only ensure the center of a circle at the head and tail ends of the silicon rod, but cannot ensure that other parts on the surface are in the position of the circle center during polishing, so that part of the surface area of a cutting mechanism can not be contacted in the polishing and cutting processes, and therefore, the clamping mechanism capable of quickly adjusting the polishing direction feeding is urgently needed to be invented.

In order to achieve the purpose, the invention is realized by the following technical scheme: clamping and feeding mechanism for adjusting semiconductor silicon rods based on veneering transposition principle comprises a fixed ground foot, a host machine, a controller, a vertical arm, a clamping mechanism, a processing platform and a heat dissipation groove, wherein the heat dissipation groove is of a rectangular structure and is installed at the front end of the host machine in an embedding mode, the four corners of the bottom of the host machine are provided with the fixed ground foot, the bottom of the controller is installed at the left end of the surface of the processing platform in an embedding mode, the right end of the surface of the processing platform is provided with two vertical arms, the vertical arms are provided with the clamping mechanism between every two vertical arms and are connected in a buckling mode, the processing platform is of a rectangular structure.

According to the technical scheme, the clamping mechanism comprises a sliding base, two clamping stand columns, parallel guide sleeves, a synchronous pull rod, a cladding mechanism, a silicon rod main body and a vertical cutting mechanism, the two clamping stand columns are respectively connected with a vertical arm, the middle of the sliding base is buckled with the bottom of the vertical cutting mechanism, the right end of the vertical cutting mechanism is connected with the left side of the silicon rod main body, the silicon rod main body is of a cylindrical structure, the head end and the tail end of the silicon rod main body are connected with the tops of the clamping stand columns, the parallel guide sleeves are installed at the lower ends of the clamping stand columns in a buckling mode, the lower ends of the synchronous pull rods are connected with the parallel guide sleeves in a sleeving mode, the cladding mechanism is installed on the left side.

As the further optimization of the technical scheme, the cladding mechanism comprises a matching groove, balls and a linkage block, the rear end of the linkage block is buckled with the synchronous pull rod, the matching groove is formed in the front end of the linkage block and is of an integrated structure, and the three balls are movably arranged in the matching groove in an embedding mode.

As the further optimization of the technical scheme, the vertical cutting mechanism comprises an assembling hole, a limiting slide block, a supporting column and a matched assembly, wherein the limiting slide block is arranged at the left end of the matched assembly and is of an integrated structure, the assembling hole is formed in the upper end of the supporting column and is of an integrated structure, the limiting slide block is buckled with the inner part of the assembling hole, and the inner side of the matched assembly is connected with the left side of the silicon rod main body.

As a further optimization of the technical scheme, the matching assembly comprises a matching main body, a section cutting mechanism, a positioning fan cover and a movable sliding rod, the upper end and the lower end of the movable sliding rod are mounted at the two ends inside the matching main body in a buckling mode, and the section cutting mechanism is connected with the middle of the movable sliding rod through the positioning fan cover.

As the further optimization of the technical scheme, the tangent plane mechanism comprises a co-rotating wheel, a cutting disc and two counter-flow blades, the co-rotating wheel is provided with two counter-flow blades, the two counter-flow blades are arranged on two sides of the middle of the cutting disc respectively and connected with the co-rotating wheel.

As a further optimization of the technical scheme, the upper end and the lower end of the matched main body are respectively provided with a guide rail matched with the movable sliding rod, so that the movable sliding rod is guided to move, and the condition of inclined displacement is avoided.

As the further optimization of this technical scheme, remove the whole magnet material that is of slide bar, and supporting main part left side is equipped with homopolar magnetite, can form the repulsion principle and carry out the outside promotion that removes the slide bar, improve the contact force with the silicon rod main part.

As the further optimization of this technical scheme, be anti-skidding material with the runner outside, can effectively improve the transmission power after contacting with the silicon rod main part, avoid skidding to effective quick drive is blade rotation against the current.

Advantageous effects

The invention adjusts the clamping and feeding mechanism of the semiconductor silicon rod based on the veneering transposition principle, the host is started by the controller, the silicon rod main body is placed on the clamping mechanism for grinding and cutting, the head and the tail ends of the silicon rod main body are fixed by the clamping upright post, the parallel guide sleeves are used for sleeving the synchronous pull rod and can play a role of guiding and moving, the cladding mechanism is used for laminating the right side surface of the silicon rod main body, thereby playing a role of monitoring the surface evenness of the silicon rod main body, when deviation occurs, the cladding mechanism can push the synchronous pull rod to move, further controlling the grinding and cutting position adjustment of the vertical cutting mechanism, eliminating the friction generated when the silicon rod main body is contacted with the matching groove by balls, realizing driving force and reducing resistance, the matched component is used for grinding and cutting the silicon rod main body and is matched and positioned with the assembling hole on the supporting column by the limiting slide block, played fine fixed, the synchronous pull rod of support column connection links, cut the mechanism and process after the contact of silicon rod main part, and can collect the processing sweeps that produces through the location fan housing, through removing the slide bar and repelling with the inside production magnetism of supporting main part, can increase the laminating dynamics of cut the mechanism, with runner and silicon rod main part surface laminating in the course of working through the cutting disc both sides, and drive the linkage of adverse current blade according to the rotation of silicon rod main part, and then produce the adverse current flow and carried out effectual absorption to the sweeps, and collect the emission through the location fan housing.

Based on the prior art, the invention can achieve the following advantages after operation:

fixture passes through the centre gripping stand and fixes the silicon rod main part, then parallel guide pin bushing will synchronous pull rod location, thereby make facing mechanism can laminate with silicon rod main part right side, can judge the roughness of silicon rod main part according to facing mechanism, finally drive and found the mechanism and carry out synchronous motion immediately, ensure to adjust in real time according to the roughness in the course of working, in order to reach timely feeding compensation, effectively avoid polishing the phenomenon that the cutting in-process appears partial face territory and can not arrive, the precision of processing has been improved, ensure the circularity after follow-up silicon chip cutting.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural diagram of a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on a veneering transposition principle.

Fig. 2 is a schematic side view of a clamping mechanism of a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on a veneering transposition principle.

Fig. 3 is a schematic structural diagram of a cladding mechanism of a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on the cladding transposition principle.

Fig. 4 is a schematic structural view of a vertical cutting mechanism of a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on the veneering transposition principle.

Fig. 5 is a perspective view of the internal structure of a matching component of the clamping and feeding mechanism for adjusting the semiconductor silicon rod based on the veneering transposition principle.

Fig. 6 is a schematic structural view of a section mechanism of a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on the principle of surface transposition.

Reference numerals in the drawings indicate: the device comprises a fixed anchor-y 1, a host-y 2, a controller-y 3, a vertical arm-y 4, a clamping mechanism-y 5, a processing platform-y 6, a heat dissipation groove-y 7, a sliding base-y 51, a clamping upright post-y 52, a parallel guide sleeve-y 53, a synchronous pull rod-y 54, a cladding mechanism-y 55, a silicon rod body-y 56, a vertical cutting mechanism-y 57, a matching groove-y 551, a ball-y 552, a linkage block-y 553, an assembly hole-y 571, a limiting slider-y 572, a support column-y 573, a matching component-y 574, a matching body-74 a, a section cutting mechanism-74 b, a positioning fan cover-74 c, a movable slide rod-74 d, a rotating wheel-74 b1, a cutting disc-74 b2 and a counter-flow blade-74 b 3.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.

The upper and lower, inner and outer, front and rear, and left and right in the present invention are referred to with reference to the orientation in fig. 1.

Examples

Referring to fig. 1-6, the present invention provides a clamping and feeding mechanism for adjusting a semiconductor silicon rod based on the facing transposition principle, the structure of the device comprises a fixed anchor y1, a main machine y2, a controller y3, a vertical arm y4, a clamping mechanism y5, a processing platform y6 and a heat dissipation groove y7, wherein the heat dissipation groove y7 is of a rectangular structure, and is installed at the front end of a main machine y2 in an embedding way, four corners of the bottom of the main machine y2 are provided with fixing feet y1, the bottom of the controller y3 is installed at the left end of the surface of a processing platform y6 in an embedded mode, the right end of the surface of the processing platform y6 is provided with two vertical arms y4, clamping mechanisms y5 are arranged between every two vertical arms y4, and are connected by a buckling mode, the processing platform y6 is of a rectangular structure and is arranged at the top of the main machine y2 by a sleeving mode, the main machine y2 is started by the controller y3, and the silicon rod main body y56 is placed on the clamping mechanism y5 for grinding and cutting.

The clamping mechanism y5 comprises a sliding base y51, a clamping upright post y52, two parallel guide sleeves y53, a synchronous pull rod y54, a cladding mechanism y55, a silicon rod body y56 and a vertical cutting mechanism y57, wherein the clamping upright post y52 is connected with the vertical arm y4, the middle part of the sliding base y51 is buckled with the bottom part of the vertical cutting mechanism y57, the right end of the vertical cutting mechanism y57 is connected with the left side of the silicon rod body y56, the silicon rod body y56 is a cylindrical structure, the head end and the tail end of the silicon rod body y52 are connected, the parallel guide sleeve y53 is installed at the lower end of the clamping upright post y52 in a buckling mode, the lower end of the synchronous pull rod y54 is connected with the parallel guide sleeves y53 in a sleeving mode, the cladding mechanism y55 is installed at the left side of the upper end of the synchronous pull rod y54 in a buckling mode, the right side of the silicon rod body y54 is connected with the cladding mechanism y54, the head end and the tail end of, parallel guide pin bushing y53 is used for registrating synchronous pull rod y54, and can play the effect of guide movement, and cladding mechanism y55 is used for laminating silicon rod main part y56 right side surface to play the efficiency of silicon rod main part y56 surface smoothness control, when the deviation appears, cladding mechanism y55 can promote synchronous pull rod y54 and remove, and then the adjustment of the cutting position of polishing of control vertical cutting mechanism y 57.

The cladding mechanism y55 comprises a matching groove y551, a ball y552 and a linkage block y553, the rear end of the linkage block y553 is buckled with the synchronous pull rod y54, the matching groove y551 is arranged at the front end of the linkage block y553 and is an integrated structure, the number of the balls y552 is three, the balls y552 are movably arranged in the matching groove y551 in an embedding mode, friction generated when the silicon rod body y56 is in contact with the matching groove y551 can be eliminated through the ball y552, and pushing force and resistance can be achieved and reduced.

The vertical cutting mechanism y57 comprises an assembly hole y571, a limit slider y572, a support column y573 and a matching component y574, the limit slider y572 is arranged at the left end of the matching component y574 and is of an integrated structure, the assembly hole y571 is arranged at the upper end of the support column y573 and is of an integrated structure, the limit slider y572 is buckled with the inner part of the assembly hole y571, the inner side of the matching component y574 is connected with the left side of the silicon rod body y56, the matching component y574 is used for grinding and cutting the silicon rod body y56, the limit slider y572 is matched and positioned with the assembly hole y571 on the support column y573, good fixation is achieved, and the support column y573 is connected with the synchronous pull rod y54 for linkage.

The matching component y574 comprises a matching main body 74a, a tangent plane mechanism 74b, a positioning fan cover 74c and a movable sliding rod 74d, the upper end and the lower end of the movable sliding rod 74d are mounted at the two ends of the inside of the matching main body 74a in a buckling mode, the tangent plane mechanism 74b is connected with the middle of the movable sliding rod 74d through the positioning fan cover 74c, the tangent plane mechanism 74b is in contact with the silicon rod main body y56 and then processed, waste scraps generated in processing can be collected and processed through the positioning fan cover 74c, and magnetic repulsion is generated inside the movable sliding rod 74d and the matching main body 74a, so that the bonding strength of the tangent plane mechanism 74b can be increased.

The section cutting mechanism 74b comprises two same rotating wheels 74b1, a cutting disc 74b2 and counter-flow blades 74b3, the two same rotating wheels 74b1 are installed on two sides of the cutting disc 74b2 in a buckling mode, the counter-flow blades 74b3 are respectively arranged on two sides of the middle of the cutting disc 74b2, the counter-flow blades 74b3 are connected with the same rotating wheels 74b1, the same rotating wheels 74b1 on two sides of the cutting disc 74b2 are attached to the surface of the silicon rod body y56 in the machining process, the counter-flow blades 74b3 are driven to be linked according to the rotation of the silicon rod body y56, and then counter-flow is generated to effectively absorb waste chips and is collected and discharged through a positioning fan cover 74 c.

The upper and lower ends of the mating body 74a are respectively provided with a guide rail which is matched with the movable sliding rod 74d, so as to guide the movable sliding rod 74d to move, and avoid the condition of inclined displacement.

The movable slide bar 74d is made of a magnet material, and a homopolar magnet is arranged on the left side of the matching main body 74a, so that the repulsion principle can be formed to push the movable slide bar 74d outwards, and the contact force with the silicon rod main body y56 is improved.

The outer side of the same rotating wheel 74b1 is made of anti-skidding materials, transmission force can be effectively improved after the same rotating wheel is in contact with the silicon rod main body y56, slipping is avoided, and therefore the counter-flow blades 74b3 are effectively and quickly driven to rotate.

The principle of the invention is as follows: the main machine y2 is started through the controller y3, the silicon rod body y56 is placed on the clamping mechanism y5 to be ground and cut, the head end and the tail end of the silicon rod body y56 are fixed through the clamping upright post y52, the parallel guide sleeve y53 is used for sleeving the synchronous pull rod y54 and can play a role in guiding and moving, the facing mechanism y55 is used for attaching the right side surface of the silicon rod body y56, so that the effect of monitoring the surface flatness of the silicon rod body y56 is achieved, when deviation occurs, the facing mechanism y55 can push the synchronous pull rod y54 to move, further the grinding and cutting position adjustment of the vertical cutting mechanism y57 is controlled, friction generated when the silicon rod body y56 is in contact with the matching groove y574 can be avoided through the ball y552, pushing force can be achieved and resistance can be reduced, the matching component y55 is used for grinding and cutting the silicon rod body y56, and is matched and positioned with the assembling hole y573 on the y supporting column through the limiting slide block y552, the silicon rod cutting mechanism has the advantages that good fixation is achieved, the supporting column y573 is connected with the synchronous pull rod y54 to be linked, the section cutting mechanism 74b is contacted with the silicon rod body y56 to be processed, waste chips generated in processing can be collected and processed through the positioning fan cover 74c, magnetic repulsion is generated between the movable slide rod 74d and the matching body 74a, the attaching force of the section cutting mechanism 74b can be increased, the same rotating wheels 74b1 on the two sides of the cutting disc 74b2 are attached to the surface of the silicon rod body y56 in the processing process, the countercurrent blades 74b3 are driven to be linked according to rotation of the silicon rod body y56, countercurrent flow is generated, the waste chips are effectively absorbed, and the waste chips are collected and discharged through the positioning fan cover 74 c.

The invention solves the problem that the clamping mechanism in the prior art can only ensure the center of a circle at the head end and the tail end of a silicon rod, but cannot ensure that other parts on the surface are positioned at the center of a circle during polishing, so that part of surface area can not be contacted in the polishing and cutting process of the cutting mechanism, and therefore, the clamping mechanism capable of quickly adjusting the feeding of the polishing direction is urgently needed to be invented.

While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The clamping and feeding mechanism for adjusting the semiconductor silicon rods based on the veneering transposition principle structurally comprises a fixed anchor (y1), a host (y2), a controller (y3), a vertical arm (y4), a clamping mechanism (y5), a processing platform (y6) and a heat dissipation groove (y7), wherein the heat dissipation groove (y7) is installed at the front end of the host (y2), the fixed anchor (y1) is arranged at the bottom corner of the host (y2), the bottom of the controller (y3) is installed at the left end of the surface of the processing platform (y6), two vertical arms (y4) are arranged at the right end of the surface of the processing platform (y6), a clamping mechanism (y5) is arranged between every two vertical arms (y4), and the processing platform (y6) is installed at the top of the host (y 2);

the clamping mechanism (y5) comprises a sliding base (y51), a clamping upright post (y52), a parallel guide sleeve (y53), a synchronous pull rod (y54), a cladding mechanism (y55), a silicon rod body (y56) and a vertical cutting mechanism (y57), wherein the clamping upright post (y52) is respectively connected with a vertical arm (y4), the middle part of the sliding base (y51) is buckled with the bottom part of the vertical cutting mechanism (y57), the right end of the vertical cutting mechanism (y57) is connected with the silicon rod body (y56), the silicon rod body (y56) is connected with the top part of the clamping upright post (y52), the parallel guide sleeve (y53) is installed at the lower end of the clamping upright post (y52), the lower end of the synchronous pull rod (y54) is connected with the parallel guide sleeve (y 5739) in a sleeving manner, the cladding mechanism (y55) is installed at the left side of the upper end of the synchronous pull rod (y54), and the right side of the silicon rod body (y 6353) is connected with the left side;

the facing mechanism (y55) comprises a matching groove (y551), a ball (y552) and a linkage block (y553), the rear end of the linkage block (y553) is buckled with the synchronous pull rod (y54), the matching groove (y551) is arranged at the front end of the linkage block (y553), and the ball (y552) is arranged in the matching groove (y 551);

the vertical cutting mechanism (y57) comprises an assembling hole (y571), a limiting slider (y572), a supporting column (y573) and a matching component (y574), the limiting slider (y572) is arranged at the left end of the matching component (y574) and is of an integrated structure, the assembling hole (y571) is arranged at the upper end of the supporting column (y573) and is of an integrated structure, the limiting slider (y572) is buckled with the inner part of the assembling hole (y571), and the inner side of the matching component (y574) is connected with the left side of the silicon rod main body (y 56);

the matching assembly (y574) comprises a matching main body (74a), a tangent plane mechanism (74b), a positioning fan cover (74c) and a movable sliding rod (74d), wherein the upper end and the lower end of the movable sliding rod (74d) are arranged at the two ends of the inner part of the matching main body (74a) in a buckling mode, and the tangent plane mechanism (74b) is connected with the middle part of the movable sliding rod (74d) through the positioning fan cover (74 c);

the section cutting mechanism (74b) comprises two same rotating wheels (74b1), a cutting disc (74b2) and counter-flow blades (74b3), the two same rotating wheels (74b1) are arranged on two sides of the cutting disc (74b2) in a buckling mode, the counter-flow blades (74b3) are arranged on two sides of the middle of the cutting disc (74b2) respectively, and the counter-flow blades (74b3) are connected with the same rotating wheels (74b 1);

the main machine (y2) is started through the controller (y3), the silicon rod main body (y56) is placed on the clamping mechanism (y5) to be ground and cut, the head end and the tail end of the silicon rod main body (y56) are fixed through the clamping upright post (y52), the parallel guide sleeve (y53) is used for sleeving the synchronous pull rod (y54) and can play a role in guiding and moving, the cladding mechanism (y55) is used for laminating the right side surface of the silicon rod main body (y56), so that the effect of monitoring the surface flatness of the silicon rod main body (y56) is achieved, when deviation occurs, the cladding mechanism (y55) can push the synchronous pull rod (y54) to move, further the grinding and cutting position adjustment of the vertical cutting mechanism (y57) is controlled, friction generated when the silicon rod main body (y56) is in contact with the matching groove (y551) can be avoided through the ball (y552), the driving force can be achieved in a matched mode, the resistance can be reduced, and the silicon rod (y574) can be used for grinding and cutting main body (y56, the limiting sliding block (y572) is matched and positioned with the assembling hole (y571) on the supporting column (y573) to achieve good fixation, the supporting column (y573) is connected with the synchronous pull rod (y54) to be linked, the section cutting mechanism (74b) is contacted with the silicon rod body (y56) to be processed, and the positioning fan cover (74c) can collect and process the scraps generated in the processing, the joint force of the section cutting mechanism (74b) can be increased by moving the sliding rod (74d) to generate magnetic repulsion with the inside of the matched main body (74a), by the same rotating wheels (74b1) at the two sides of the cutting disc (74b2) being jointed with the surface of the silicon rod main body (y56) in the processing process, and drives the counter flow blades (74b3) to be linked according to the rotation of the silicon rod main body (y56), thereby generating an upwind flow to effectively absorb the waste scraps, and collecting and discharging the waste scraps through the positioning air cover (74 c).