CN109968551A - Principle pneumatically stable semiconductor crystal wafer cutter device is pressurized based on magnetic pole - Google Patents
Principle pneumatically stable semiconductor crystal wafer cutter device is pressurized based on magnetic pole Download PDFInfo
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- CN109968551A CN109968551A CN201910165888.7A CN201910165888A CN109968551A CN 109968551 A CN109968551 A CN 109968551A CN 201910165888 A CN201910165888 A CN 201910165888A CN 109968551 A CN109968551 A CN 109968551A
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- Prior art keywords
- magnetic pole
- pneumatically
- axle center
- semiconductor crystal
- weight box
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- 239000013078 crystal Substances 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 50
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 239000002994 raw material Substances 0.000 abstract description 13
- 239000002826 coolant Substances 0.000 abstract description 11
- 239000007788 liquid Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000005389 magnetism Effects 0.000 description 4
- 239000010454 slate Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000001846 repelling effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses be pressurized principle pneumatically stable semiconductor crystal wafer cutter device based on magnetic pole, its structure includes observation axle bed, mobile platform, gantry saddle, firm banking, processing turntable, cutter, it processes turntable and firm banking surface middle part is installed on by manner, firm banking top rear is equipped with gantry saddle, and mobile platform bottom is installed on gantry saddle upper end by manner.Cutter of the present invention ensure that the angle of gravitation cooler by drawing weight box, and the pressurization that gas carries out is exported by turning platen, and the bottom of cutting sheet is carried out pneumatic, to solve the problems, such as to occur in cutting process the cooled water removing of chip raw material, and water-cooling head is designed as two sides cooling, the case where chip raw material is washed away by coolant liquid is effectively prevented, the integrality after improving wafer cutting.
Description
Technical field
The present invention relates to semiconductor fields, are pressurized principle pneumatically stable semiconductor crystal wafer particularly with regard to based on magnetic pole
Cutter device.
Background technique
Wafer refers to silicon semiconductor integrated circuit production silicon wafer used, since its shape is circle, therefore referred to as wafer,
Wafer is the basic material for manufacturing semiconductor chip, when manufacture, obtains silicon crystal slate by very long long brilliant process, using cutting
Section, barreling, slice, chamfering, polishing, laser incising separate silicon wafer with plate, become the chip raw material of IC works.City
Such problems is deposited in existing wafer cutting device use process on face:
Existing technology passes through transverse cuts, the chip raw material on silicon crystal slate is separated with plate body, to extract, due to mesh
Before generally use coolant liquid and carry out directly cooling chip raw material to reach the cooling of cutting sheet, after leading to cutting to cut point
It is washed away by coolant liquid, the wafer integrality after cutting is restricted, and is had to be optimized.
Summary of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide pneumatically smoothly partly led based on magnetic pole pressurization principle
Body wafer cutting device passes through transverse cuts to solve existing technology, the chip raw material on silicon crystal slate is separated with plate body, thus into
Row extracts, and directly cool down to cut point due to generalling use coolant liquid at present, to reach the cooling of cutting sheet, causes to cut
Chip raw material afterwards is washed away by coolant liquid, and the wafer integrality after cutting is restricted, and has problem to be optimized.
To achieve the goals above, the present invention is to realize by the following technical solutions: being pressurized principle gas based on magnetic pole
Stable semiconductor crystal wafer cutter device is moved, structure includes observation axle bed, mobile platform, gantry saddle, firm banking, processing
Turntable, cutter, processing turntable are installed on firm banking surface middle part by manner, and firm banking top rear is equipped with dragon
Door saddle, mobile platform bottom are installed on gantry saddle upper end, observation axle bed rear end and mobile platform front end by manner
Mutually chimeric, cutter is installed on observation axle bed bottom by manner.
As advanced optimizing for the technical program, cutter includes gravitation cooler, actuating arm, cutting sheet, actuating arm
Front end is equipped with cutting sheet, and gravitation cooler is installed on cutting sheet upper center by fitting mode.
As advanced optimizing for the technical program, gravitation cooler includes drawing weight box, water-cooling head, turning platen, water-cooling head
Be installed on by manner and turn platen left and right ends, turn platen bottom be equipped with draw weight box, draw weight box both ends respectively with water-cooling head
It is connected, turns to be interlocked in the middle part of platen and cutting sheet.
As advanced optimizing for the technical program, turning platen includes drive shaft, sliding pearl, counterweight ring, pressurization slot, air inducing
Mouth, booster block, nozzle, nozzle is set to by manner draws weight cassette bottom portion, draws weight box interior lower end and is equipped with air-vent, air-vent
If there are two, and it is connected inside top and drive shaft, pressurization slot, which is vertical at, to be drawn in the middle part of weight box lower end, and is integration knot
Structure, booster block is set to inside pressurization slot by embedded mode, and is connected with drive shaft, and counterweight ring passes through sliding pearl and propeller shaft sleeve
Connection is closed, draws and is connect inside weight box with counterweight ring fitting.
As advanced optimizing for the technical program, drive shaft includes axle center, instead denounces block, guides ring, swing arm, fan blade into, is put
There are three arm is set, and head end is connected by manner with axle center, anti-that block is denounceed to be installed on swing arm end, wind by fitting mode
Leaf is equipped with two or more, and is uniformly equally spaced in axle center surrounding, and guiding ring into is circular configuration, and is installed on outer inside drive shaft
Side, anti-reprimand block, which is located at, guides into inside ring.
As advanced optimizing for the technical program, actuating arm includes belt, injection pipe, axle center back set, and axle center back set is logical
It crosses fitting mode and is installed on axle center rear end, connection is engaged with axle center back set in belt bottom, and injection pipe is set to inside actuating arm, axle center
Back set rear end is connected with injection bottom of the tube.
As advanced optimizing for the technical program, draw weight cassette bottom portion and be equipped with clump weight, by gravity principle to drawing weight box
Bottom forms dragging effect, occurs the case where transfer when cutting sheet being avoided to rotate.
As advanced optimizing for the technical program, booster block bottom is equipped with sealing piston, so as in pressurization slot
Portion forms pressure seal, facilitates carry out pressure-increasing unit.
As advanced optimizing for the technical program, anti-reprimand block and booster block are magnetic material, and are the design that repels each other,
Being repelled each other when contact by magnetic force keeps booster block mobile, thus to play the role of gas boosting inside pressurization slot.
Beneficial effect
The present invention is based on magnetic poles to be pressurized principle pneumatically stable semiconductor crystal wafer cutter device, can be right by observation axle bed
The cutting work of cutter amplifies observation, and the processing turntable being equipped with is used to place the wafer board of processing, and actuating arm is for driving
Dynamic cutting sheet rotation, in process, effectively can play cooling effect to cutting sheet by gravitation cooler, draw weight box and use
In placing cooling water, play the role of reflux, and cool down by left and right ends position of the water-cooling head of two sides to cutting sheet, drives
When moving axis rotates, booster block is pressurized, and wind-force can be increased by internal air guiding component, then drawn and sprayed by air-vent
Mouth, booster block are pushed down on booster block by the thrust of the magnetic generation that repels each other, and make to be pressurized generation discontinuity jet inside slot, from
And the chip material of cutting is smoothed, avoiding raising causes to fall off, and sliding pearl is used to increase the sliding of counterweight ring and drive shaft
Property, avoid following rotation, when axis rotation is able to drive fan blade and forms air-flow, and swing arm follows rotation, then drives and instead denounces block
Loopy moving has gone promotions by magnetism principle of repelling each other, belt is used to that axle center to be driven to carry on the back when anti-reprimand block passes through booster block
Set rotation, and there are hollow out positions at axle center back set middle part, in order to connect with injection pipe, draw weight box to guide the coolant into
It is interior.
For the prior art, there is accessible advantage after operation of the present invention:
Cutter of the present invention ensure that the angle of gravitation cooler by drawing weight box, and gas is carried out by turning platen
Pressurization output, and to the pneumatic of the bottom of cutting sheet progress, there is the cooled water of chip raw material to solve in cutting process
The problem of removing, and water-cooling head is designed as two sides cooling, effectively prevents the case where chip raw material is washed away by coolant liquid, improves
Integrality after wafer cutting.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is that the present invention is based on the structural schematic diagrams that magnetic pole is pressurized the pneumatic stable semiconductor crystal wafer cutter device of principle.
Fig. 2 is that the cutter structure for being pressurized the pneumatic stable semiconductor crystal wafer cutter device of principle the present invention is based on magnetic pole is shown
It is intended to.
Fig. 3 is that the present invention is based on the cutter forward sight knots that magnetic pole is pressurized the pneumatic stable semiconductor crystal wafer cutter device of principle
Structure schematic diagram.
Fig. 4 is that the present invention is based on before magnetic pole pressurization principle pneumatically the gravitation cooler of stable semiconductor crystal wafer cutter device
Depending on structure sectional view.
Fig. 5 is that the present invention is based on the drive shaft forward sight knots that magnetic pole is pressurized the pneumatic stable semiconductor crystal wafer cutter device of principle
Structure cross-sectional view.
Fig. 6 is to be pressurized principle the present invention is based on magnetic pole pneumatically stable semiconductor crystal wafer cutter device turns platen internal junction
Structure perspective view.
Fig. 7 is that the present invention is based on the actuating arm internal junctions that magnetic pole is pressurized the pneumatic stable semiconductor crystal wafer cutter device of principle
Structure side view.
Numbering in the drawing explanation: observation axle bed -1, mobile platform -2, gantry saddle -3, firm banking -4, processing turntable -
5, cutter -6, gravitation cooler -601, actuating arm -602, cutting sheet -603, draw weight box -6011, water-cooling head -6012, turn pressure
Disk -6013, drive shaft -60131, sliding pearl -60132, counterweight ring -60133, pressurization slot -60134, air-vent -60135, pressurization
Block -60136, axle center -601311, instead denounces block -601312, guides ring -601313, swing arm -601314, fan blade-at nozzle -60137
601315, belt -6021, injection pipe -6022, axle center back set -6023.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment and Detailed description of the invention, the preferred embodiment that the present invention is further explained.
Be previously mentioned in the present invention up and down, inside and outside, front and back and left and right on the basis of the orientation in Fig. 1.
Embodiment
Fig. 1-Fig. 7 is please referred to, the present invention, which is provided, is pressurized principle pneumatically stable semiconductor crystal wafer cutter device based on magnetic pole,
Its structure includes observation axle bed 1, mobile platform 2, gantry saddle 3, firm banking 4, processing turntable 5, cutter 6, the processing
Turntable 5 is installed on 4 surface middle part of firm banking by manner, and 4 top rear of firm banking is equipped with gantry saddle 3,
2 bottom of mobile platform is installed on 3 upper end of gantry saddle, 1 rear end of observation axle bed and mobile platform 2 by manner
Front end is mutually fitted into, and the cutter 6 is installed on observation 1 bottom of axle bed by manner, can be to cutting by observation axle bed 1
The cutting work of device 6 amplifies observation, and the processing turntable 5 being equipped with is used to place the wafer board of processing.
The cutter 6 includes gravitation cooler 601, actuating arm 602, cutting sheet 603, and 602 front end of actuating arm is set
There is cutting sheet 603, the gravitation cooler 601 is installed on 603 upper center of cutting sheet by fitting mode, and actuating arm 602 is used
It is rotated in driving cutting sheet 603, in process, cooling effectively can be played to cutting sheet 603 by gravitation cooler 601
Effect.
The gravitation cooler 601 includes drawing weight box 6011, water-cooling head 6012, turning platen 6013, the water-cooling head 6012
Be installed on by manner and turn 6013 left and right ends of platen, it is described turn 6013 bottom of platen be equipped with draw weight box 6011, it is described to draw
6011 both ends of weight box are connected with water-cooling head 6012 respectively, described to turn to be interlocked in the middle part of platen 6013 and cutting sheet 603, draw weight box
6011, for placing cooling water, play the role of reflux, and by the water-cooling head 6012 of two sides to the left and right ends position of cutting sheet 603
It sets and is cooled down.
The platen 6013 that turns includes drive shaft 60131, sliding pearl 60132, counterweight ring 60133, pressurization slot 60134, air inducing
Mouth 60135, booster block 60136, nozzle 60137, the nozzle 60137 is set to by manner draws 6011 bottom of weight box, institute
It states and draws 6011 interior lower end of weight box equipped with air-vent 60135, there are two the air-vent 60135 is set, and top and drive shaft
It is connected inside 60131, the pressurization slot 60134, which is vertical at, to be drawn in the middle part of 6011 lower end of weight box, and is integrated, described
Booster block 60136 is set to inside pressurization slot 60134 by embedded mode, and is connected with drive shaft 60131, the counterweight ring
60133 are connect by sliding pearl 60132 with 60131 fitting of drive shaft, and 6011 inside of weight box of drawing connects with 60133 fitting of counterweight ring
It connects, when drive shaft 60131 rotates, booster block 60136 is pressurized, and wind-force can be increased by internal air guiding component,
Again by air-vent 60135 draw nozzle 60137, booster block 60136 by magnetism repel each other generation thrust by booster block 60136 to
Lower promotion makes to be pressurized generation discontinuity jet inside slot 60134, and sliding pearl 60132 is for increasing counterweight ring 60133 and drive shaft
60131 sliding property avoids following rotation.
The drive shaft 60131 includes axle center 601311, anti-reprimand block 601312, guides ring 601313, swing arm 601314, wind into
Leaf 601315, there are three the swing arm 601314 is set, and head end is connected by manner with axle center 601311, the anti-reprimand
Block 601312 is installed on 601314 end of swing arm by fitting mode, and the fan blade 601315 is equipped with two or more, and uniformly etc.
Away from 601311 surrounding of axle center is distributed in, the ring 601313 of guiding into is circular configuration, and it is outer to be installed on 60131 inside of drive shaft
Side, the anti-reprimand block 601312, which is located at, guides into inside ring 601313, and axle center 601311 is able to drive 601315 shape of fan blade when rotating
At air-flow, and swing arm 601314 follows rotation, then drives anti-reprimand 601312 loopy moving of block, when anti-reprimand block 601312 is by increasing
When briquetting 60136, promotion has been gone by magnetism principle of repelling each other.
The actuating arm 602 includes belt 6021, injection pipe 6022, axle center back set 6023, and the axle center back set 6023 is logical
It crosses fitting mode and is installed on 601311 rear end of axle center, connection, the note are engaged with axle center back set 6023 in 6021 bottom of belt
Enter pipe 6022 inside actuating arm 602,6023 rear ends of the axle center back set are connected with 6022 bottom of injection pipe, belt 6021
For driving 6023 rotation of axle center back set, and there are hollow out positions at axle center back set 6023 middle part, in order to connect with injection pipe 6022
It connects, draws in weight box 6011 to guide the coolant into.
6011 bottom of weight box of drawing forms dragging effect to 6011 bottom of weight box is drawn by gravity principle equipped with clump weight
Fruit avoids cutting sheet 603 from the case where transfer occur when rotating.
60136 bottom of booster block is equipped with sealing piston, close so as to form pressure inside pressurization slot 60134
Envelope, facilitates carry out pressure-increasing unit.
The anti-reprimand block 601312 and booster block 60136 are magnetic material, and are the design that repels each other, and pass through magnetic at the time of contact
Power, which is repelled each other, keeps booster block 60136 mobile, thus to play the role of gas boosting inside pressurization slot 60134.
The principle of the present invention: by observation axle bed 1 can the cutting work to cutter 6 amplify observation, be equipped with
Processing turntable 5 is used to place the wafer board of processing, and actuating arm 602 is for driving cutting sheet 603 to rotate, and in process, leads to
Crossing gravitation cooler 601 effectively can play cooling effect to cutting sheet 603, draw weight box 6011 for placing cooling water, play
Reflux effect, and cooled down by left and right ends position of the water-cooling head of two sides 6012 to cutting sheet 603, drive shaft 60131
When rotation, booster block 60136 is pressurized, and wind-force can be increased by internal air guiding component, then by air-vent 60135
Nozzle 60137 is drawn, booster block 60136 is pushed down on booster block 60136 by the thrust of the magnetic generation that repels each other, and makes to be pressurized slot
60134 inside generate discontinuity jet, so that the chip material to cutting smooths, avoiding raising causes to fall off, sliding pearl
60132, for increasing the sliding property of counterweight ring 60133 Yu drive shaft 60131, avoid following rotation, energy when axle center 601311 rotates
Enough fan blade 601315 is driven to form air-flow, and swing arm 601314 follows rotation, then drives anti-reprimand 601312 loopy moving of block, when
When anti-reprimand block 601312 is by booster block 60136, promotions is gone by magnetism principle of repelling each other, belt 6021 is used for moving axis
6023 rotation of heart back set, and there are hollow out positions at axle center back set 6023 middle part, in order to be connect with injection pipe 6022, thus by cold
But liquid importing is drawn in weight box 6011.
Problems solved by the invention is existing technology by transverse cuts, and the chip raw material on silicon crystal slate is separated with plate body,
To extract, cut point directly cool down due to generalling use coolant liquid at present, to reach the cooling of cutting sheet, is led
Chip raw material after causing cutting is washed away by coolant liquid, and the wafer integrality after cutting is restricted, and has to be optimized, and the present invention passes through
Above-mentioned component is combined with each other, and cutter of the present invention ensure that the angle of gravitation cooler by drawing weight box, and by turning platen
To the pressurization output that gas carries out, and to the pneumatic of the bottom of cutting sheet progress, occurs chip in cutting process to solve
The problem of cooled water of raw material is removed, and water-cooling head is designed as two sides cooling, effectively prevents chip raw material and is washed away by coolant liquid
The case where, the integrality after improving wafer cutting.
The basic principles, main features and advantages of the present invention have been shown and described above, the technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention can not only be realized in other specific forms under the premise of not departing from spirit of that invention or essential characteristic
The present invention will also have various changes and improvements, these changes and improvements both fall within scope of the claimed invention, therefore this hair
Bright claimed range is defined by appended claims and its equivalent, rather than above description limits.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (6)
1. based on magnetic pole pressurization principle, pneumatically stable semiconductor crystal wafer cutter device, structure include observation axle bed (1), movement
Platform (2), gantry saddle (3), firm banking (4), processing turntable (5), cutter (6), it is characterised in that:
The processing turntable (5) is installed on firm banking (4) surface middle part, is equipped with gantry saddle at the top of the firm banking (4)
(3), mobile platform (2) bottom is installed on gantry saddle (3) upper end, the observation axle bed (1) rear end and mobile platform (2)
Front end is connected, and the cutter (6) is installed on observation axle bed (1) bottom.
2. according to claim 1 be pressurized principle pneumatically stable semiconductor crystal wafer cutter device, feature based on magnetic pole
Be: the cutter (6) includes gravitation cooler (601), actuating arm (602), cutting sheet (603), the actuating arm (602)
Front end is equipped with cutting sheet (603), and the gravitation cooler (601) is installed on cutting sheet (603) upper center.
3. according to claim 2 be pressurized principle pneumatically stable semiconductor crystal wafer cutter device, feature based on magnetic pole
Be: the gravitation cooler (601) includes drawing weight box (6011), water-cooling head (6012), turning platen (6013), the water-cooling head
(6012) be installed on and turn platen (6013) left and right ends, it is described turn platen (6013) bottom be equipped with draw weight box (6011), it is described to draw
Weight box (6011) both ends are connected with water-cooling head (6012), described to turn to be interlocked in the middle part of platen (6013) and cutting sheet (603).
4. according to claim 3 be pressurized principle pneumatically stable semiconductor crystal wafer cutter device, feature based on magnetic pole
Be: the platen (6013) that turns includes drive shaft (60131), sliding pearl (60132), counterweight ring (60133), pressurization slot
(60134), air-vent (60135), booster block (60136), nozzle (60137), the nozzle (60137), which is set to, draws weight box
(6011) bottom, weight box (6011) interior lower end of drawing are equipped with air-vent (60135), at the top of the air-vent (60135) with
It is connected inside drive shaft (60131), the pressurization slot (60134), which is set to, draws in the middle part of weight box (6011) lower end, the booster block
(60136) it is set to pressurization slot (60134) inside, the drive shaft (60131) is connected with booster block (60136), the counterweight
Ring (60133) passes through sliding pearl (60132) and connect with drive shaft (60131), described to draw weight box (6011) inside and counterweight ring
(60133) it connects.
5. according to claim 4 be pressurized principle pneumatically stable semiconductor crystal wafer cutter device, feature based on magnetic pole
Be: the drive shaft (60131) includes axle center (601311), instead denounces block (601312), guides ring (601313), swing arm into
(601314), fan blade (601315), the swing arm (601314) are connected with axle center (601311), the anti-reprimand block (601312)
It is installed on swing arm (601314) end, the fan blade (601315) is distributed in axle center (601311) surrounding, described to guide ring into
(601313) it is installed on the internal outside of drive shaft (60131), the anti-reprimand block (601312), which is located at, guides ring (601313) inside into.
6. according to claim 2 be pressurized principle pneumatically stable semiconductor crystal wafer cutter device, feature based on magnetic pole
Be: the actuating arm (602) includes belt (6021), injection pipe (6022), axle center back set (6023), the axle center back set
(6023) it is installed on axle center (601311) rear end, belt (6021) bottom is carried on the back set (6023) with axle center and connect, the injection
It manages (6022) and is set to actuating arm (602) inside, axle center back set (6023) rear end is connected with injection pipe (6022) bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910165888.7A CN109968551B (en) | 2019-03-06 | 2019-03-06 | Pneumatic stable semiconductor wafer cutting device based on magnetic pole pressurization principle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910165888.7A CN109968551B (en) | 2019-03-06 | 2019-03-06 | Pneumatic stable semiconductor wafer cutting device based on magnetic pole pressurization principle |
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| Publication Number | Publication Date |
|---|---|
| CN109968551A true CN109968551A (en) | 2019-07-05 |
| CN109968551B CN109968551B (en) | 2021-04-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020059947A1 (en) * | 2000-11-20 | 2002-05-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate cleaning apparatus |
| CN101590669A (en) * | 2008-05-30 | 2009-12-02 | 株式会社迪思科 | Topping machanism |
| CN203527673U (en) * | 2013-11-15 | 2014-04-09 | 英利能源（中国）有限公司 | Silicon block slicer |
| CN207503921U (en) * | 2017-09-26 | 2018-06-15 | 合肥新汇成微电子有限公司 | A kind of cutter device of semiconductor crystal wafer |
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2019
- 2019-03-06 CN CN201910165888.7A patent/CN109968551B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020059947A1 (en) * | 2000-11-20 | 2002-05-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate cleaning apparatus |
| CN101590669A (en) * | 2008-05-30 | 2009-12-02 | 株式会社迪思科 | Topping machanism |
| CN203527673U (en) * | 2013-11-15 | 2014-04-09 | 英利能源（中国）有限公司 | Silicon block slicer |
| CN207503921U (en) * | 2017-09-26 | 2018-06-15 | 合肥新汇成微电子有限公司 | A kind of cutter device of semiconductor crystal wafer |
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| CN109968551B (en) | 2021-04-09 |
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Denomination of invention: Semiconductor wafer cutting device based on the principle of magnetic pole pressurization Effective date of registration: 20221116 Granted publication date: 20210409 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing Economic Development Zone sub branch Pledgor: Zhejiang jichengxing Technology Co.,Ltd. Registration number: Y2022330003081 |
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