CN107053618A - 一种集成电路塑封模注射系统 - Google Patents

一种集成电路塑封模注射系统 Download PDF

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Publication number
CN107053618A
CN107053618A CN201710134760.5A CN201710134760A CN107053618A CN 107053618 A CN107053618 A CN 107053618A CN 201710134760 A CN201710134760 A CN 201710134760A CN 107053618 A CN107053618 A CN 107053618A
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CN
China
Prior art keywords
injection
seat
pressing plate
integrated circuit
plastic packaging
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Pending
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CN201710134760.5A
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English (en)
Inventor
孙明华
许方宏
王传玉
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ANHUI BRILLIANT LITTLE ELECTRONICS Co Ltd
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ANHUI BRILLIANT LITTLE ELECTRONICS Co Ltd
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Application filed by ANHUI BRILLIANT LITTLE ELECTRONICS Co Ltd filed Critical ANHUI BRILLIANT LITTLE ELECTRONICS Co Ltd
Priority to CN201710134760.5A priority Critical patent/CN107053618A/zh
Publication of CN107053618A publication Critical patent/CN107053618A/zh
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/53Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
    • B29C45/535Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston using two or more cooperating injection rams, e.g. coaxially or alternately operating rams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

本发明及半导体塑封设备领域,具体涉及一种集成电路塑封模注射系统,包括锁板、压板、注塑座、浮动座、盖柄、注射杆和注射头;所述的注塑座置于本系统的最底层;所述的压板设在所述注塑座上端并与注塑座形成空腔;所述的锁板设在所述的压板和盖柄之间;设在所述空腔内的是弹簧;所述的注射杆的一端连接在弹簧内,另一端与所述的注射头相连。本发明采用锁板将注射杆、压板和盖柄三者连接在一起,后期维护时,只需要松开锁板即可实现快换,偏于维护。整体系统采用浮动结构,以保证各个注射头在注射时压力均衡,确保注射模具内型腔充满。

Description

一种集成电路塑封模注射系统
技术领域
本发明及半导体塑封设备领域,具体涉及一种集成电路塑封模注射系统。
背景技术
注射头是指半导体塑封模注塑时与料筒配合加压压注塑封料让其通过流道浇口进入型腔形成产品的一个装置。现有的注射头多数为整体固定式,当注射头长度增加时,侧面与料筒内壁配合面大,增加阻力或者干涉,影响正常使用及降低寿命;当注射头长度减短时,侧面与料筒内壁配合面小,无法保证配合导向的精度,影响正常使用,还会降低注射头的使用寿命,除以上外,整体固定式的注射装置拆卸麻烦,更换时必须整体更换,不能单独零件更换。
发明内容
本发明的目的就是克服现有技术的不足而提供的一种便于维修的浮动式集成电路塑封模注射系统。
为解决上述技术问题,本发明采取如下技术方案:
一种集成电路塑封模注射系统,包括锁板、压板、注塑座、浮动座、盖柄、注射杆和注射头;所述的注塑座置于本系统的最底层;所述的压板设在所述注塑座上端并与注塑座形成空腔;所述的锁板设在所述的压板和盖柄之间;设在所述空腔内的是弹簧;所述的注射杆的一端连接在弹簧内,另一端与所述的注射头相连。
优选地,所述的注射杆为多个。
与现有技术相比,本发明的有益效果为:
本发明采用锁板将注射杆、压板和盖柄三者连接在一起,后期维护时,只需要松开锁板即可实现快换,偏于维护。整体系统采用浮动结构,以保证各个注射头在注射时压力均衡,确保注射模具内型腔充满。
附图说明
图1为本发明结构示意图。
具体实施方式
参见附图1所示,一种集成电路塑封模注射系统,包括锁板1、压板2、注塑座8、浮动座4、盖柄5、注射杆6和注射头7;所述的注塑座8置于本系统的最底层;所述的压板2设在所述注塑座8上端并与注塑座8形成空腔3;所述的锁板1设在所述的压板2和盖柄5之间;设在所述空腔3内的是弹簧9;所述的注射杆6的一端连接在弹簧9内,另一端与所述的注射头7相连。
优选地,所述的注射杆6为多个。
使用过程中,注塑座8与塑封注射装置连接,注射头7与注射模具相连,物料从空腔3进入注射杆6内,并从注射头7注射到注射模具内,当多个注射头7在注射过程中,注射头7在受到压力时,压力传给另一端连接的弹簧9,弹簧9对注射头所受的压力起调节作用,以保证注射时压力均衡,对模腔填充一致并充满。在维修方面,本发明采用锁板1将注射杆6、压板2和盖柄5三者连接在一起,后期维护时,只需要松开锁板1即可实现快换,偏于维护。整体机构设计合理,满足集成电路塑封的生产需要。

Claims (2)

1.一种集成电路塑封模注射系统,其特征在于:包括锁板(1)、压板(2)、注塑座(8)、浮动座(4)、盖柄(5)、注射杆(6)和注射头(7);所述的注塑座(8)置于本系统的最底层;所述的压板(2)设在所述注塑座(8)上端并与注塑座(8)形成空腔(3);所述的锁板(1)设在所述的压板(2)和盖柄(5)之间;设在所述空腔(3)内的是弹簧(9);所述的注射杆(6)的一端连接在弹簧(9)内,另一端与所述的注射头(7)相连。
2.根据权利要求1所述的一种集成电路塑封模注射系统,其特征在于:所述的注射杆(6)为多个。
CN201710134760.5A 2017-03-08 2017-03-08 一种集成电路塑封模注射系统 Pending CN107053618A (zh)

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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351113A (ja) * 1989-07-20 1991-03-05 Nissan Motor Co Ltd 射出圧縮成形金型のゲートシール装置
US5501587A (en) * 1993-09-04 1996-03-26 Han-Mi Mold & Tool, Co., Ltd. Molding machine for semiconductor package
EP0800908A1 (de) * 1996-04-12 1997-10-15 HERBST, Richard Verfahren und Vorrichtung zum Spritzgiessen von Kunststoffteilen
US20030209817A1 (en) * 2002-05-07 2003-11-13 Samsung Electronics Co., Ltd. Apparatus and method for molding simultaneously a plurality of semiconductor devices
CN101866865A (zh) * 2009-04-14 2010-10-20 深圳市劲升迪龙科技发展有限公司 一种封装模具及其封装方法
CN202448314U (zh) * 2011-12-31 2012-09-26 天水华天微电子股份有限公司 一种整体式mgp塑封模具注塑头
CN102909825A (zh) * 2012-10-25 2013-02-06 成都中科精密模具有限公司 半导体塑封模具的独立多缸、等压、同步液压注塑系统
CN102990879A (zh) * 2012-12-07 2013-03-27 铜陵三佳山田科技有限公司 用于mgp模的快换式注射机构
CN104002423A (zh) * 2014-05-16 2014-08-27 铜陵三佳山田科技有限公司 用于集成电路塑料封装模具的防粉尘注射机构
CN204526033U (zh) * 2014-12-09 2015-08-05 南通富士通微电子股份有限公司 便于安装拆卸的注射装置
CN206568505U (zh) * 2017-03-08 2017-10-20 安徽国晶微电子有限公司 一种集成电路塑封模注射系统

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351113A (ja) * 1989-07-20 1991-03-05 Nissan Motor Co Ltd 射出圧縮成形金型のゲートシール装置
US5501587A (en) * 1993-09-04 1996-03-26 Han-Mi Mold & Tool, Co., Ltd. Molding machine for semiconductor package
EP0800908A1 (de) * 1996-04-12 1997-10-15 HERBST, Richard Verfahren und Vorrichtung zum Spritzgiessen von Kunststoffteilen
US20030209817A1 (en) * 2002-05-07 2003-11-13 Samsung Electronics Co., Ltd. Apparatus and method for molding simultaneously a plurality of semiconductor devices
CN101866865A (zh) * 2009-04-14 2010-10-20 深圳市劲升迪龙科技发展有限公司 一种封装模具及其封装方法
CN202448314U (zh) * 2011-12-31 2012-09-26 天水华天微电子股份有限公司 一种整体式mgp塑封模具注塑头
CN102909825A (zh) * 2012-10-25 2013-02-06 成都中科精密模具有限公司 半导体塑封模具的独立多缸、等压、同步液压注塑系统
CN102990879A (zh) * 2012-12-07 2013-03-27 铜陵三佳山田科技有限公司 用于mgp模的快换式注射机构
CN104002423A (zh) * 2014-05-16 2014-08-27 铜陵三佳山田科技有限公司 用于集成电路塑料封装模具的防粉尘注射机构
CN204526033U (zh) * 2014-12-09 2015-08-05 南通富士通微电子股份有限公司 便于安装拆卸的注射装置
CN206568505U (zh) * 2017-03-08 2017-10-20 安徽国晶微电子有限公司 一种集成电路塑封模注射系统

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