US20180267572A1 - Method of applying a transfer film to metal surfaces - Google Patents

Method of applying a transfer film to metal surfaces Download PDF

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Publication number
US20180267572A1
US20180267572A1 US15/988,175 US201815988175A US2018267572A1 US 20180267572 A1 US20180267572 A1 US 20180267572A1 US 201815988175 A US201815988175 A US 201815988175A US 2018267572 A1 US2018267572 A1 US 2018267572A1
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United States
Prior art keywords
oxide layer
metal oxide
applying
transfer film
metal
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Abandoned
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US15/988,175
Inventor
Chung-Hung Huang
Yu-Chuan Kang, JR.
Chien-Ting Lin
Kuan-Ting Wu
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority to US15/988,175 priority Critical patent/US20180267572A1/en
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. reassignment HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, CHIEN-TING, WU, KUAN-TING, HUANG, CHUNG-HUNG, KANG, Yu-Chuan
Publication of US20180267572A1 publication Critical patent/US20180267572A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B32B1/02—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/024—Anodisation under pulsed or modulated current or potential
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/026—Anodisation with spark discharge
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/26—Anodisation of refractory metals or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/30—Anodisation of magnesium or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163—Indexing scheme relating to constructional details of the computer
    • G06F2200/1633—Protecting arrangement for the entire housing of the computer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate

Definitions

  • Devices such as mobile phones, tablets and portable (e.g. laptop or palm) computers are generally provided with a casing.
  • the casing typically provides a number of functional features, e.g. protecting the device from damage.
  • FIG. 1 is a flow diagram illustrating an example of a method of applying a transfer film to a metal surface
  • FIG. 2 is a flow diagram illustrating another example of a method of applying a transfer film to a metal surface
  • FIG. 3 is a sectional side view of an example of a metal oxide layer on a metal produced by the electrochemical treatment of FIG. 1 or FIG. 2
  • FIG. 4 is a perspective view of the metal oxide layer of FIG. 3
  • FIG. 5 is a sectional side view of an example of a coated metal surface produced by the method of FIG. 1 or FIG. 2
  • FIG. 6 is a perspective view of an example of a metal casing with a part of the casing cut away
  • FIG. 7 is a perspective view of the casing of FIG. 6 after electrochemical treatment
  • FIG. 8 is a perspective view of the casing of FIG. 7 after transfer film
  • the present disclosure describes a method of applying a transfer film to a metal surface, for example the metal surface of a casing for a device.
  • the method comprises the formation of a metal oxide layer on the metal surface through an electrochemical treatment of the metal surface.
  • the electrochemical treatment disclosed allows for a high degree of control in determining various physical and visual properties of the metal oxide layer.
  • the metal oxide layer formed by the disclosed method provides a good adherence of the oxide to the metal.
  • the metal oxide layer formed by the disclosed methods is porous in nature. This porosity can enhance the bonding between the electrochemically treated surface and the transfer film compared to oxide layers formed by other methods.
  • the disclosed method can be used and may vary to form metal oxide layers of 1-300 ⁇ m in thickness and more preferably 3-50 ⁇ m in thickness. In comparison, metal oxide layers formed by other techniques are typically in the range of 0.001-0.1 ⁇ m.
  • FIGS. 1 and 2 illustrate examples of methods of transfer film a metal surface.
  • a metal surface ( 140 ) is provided ( 110 ).
  • the metal surface may be, for example, in the form of a casing for a device.
  • the casing can be formed using conventional methods, such as stamping or moulding, into the desired shape of the finished product.
  • the casing is formed of a light metal, such as aluminium, magnesium, titanium or alloys thereof.
  • the metal surface ( 140 ) is electrochemically treated ( 120 ) to form a metal oxide layer ( 150 ) such as that shown in FIG. 3 .
  • the electrochemical treatment includes applying a potential greater than the oxide layer's dielectric breakdown potential to the metal surface in an electrolytic solution.
  • the dielectric breakdown potential of a material is the voltage applied via an electric field that the material can withstand without breaking down.
  • a material such as a metal oxide
  • the breakdown results in a disruptive discharge through the metal oxide.
  • the dielectric breakdown potential of a material varies depending on a number of factors, for example the composition, thickness and temperature of the material.
  • micro-arc oxidation also known as plasma electrolytic oxidation
  • Micro-arc oxidation is an electrochemical surface treatment process for generating oxide layers on metal surfaces.
  • a metal is immersed in a bath of electrolytic solution, typically a dilute alkali solution such as potassium hydroxide.
  • electrolytic solution typically a dilute alkali solution such as potassium hydroxide.
  • the casing is electrically connected so as to become one of the electrodes in the electrochemical cell, with the wall of the bath, typically formed of an inert material such as stainless steel, acting as the counter-electrode.
  • a potential is applied between the two electrodes, which may be continuous or pulsing, and direct current or alternating current.
  • oxide layers formed in the above manner are conversion coatings, converting the existing metal material into the oxide layer. This conversion of the metal provides a good adhesion of the oxide to the metal relative to oxide layers deposited on the metal as occurs using other methods.
  • Properties of the oxide layer such as porosity, hardness, colour, conductivity, wear resistance, toughness, corrosion resistance, thickness and adherence to the metal layer can be varied by varying the parameters of the electrochemical treatment.
  • Such parameters include the electrolyte (e.g. temperature and composition), the potential (e.g. pulse or continuous, direct current or alternating current, frequency, duration and voltage) and the processing time.
  • the resulting colour of a titanium dioxide layer can be altered by varying the voltage applied.
  • organic acid can be added to the electrolyte to allow for thicker oxide layers being formed.
  • a transfer film ( 160 ) as shown in FIG. 5 for example a polymer based transfer film, can then be applied to the metal oxide layer ( 150 ).
  • the porous nature of the metal oxide layer formed by the disclosed method can enhance the bonding between the transfer film and the metal oxide layer.
  • polymers that may be used in the transfer film include: polycarbonate (PC), polyethylene terephthalate (PET), glycol modified polyethylene terephthalate (PET-G), polyvinyl chloride (PVC), polyacrylic polymer such as polymethyl methacrylate (PMMA), polyphenylene sulphide (PPS) and UV ink.
  • PC polycarbonate
  • PET polyethylene terephthalate
  • PET-G glycol modified polyethylene terephthalate
  • PVC polyvinyl chloride
  • PMMA polymethyl methacrylate
  • PPS polyphenylene sulphide
  • UV ink UV ink.
  • the polymer based transfer film may contain inorganic or metallic nano-particles.
  • Examples of processes that can be used to apply the polymer based transfer film include: in-mould decoration, out-side mould decoration, in-mould film, in-mould label, release film and nano-imprint lithography.
  • the selection of the polymer based transfer film and its application process may depend on desired properties of the film. These properties may include: visual, tactual and textural effects, as well as functional properties such as UV-protection, anti-fingerprinting or anti-bacterial capability.
  • the oxide layer may undergo a pre-film treatment ( 125 ) prior to the application of the transfer film ( 130 ).
  • the pre-film treatment of the oxide layer ( 125 ) can be used to alter the visual, tactual and textural properties of the casing.
  • pre-film treatments include: baking, dyeing, painting, spray coating, sputter coating, electrophoretic deposition, nano-coating, chemical vapour deposition and physical vapour deposition.
  • FIGS. 4 and 5 show examples of a metal surface as it undergoes a method as shown in FIG. 1 .
  • FIG. 4 shows the metal surface ( 140 ) having a metal oxide layer ( 150 ) formed by the electrochemical treatment of the metal surface ( 120 ).
  • FIG. 5 shows a transfer film ( 160 ) on the metal oxide layer ( 150 ).
  • FIGS. 6 to 8 provide an example of a casing ( 180 ) for a smart phone at various stages of the method of FIG. 1 : FIG. 6 showing the casing having a metal surface ( 140 ); FIG. 7 showing the casing of FIG. 6 after electrochemical treatment ( 120 ); and FIG. 8 showing a transfer film ( 160 ) on the metal oxide layer ( 150 ) of the casing of FIG. 7 .

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.

Description

    PRIORITY INFORMATION
  • This application is a divisional application of U.S. application Ser. No. 15/021,476 filed on Mar. 11, 2016, which claims priority to International Application No. PCT/US2013/067734 filed on Oct. 31, 2013. The entire contents of which are incorporated herein by reference.
    • BACKGROUND
  • Devices such as mobile phones, tablets and portable (e.g. laptop or palm) computers are generally provided with a casing. The casing typically provides a number of functional features, e.g. protecting the device from damage.
  • Increasingly, consumers are also interested in the aesthetic properties of the casing such as the look, colour, and style. In addition, devices such as mobile phones, tablets and portable computers are typically designed for hand-held functionality, thus the consumer may also consider the weight of the device and the feel of the casing by which they hold the device.
    • BRIEF DESCRIPTION OF DRAWINGS
  • By way of non-limiting examples, device casings and processes of manufacturing such casings according to the present disclosure will be described with reference to the following drawings in which
  • FIG. 1 is a flow diagram illustrating an example of a method of applying a transfer film to a metal surface
  • FIG. 2 is a flow diagram illustrating another example of a method of applying a transfer film to a metal surface
  • FIG. 3 is a sectional side view of an example of a metal oxide layer on a metal produced by the electrochemical treatment of FIG. 1 or FIG. 2
  • FIG. 4 is a perspective view of the metal oxide layer of FIG. 3
  • FIG. 5 is a sectional side view of an example of a coated metal surface produced by the method of FIG. 1 or FIG. 2
  • FIG. 6 is a perspective view of an example of a metal casing with a part of the casing cut away
  • FIG. 7 is a perspective view of the casing of FIG. 6 after electrochemical treatment
  • FIG. 8 is a perspective view of the casing of FIG. 7 after transfer film
    •  DETAILED DESCRIPTION
  • The present disclosure describes a method of applying a transfer film to a metal surface, for example the metal surface of a casing for a device. The method comprises the formation of a metal oxide layer on the metal surface through an electrochemical treatment of the metal surface. The electrochemical treatment disclosed allows for a high degree of control in determining various physical and visual properties of the metal oxide layer. Furthermore, the metal oxide layer formed by the disclosed method provides a good adherence of the oxide to the metal.
  • The metal oxide layer formed by the disclosed methods is porous in nature. This porosity can enhance the bonding between the electrochemically treated surface and the transfer film compared to oxide layers formed by other methods.
  • Depending on the conditions of the electrochemical treatment and the metal being treated, the disclosed method can be used and may vary to form metal oxide layers of 1-300 μm in thickness and more preferably 3-50 μm in thickness. In comparison, metal oxide layers formed by other techniques are typically in the range of 0.001-0.1 μm.
  • FIGS. 1 and 2 illustrate examples of methods of transfer film a metal surface.
  • Referring to FIG. 1, a metal surface (140) is provided (110). The metal surface may be, for example, in the form of a casing for a device. The casing can be formed using conventional methods, such as stamping or moulding, into the desired shape of the finished product. In one example, the casing is formed of a light metal, such as aluminium, magnesium, titanium or alloys thereof.
  • The metal surface (140) is electrochemically treated (120) to form a metal oxide layer (150) such as that shown in FIG. 3. The electrochemical treatment includes applying a potential greater than the oxide layer's dielectric breakdown potential to the metal surface in an electrolytic solution.
  • The dielectric breakdown potential of a material is the voltage applied via an electric field that the material can withstand without breaking down. When a material such as a metal oxide is treated with a potential greater than its dielectric breakdown potential, the breakdown results in a disruptive discharge through the metal oxide.
  • The dielectric breakdown potential of a material varies depending on a number of factors, for example the composition, thickness and temperature of the material.
  • An example of a suitable electrochemical process includes micro-arc oxidation (also known as plasma electrolytic oxidation). Micro-arc oxidation is an electrochemical surface treatment process for generating oxide layers on metal surfaces.
  • In one example of micro-arc oxidation, a metal is immersed in a bath of electrolytic solution, typically a dilute alkali solution such as potassium hydroxide. The casing is electrically connected so as to become one of the electrodes in the electrochemical cell, with the wall of the bath, typically formed of an inert material such as stainless steel, acting as the counter-electrode. A potential is applied between the two electrodes, which may be continuous or pulsing, and direct current or alternating current.
  • As potentials used in micro-arc oxidation are greater than the dielectric breakdown potential of the metal oxide layer, disruptive discharges occur and the resulting high temperature, high pressure plasma modifies the structure of the oxide layer. This results in an oxide layer that is porous (as shown in FIG. 4) and with the oxide in a substantially crystalline form.
  • In addition, oxide layers formed in the above manner are conversion coatings, converting the existing metal material into the oxide layer. This conversion of the metal provides a good adhesion of the oxide to the metal relative to oxide layers deposited on the metal as occurs using other methods.
  • Properties of the oxide layer such as porosity, hardness, colour, conductivity, wear resistance, toughness, corrosion resistance, thickness and adherence to the metal layer can be varied by varying the parameters of the electrochemical treatment. Such parameters include the electrolyte (e.g. temperature and composition), the potential (e.g. pulse or continuous, direct current or alternating current, frequency, duration and voltage) and the processing time.
  • In one example, the resulting colour of a titanium dioxide layer can be altered by varying the voltage applied. In another example, organic acid can be added to the electrolyte to allow for thicker oxide layers being formed.
  • After electrochemically treating the metal surface (120), a transfer film (160) as shown in FIG. 5, for example a polymer based transfer film, can then be applied to the metal oxide layer (150). The porous nature of the metal oxide layer formed by the disclosed method can enhance the bonding between the transfer film and the metal oxide layer.
  • Examples of polymers that may be used in the transfer film include: polycarbonate (PC), polyethylene terephthalate (PET), glycol modified polyethylene terephthalate (PET-G), polyvinyl chloride (PVC), polyacrylic polymer such as polymethyl methacrylate (PMMA), polyphenylene sulphide (PPS) and UV ink. The polymer based transfer film may contain inorganic or metallic nano-particles.
  • Examples of processes that can be used to apply the polymer based transfer film include: in-mould decoration, out-side mould decoration, in-mould film, in-mould label, release film and nano-imprint lithography.
  • The selection of the polymer based transfer film and its application process may depend on desired properties of the film. These properties may include: visual, tactual and textural effects, as well as functional properties such as UV-protection, anti-fingerprinting or anti-bacterial capability.
  • Referring to FIG. 2, the oxide layer may undergo a pre-film treatment (125) prior to the application of the transfer film (130).
  • As with the polymer based transfer film, the pre-film treatment of the oxide layer (125) can be used to alter the visual, tactual and textural properties of the casing. Examples of pre-film treatments include: baking, dyeing, painting, spray coating, sputter coating, electrophoretic deposition, nano-coating, chemical vapour deposition and physical vapour deposition.
  • FIGS. 4 and 5 show examples of a metal surface as it undergoes a method as shown in FIG. 1. FIG. 4 shows the metal surface (140) having a metal oxide layer (150) formed by the electrochemical treatment of the metal surface (120). FIG. 5 shows a transfer film (160) on the metal oxide layer (150).
  • FIGS. 6 to 8 provide an example of a casing (180) for a smart phone at various stages of the method of FIG. 1: FIG. 6 showing the casing having a metal surface (140); FIG. 7 showing the casing of FIG. 6 after electrochemical treatment (120); and FIG. 8 showing a transfer film (160) on the metal oxide layer (150) of the casing of FIG. 7.
  • It will be appreciated that numerous variations and/or modifications may be made to the above-described examples, without departing from the broad general scope of the present disclosure. The present examples are, therefore, to be considered in all respects as illustrative and not restrictive.

Claims (15)

1. A method of applying a transfer film to a metal surface of a device casing, the method comprising:
treating the metal surface with an electrochemical treatment to form a metal oxide layer having a dielectric breakdown potential, the electrochemical treatment comprising:
applying a potential to the metal surface of the casing in an electrolytic solution, wherein the potential applied is greater than the dielectric breakdown potential of the metal oxide layer; and
applying a transfer film to the metal oxide layer.
2. The method according to claim 1, wherein applying the potential to the metal surface of the casing includes applying the potential to the metal surface utilizing pulsed direct current.
3. The method according to claim 1, wherein applying the potential to the metal surface of the casing includes a dilute alkali composition in the electrolytic solution.
4. The method according to claim 1, wherein applying the potential to the metal surface of the casing includes an organic acid in the electrolytic solution.
5. The method according to claim 3, wherein the dilute alkali composition includes potassium hydroxide.
6. The method according to claim 1, wherein the transfer film is a polymer-based transfer film.
7. The method according to claim 1, wherein the application of the transfer film includes applying a transfer film comprising polymer nano-particles, metallic nano-particles or a combination thereof.
8. The method according to claim 1, wherein the metal oxide layer undergoes a pre-film treatment prior to applying the transfer film to the metal oxide layer.
9. The method according to claim 1, wherein the transfer film comprises one of inorganic nano-particles, metallic nano-particles or a combination thereof.
10. The method according to claim 1, wherein the metal comprises aluminium, magnesium or titanium, or alloys thereof.
11. A method of applying a transfer film to a metal surface of a device casing, the method comprising:
treating the metal surface with a plasma electrolytic oxidation treatment to form a metal oxide layer having a dielectric breakdown potential, the plasma electrolytic oxidation treatment comprising:
applying a potential to the metal surface of the casing in an electrolytic solution, wherein the potential applied is greater than the dielectric breakdown potential of the metal oxide layer, and wherein the plasma electrolytic oxidation treatment forms a porous metal oxide layer; and
applying a polymer transfer film to the metal oxide layer.
12. The method of claim 11, wherein the porous metal oxide layer is altered by varying a voltage applied to the metal surface during the plasma electrolytic oxidation treatment, and wherein the porous metal oxide layer is titanium dioxide.
13. The method of claim 11, the method further comprising:
treating the metal oxide layer with a pre-film treatment prior to applying the transfer film to the metal oxide layer, wherein the pre-film treatment is used to alter a tactual property of the device casing.
14. An electrochemically treated casing for a device comprising:
a metal layer treated with the electrochemical treatment to form a metal oxide layer
the metal oxide layer having a dielectric breakdown potential formed by micro-arc oxidation of the metal layer, wherein the metal oxide layer is porous; and
a polymer transfer film on the metal oxide layer.
15. The casing of claim 14, wherein the metal layer comprises aluminium, magnesium or titanium, or alloys thereof.
US15/988,175 2013-10-31 2018-05-24 Method of applying a transfer film to metal surfaces Abandoned US20180267572A1 (en)

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PCT/US2013/067734 WO2015065420A1 (en) 2013-10-31 2013-10-31 Method of applying a transfer film to metal surfaces
US201615021476A 2016-03-11 2016-03-11
US15/988,175 US20180267572A1 (en) 2013-10-31 2018-05-24 Method of applying a transfer film to metal surfaces

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