CN110450050A - Grip(per) feed mechanism based on veneer Transposition Principle adjustment semiconductor silicon rod - Google Patents

Grip(per) feed mechanism based on veneer Transposition Principle adjustment semiconductor silicon rod Download PDF

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Publication number
CN110450050A
CN110450050A CN201910592126.5A CN201910592126A CN110450050A CN 110450050 A CN110450050 A CN 110450050A CN 201910592126 A CN201910592126 A CN 201910592126A CN 110450050 A CN110450050 A CN 110450050A
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CN
China
Prior art keywords
silicon rod
main body
clad
veneer
rod main
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Granted
Application number
CN201910592126.5A
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Chinese (zh)
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CN110450050B (en
Inventor
刘良国
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Jiangsu Hongshun Silicon Based Semiconductor Technology Co ltd
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Individual
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Priority to CN201910592126.5A priority Critical patent/CN110450050B/en
Publication of CN110450050A publication Critical patent/CN110450050A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention discloses the grip(per) feed mechanism based on veneer Transposition Principle adjustment semiconductor silicon rod, structure includes fixed lower margin, host, controller, armstand, clamping device, processing platform, radiating groove.Silicon rod main body is fixed by clamping column for clamping device of the present invention, then parallel guide sleeve positions Synchronous pull rod, to enable to be bonded on the right side of clad can mechanism and silicon rod main body, the flatness of silicon rod main body can be judged according to clad can mechanism, it is final that sets up cutting machine structure is driven to synchronize movement, ensure to be adjusted in real time according to flatness in process, to reach timely feed compensation, effectively avoid the phenomenon that part face domain does not reach occur in polishing cutting process, improve the precision of processing, it is ensured that the circularity after subsequent silicon wafer cutting.

Description

Grip(per) feed mechanism based on veneer Transposition Principle adjustment semiconductor silicon rod
Technical field
The present invention relates to semiconductor fields, particularly with regard to the clamping based on veneer Transposition Principle adjustment semiconductor silicon rod Feed mechanism.
Background technique
When making semi-conductor silicon chip, the material of use is the silicon materials that a kind of quality meets semiconductor devices requirement, Referred to as silicon rod polishes to silicon rod by equipment, is sliced, being polished so that silicon wafer is made, and silicon rod is in the grinding process due to coming Expect that silicon rod surface smoothness caused by undesirable various factors differs greatly, needs the head and the tail both ends by clamping device to silicon rod A point middle fixation is carried out, drive rotation is then carried out by equipment again, it is final that cutting mechanism is cooperated to carry out polishing slice.It is existing on the market There is such problems in use in technology:
In the center of circle point of the clamping device of existing technology due to that can only ensure silicon rod head and the tail both ends, but it cannot be guaranteed surface Other positions polishing when be in center location, cause cutting mechanism polishing cutting process in will appear part face domain contact Less than the case where, therefore be badly in need of inventing a kind of clamping device that can quickly adjust the feeding of polishing orientation.
Summary of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide adjust semiconductor silicon rod based on veneer Transposition Principle Grip(per) feed mechanism, to solve in the center of circle point of the clamping device of existing technology due to that can only ensure silicon rod head and the tail both ends, still It is impossible to ensure that other positions on surface are in center location in polishing, cause cutting mechanism that can go out in polishing cutting process Not the case where now part face domain does not reach, therefore it is badly in need of inventing a kind of clamping device that can quickly adjust the feeding of polishing orientation Problem.
To achieve the goals above, the present invention is to realize by the following technical solutions: based on veneer Transposition Principle tune The grip(per) feed mechanism of whole semiconductor silicon rod, structure include fixed lower margin, host, controller, armstand, clamping device, processing Platform, radiating groove, radiating groove are rectangular configuration, and are installed on host front end by embedded mode, and host bottom four corners are equipped with solid Determine lower margin, controller bottom is installed on processing platform surface left end by embedded mode, there are two processing platform surface right end is set Armstand, armstand is equipped with clamping device between any two, and is connected by manner, and processing platform is rectangular configuration, and is passed through Fitting mode is installed at the top of host.
As advanced optimizing for the technical program, clamping device includes sliding pedestal, clamping column, parallel guide sleeve, same Pull rod, clad can mechanism, silicon rod main body, sets up cutting machine structure are walked, clamping column and is connected respectively with armstand there are two setting, slides bottom Seat middle part is interlocked with sets up cutting machine structure bottom, is connected on the left of sets up cutting machine structure right end and silicon rod main body, silicon rod main body is cylindrical shape Structure, and be connected at the top of head and the tail both ends and clamping column, parallel guide sleeve is installed on clamping column lower end by manner, together Step pull rod lower end is connected with parallel guide sleeve fitting, and clad can mechanism is installed on the left of Synchronous pull rod upper end by manner, silicon rod It is connected on the left of main body right side and clad can mechanism.
As advanced optimizing for the technical program, clad can mechanism includes matching slot, ball, linkage block, linkage block rear end It is interlocked with Synchronous pull rod, matching slot is set to linkage block front end, and is integrated, and there are three ball is set, and passes through insertion Mode is movably installed in inside matching slot.
As advanced optimizing for the technical program, sets up cutting machine structure includes assembly hole, position limiting slide block, support column, mating group Part, matching component left end is equipped with position limiting slide block, and is integrated, and assembly hole is set to upper end of support column, and is integration knot It is interlocked inside structure, position limiting slide block and assembly hole, is connected on the inside of matching component on the left of silicon rod main body.
As advanced optimizing for the technical program, matching component includes mating main body, noodle cutting mechanism, positioning fan housing, moves Moving slide-bar, mobile slide bar upper and lower ends are installed on mating body interior both ends by manner, and noodle cutting mechanism passes through positioning wind It is connected in the middle part of cover and mobile slide bar.
As advanced optimizing for the technical program, noodle cutting mechanism includes same runner, cutting disc, adverse current blade, is set with runner There are two, and cutting disc two sides are installed on by manner, cutting disc on both sides of the middle is respectively equipped with adverse current blade, adverse current blade and same Runner is connected.
As advanced optimizing for the technical program, mating main body upper and lower ends are respectively equipped with to be led with what mobile slide bar cooperated Rail, the case where in order to guide mobile slide bar to be moved, avoid the occurrence of tilt displacement.
As advanced optimizing for the technical program, mobile slide bar generally magnet material, and be equipped on the left of mating main body Homopolarity magnetite is capable of forming principle of repelling each other and carries out pushing out for mobile slide bar, improves and the contact dynamics of silicon rod main body.
As advanced optimizing for the technical program, be on the outside of runner can after anti-skidding material, with silicon rod body contact Driving force is effectively improved, avoids skidding, to fast and effectively drive the rotation of adverse current blade.
Beneficial effect
The present invention is based on the grip(per) feed mechanisms of veneer Transposition Principle adjustment semiconductor silicon rod, are started by controller and are led Silicon rod main body is placed on clamping device and carries out polishing cutting by machine, is carried out silicon rod main body head and the tail both ends by clamping column Fixed, parallel conductive set can play the role of guiding movement for Synchronous pull rod to be carried out fitting, and clad can mechanism is used for silicon Stick main body right lateral surface is bonded, thus the effect of playing the monitoring of silicon rod body surfaces flatness, when there is deviation, clad can Mechanism can push Synchronous pull rod to be moved, and then control the polishing cutting position adjustment of sets up cutting machine structure, can by ball Prevent the friction generated when silicon rod main body is contacted with matching slot, can either realize that motive force can reduce resistance, matching component again For carrying out polishing cutting to silicon rod main body, and cooperation positioning is carried out by the assembly hole on position limiting slide block and support column, played Good fixation, support column connection Synchronous pull rod link, are processed after noodle cutting mechanism and silicon rod body contact, and lead to The scrap that processing can be generated by crossing positioning fan housing is collected processing, is generated by mobile slide bar and mating body interior magnetic Repel each other, the fitting dynamics of noodle cutting mechanism can be increased, by the same runners of cutting disc two sides in process with silicon rod body table Face paste is closed, and drives the linkage of adverse current blade according to the rotation of silicon rod main body, and then is generated contrary wind flow and carried out effectively to scrap Absorption, and by position fan housing be collected discharge.
For the prior art, there is accessible advantage after operation of the present invention:
Silicon rod main body is fixed by clamping column for clamping device, and then parallel guide sleeve positions Synchronous pull rod, from And enable to be bonded on the right side of clad can mechanism and silicon rod main body, the flatness of silicon rod main body can be judged according to clad can mechanism, finally Drive sets up cutting machine structure to synchronize movement, it is ensured that can be adjusted in real time according to flatness in process, to reach and When feed compensation, effectively avoid polishing cutting process in there is the phenomenon that part face domain does not reach, improve the essence of processing Accuracy, it is ensured that the circularity after subsequent silicon wafer cutting.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention, Objects and advantages will become more apparent upon:
Fig. 1 is the structural schematic diagram that the grip(per) feed mechanism of semiconductor silicon rod is adjusted the present invention is based on veneer Transposition Principle.
Fig. 2 is the clamping device side view that the grip(per) feed mechanism of semiconductor silicon rod is adjusted the present invention is based on veneer Transposition Principle Structural schematic diagram.
Fig. 3 is the clad can mechanism structure that the grip(per) feed mechanism of semiconductor silicon rod is adjusted the present invention is based on veneer Transposition Principle Schematic diagram.
Fig. 4 is the sets up cutting machine structure structure that the grip(per) feed mechanism of semiconductor silicon rod is adjusted the present invention is based on veneer Transposition Principle Schematic diagram.
Fig. 5 is inside the matching component for the grip(per) feed mechanism for adjusting semiconductor silicon rod the present invention is based on veneer Transposition Principle Structural perspective.
Fig. 6 is the noodle cutting mechanism structure that the grip(per) feed mechanism of semiconductor silicon rod is adjusted the present invention is based on veneer Transposition Principle Schematic diagram.
Numbering in the drawing explanation: fixed lower margin-y1, host-y2, controller-y3, armstand-y4, clamping device-y5, processing Platform-y6, radiating groove-y7, pedestal-y51, clamping column-y52, parallel guide sleeve-y53, Synchronous pull rod-y54, surface coating machine are slided Structure-y55, silicon rod main body-y56, sets up cutting machine structure-y57, matching slot-y551, ball-y552, linkage block-y553, assembly hole- Y571, position limiting slide block-y572, support column-y573, matching component-y574, mating main body -74a, noodle cutting mechanism -74b, positioning wind Cover -74c, mobile slide bar -74d, same to runner -74b1, cutting disc -74b2, adverse current blade -74b3.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to Specific embodiment and Detailed description of the invention, the preferred embodiment that the present invention is further explained.
Be previously mentioned in the present invention up and down, inside and outside, front and back and left and right on the basis of the orientation in Fig. 1.
Embodiment
Fig. 1-Fig. 6 is please referred to, the present invention provides the grip(per) feed mechanism based on veneer Transposition Principle adjustment semiconductor silicon rod, Its structure includes fixed lower margin y1, host y2, controller y3, armstand y4, clamping device y5, processing platform y6, radiating groove y7, institute Stating radiating groove y7 is rectangular configuration, and is installed on the front end host y2 by embedded mode, and the host y2 bottom four corners are equipped with solid Determine lower margin y1, the bottom the controller y3 is installed on the surface processing platform y6 left end, the processing platform y6 by embedded mode Surface right end is set there are two armstand y4, and the armstand y4 is equipped with clamping device y5 between any two, and is connected by manner, The processing platform y6 is rectangular configuration, and is installed at the top of host y2 by fitting mode, starts host by controller y3 Silicon rod main body y56 is placed on clamping device y5 and carries out polishing cutting by y2.
The clamping device y5 includes sliding pedestal y51, clamping column y52, parallel guide sleeve y53, Synchronous pull rod y54, covering Face mechanism y55, silicon rod main body y56, sets up cutting machine structure y57 there are two the clamping column y52 is set, and are connected with armstand y4 respectively It connects, described slide is interlocked in the middle part of pedestal y51 with the bottom sets up cutting machine structure y57, the sets up cutting machine structure y57 right end and silicon rod main body It is connected on the left of y56, the silicon rod main body y56 is columnar structured, and is connected at the top of head and the tail both ends and clamping column y52, The parallel guide sleeve y53 is installed on the clamping lower end column y52, the lower end the Synchronous pull rod y54 and parallel conductive by manner The connection of y53 fitting is covered, the clad can mechanism y55 is installed on the left of the upper end Synchronous pull rod y54 by manner, the silicon rod master It is connected on the right side of body y56 with the left side clad can mechanism y55, is consolidated silicon rod main body y56 head and the tail both ends by clamping column y52 Fixed, parallel guide sleeve y53 is used to Synchronous pull rod y54 carrying out fitting, and can play the role of guiding movement, clad can mechanism y55 For being bonded to silicon rod main body y56 right lateral surface, thus the effect of playing the monitoring of silicon rod main body y56 surface smoothness, when When there is deviation, clad can mechanism y55 can push Synchronous pull rod y54 to be moved, and then the polishing for controlling sets up cutting machine structure y57 is cut Cut position adjustment.
The clad can mechanism y55 includes matching slot y551, ball y552, the rear end linkage block y553, the linkage block y553 It is interlocked with Synchronous pull rod y54, the matching slot y551 is set to the front end linkage block y553, and is integrated, the ball It there are three y552 is set, and is movably installed in inside matching slot y551 by embedded mode, silicon rod can be prevented by ball y552 The friction that main body y56 and matching slot y551 are generated when contacting, can either realize that motive force can reduce resistance again.
The sets up cutting machine structure y57 includes assembly hole y571, position limiting slide block y572, support column y573, matching component y574, institute The left end matching component y574 is stated equipped with position limiting slide block y572, and is integrated, the assembly hole y571 is set to support column The upper end y573, and be integrated, it is interlocked inside the position limiting slide block y572 and assembly hole y571, the matching component It is connected on the inside of y574 on the left of silicon rod main body y56, matching component y574 is used to carry out polishing cutting to silicon rod main body y56, and Cooperation positioning is carried out by the assembly hole y571 on position limiting slide block y572 and support column y573, plays good fixation, is supported Column y573 connection Synchronous pull rod y54 links.
The matching component y574 includes mating main body 74a, noodle cutting mechanism 74b, positions fan housing 74c, mobile slide bar 74d, The mobile slide bar 74d upper and lower ends are installed on both ends inside mating main body 74a, the noodle cutting mechanism 74b by manner By being connected in the middle part of positioning fan housing 74c and mobile slide bar 74d, noodle cutting mechanism 74b is added after contacting with silicon rod main body y56 Work, and processing is collected by the scrap that positioning fan housing 74c can generate processing, pass through mobile slide bar 74d and mating master Magnetism is generated inside body 74a to repel each other, and can increase the fitting dynamics of noodle cutting mechanism 74b.
The noodle cutting mechanism 74b includes same runner 74b1, cutting disc 74b2, adverse current blade 74b3, and the same runner 74b1 is set There are two, and the two sides cutting disc 74b2 are installed on by manner, the cutting disc 74b2 on both sides of the middle is respectively equipped with adverse current blade 74b3, the adverse current blade 74b3 are connected with same runner 74b1, by the same runner 74b1 of the two sides cutting disc 74b2 processed The fitting of the Cheng Zhongyu silicon rod surface main body y56, and adverse current blade 74b3 linkage is driven according to the rotation of silicon rod main body y56, and then produce Raw contrary wind flow has carried out effective absorption to scrap, and is collected discharge by positioning fan housing 74c.
The mating main body 74a upper and lower ends are respectively equipped with the guide rail with mobile slide bar 74d cooperation, in order to guide movement The case where slide bar 74d is moved, is avoided the occurrence of tilt displacement.
The mobile slide bar 74d generally magnet material, and homopolarity magnetite is equipped on the left of mating main body 74a, it is capable of forming Principle of repelling each other carries out pushing out for mobile slide bar 74d, improves and the contact dynamics of silicon rod main body y56.
It is anti-skidding material on the outside of the same runner 74b1, driving force can be effectively improved after contacting with silicon rod main body y56, kept away Exempt to skid, to fast and effectively drive adverse current blade 74b3 rotation.
The principle of the present invention: host y2 is started by controller y3, it is enterprising that silicon rod main body y56 is placed on clamping device y5 Silicon rod main body y56 head and the tail both ends are fixed by clamping column y52 for row polishing cutting, and parallel guide sleeve y53 will be for that will synchronize Pull rod y54 carries out fitting, and can play the role of guiding movement, and clad can mechanism y55 is used for silicon rod main body y56 right lateral surface It is bonded, thus the effect of playing the monitoring of silicon rod main body y56 surface smoothness, when there is deviation, clad can mechanism y55 can It pushes Synchronous pull rod y54 to be moved, and then controls the polishing cutting position adjustment of sets up cutting machine structure y57, pass through ball y552 energy Enough prevent the friction generated when silicon rod main body y56 and matching slot y551 is contacted, can either realize that motive force can reduce resistance again, Matching component y574 is used to carry out silicon rod main body y56 polishing cutting, and by position limiting slide block y572 and support column y573 Assembly hole y571 carries out cooperation positioning, plays good fixation, and support column y573 connection Synchronous pull rod y54 links, cuts Mechanism 74b in face is processed after contacting with silicon rod main body y56, and by positioning fan housing 74c can to processing generate scrap into Row collection processing is repelled each other by generating magnetism inside mobile slide bar 74d and mating main body 74a, can increase noodle cutting mechanism 74b's Fitting dynamics is bonded with the surface silicon rod main body y56 in process by the same runner 74b1 of the two sides cutting disc 74b2, and according to The rotation of silicon rod main body y56 drives adverse current blade 74b3 linkage, and then generates contrary wind flow and carried out effective absorption to scrap, And discharge is collected by positioning fan housing 74c.
Problems solved by the invention is in the center of circle point of the clamping device of existing technology due to that can only ensure silicon rod head and the tail both ends, But cannot be guaranteed that other positions on surface are in center location in polishing, cause cutting mechanism in polishing cutting process It will appear the case where part face domain does not reach, therefore be badly in need of inventing a kind of clamping machine that can quickly adjust the feeding of polishing orientation Structure, the present invention are combined with each other by above-mentioned component, effectively avoid occurring what part face domain did not reached in polishing cutting process Phenomenon improves the precision of processing, it is ensured that the circularity after subsequent silicon wafer cutting.
The basic principles, main features and advantages of the present invention have been shown and described above, the technology of the industry Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this The principle of invention can not only be realized in other specific forms under the premise of not departing from spirit of that invention or essential characteristic The present invention will also have various changes and improvements, these changes and improvements both fall within scope of the claimed invention, therefore this hair Bright claimed range is defined by appended claims and its equivalent, rather than above description limits.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiments being understood that.

Claims (3)

1. structure includes fixed lower margin (y1), master based on the grip(per) feed mechanism of veneer Transposition Principle adjustment semiconductor silicon rod Machine (y2), controller (y3), armstand (y4), clamping device (y5), processing platform (y6), radiating groove (y7), it is characterised in that:
The radiating groove (y7) is installed on the front end host (y2), and host (y2) bottom corner is equipped with fixed lower margin (y1), described The bottom controller (y3) is installed on the surface left end processing platform (y6), and processing platform (y6) surface right end sets that there are two armstands (y4), the armstand (y4) is equipped with clamping device (y5) between any two, and the processing platform (y6) is installed at the top of host (y2).
2. the grip(per) feed mechanism according to claim 1 based on veneer Transposition Principle adjustment semiconductor silicon rod, feature Be: the clamping device (y5) includes sliding pedestal (y51), clamping column (y52), parallel guide sleeve (y53), Synchronous pull rod (y54), clad can mechanism (y55), silicon rod main body (y56), sets up cutting machine structure (y57), the clamping column (y52) respectively with armstand (y4) it is connected, described slide is interlocked in the middle part of pedestal (y51) with the bottom sets up cutting machine structure (y57), and the sets up cutting machine structure (y57) is right End is connected with silicon rod main body (y56), is connected at the top of the silicon rod main body (y56) and clamping column (y52), the parallel conductive Set (y53) is installed on clamping lower end column (y52), and the Synchronous pull rod lower end (y54) is connected with parallel guide sleeve (y53) fitting, The clad can mechanism (y55) is installed on the left of the upper end Synchronous pull rod (y54), silicon rod main body (y56) right side and clad can mechanism (y55) left side is connected.
3. the grip(per) feed mechanism according to claim 2 based on veneer Transposition Principle adjustment semiconductor silicon rod, feature Be: the clad can mechanism (y55) includes matching slot (y551), ball (y552), linkage block (y553), the linkage block (y553) rear end is interlocked with Synchronous pull rod (y54), and the matching slot (y551) is set to the front end linkage block (y553), the ball (y552) it is internal to be installed on matching slot (y551).
CN201910592126.5A 2019-07-03 2019-07-03 Clamping and feeding mechanism for adjusting semiconductor silicon rod based on veneering transposition principle Active CN110450050B (en)

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CN201910592126.5A CN110450050B (en) 2019-07-03 2019-07-03 Clamping and feeding mechanism for adjusting semiconductor silicon rod based on veneering transposition principle

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CN201910592126.5A CN110450050B (en) 2019-07-03 2019-07-03 Clamping and feeding mechanism for adjusting semiconductor silicon rod based on veneering transposition principle

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CN110450050B CN110450050B (en) 2020-12-08

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US20160031060A1 (en) * 2013-02-21 2016-02-04 Supfina Grieshaber Gmbh & Co. Kg Device and system for finish-machining a workpiece in the form of a crankshaft or a camshaft
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CN106078428A (en) * 2016-08-19 2016-11-09 王朝永 A kind of bend pipe buffing machine
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CN208483620U (en) * 2018-06-15 2019-02-12 重庆伟福机械有限公司 Crankshaft grinding machine grinding wheel adjusts device
CN108818284A (en) * 2018-08-20 2018-11-16 安徽全柴动力股份有限公司 A kind of use for diesel engine crankshaft burnishing device and polishing method
CN109732140A (en) * 2018-11-13 2019-05-10 广州市水电设备安装有限公司 A kind of safe copper pipe cutter of good positioning effect
CN109623609A (en) * 2018-12-13 2019-04-16 陈壮壮 A kind of abnormal shape round tube metal surface treating apparatus

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