CN107075711A - 基材上的阳极氧化层和铝层 - Google Patents

基材上的阳极氧化层和铝层 Download PDF

Info

Publication number
CN107075711A
CN107075711A CN201580059445.XA CN201580059445A CN107075711A CN 107075711 A CN107075711 A CN 107075711A CN 201580059445 A CN201580059445 A CN 201580059445A CN 107075711 A CN107075711 A CN 107075711A
Authority
CN
China
Prior art keywords
aluminium lamination
base material
anodic oxide
oxide coating
continuous aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580059445.XA
Other languages
English (en)
Inventor
吴冠霆
C·卡什亚普
J·常
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of CN107075711A publication Critical patent/CN107075711A/zh
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/08Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/106Coating with metal alloys or metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F17/00Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Laser Beam Processing (AREA)

Abstract

本文描述的各种实例提供了一种基材或用于制备基材的方法,所述基材包括在基材上的铝层和阳极氧化层。例如,所述基材可以包括基材、在所述基材上形成的连续铝层以及在所述连续铝层上形成的阳极氧化层。

Description

基材上的阳极氧化层和铝层
背景技术
各种电子产品,例如笔记本电脑、平板电脑、媒体播放器和智能手机等具有一组具有金属饰面(finish)的外表面。除了提供审美吸引力之外,金属饰面表面可以强化电子产品的外壳。
附图简述
参考以下附图在下文的详细描述中描述了某些实例。
图1-图4图示说明了根据本公开内容的用于形成基材的示例性方法。
图5和图6图示说明了根据本公开内容的示例性基材。
详细描述
本文描述的各种实例提供了基材或用于制备基材的方法,所述基材包括非金属基材上的铝层和阳极氧化层。本文描述的基材可以用作电子设备,例如笔记本电脑、平板电脑、媒体播放器或移动电话的一部分。所述基材可以是电子设备的外壳的一部分,所述外壳可以支撑或容纳电子设备的多个组件。
根据一些实例,将铝粉涂层施加至非金属基材,将激光(例如,激光处理)施加至铝粉涂层,并将经激光处理的铝粉涂层的顶层阳极氧化。根据各种实例,将含有铝填料的塑性膜施加至非金属基材,将激光(例如激光处理)施加至塑性膜,并将经激光处理的塑性膜的顶层阳极氧化。对于各种实例而言,如本文所述,相比于将直接激光束施加至铝表面上,通过将激光施加至铝粉涂层或含有铝填料的塑性膜反射的光较少,所述铝表面比铝粉涂层或含有铝填料的塑性膜更有光泽。光反射的减少表明铝粉涂层或含有铝填料的塑性膜可以比铝表面吸收更多的激光能量。根据该实例,得到的基材可以具有阳极氧化的美化表面特征,并且可以拥有具有独特金属感的表面。一些实例提供具有阳极氧化表面的非铝基材。
如本文所用,术语“在...之上、“在...之下”、“在...之间”和“在...上”是指一个层相对于其他层的相对位置。因此,例如,在另一层之上或之下形成的一个层可以直接与另一层接触或者可以具有一组中间层。此外,设置在两个层之间的一个层可以直接与该两个层接触或者可以具有一组中间层。相比之下,第二层“上”的第一层与该第二层接触。另外,在不考虑基材的绝对取向下假设操作都相对于基材实施,提供了一个层相对于其它层的相对位置。
图1图示说明了根据本公开内容的用于形成基材的示例性方法100。方法100可以以存储在非暂时的计算机可读介质上的可执行指令的形式实施或以电子电路的形式实施,这可以使一组机器根据本文所述的实例来制备基材。结合图1描述的操作次序并不意欲为限制性的,并且符合图1的实例的实施不需要以描述的具体顺序实施操作次序。
如图所示,方法100通过在非金属基材上设置铝粉涂层(例如,分离的铝粉)而在方框102处开始。铝粉涂层可以包含热塑性树脂,例如聚缩醛、聚丙烯腈、聚乙烯、聚甲基丙烯酸甲酯、聚丙烯、聚苯乙烯、聚乙酸乙烯酯、聚氯乙烯、含氟聚合物、氯化聚醚、线性聚氨酯、聚酰胺、聚碳酸酯、聚酯、聚酰亚胺和聚砜。根据该实例,非金属基材可以包含聚合物、陶瓷或复合材料(例如碳纤维)。
对于替代的实例而言,使用非铝基材代替非金属基材。非铝基材可以包含非铝金属,例如镁、锂、锌、钛或铌,或者可以包含非铝合金。如本文所述,铝粉涂层可以设置在非金属基材上,从而使得铝粉涂层与非金属基材接触。铝粉涂层可以包含含有铝或铝合金颗粒的聚合物树脂,所述铝粉涂层可以作为铝液体涂料喷涂到非金属基材上。
方法100通过将激光(例如,激光处理)施加至在方框102处设置在非金属基材上的铝粉涂层而继续到方框104,以在非金属基材上形成连续铝层。具体而言,将激光施加至铝粉涂层可以使铝粉涂层熔化并在非金属基材上形成连续铝层。此外,对于一些实例而言,将激光施加至铝粉涂层可以使存在于非金属基材中的有机树脂被去除。如本文所述,形成的连续铝层可以设置在非金属基材上并与该非金属基材接触(例如,在方框102处将铝粉设置在非金属基材上)。
方法100通过在方框104处形成的连续铝层上形成阳极氧化层而继续到方框106。对于一些实例而言,阳极氧化层通过将在方框104处形成的连续铝层的顶层阳极氧化而形成。如本文所述,阳极氧化层可以设置在方框104处形成的连续铝层上并与该连续铝层接触。
图2图示说明了根据本公开内容的用于形成基材的示例性方法200。方法200可以以存储在非暂时的计算机可读介质上的可执行指令的形式实施或以电子电路的形式实施,这可以使一组机器根据本文所述的实例来制备基材。结合图2描述的操作次序并不意欲为限制性的,并且符合图2的实例的实施不需要以描述的具体顺序实施操作次序。
如图所示,方法200开始于方框202并继续到方框204,其中方框202和方框204可以分别类似于关于图1描述的方法100的方框102和方框104。
方法200通过将物理气相沉积(PVD)涂层设置在方框204处形成的连续铝层上而继续到方框206。根据该实例,将PVD涂层设置在连续铝层上可以包括通过离子束溅射(IBS)、反应性溅射、离子辅助沉积(IAD)、高靶材利用率溅射(high-target-utilizationsputtering)、大功率脉冲磁控溅射(HIPIMS)、气流溅射、化学气相沉积等实施物理气相沉积。PVD涂层可以包含铝或铝合金。如本文所述,PVD涂层可以设置在方框204处形成的连续铝层上并与该连续铝层接触。
方法200通过在方框206处设置的PVD涂层上形成阳极氧化层而继续到方框208。对于一些实例而言,阳极氧化层通过将在方框206处设置的PVD涂层的顶层阳极氧化而形成。如本文所述,阳极氧化层可以设置在方框206处设置的PVD涂层上并与该PVD涂层接触。
图3图示说明了根据本公开内容的用于形成基材的示例性方法300。方法300可以以存储在非暂时的计算机可读介质上的可执行指令的形式实施或以电子电路的形式实施,这可以使一组机器根据本文所述的实例来制备基材。结合图3描述的操作次序并不意欲为限制性的,并且符合图3的实例的实施不需要以描述的具体顺序实施操作次序。
如图所示,方法300通过在非金属基材上设置含有铝填料的塑性膜而在方框302处开始。将塑性膜设置在非金属基材上可以包括将塑性膜夹物模压(insert molding)在非金属基材上。根据该实例,塑性膜可以包含模内装饰(IMD)、模外装饰(OMD)、模内膜(IMF)、模内标签(IML)或模外离型-膜(release-film)(OMR)。如本文所述,塑性膜可以设置在非金属基材上,从而使得塑性膜与该非金属基材接触。
方法300通过将激光施加至在方框302处设置在非金属基材上的塑性膜而继续到304,以在非金属基材上形成连续铝层。在一些实例中,将激光施加至塑性膜可以使铝粉涂层熔化并在非金属基材上形成连续铝层。此外,将激光施加至塑性膜可以使存在于非金属基材中的有机树脂或塑性膜的树脂被除去。如本文所述,形成的连续铝层可以设置在非金属基材上并与该非金属基材接触(例如,在方框102处将塑性膜设置在非金属基材上)。
方法300通过在方框304处形成的连续铝层上形成阳极氧化层而继续到方框306。对于些实例而言,阳极氧化层通过将在方框304处形成的连续铝层的顶层阳极氧化而形成。如本文所述,阳极氧化层可以设置在方框304处形成的连续铝层上并与该连续铝层接触。
图4图示说明了根据本公开内容的用于形成基材的示例性方法400。方法400可以以存储在非暂时的计算机可读介质上的可执行指令的形式实施或以电子电路的形式实施,这可以使一组机器根据本文所述的实例来制备基材。结合图4描述的操作次序并不意欲为限制性的,并且符合图4的实例的实施不需要以描述的具体顺序实施操作次序。
如图所示,方法400开始于方框402并继续到方框404,其中方框402和方框404可以分别类似于参照图3描述的方法300的方框302和方框304。
方法400通过将物理气相沉积(PVD)涂层设置在方框404处形成的连续铝层上而继续到方框406。如本文所述,将PVD涂层设置在连续铝层上可以包括通过离子束溅射(IBS)、反应性溅射、离子辅助沉积(IAD)、高靶材利用率溅射、大功率脉冲磁控溅射(HIPIMS)、气流溅射、化学气相沉积等实施物理气相沉积。另外,如本文所述,PVD涂层可以包含铝或铝合金。PVD涂层可以设置在方框404处形成的连续铝层上并与该连续铝层接触。
方法400通过在方框406处设置的PVD涂层上形成阳极氧化层而继续到方框408。对于一些实例而言,阳极氧化层通过将在方框406处设置的PVD涂层的顶层阳极氧化而形成。如本文所述,阳极氧化层可以设置在方框406处设置的PVD涂层上并与该PVD涂层接触。
图5图示说明了根据本公开内容的示例性基材500。如图所示,基材500包括非铝基材506、在非铝基材506上形成的连续铝层504和在连续铝层504上形成的阳极氧化层502。根据该实例,非铝基材可以包含非铝金属,例如镁、锂、锌、钛或铌,或者可以包含非铝合金。虽然图5图示说明了基材500的结构,该结构包括设置在彼此之上并且彼此接触的元件(例如层、涂层等),但是对于一些实例而言,一组其他元件(例如层、涂层等)可以存在于基材500的两个元件之间。
图6图示说明了根据本公开内容的示例性基材600。如图所示,基材600包括非铝基材608、在非铝基材608上形成的连续铝层606、在连续铝层606上形成的物理气相沉积(PVD)涂层604以及在PVD涂层604上形成的阳极氧化层602。如本文所述,非铝基材可以包含非铝金属,例如镁、锂、锌、钛或铌,或者可以包含非铝合金。虽然图6图示说明了基材600的结构,该结构包括设置在彼此之上并且彼此接触的元件(例如层、涂层等),但是对于一些实例而言,一组其他元件(例如层、涂层等))可以存在于基材600的两个元件之间。
在前面的描述中,阐述了许多细节以提供对本文公开的主题的理解。然而,可以在没有这些细节中的一些或全部的情况下实践各种实例。一些实例可以包括上述细节的修改和变化。所附权利要求旨在涵盖这样的修改和变化。

Claims (15)

1.一种方法,其包括:
在非金属基材上设置铝粉涂层;
将激光施加至所述铝粉涂层以在所述非金属基材上形成连续铝层;和
在所述连续铝层上形成阳极氧化层。
2.权利要求1的方法,其中所述非金属基材包含有机树脂,并且将激光施加至所述铝粉涂层使所述有机树脂被去除。
3.权利要求1的方法,其中在所述连续铝层上形成所述阳极氧化层包括将所述连续铝层阳极氧化以在所述连续铝层上形成所述阳极氧化层。
4.权利要求1的方法,其包括在所述连续铝层上形成所述阳极氧化层之前,在所述连续铝层上设置物理气相沉积(PVD)涂层,其中所述PVD涂层被插入所述连续铝层和所述阳极氧化层之间。
5.权利要求4的方法,其中在所述连续铝层上形成所述阳极氧化层包括将所述PVD涂层阳极氧化以在所述连续铝层和所述PVD涂层上形成所述阳极氧化层。
6.一种方法,其包括:
在非金属基材上设置塑性膜,其中所述塑性膜包含铝填料;
将激光施加至所述塑性膜以在所述非金属基材上形成连续铝层;和
在所述连续铝层上形成阳极氧化层。
7.权利要求6的方法,其中在所述非金属基材上设置所述塑性膜包括将所述塑性膜夹物模压在所述非金属基材上。
8.权利要求6的方法,其中所述非金属基材包含有机树脂,并且将所述激光施加至所述塑性膜使所述有机树脂被去除。
9.权利要求6的方法,其中在所述连续铝层上形成所述阳极氧化层包括将所述连续铝层阳极氧化以在所述连续铝层上形成所述阳极氧化层。
10.权利要求6的方法,其包括在所述连续铝层上形成所述阳极氧化层之前,在所述连续铝层上设置物理气相沉积(PVD)涂层,其中所述PVD涂层被插入所述连续铝层和所述阳极氧化层之间。
11.权利要求10的方法,其中在所述连续铝层上形成所述阳极氧化层包括将所述PVD涂层阳极氧化以形成所述阳极氧化层。
12.一种基材,其包括:
非铝基材;
在所述非铝基材上形成的连续铝层;和
在所述连续铝层上的阳极氧化层。
13.权利要求12的基材,其包括被插入所述连续铝层和所述阳极氧化层之间的物理气相沉积(PVD)涂层。
14.权利要求12的基材,其中所述非铝基材包含选自镁、锂、锌、钛和铌的金属。
15.权利要求12的基材,其中所述非铝基材包含聚合物、陶瓷或复合材料。
CN201580059445.XA 2015-04-30 2015-04-30 基材上的阳极氧化层和铝层 Pending CN107075711A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/028643 WO2016175860A1 (en) 2015-04-30 2015-04-30 Anodized layer and aluminum layer over substrate

Publications (1)

Publication Number Publication Date
CN107075711A true CN107075711A (zh) 2017-08-18

Family

ID=57199306

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580059445.XA Pending CN107075711A (zh) 2015-04-30 2015-04-30 基材上的阳极氧化层和铝层

Country Status (4)

Country Link
US (1) US20180298499A1 (zh)
EP (1) EP3198058A4 (zh)
CN (1) CN107075711A (zh)
WO (1) WO2016175860A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107675226A (zh) * 2017-09-26 2018-02-09 联想(北京)有限公司 壳体处理方法及壳体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202100022757A1 (it) * 2021-09-02 2023-03-02 Metaly S R L Metodo di decorazione superfici trattate con rivestimento pvd e superfici decorate ottenute

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087071A1 (en) * 2001-11-07 2003-05-08 Che-Yuan Hsu Cover structure for electronic device and method of manufacturing same
CN101868129A (zh) * 2009-04-16 2010-10-20 富准精密工业(深圳)有限公司 壳体及其制造方法
US20130093299A1 (en) * 2011-10-14 2013-04-18 Samsung Electronics Co., Ltd. Electronic device case and surface treatment method thereof
EP2649224B1 (en) * 2010-12-06 2016-03-23 Bang & Olufsen A/S A method to obtain a radiation scattering surface finish on an object

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6960724B2 (en) * 2002-09-30 2005-11-01 Schlumberger Technology Corporation Dual stress member conductive cable
US20090179343A1 (en) * 2008-01-14 2009-07-16 Tzu-Wen Soong Method for forming a surface layer on a substrate
CN102002712A (zh) * 2009-09-03 2011-04-06 深圳富泰宏精密工业有限公司 电子装置外壳及其制造方法
US8858854B2 (en) * 2010-04-01 2014-10-14 Flextronics Ap, Llc System and method for plastic overmolding on a metal surface
US9133559B2 (en) * 2011-03-07 2015-09-15 Apple Inc. Methods for forming electroplated aluminum structures
CN103031555B (zh) * 2011-10-10 2016-12-07 深圳富泰宏精密工业有限公司 壳体的制备方法及该方法所制备的壳体
CN107815713B (zh) * 2012-06-22 2020-11-17 苹果公司 白色外观阳极化膜及其形成方法
US9818501B2 (en) * 2012-10-18 2017-11-14 Ford Global Technologies, Llc Multi-coated anodized wire and method of making same
US20150016030A1 (en) * 2013-07-12 2015-01-15 Apple Inc. Reducing appearance of physical damage on cosmetic surfaces
US9803283B1 (en) * 2013-10-18 2017-10-31 Hrl Laboratories, Llc Method of electroless deposition of aluminum or aluminum alloy, an electroless plating composition, and an article including the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087071A1 (en) * 2001-11-07 2003-05-08 Che-Yuan Hsu Cover structure for electronic device and method of manufacturing same
CN101868129A (zh) * 2009-04-16 2010-10-20 富准精密工业(深圳)有限公司 壳体及其制造方法
EP2649224B1 (en) * 2010-12-06 2016-03-23 Bang & Olufsen A/S A method to obtain a radiation scattering surface finish on an object
US20130093299A1 (en) * 2011-10-14 2013-04-18 Samsung Electronics Co., Ltd. Electronic device case and surface treatment method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107675226A (zh) * 2017-09-26 2018-02-09 联想(北京)有限公司 壳体处理方法及壳体

Also Published As

Publication number Publication date
EP3198058A4 (en) 2018-04-18
US20180298499A1 (en) 2018-10-18
EP3198058A1 (en) 2017-08-02
WO2016175860A1 (en) 2016-11-03

Similar Documents

Publication Publication Date Title
US20110003102A1 (en) Method for making housing and housing thereof
US8211503B2 (en) Method for making device housing
US20160324026A1 (en) Device Casing Including Layered Metals
US20110091690A1 (en) Composite optical film and decorated article comprising the same
US20130075026A1 (en) Method for bonding plastic mold member onto metal housing
WO2012000343A1 (en) Shell, method of preparing the shell and electronic product comprising the shell
JP2012157901A (ja) 複数の金属層を含むカバーを製造する方法及び装置
US20130052899A1 (en) Resin-and-fiber composite and method for making same
CN102049895A (zh) 连续性纤维积层板及其制备方法
US20110014405A1 (en) Housing and method for making the housing
CN107075711A (zh) 基材上的阳极氧化层和铝层
US20160339537A1 (en) Forming a Casing of an Electronics Device
US8609010B2 (en) Molding method providing micro-structures and articles molded by the method
CN103029306A (zh) 碳纤外壳制作方法
US9788431B2 (en) Housing, electronic device using same, and method for making same
US20130140266A1 (en) In-mold roller manufacturing method and casing product made thereby
US20190054671A1 (en) Metal-plastic composite structure for electronic devices
CN110406013A (zh) 终端壳体及其制备方法
JP2012116219A (ja) 金属調加飾シート及びその製造方法
CN102378510A (zh) 电子装置外壳及其制备方法
CN103029305A (zh) 碳纤外壳制作方法
US20180267572A1 (en) Method of applying a transfer film to metal surfaces
CN103935578B (zh) 覆膜注塑防潮容器及其制造方法
TW201125721A (en) Metal and plastic joint structure and the manufacturing method thereof
JP5946578B1 (ja) 表面平滑積層体の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170818

RJ01 Rejection of invention patent application after publication