CN107020285B - Ultrasonic cleaning device and substrate processing system - Google Patents
Ultrasonic cleaning device and substrate processing system Download PDFInfo
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- CN107020285B CN107020285B CN201710258646.3A CN201710258646A CN107020285B CN 107020285 B CN107020285 B CN 107020285B CN 201710258646 A CN201710258646 A CN 201710258646A CN 107020285 B CN107020285 B CN 107020285B
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- 239000000758 substrate Substances 0.000 title claims abstract description 96
- 238000012545 processing Methods 0.000 title claims abstract description 68
- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 54
- 238000007664 blowing Methods 0.000 claims abstract description 33
- 239000012535 impurity Substances 0.000 claims abstract description 27
- 238000004140 cleaning Methods 0.000 claims abstract description 25
- 238000000605 extraction Methods 0.000 claims abstract description 11
- 230000010355 oscillation Effects 0.000 claims abstract description 8
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims description 18
- 230000000694 effects Effects 0.000 claims description 12
- 238000012544 monitoring process Methods 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 description 44
- 238000000034 method Methods 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- 238000010926 purge Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/04—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides an ultrasonic cleaning device and a substrate processing system, and relates to the technical field of display. The ultrasonic cleaning device comprises an air blowing unit, a cleaning unit and a cleaning unit, wherein the air blowing unit is used for spraying air flow to the surface of an object to be cleaned; an ultrasonic oscillation generator for oscillating the air flow ejected from the air blowing unit; and the air extraction unit is used for collecting impurities swept out from the surface of the object to be cleaned.
Description
Technical Field
The invention relates to the technical field of display, in particular to an ultrasonic cleaning device and a substrate processing system.
Background
The surface of the substrate needs to be cleaned during the manufacturing process of the display product in order to further process the substrate. Since the surface of the substrate is not absolutely smooth but has many very tiny gaps, foreign particles (particles) and the like enter the gaps, and the foreign particles in the gaps are difficult to be blown out by blowing the impurities through the existing blowing device forming the air knife, so that a large amount of impurity residues (Remain) are generated on the surface of the substrate when the substrate is further processed, and the product quality is influenced.
Disclosure of Invention
In view of the above, embodiments of the present invention provide an ultrasonic cleaning apparatus and a substrate processing system, in which the ultrasonic cleaning apparatus has high cleaning efficiency for purging a substrate, and when the cleaning apparatus is applied to a substrate processing system, the cleaning efficiency of the substrate entering the processing apparatus can be significantly improved, and a large amount of impurities left on the surface of the substrate after processing can be avoided.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
in one aspect, an embodiment of the present invention provides an ultrasonic cleaning apparatus, including an air blowing unit, configured to blow an air flow toward a surface of an object to be cleaned; an ultrasonic oscillation generator for oscillating the air flow ejected from the air blowing unit; and the air extraction unit is used for collecting impurities swept out from the surface of the object to be cleaned.
Optionally, the blowing unit comprises a pressure chamber and a gas supply end; wherein, an air inlet and a nozzle are arranged on the pressure cavity; the gas supply end is communicated with the gas inlet and is used for providing gas into the pressure cavity; the nozzle is used for spraying airflow to the surface of an object to be cleaned.
Optionally, the air extraction unit includes an adsorption cavity, a connecting pipeline and an air extraction assembly; the air exhaust assembly is used for generating negative pressure in the adsorption cavity through the connecting pipeline; the adsorption cavity is provided with a suction inlet for collecting impurities swept out from the surface of the object to be cleaned through the suction inlet.
Preferably, the air exhaust assembly comprises a vacuum pump for generating a vacuum adsorption effect in the adsorption cavity.
Preferably, the nozzle comprises a slit nozzle; the suction chamber in the suction unit is provided at least one of both sides in a length direction of the slit nozzle.
Preferably, the nozzle comprises a slit nozzle; the ultrasonic oscillation generator is disposed in the pressure chamber and located at least one of both sides of the slit nozzle in the length direction.
Preferably, the opening of the nozzle and the opening of the suction port are arranged in the same plane.
In another aspect, an embodiment of the present invention further provides a substrate processing system, including a processing apparatus for processing a substrate; the substrate processing system further comprises any one of the ultrasonic cleaning devices arranged at the inlet of the substrate to be processed into the processing device, and the ultrasonic cleaning device is used for cleaning the surface to be processed of the substrate to be processed.
Optionally, the processing apparatus comprises a load lock chamber; the ultrasonic cleaning device is arranged on a door of the load lock chamber; the processing device also comprises a driving cylinder for driving the door of the load locking chamber to open and close and a supply cylinder for supplying compressed gas to the driving cylinder; the driving cylinder comprises a cylinder exhaust port; the air cylinder exhaust port and the air supply cylinder are communicated with an air blowing unit of the ultrasonic cleaning device and used for supplying air to the air blowing unit.
Preferably, the driving cylinder further comprises a cylinder body, a cylinder air inlet, a connecting rod and a piston; the cylinder air inlet and the cylinder air outlet are both arranged on the cylinder body; the piston is arranged in the cylinder body; one end of the connecting rod is arranged in the cylinder body and connected with the piston, and the other end of the connecting rod is arranged outside the cylinder body and connected with a door of the load locking chamber and used for driving the door to open and close; the processing device also comprises a flow controller; the air supply cylinder is communicated with the air inlet of the air cylinder and the air blowing unit through the flow controller; the substrate processing system further comprises a first pipeline for communicating the air cylinder exhaust port with the flow controller; a filter is arranged on the first pipeline; and/or the substrate processing system also comprises an exhaust gas processing unit communicated with the air outlet of the air cylinder.
Preferably, the gas supply end of the ultrasonic cleaning device comprises a negative pressure device communicated with the atmosphere; the negative pressure device provides air for the pressure cavity.
Preferably, the substrate processing system further comprises a monitoring sensor for monitoring the opening and closing of a door of the load lock chamber; and the controller is connected with the monitoring sensor and is used for receiving signals of opening or closing the door, so that the ultrasonic cleaning device is controlled to start to work when the door is opened and is controlled to stop working when the door is closed.
Based on this, with the ultrasonic cleaning apparatus provided by the embodiment of the present invention, the sheet of Air flow formed in the Air blowing unit like an Air Knife (Air Knife) is blown to the surface of the substrate to be cleaned, and then the suction unit is used to suck away the particulate impurities, thereby reducing the substrate processing failure caused by the impurity residue. In addition, the cleaning device utilizes the airflow of ultrasonic resonance to sweep and clean the surface of the object, and the cleaning device is not in direct contact with the object to be cleaned, so that other defects of the product are avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultrasonic cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing a basic configuration of a dry etching apparatus according to the prior art;
FIG. 3 is a first schematic diagram of a substrate processing system according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating a substrate configuration of a processing apparatus in a substrate processing system according to an embodiment of the present invention;
fig. 5 is a schematic view illustrating gas recycling of a substrate processing system according to embodiment 1 of the present invention;
fig. 6 is a second schematic diagram of a basic configuration of a substrate processing system according to embodiment 1 of the present invention.
Reference numerals:
01-a substrate processing system; 10-ultrasonic cleaning device; 11-a blowing unit; 110-a pressure chamber; 110 a-an air inlet; 110 b-a nozzle; 111-gas supply end; 12-an ultrasonic oscillation generator; 13-an air extraction unit; 130-an adsorption cavity; 130 a-suction inlet; 131-connecting pipeline; 132-a pumping assembly; 20-a processing device; 21-entrance (door); 22-a driving cylinder; 220-a cylinder body; 221-cylinder exhaust port; 222-cylinder intake ports; 223-connecting rod; 224-a piston; 23-a supply cylinder; 24-a flow controller; 25-a first conduit; 26-a filter; 27-an exhaust gas treatment unit; 28-gas control valve; 30-a detection sensor; 02-a substrate; 03-impurities.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is to be noted that, unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of the present invention have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
For example, the use of the terms "comprises" or "comprising" and the like in the description and in the claims of the present patent application means that the element or item presented before the term covers the element or item listed after the term and its equivalents, and not the exclusion of other elements or items. The terms "one side", "the other side" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only used for convenience of simplifying the description of the technical solution of the present invention, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention.
As shown in fig. 1, an embodiment of the present invention provides an ultrasonic cleaning apparatus 10, where the apparatus 10 includes an air blowing unit 11 for blowing an air flow toward a surface of an object to be cleaned (e.g., a substrate 02); an ultrasonic oscillation generator 12 for oscillating the air flow ejected from the air blowing unit 11; and the air exhaust unit 13 is used for collecting impurities 03 blown out of the surface of the object to be cleaned.
It should be noted that the air flow ejected from the air blowing unit 11 resonates with the Ultrasonic wave emitted from the Ultrasonic wave Generator (Ultrasonic Generator)12, so that the ejected air flow has a large energy to "shake out" the granular impurities 03 hidden in the crevices on the surface of the object to be cleaned; and then the impurities 03 vibrated out are sucked away and collected under the negative pressure action of the air pumping unit 13, so that the granular impurities 03 are prevented from being vibrated out from one gap and then falling into another gap again.
Referring to fig. 1, the cleaning apparatus has an internal flow for blowing a gas flow sheet (indicated by a double-headed arrow) like an Air Knife (Air Knife) from a blowing unit 11 onto the surface of a substrate 02 to be cleaned, and then sucking off the particulate impurities 03 by using a suction unit 13, thereby reducing substrate processing defects due to impurity residues. In addition, the cleaning device utilizes the airflow of ultrasonic resonance to sweep and clean the surface of the object, and the cleaning device is not in direct contact with the object to be cleaned, so that other defects of the product are avoided.
In addition, the purging principle of the ultrasonic cleaning device 10 provided by the embodiment of the present invention is that the resonance effect of the ultrasonic waves and the gas is utilized, so that the ultrasonic cleaning device (Ultra Sonic Cleaner, abbreviated as USC) without an air exhaust structure in the existing production line process can be replaced, the budget for purchasing the existing USC equipment is saved, and the equipment cost of the manufacturer is reduced.
The above units are specifically constituted as follows:
air blowing unit
Referring to fig. 1, the air blowing unit 11 specifically includes a pressure chamber 110 and a gas supply port 111; wherein, the pressure chamber 110 is provided with an air inlet 110a and a nozzle 110 b; the gas supply end 111 communicates with the gas inlet 110a for supplying gas into the pressure chamber 110; the nozzle 110b is used to eject an air flow toward the surface of the object 02 to be cleaned.
In fig. 1, only the pressure chamber 110 is illustrated as being provided with the air inlet 110a and the nozzle 110b, the specific location of the air inlet 110a includes, but is not limited to, being located right above the nozzle 110b illustrated in the figure, and may also be located at other locations on the pressure chamber 110, for example, being located on a chamber wall of the pressure chamber 110 in the paper direction, that is, located above the side of the nozzle 110b, and the specific structure may follow the related devices adopting the same principle in the prior art, which is not limited in this embodiment of the present invention.
Air extraction unit
Referring to fig. 1, the air pumping unit 13 specifically includes an adsorption cavity 130, a connecting pipe 131 and an air pumping assembly 132; the air extraction assembly 132 is used for generating negative pressure in the adsorption cavity 130 through the connecting pipeline 131; the adsorption chamber 130 is provided with a suction port 130a for collecting the impurities 03 blown out from the surface of the object 02 to be cleaned through the suction port 130 a.
The pumping assembly 132 may be a vacuum pump, and is configured to generate a vacuum absorption effect in the absorption cavity 130.
Fig. 1 only illustrates a case where the ultrasonic cleaning apparatus 10 includes two air extraction units 13, and the number of the units is not limited in the embodiment of the present invention. Also, in the case where two evacuation units 13 are included as illustrated in FIG. 1 above, the two adsorption chambers 130 may be in communication with two independent evacuation assemblies 132, respectively (i.e., as shown in the figures); alternatively, a plurality of adsorption chambers 130 may share a suction assembly 132, and the specific structure may follow the related devices using the same principle in the prior art, which is not limited by the embodiment of the present invention.
Specifically, the inner flow of the cleaning apparatus 01 is to form an air knife from a Pressure Chamber (Pressure Chamber)110 to blow air onto the surface of the substrate 02 (i.e., at the Boundary Layer where the Particles exist), and then suck the particulate impurities 03 from the adsorption Chamber (Vacuum Chamber) 130.
Further, referring to fig. 1, the nozzle 110b is embodied as a slit nozzle; the adsorption chamber 130 in the above-described evacuation unit 13 is provided at least one of both sides in the longitudinal direction of the slit nozzle.
That is, the slit nozzle performs purging toward the center of the substrate 02 to be cleaned, and the impurities 03 oscillated are sucked away by the adsorption chamber 130 provided at least one of both sides to further improve the cleaning effect.
Further, referring to fig. 1, the opening of the nozzle 110b and the opening of the suction port 130a may be disposed in the same plane to ensure an optimal cleaning effect.
Further, referring to fig. 1, the nozzle 110b is embodied as a slit nozzle; the ultrasonic oscillation generator 12 is disposed in the pressure chamber 110 at least at one of both sides of the slit nozzle in the longitudinal direction, thereby ensuring that the gas flow ejected from the gas blowing unit 11 is sufficiently oscillated to improve the purging and cleaning effect of the substrate 02.
Further, in the prior art, the surface of a Glass (Glass) substrate is exposed to the atmosphere for a long time, and impurity particles are easily drifted off from the surface of the substrate during the transportation and placement processes and adhered to the surface of the substrate, and then a large amount of impurity residues are generated on the surface of a product through processes such as etching the substrate.
Taking a Dry etching apparatus (Dry Etcher) as an example, as shown in fig. 2, a conventional process flow is as follows: the atmospheric robot transfers the glass substrate from each Port (P in the drawing) of the cassette (Index)1、P2And P3Etc.), the substrate is taken out, cleaned by a conventional USC, transferred by a Load-Lock Chamber (L/L) in a dry etching apparatus, and transferred by a Transfer Module (T/M) to a Process Chamber (P/C) for etching Process (Etch), wherein only 3P/cs are shown in the figure, respectively marked as P/C-1, P/C-2, and P/C-3, and the specific number is not limited. The processed glass substrate is conveyed out of the dry etching equipment through the conveying assembly and the load locking chamber again, and is conveyed to the next processing link through the atmospheric manipulator, and each reciprocating conveying path of the glass substrate is shown as an arrow in the figure. In the whole etching process, only one time of conventional USC cleaning is carried out before the substrate is placed into the containing box, and after the glass substrate is taken out of the USC, impurity particles in the environment are still likely to fall to gaps on the surface of the substrate to form secondary pollution; the substrate may be contaminated again by the impurity particles during the transfer process (mainly before the transfer process of the load lock chamber) of the substrate through the load lock chamber and/or the transfer module, and if the surface of the substrate to be processed has impurities, the object to be etched below the impurities cannot be etched due to the blocking of the impurity particles, which may result in poor etching and poor product quality (Not Good, NG for short).
In this regard, the embodiment of the present invention further provides a substrate processing system 01, as shown in fig. 3, including a processing apparatus 20 for processing a substrate 02; an ultrasonic cleaning apparatus 10 provided at an inlet 21 of the substrate 02 to be processed into the above-mentioned processing apparatus 20 is used for cleaning a surface to be processed of the substrate 02 to be processed.
That is, when the upper surface of the substrate 02 is processed, the ultrasonic cleaning apparatus 10 is disposed above the substrate inlet 21 so as to perform purge cleaning on the upper surface of the substrate 02; on the other hand, when the lower surface of the substrate 02 is processed, the ultrasonic cleaning apparatus 10 is disposed below the substrate inlet 21, so that the lower surface of the substrate 02 can be cleaned by purging.
The processing apparatus 20 may be, for example, a dry etching apparatus for performing an etching process on a substrate.
Taking the example that the processing apparatus 20 specifically includes a Load-Lock Chamber (Load-Lock Chamber), as shown in fig. 3, the ultrasonic cleaning apparatus 10 is disposed on a door of the Load-Lock Chamber (the number of the Load-Lock chambers includes, but is not limited to, 1 shown in the figure, and may be one above the other). As shown in fig. 4, the processing apparatus 20 further includes a driving cylinder 22 for driving the opening and closing of the door 21 of the load lock chamber and a supply cylinder 23 for supplying a compressed gas to the driving cylinder 22; the driving cylinder 22 includes a cylinder body 220, a cylinder exhaust port 221, a cylinder intake port 222, a connecting rod 223, and a piston 224; wherein, the cylinder air inlet 222 and the cylinder air outlet 221 are both arranged on the cylinder body 220; the piston 224 is disposed within the cylinder body 220; one end of a connecting rod 223 is disposed inside the cylinder body 220 to be connected to the piston 224, and the other end is disposed outside the cylinder body 220 to be connected to the door 21 of the load lock chamber for driving the door 21 to open and close.
Wherein the gas supplied from the cylinder 23 flows in the direction shown in the figure, and the gas is directly discharged through the cylinder discharge port 221 after the door 21 is opened and closed.
Further, the substrate processing system 01 may further include a monitoring sensor for monitoring the opening or closing of the door 21 of the load lock chamber; and a controller connected with the monitoring sensor and used for receiving signals of opening or closing of the door 21, so that the ultrasonic cleaning device 10 is controlled to start to work when the door 21 is opened, and the ultrasonic cleaning device 10 is controlled to stop working when the door 21 is closed.
That is, when the door 21 is given an open command, the ultrasonic cleaning starts to work; during the process of transferring the glass substrate into the door 21 by the robot arm, the ultrasonic cleaning device 10 continuously purges the surface to be processed of the glass substrate (usually, the surface away from the upper surface in contact with the robot arm), thereby achieving the cleaning effect.
Further, the embodiment of the present invention provides an air supply system of the ultrasonic cleaning apparatus 10, and the specific embodiment and configuration are as follows:
example 1
Referring to fig. 4, since the movement of opening or closing the door 21 of the load lock chamber is operated by supplying gas from the gas cylinder 23, the gas is directly discharged after the door 21 is opened or closed, and there is a problem of gas waste. According to the phenomenon, the embodiment 1 of the invention adds a recovery device at the tail end of the driving cylinder 22, and filters the gas discharged from the cylinder through a Filter (Filter) to be applied to an ultrasonic cleaning device, so that the effect of recovery and reuse is achieved. The gas recycling schematic diagram is shown in fig. 5, and the specific structure is shown in fig. 6: wherein, the air supply cylinder 23 is also communicated with the air blowing unit of the ultrasonic cleaning device 10 for supplying air to the air blowing unit, i.e. the air supply end 111 in the air blowing unit 11 shares the air supply cylinder 23 of the processing device 20; the processing apparatus 20 further includes a Mass Flow Controller (MFC) 24; the air supply cylinder 23 is communicated with the air inlet 222 and the air blowing unit through the flow controller 24; the substrate processing system 01 further includes a first pipe 25 for communicating the cylinder exhaust port 221 with the flow rate controller 24; the first pipeline 25 is provided with a filter 26; and/or, the substrate processing system 01 further includes a waste gas processing unit 27 connected to the cylinder exhaust port 221, and the grid connection pipeline is further provided with a gas control valve 28 and other structures, which may specifically follow the gas pipeline design structure in the prior art, and the details of the embodiment of the present invention are not repeated.
That is, the gas supply cylinder 23 supplies gas to the ultrasonic cleaning apparatus 10, the flow rate is limited by the flow controller 24, a part of the gas moves the door 21 of the load lock chamber, another part of the gas supplies power to the ultrasonic cleaning, and then the gas is transmitted to the filter 26 through the control valve of the gas flow rate to be filtered and cleaned, and then is circulated to the flow controller 24 to operate, the above operations are repeated until the gas circulation number reaches a limit value, and then the gas is discharged, and the exhaust gas is treated by the exhaust gas treatment unit 27 arranged at the tail end of the pipeline, so that the energy is saved and the productivity is improved through the above gas circulation utilization.
The specific operation of the ultrasonic cleaning device 10 and the door 21 is as follows:
when the door 21 is given an opening command, the ultrasonic cleaning starts to work;
during the process of transferring the glass substrate into the door 21 by the robot arm, the ultrasonic cleaning device 10 continuously purges the surface to be processed of the glass substrate (usually, the surface away from the upper surface in contact with the robot arm), thereby achieving the cleaning effect.
Example 2
The ultrasonic cleaning apparatus 10 may be directly applied to the top end of the door 21 of the load lock chamber by using a Clean Dry Air (CDA) supply system which is a conventional system in a production line and a pipe.
The specific operation of the ultrasonic cleaning device 10 and the door 21 is as follows:
when the door 21 is given an opening command, the ultrasonic cleaning starts to work;
during the process of transferring the glass substrate into the door 21 by the robot arm, the ultrasonic cleaning device 10 continuously purges the surface to be processed of the glass substrate (usually, the surface away from the upper surface in contact with the robot arm), thereby achieving the cleaning effect.
Example 3
The gas supply end 111 of the air blowing unit 11 in the ultrasonic cleaning apparatus 10 is embodied as a negative pressure device communicated with the atmosphere to supply air to the pressure chamber 110.
Namely, a negative pressure device is installed to be directly connected to the atmosphere, thereby supplying gas to the ultrasonic cleaning apparatus 10. The specific operation of the ultrasonic cleaning device 10 and the door 21 is as follows:
when the door 21 is given an opening command, the ultrasonic cleaning starts to work;
during the process of transferring the glass substrate into the door 21 by the robot arm, the ultrasonic cleaning device 10 continuously purges the surface to be processed of the glass substrate (usually, the surface away from the upper surface in contact with the robot arm), thereby achieving the cleaning effect.
On the basis, as shown in fig. 3, a detection sensor 30 is further disposed at the inlet 21 of the processing apparatus 20 for detecting the integrity of the substrate 02 to be processed entering the processing apparatus 20, so as to ensure the product quality and reduce the waste of production capacity caused by processing defective products.
The detection sensors 30 may be specifically disposed at both sides and the bottom of the door 21 of the load lock chamber. The specific principle may be, for example, an infrared scanning technology, that is, infrared rays are generated to the surface of the substrate by using an infrared generator, and if there is a damage at a corner of the substrate, the infrared spectrum reflected at the damaged position is different from that at the undamaged position, so as to determine that the substrate is damaged.
Based on the device and the system provided by the embodiment of the invention, the ultrasonic cleaning device is arranged at the inlet of the substrate processing device to blow and clean the surface of the substrate entering the processing device, and the sensor units for detecting the integrity of the substrate are additionally arranged at the two sides of the inlet, so that the integrity of the substrate entering the processing device for the next processing is ensured, the product quality is ensured, and the waste of productivity is reduced. In addition, the embodiment of the invention also provides an ultrasonic cleaning device and a cylinder gas recycling system, so that waste is avoided, and the capacity is further improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A substrate processing system includes a processing apparatus for processing a substrate; the substrate processing system is characterized by further comprising an ultrasonic cleaning device arranged at an inlet of the substrate to be processed, which enters the processing device, and used for cleaning the surface to be processed of the substrate to be processed;
the ultrasonic cleaning device comprises a cleaning device, a cleaning device and a cleaning device,
the air blowing unit is used for spraying air flow to the surface of an object to be cleaned;
an ultrasonic oscillation generator for oscillating the air flow ejected from the air blowing unit;
the air extraction unit is used for collecting impurities swept out from the surface of the object to be cleaned;
wherein the gas blowing unit comprises a pressure chamber and a gas supply end;
the air extraction unit comprises an adsorption cavity, a connecting pipeline and an air extraction assembly;
the cavity wall of the pressure cavity and the cavity wall of the adsorption cavity are partially overlapped and connected together;
the processing apparatus includes, a load lock chamber; the ultrasonic cleaning device is arranged on a door of the load lock chamber;
the processing device also comprises a driving cylinder for driving the door of the load locking chamber to open and close and a supply cylinder for supplying compressed gas to the driving cylinder;
the driving cylinder comprises a cylinder exhaust port; the air cylinder air outlet and the air supply cylinder are communicated with an air blowing unit of the ultrasonic cleaning device and used for supplying air to the air blowing unit;
the driving cylinder also comprises a cylinder body, a cylinder air inlet, a connecting rod and a piston; the cylinder air inlet and the cylinder air outlet are both arranged on the cylinder body; the piston is arranged in the cylinder body; one end of the connecting rod is arranged in the cylinder body and connected with the piston, and the other end of the connecting rod is arranged outside the cylinder body and connected with a door of the load locking chamber and used for driving the door to open and close;
the processing device also comprises a flow controller; the air supply cylinder is communicated with the air inlet of the air cylinder and the air blowing unit through the flow controller;
the substrate processing system further comprises a first pipeline for communicating the air cylinder exhaust port with the flow controller;
a filter is arranged on the first pipeline;
and/or the presence of a gas in the gas,
the substrate processing system further comprises an exhaust gas treatment unit communicated with the air outlet of the air cylinder.
2. The substrate processing system of claim 1,
the pressure cavity is provided with an air inlet and a nozzle; the gas supply end is communicated with the gas inlet and is used for providing gas into the pressure cavity;
the nozzle is used for spraying airflow to the surface of an object to be cleaned.
3. The substrate processing system of claim 2,
the air exhaust assembly is used for generating negative pressure in the adsorption cavity through the connecting pipeline;
the adsorption cavity is provided with a suction inlet for collecting impurities swept out from the surface of the object to be cleaned through the suction inlet.
4. The substrate processing system of claim 3, wherein the pumping assembly comprises a vacuum pump configured to generate a vacuum chucking effect within the chucking chamber.
5. The substrate processing system of claim 2,
the nozzle comprises a slit nozzle;
the suction chamber in the suction unit is provided at least one of both sides in a length direction of the slit nozzle.
6. The substrate processing system of claim 2,
the nozzle comprises a slit nozzle;
the ultrasonic oscillation generator is disposed in the pressure chamber and located at least one of both sides of the slit nozzle in the length direction.
7. The substrate processing system of claim 3, wherein the opening of the nozzle is disposed in the same plane as the opening of the suction inlet.
8. The substrate processing system of claim 1, wherein the gas supply port of the ultrasonic cleaning device comprises a negative pressure device connected to the atmosphere; the negative pressure device provides air for the pressure cavity.
9. The substrate processing system of claim 1, further comprising,
a monitoring sensor for monitoring the door opening and closing of the load lock chamber;
and the controller is connected with the monitoring sensor and is used for receiving signals of opening or closing the door, so that the ultrasonic cleaning device is controlled to start to work when the door is opened and is controlled to stop working when the door is closed.
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| CN109772811A (en) * | 2017-11-10 | 2019-05-21 | 中芯国际集成电路制造(上海)有限公司 | Clearing apparatus and purging system |
| CN108893716B (en) * | 2018-06-29 | 2021-01-15 | 奕瑞影像科技（太仓）有限公司 | Coating system and substrate processing method |
| CN112703065A (en) * | 2018-10-09 | 2021-04-23 | 深圳市柔宇科技股份有限公司 | Ultrasonic cleaning machine |
| CN109290287A (en) * | 2018-10-16 | 2019-02-01 | 深圳市华星光电半导体显示技术有限公司 | A kind of dry cleaning device and cleaning method |
| CN110449431B (en) * | 2019-06-25 | 2021-09-17 | 人民百业科技有限公司 | Dust removal device for liquid crystal module display screen in machining process |
| TWI711495B (en) * | 2019-08-27 | 2020-12-01 | 勵威電子股份有限公司 | Dry ultrasonic cleaning head and cleaning machine |
| CN110899244A (en) * | 2019-11-08 | 2020-03-24 | 上海精测半导体技术有限公司 | Porous ceramic carrying platform cleaning device and display panel manufacturing equipment |
| CN111229728A (en) * | 2020-03-03 | 2020-06-05 | 河南科技大学 | Ultrasonic cleaning head for dry ultrasonic cleaning |
| CN113921431A (en) * | 2021-11-18 | 2022-01-11 | 安徽熙泰智能科技有限公司 | Dirty clearance system of micro-display device substrate film layer |
| CN115415245A (en) * | 2022-09-06 | 2022-12-02 | 赫曼半导体技术(深圳)有限公司 | Ultrasonic substrate cleaning and cooling device |
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