CN107072070A - Ship step type circuit board manufacturing method - Google Patents
Ship step type circuit board manufacturing method Download PDFInfo
- Publication number
- CN107072070A CN107072070A CN201710050334.3A CN201710050334A CN107072070A CN 107072070 A CN107072070 A CN 107072070A CN 201710050334 A CN201710050334 A CN 201710050334A CN 107072070 A CN107072070 A CN 107072070A
- Authority
- CN
- China
- Prior art keywords
- layers
- copper
- hole
- etched
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention discloses a kind of stepped circuit board manufacturing method of ship, comprises the following steps：Sawing sheet, once drilling, electric plating of whole board, secondary outer-layer circuit, once one step press, anti-welding, internal layer circuit, second pressing, secondary drilling, outer-layer circuit, etching, secondary anti-welding, lettering symbol, outer-layer circuit, etching, three pressings, three drillings, ET, FQC, PK.Thereby, by between before first time presses L3 layers of L2 blind slot make, blind slot between L5 layers of L4 is made before being pressed second, and the graphic making of needs is come out before pressing using not gummosis PP, realize the making of ladder type circuit plate blind slot twice, the defect of blind slot twice can not be made by overcoming traditional circuit-board making, met the production requirement of ladder type circuit plate, made circuit board can be with inserted assembling.
Description
Technical field
The present invention relates to field of circuit boards technology, a kind of stepped circuit board manufacturing method of ship is referred in particular to.
Background technology
With the development of electronics industry, the packing density of electronic equipment is continuously increased, and function is constantly lifted and downsizing.Ship
The welding resisting layer on electronic romote-controller circuit board on oceangoing ship must be done in outermost layer, cause the complex process of circuit board, moreover, existing
Some ship remote controls are flat with circuit board, and space-consuming is big, must be fixed when mounted using bonding way；In order to subtract
Small remote control volume, using the inserted installation of ladder type circuit plate, can so have, it is necessary to be improved to its circuit board used
Effect reduces remote control overall volume, still, can only reach the mesh of blind slot using the deep gong of control using traditional process for manufacturing circuit board
, and the shape of needs can only could be made after pressing, blind slot purpose is reached using the deep gong of control, manufacture difficulty is big,
Complex process.Therefore, the preparation method of reply available circuit plate is improved, to solve the above problems.
The content of the invention
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of ship ladder to the present invention
Type circuit board manufacturing method, by between before first time presses L2-L3 layer blind slot make, in the preceding handle of second pressing
Blind slot is made between L4-L5 layers, is realized the making of ladder type circuit plate blind slot twice, is met the life of ladder type circuit plate
Production is required.
To achieve the above object, the present invention is using following technical scheme：
A kind of ship is comprised the following steps with stepped circuit board manufacturing method：
（1）Sawing sheet, takes PCB raw material to be cut, and the deburred on PCB sides after cutting is clean, carries out edging and circle
Angle, the product for completing to cut is toasted, and sheet material upper surface is L1 layers, and lower surface is L2 layers；
（2）Once drill, choose suitable drill bit, make drill spindle rotating speed and roll setting speed parameter, according to the demand of making
Bore L1 layers of-L2 layers of through hole, aperture >=0.3MM；
（3）Heavy copper：Adhere to one layer of chemical copper in the hole wall once drilled, be that electric plating of whole board is prepared；
（4）Electric plating of whole board：To complete the L1 layers of heavy copper, L2 layers clamped using conductive clip, in one layer of electricity of PCB chemical coppers surface increase
Removed after solution copper, hole copper >=25.4UM, face copper >=35UM；
（5）Secondary outer-layer circuit：Circuit is laid at L2 layers, the film is gone out according to solid plate coefficient, L1 layers of copper face are protected, increases rivet hole；
（6）Negative film is etched：Acid etching line is etched, only L2 layers of etching, etch copper 1 oz of thickness, and L1 layers are protected with dry film, are not etched；
（7）One step press：Suppressed using PP, meet L1-L2 layers of consent；Pressing separates PP and steel using mould release membrance for the first time
Plate；
（8）It is once anti-welding：Circuit welding resisting layer on silk-screen L2 layers（Apply dirty oil）；
（9）Sawing sheet：With L3 layers and L4 layers of FR4 sheet materials sawing sheet formation, wherein sheet material upper surface is L3 layers, and lower surface is L4 layers；
（10）Secondary drilling：Bore L3-L4 layers of peripheral positioning through hole；
（11）Internal layer circuit：L3 sandwich circuits are only done, L1 layers of copper face are protected, increase rivet hole；
（12）Internal layer is etched：L3 sandwich circuits are etched, L4 layers are protected with dry film, are not etched；
（13）L2 layers and L3 layers of bonding：L2 layers and L3 layers are bonded using not gummosis PP；
（14）Cut out PP：L2 layers and L3 layers of peripheral unnecessary PP are dismissed；
（15）PP drills：With 3.2mm drill bits brill positioning hole is placed in L1 layers and L2 layers outside；
（16）PP groove millings：Gong goes out L1-L2 layers of inside groove, the big unilateral 0.2mm of inside groove, and uses clockwise direction gong groove；
（17）Make L5 layers：Made using not gummosis PP；
（18）Cut out PP：L2 layers and L3 layers of peripheral unnecessary PP are dismissed；
（19）PP drills：With 3.2mm drill bits in boring positioning hole on L1 to L4 layers；
（20）PP groove millings：Gong goes out L1-L4 layers of inside groove, the big unilateral 0.2mm of inside groove, and uses clockwise direction gong groove；
（21）Riveted L1 to L4 layers：L1 to L4 layers is riveted together by above-mentioned rivet hole；
（22）Second pressing：L1 to L4 is laminated and closed, is made using the PP of not gummosis, pressure 250PSI gets out PP rivetings before pressing
Nail, PP blind slots, upwards, PP gongs before pressing go out blind slot during row's plate, and the rivet hole and PP that second pressing is used go out in shaping gong,
Blind hole arranges plate above during second pressing；
（23）Machine drilling：The hole of L1 to L4 layers of brill, aperture 0.3mm hole has checked whether PP powder consents；
（24）Heavy copper：Copper is sunk in machine drilling twice, radius-thickness ratio 3：1；
（25）Electric plating of whole board：Hole copper 6-10UM；
（26）Outer-layer circuit：The compensation of L4 sandwich circuits increases 1.2mil, and makees lead, and L1 layers are compensated by 1oz bottoms copper；
（27）Graphic plating：Electroplating parameter 18ASF*60MIN, hole copper 25um；
（28）It is anti-welding；
（29）Lettering is accorded with：In L4 layers of character silk printing, show for welding time zone minute mark, the product for completing printing is subjected to solidification baking
It is roasting, it is ensured that its word and PCB adhesion and heat resistance etc.；
（30）It is surface-treated IQC；
（31）Outer-layer circuit：The L4 layers of lead film；
（32）Lead is etched；
（33）Shaping：L1 to L5 layers is molded in flakes；
（34）Three pressings：L5 layers are pressed using not gummosis PP；
（35）Three drilling：Bore L5 layers of positioning hole, aperture 2.0MM；
（36）ET；
（37）FQC；
（38）PK.
It is used as a kind of preferred scheme：The heavy copper aperture is min0.3mml, and aspect ratio is 3:1.
It is used as a kind of preferred scheme：The first time is anti-welding and during second of welding masking developing, ink layer is downward.
It is used as a kind of preferred scheme：The electric plating of whole board parameter is 15ASF*30min.
The present invention has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technical proposal
Understand, by between before first time presses L2-L3 layer blind slot make, between second pressing is preceding L4-L5 layers
Blind slot is made, and the graphic making of needs is come out before pressing using not gummosis PP, realizes ladder type circuit plate twice
The making of blind slot, the defect of blind slot twice can not be made by overcoming traditional circuit-board making, meet the life of ladder type circuit plate
Production is required, circuit board is reduced ship electronic equipment volume with inserted assembling.
More clearly to illustrate the architectural feature and effect of the present invention, it is entered with specific embodiment below in conjunction with the accompanying drawings
Row is described in detail.
Brief description of the drawings
Fig. 1 is the finished product stratiform structural representation of the present invention.
Accompanying drawing identifier declaration：
L1, first layer
L2, first layer
L3, first layer
L4, first layer
L5, first layer.
Embodiment
The present invention, finished product layer structure as shown in figure 1, a kind of ship is with stepped circuit board manufacturing method, including
Have the following steps：
（1）Sawing sheet, takes PCB raw material to be cut, and the deburred on PCB sides after cutting is clean, carries out edging and circle
Angle, the product for completing to cut is toasted, and sheet material upper surface is L1 layers, and lower surface is L2 layers；
（2）Once drill, choose suitable drill bit, make drill spindle rotating speed and roll setting speed parameter, according to the demand of making
Bore L1 layers of-L2 layers of through hole, aperture >=0.3MM；
（3）Heavy copper：Adhere to one layer of chemical copper in the hole wall once drilled, be that electric plating of whole board is prepared；
（4）Electric plating of whole board：To complete the L1 layers of heavy copper, L2 layers clamped using conductive clip, in one layer of electricity of PCB chemical coppers surface increase
Removed after solution copper, hole copper >=25.4UM, face copper >=35UM；
（5）Secondary outer-layer circuit：Circuit is laid at L2 layers, the film is gone out according to solid plate coefficient, L1 layers of copper face are protected, increases rivet hole；
（6）Negative film is etched：Acid etching line is etched, only L2 layers of etching, etch copper 1 oz of thickness, and L1 layers are protected with dry film, are not etched；
（7）One step press：Suppressed using PP, meet L1-L2 layers of consent；Pressing separates PP and steel using mould release membrance for the first time
Plate；
（8）It is once anti-welding：Circuit welding resisting layer on silk-screen L2 layers（Apply dirty oil）；
（9）Sawing sheet：With L3 layers and L4 layers of FR4 sheet materials sawing sheet formation, wherein sheet material upper surface is L3 layers, and lower surface is L4 layers；
（10）Secondary drilling：Bore L3-L4 layers of peripheral positioning through hole；
（11）Internal layer circuit：L3 sandwich circuits are only done, L1 layers of copper face are protected, increase rivet hole；
（12）Internal layer is etched：L3 sandwich circuits are etched, L4 layers are protected with dry film, are not etched；
（13）L2 layers and L3 layers of bonding：L2 layers and L3 layers are bonded using not gummosis PP；
（14）Cut out PP：L2 layers and L3 layers of peripheral unnecessary PP are dismissed；
（15）PP drills：With 3.2mm drill bits brill positioning hole is placed in L1 layers and L2 layers outside；
（16）PP groove millings：Gong goes out L1-L2 layers of inside groove, the big unilateral 0.2mm of inside groove, and uses clockwise direction gong groove；
（17）Make L5 layers：Made using not gummosis PP；
（18）Cut out PP：L2 layers and L3 layers of peripheral unnecessary PP are dismissed；
（19）PP drills：With 3.2mm drill bits in boring positioning hole on L1 to L4 layers；
（20）PP groove millings：Gong goes out L1-L4 layers of inside groove, the big unilateral 0.2mm of inside groove, and uses clockwise direction gong groove；
（21）Riveted L1 to L4 layers：L1 to L4 layers is riveted together by above-mentioned rivet hole；
（22）Second pressing：L1 to L4 is laminated and closed, is made using the PP of not gummosis, pressure 250PSI gets out PP rivetings before pressing
Nail, PP blind slots, upwards, PP gongs before pressing go out blind slot during row's plate, and the rivet hole and PP that second pressing is used go out in shaping gong,
Blind hole arranges plate above during second pressing；
（23）Machine drilling：The hole of L1 to L4 layers of brill, aperture 0.3mm hole has checked whether PP powder consents；
（24）Heavy copper：Copper is sunk in machine drilling twice, radius-thickness ratio 3：1；
（25）Electric plating of whole board：Hole copper 6-10UM；
（26）Outer-layer circuit：The compensation of L4 sandwich circuits increases 1.2mil, and makees lead, and L1 layers are compensated by 1oz bottoms copper；
（27）Graphic plating：Electroplating parameter 18ASF*60MIN, hole copper 25um；
（28）It is anti-welding；
（29）Lettering is accorded with：In L4 layers of character silk printing, show for welding time zone minute mark, the product for completing printing is subjected to solidification baking
It is roasting, it is ensured that its word and PCB adhesion and heat resistance etc.；
（30）It is surface-treated IQC；
（31）Outer-layer circuit：The L4 layers of lead film；
（32）Lead is etched；
（33）Shaping：L1 to L5 layers is molded in flakes；
（34）Three pressings：L5 layers are pressed using not gummosis PP；
（35）Three drilling：Bore L5 layers of positioning hole, aperture 2.0MM；
（36）ET；
（37）FQC；
（38）PK.
It should be noted that, shaping, gong PP programs clockwise, drill bit 3.2mm, and post forming gong L1-L4 justify every time
Positioned during cake with double faced adhesive tape.
The design focal point of the present invention is, by between before first time presses L2-L3 layers blind slot make, the
Blind slot between L4-L5 layers is made before second pressing, and the graphic making of needs gone out before pressing using not gummosis PP
Come, realize the making of ladder type circuit plate blind slot twice, the defect of blind slot twice can not be made by overcoming traditional circuit-board and making,
The production requirement of ladder type circuit plate is met, circuit board is reduced ship electronic equipment volume with inserted assembling.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore every technical spirit according to the present invention is to any subtle modifications, equivalent variations and modifications made for any of the above embodiments, still
Belong in the range of technical solution of the present invention.
Claims (4)
1. a kind of ship step type circuit board manufacturing method, it is characterised in that：Comprise the following steps：
（1）Sawing sheet, takes PCB raw material to be cut, and the deburred on PCB sides after cutting is clean, carries out edging and circle
Angle, the product for completing to cut is toasted, and sheet material upper surface is L1 layers, and lower surface is L2 layers；
（2）Once drill, choose suitable drill bit, make drill spindle rotating speed and roll setting speed parameter, according to the demand of making
Bore L1 layers of-L2 layers of through hole, aperture >=0.3MM；
（3）Heavy copper：Adhere to one layer of chemical copper in the hole wall once drilled, be that electric plating of whole board is prepared；
（4）Electric plating of whole board：To complete the L1 layers of heavy copper, L2 layers clamped using conductive clip, in one layer of electricity of PCB chemical coppers surface increase
Removed after solution copper, hole copper >=25.4UM, face copper >=35UM；
（5）Secondary outer-layer circuit：Circuit is laid at L2 layers, the film is gone out according to solid plate coefficient, L1 layers of copper face are protected, increases rivet hole；
（6）Negative film is etched：Acid etching line is etched, only L2 layers of etching, etch copper 1 oz of thickness, and L1 layers are protected with dry film, are not etched；
（7）One step press：Suppressed using PP, meet L1-L2 layers of consent；Pressing separates PP and steel using mould release membrance for the first time
Plate；
（8）It is once anti-welding：Circuit welding resisting layer on silk-screen L2 layers（Apply dirty oil）；
（9）Sawing sheet：With L3 layers and L4 layers of FR4 sheet materials sawing sheet formation, wherein sheet material upper surface is L3 layers, and lower surface is L4 layers；
（10）Secondary drilling：Bore L3-L4 layers of peripheral positioning through hole；
（11）Internal layer circuit：L3 sandwich circuits are only done, L1 layers of copper face are protected, increase rivet hole；
（12）Internal layer is etched：L3 sandwich circuits are etched, L4 layers are protected with dry film, are not etched；
（13）L2 layers and L3 layers of bonding：L2 layers and L3 layers are bonded using not gummosis PP；
（14）Cut out PP：L2 layers and L3 layers of peripheral unnecessary PP are dismissed；
（15）PP drills：With 3.2mm drill bits brill positioning hole is placed in L1 layers and L2 layers outside；
（16）PP groove millings：Gong goes out L1-L2 layers of inside groove, the big unilateral 0.2mm of inside groove, and uses clockwise direction gong groove；
（17）Make L5 layers：Made using not gummosis PP；
（18）Cut out PP：L2 layers and L3 layers of peripheral unnecessary PP are dismissed；
（19）PP drills：With 3.2mm drill bits in boring positioning hole on L1 to L4 layers；
（20）PP groove millings：Gong goes out L1-L4 layers of inside groove, the big unilateral 0.2mm of inside groove, and uses clockwise direction gong groove；
（21）Riveted L1 to L4 layers：L1 to L4 layers is riveted together by above-mentioned rivet hole；
（22）Second pressing：L1 to L4 is laminated and closed, is made using the PP of not gummosis, pressure 250PSI gets out PP rivetings before pressing
Nail, PP blind slots, upwards, PP gongs before pressing go out blind slot during row's plate, and the rivet hole and PP that second pressing is used go out in shaping gong,
Blind hole arranges plate above during second pressing；
（23）Machine drilling：The hole of L1 to L4 layers of brill, aperture 0.3mm hole has checked whether PP powder consents；
（24）Heavy copper：Copper is sunk in machine drilling twice, radius-thickness ratio 3：1；
（25）Electric plating of whole board：Hole copper 6-10UM；
（26）Outer-layer circuit：The compensation of L4 sandwich circuits increases 1.2mil, and makees lead, and L1 layers are compensated by 1oz bottoms copper；
（27）Graphic plating：Electroplating parameter 18ASF*60MIN, hole copper 25um；
（28）It is anti-welding；
（29）Lettering is accorded with：In L4 layers of character silk printing, show for welding time zone minute mark, the product for completing printing is subjected to solidification baking
It is roasting, it is ensured that its word and PCB adhesion and heat resistance etc.；
（30）It is surface-treated IQC；
（31）Outer-layer circuit：The L4 layers of lead film；
（32）Lead is etched；
（33）Shaping：L1 to L5 layers is molded in flakes；
（34）Three pressings：L5 layers are pressed using not gummosis PP；
（35）Three drilling：Bore L5 layers of positioning hole, aperture 2.0MM；
（36）ET；
（37）FQC；
（38）PK.
2. ship according to claim 1 step type circuit board manufacturing method, it is characterised in that：The heavy copper aperture is
0.3mml, aspect ratio is 3:1.
3. ship according to claim 1 step type circuit board manufacturing method, it is characterised in that：The first time is anti-welding
During with second of welding masking developing, ink layer is downward.
4. ship according to claim 1 step type circuit board manufacturing method, it is characterised in that：The electric plating of whole board ginseng
Number is 15ASF*30min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710050334.3A CN107072070B (en) | 2017-01-23 | 2017-01-23 | The stepped circuit board manufacturing method of ship |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710050334.3A CN107072070B (en) | 2017-01-23 | 2017-01-23 | The stepped circuit board manufacturing method of ship |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107072070A true CN107072070A (en) | 2017-08-18 |
| CN107072070B CN107072070B (en) | 2019-05-03 |
Family
ID=59598420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710050334.3A Active CN107072070B (en) | 2017-01-23 | 2017-01-23 | The stepped circuit board manufacturing method of ship |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072070B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401689A (en) * | 1992-12-21 | 1995-03-28 | Motorola, Inc. | Method for forming a semiconductor chip carrier |
| CN102348337A (en) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | Method for producing circuit board containing stepped blind hole |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN103391682A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | Method for processing PCB with step groove |
-
2017
- 2017-01-23 CN CN201710050334.3A patent/CN107072070B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401689A (en) * | 1992-12-21 | 1995-03-28 | Motorola, Inc. | Method for forming a semiconductor chip carrier |
| CN102348337A (en) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | Method for producing circuit board containing stepped blind hole |
| CN103391682A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | Method for processing PCB with step groove |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107072070B (en) | 2019-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100467825B1 (en) | A build-up printed circuit board with via-holes of stack type and a manufacturing method thereof | |
| CN106961808B (en) | The production method of sunk type high density interconnecting board | |
| CN102065648B (en) | Double-sided circuit board and interconnection conduction method thereof | |
| CN104394658B (en) | Rigid-flex circuit board and preparation method thereof | |
| CN104427786A (en) | Processing method of printed circuit board | |
| CN105704948B (en) | The production method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN107592735A (en) | Thick desired ladder board manufacturing method more than a kind of high accuracy | |
| CN109275268A (en) | A kind of PCB back drill production method being less than 0.15mm for medium thickness | |
| CN107660069A (en) | A kind of PCB plate production method with half bore | |
| CN102883524A (en) | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method | |
| CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
| WO2012065376A1 (en) | Substrate of printed circuit board and manufacturing method thereof | |
| CN100518444C (en) | Method for forming through-hole that utilizes lazer drill | |
| CN105657992A (en) | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design | |
| CN201639852U (en) | Bowl hole type double-side printed-wiring board | |
| CN101711098A (en) | Twice laminating technique of flexible printed circuits | |
| CN107072070A (en) | Ship step type circuit board manufacturing method | |
| CN110461085B (en) | Circuit board capable of realizing crimping of components in stepped groove and manufacturing method thereof | |
| CN202190454U (en) | Interconnected conducting and heat-conducting structure of double-sided circuit board | |
| CN201616952U (en) | Double-faced circuit board | |
| CN111447750B (en) | Manufacturing method of ultra-thick copper PCB | |
| CN108738235A (en) | A kind of mechanical blind hole method for manufacturing circuit board | |
| CN209882237U (en) | Blind buried orifice plate structure | |
| CN107787131A (en) | A kind of preparation method of multilayer copper base | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |