CN113921431A - Dirty clearance system of micro-display device substrate film layer - Google Patents
Dirty clearance system of micro-display device substrate film layer Download PDFInfo
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- CN113921431A CN113921431A CN202111368447.0A CN202111368447A CN113921431A CN 113921431 A CN113921431 A CN 113921431A CN 202111368447 A CN202111368447 A CN 202111368447A CN 113921431 A CN113921431 A CN 113921431A
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- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 238000004140 cleaning Methods 0.000 claims abstract description 55
- 239000002245 particle Substances 0.000 claims abstract description 52
- 238000007664 blowing Methods 0.000 claims abstract description 27
- 238000001179 sorption measurement Methods 0.000 claims description 61
- 230000007246 mechanism Effects 0.000 claims description 37
- 238000010926 purge Methods 0.000 claims description 19
- 230000003068 static effect Effects 0.000 claims description 15
- 238000010408 sweeping Methods 0.000 claims description 6
- 230000002457 bidirectional effect Effects 0.000 claims description 5
- 230000008030 elimination Effects 0.000 claims description 5
- 238000003379 elimination reaction Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 10
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- 238000010521 absorption reaction Methods 0.000 description 5
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- 239000008187 granular material Substances 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
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- 230000005540 biological transmission Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a micro-display device substrate film layer dirt cleaning system, which belongs to the technical field of micro-display devices and comprises a cleaning chamber, wherein a carrying platform used for adsorbing and positioning a substrate is arranged in the cleaning chamber, and an electrostatic eliminating device used for separating dirt particles and a blowing and adsorbing device used for removing the dirt particles are arranged above the carrying platform.
Description
Technical Field
The invention relates to the technical field of micro-display devices, in particular to a micro-display device substrate film layer dirt cleaning system.
Background
In the fields of semiconductors, semi-conductors and displays, the influence of dirt particles on the process is higher and higher due to the reduction of the key size, so that the dirt particles are removed urgently in the process.
In the manufacturing process of the display product, a film layer needs to be manufactured on a substrate, and wet cleaning cannot be performed in a part of thin film processes with poor liquid medicine tolerance, so that in the part of processes, dirty particles cause great yield loss. For example, in the field of silicon-based OLED display, after an encapsulation process, due to the characteristic influence of a film layer, if wet cleaning is adopted, the film layer is greatly damaged, and after the process, dirty particles cannot be removed in an effective cleaning mode, so that the yield of the silicon-based OLED product is greatly influenced.
Disclosure of Invention
In order to solve the technical problems, the invention provides a micro-display device substrate membrane layer dirt cleaning system which removes dirt adsorption through static electricity removal, adopts a high-pressure gas purging and ultrasonic oscillation mode to purge dirt particles, and then absorbs the dirt particles in vacuum, so that the effect of removing the dirt particles by a non-wet method is realized, the damage to a membrane layer is avoided, and the product yield is improved.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows: the micro-display device substrate film layer dirt cleaning system comprises a cleaning chamber, wherein a carrying platform for adsorbing and positioning a substrate is arranged in the cleaning chamber, and a static electricity eliminating device for separating dirt particles and a blowing and adsorbing device for removing the dirt particles are arranged above the carrying platform.
The carrying platform comprises a vacuum adsorption platform, and a plurality of jacking devices for bearing the substrate are arranged in the vacuum adsorption platform.
The jacking device comprises a telescopic driving part I and a thimble connected with the telescopic driving part I, and a through hole matched with the thimble is formed in the vacuum adsorption platform.
The vacuum adsorption platform is further provided with an alignment device for adjusting the position of the substrate, the alignment device comprises lifting clamping heads respectively arranged on two sides of the vacuum adsorption platform, and the bottoms of the two lifting clamping heads are connected with the driving mechanism I to enable the two lifting clamping heads to move oppositely or relatively.
The lifting clamping head comprises a clamping head body and a telescopic driving part II connected with the clamping head body, and the bottoms of the two telescopic driving parts II are connected with the driving mechanism I.
The driving mechanism I comprises a driving motor I, an output shaft of the driving motor I is connected with a bidirectional screw rod, the bidirectional screw rod comprises an orthodontic screw rod section and a reversed orthodontic screw rod section, the orthodontic screw rod section is in threaded connection with the bottom of one of the lifting clamping heads, and the reversed orthodontic screw rod section is in threaded connection with the bottom of the other lifting clamping head.
The static electricity eliminating device comprises a plurality of static ion bars which are arranged right above the carrying platform in a covering mode.
The blowing adsorption device slides in a reciprocating mode along the length direction of the carrying platform, the blowing adsorption device comprises a cleaning head, a blowing cavity which is used for blowing and sweeping towards the surface of the substrate in a vibrating mode is arranged in the cleaning head, and adsorption cavities which are used for adsorbing dirt particles blown up from the substrate are arranged on two sides of the blowing cavity.
The top of the purging cavity is provided with an air inlet for introducing high-pressure gas, an ultrasonic generator is arranged in the purging cavity at a position opposite to the air inlet, and the bottom of the purging cavity is provided with a conical air blowing port; the outside of adsorbing the cavity is provided with the suction opening, the bottom of adsorbing the cavity is provided with the back taper and adsorbs the mouth.
Two sides of the carrying platform are respectively provided with a sliding rail along the length direction of the carrying platform, the two sliding rails are respectively connected with a supporting frame in a sliding manner, and the two supporting frames are fixedly connected with two ends of the cleaning head; the two sliding rails are connected with the two supporting frames through the driving mechanism II so as to drive the two supporting frames to reciprocate in the sliding rails.
The invention has the beneficial effects that:
1. according to the invention, the substrate is positioned and adsorbed on the carrying platform, the electrostatic adsorption effect of the dirt particles is removed through the electrostatic elimination device, the dirt particles on the substrate are separated, and the dirt particles on the film layer are blown up through the blowing adsorption device and then adsorbed and removed, so that the effect of removing the dirt particles by a non-wet method is realized, the damage to the film layer is avoided, and the product yield is improved.
2. The vacuum adsorption table has the advantages that the substrate can be conveniently placed and taken out through the jacking device in the vacuum adsorption table, the damage to the edge of the substrate is avoided, the position of the substrate can be adjusted and aligned through the lifting and inward clamping of the lifting clamping head after the substrate is placed on the vacuum adsorption table, and the dirt particles can be more comprehensively removed in the reciprocating motion process of the cleaning head.
3. According to the invention, the sweeping cavity is arranged in the cleaning head, high-pressure gas is introduced into the sweeping cavity and vibrates under the action of the ultrasonic generator, so that the dirt particles on the surface of the substrate film layer can be quickly in a suspension state by sweeping and vibrating the dirt particles on the surface of the substrate film layer, and the suspended dirt particles are comprehensively adsorbed by the adsorption cavities on the two sides of the sweeping cavity, so that the effect of removing the dirt particles is improved.
In conclusion, the invention removes the dirt adsorption through static removal, adopts the modes of high-pressure gas blowing and ultrasonic oscillation to blow the dirt particles, and then absorbs the dirt particles in vacuum, thereby realizing the effect of removing the dirt particles by a non-wet method, avoiding the damage to the film layer and improving the product yield.
Drawings
The contents of the expressions in the various figures of the present specification and the labels in the figures are briefly described as follows:
FIG. 1 is a schematic view of the structure of a cleaning chamber according to the present invention;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a schematic view of the cleaning head of FIG. 1;
FIG. 4 is a schematic structural diagram of the aligning apparatus shown in FIGS. 2 and 3;
FIG. 5 is a schematic structural diagram of the connection between the driving mechanism II and the slide rail;
the labels in the above figures are: 1. the cleaning device comprises a cleaning chamber, 2 parts of an electrostatic elimination device, 3 parts of a blowing adsorption device, 31 parts of a cleaning head, 311 parts of a purging chamber, 312 parts of an adsorption chamber, 313 parts of an air inlet, 314 parts of a conical air blowing port, 315 parts of an air suction port, 316 parts of an inverted conical adsorption port, 32 parts of an ultrasonic generator, 4 parts of a vacuum adsorption table, 5 parts of a jacking device, 51 parts of a telescopic driving part I, 52 parts of a thimble, 6 parts of a contraposition device, 61 parts of a lifting clamping head, 611 parts of a clamping head body, 612 parts of a telescopic driving part II, 62 parts of a driving mechanism I, 621 parts of a driving motor I, 622 parts of a bidirectional screw rod, 7 parts of a slide rail, 8 parts of a support frame, 9 parts of a driving mechanism II, 91 parts of a ball screw rod mechanism I, 92 parts of a ball screw rod mechanism II, 93 parts of a driving motor II, 94 parts of a belt transmission mechanism.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and the following embodiments are used for illustrating the present invention and are not intended to limit the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The specific implementation scheme of the invention is as follows: as shown in fig. 1 and fig. 2, a micro display device substrate film layer dirt cleaning system comprises a cleaning chamber 1, a stage for adsorbing and positioning a substrate is arranged in the cleaning chamber 1, and an electrostatic elimination device 2 for separating dirt particles and an air blowing and adsorbing device 3 for removing the dirt particles are arranged above the stage. According to the invention, the substrate is positioned and adsorbed on the carrying platform, the electrostatic adsorption effect of the dirt particles is removed through the electrostatic elimination device 2, the dirt particles on the substrate are separated, and the dirt particles on the film layer are blown up through the blowing adsorption device 3 and then adsorbed and removed, so that the effect of removing the dirt particles by a non-wet method is realized, the damage to the film layer is avoided, and the product yield is improved.
Specifically, the microscope carrier includes vacuum adsorption platform 4, is provided with a plurality of jacking devices 5 that bear the weight of the base plate in this vacuum adsorption platform 4, and the jacking through jacking devices 5 can make jacking devices 5's holding surface keep away from the plane of microscope carrier, makes getting of base plate put more conveniently, has avoided getting the damage of putting the base plate in-process to the base plate edge.
The jacking device 5 comprises a telescopic driving part I51 and a thimble 52 connected with the telescopic driving part I51, the telescopic driving part I51 can be set to be an automatic telescopic part such as an air cylinder, a hydraulic cylinder and an electric telescopic rod, a through hole matched with the thimble 52 is formed in the vacuum adsorption platform 4, the thimble 52 can be driven by the telescopic driving part I51 to extend out of the surface of the vacuum adsorption platform 4 in the through hole so as to accept the substrate, the substrate and the surface of the vacuum adsorption platform 4 are separated by a certain distance, and the substrate can be conveniently taken and placed. The jacking devices 5 can be arranged in three or more than three numbers, so that the stable support of the base plate is realized.
Specifically, as shown in fig. 4, the vacuum adsorption stage 4 is further provided with an alignment device 6 for adjusting the position of the substrate, the alignment device 6 includes lifting holding heads 61 respectively disposed on two sides of the vacuum adsorption stage 4, the bottoms of the two lifting holding heads 61 are connected to a driving mechanism i 62 to enable the two lifting holding heads 61 to move in opposite directions or in relative motion, the substrate can be adjusted and aligned in position by lifting and inward holding of the lifting holding heads 61 after being placed on the vacuum adsorption stage 4, and in the reciprocating motion process of the cleaning head 31, the dirty particles can be removed more comprehensively.
The lifting clamping head 61 comprises a clamping head body 611 and a telescopic driving part II 612 connected with the clamping head body 611, the telescopic driving part II 612 can be set to be an automatic telescopic part such as an air cylinder, a hydraulic cylinder and an electric telescopic rod, the bottoms of the two telescopic driving parts II 612 are connected with a driving mechanism I62, and the two telescopic driving parts II 612 can be driven by the driving mechanism I62 to move oppositely or relatively. This actuating mechanism I62 includes driving motor I621, driving motor I621's output shaft links to each other with two-way screw rod 622, two-way screw rod includes orthodontic screw rod section and anti-dental screw rod section, orthodontic screw rod section passes through the bottom threaded connection of thread bush and one of them lift holding head 61, anti-dental screw rod section passes through the bottom threaded connection of thread bush and another lift holding head 61, driving motor I621 work and drive two-way screw rod 622 and rotate, thereby make the lift holding head 61 at two-way screw rod 622 both ends relative or move in opposite directions in order to realize centre gripping or the action that resets. Wherein, the two ends of the vacuum adsorption platform 4 are respectively provided with a strip-shaped groove which leads the lifting clamping head 61 to reciprocate.
Specifically, as shown in fig. 1 and 2, the static eliminating device 2 includes a plurality of static ion bars installed over the carrier, the number of the static ion bars is controllable to be 1-8, the number of the static ion bars is actually determined according to the required static removing capability, each static ion bar has 4-16 ionization needles, and the number of the ionization needles is actually determined according to the required static removing capability. In the process of removing the dirt particles, an area electric field is formed by charging the tungsten tip of the ion needle, so that air is ionized to form ion wind for neutralizing charges on the surface of the substrate, the electrostatic adsorption effect of the dirt particles and the substrate is relieved, and the dirt particles and the substrate are separated in an electrostatic removal mode.
Specifically, as shown in fig. 1 and fig. 2, the blowing adsorption device 3 slides back and forth along the length direction of the carrier, the blowing adsorption device 3 includes a cleaning head 31, two sides of the carrier are respectively provided with a slide rail 7 along the length direction thereof, the two slide rails 7 are respectively connected with a support frame 8 in a sliding manner, and the two support frames 8 are fixed to two ends of the cleaning head 31.
As shown in fig. 5, the two slide rails 7 are connected with the two support frames 8 through a driving mechanism ii 9 to drive the two support frames 8 to reciprocate in the slide rails 7, the driving mechanism ii 9 includes a ball screw mechanism i 91 and a ball screw mechanism ii 92 respectively arranged in the two slide rails 7 along the length direction thereof, one end of one of the slide rails 7 is provided with a driving motor ii 93, an output shaft of the driving motor ii 93 is connected with one of the support frames 8 through the ball screw mechanism i 91, an output shaft of the driving motor ii 93 is connected with the ball screw mechanism ii 92 through a belt transmission mechanism 94, and the ball screw mechanism ii 92 is connected with the other support frame 8.
Driving motor II 93 drive ball screw mechanism I91 rotates, thereby make the 8 actions of support frame on the ball screw mechanism I91, and simultaneously, driving motor II 93 drives II 92 rotations of ball screw mechanism through taking drive mechanism 94, make the 8 synchronous actions of support frame on the ball screw mechanism II 92, thereby drive cleaning head 31 and carry out reciprocating motion and get rid of dirty granule, cleaning head 31's rate of motion control is at 5 ~ 20mm/s, it can set up to 1 ~ 4 times to come and go the number of times, and cleaning head 31's width is greater than the diameter of base plate, ensure that no dead angle gets rid of dirty granule.
Specifically, as shown in fig. 3, a purging chamber 311 oscillating and purging the substrate surface is disposed in the cleaning head 31, the purging chamber 311 may blow up the dirt particles on the substrate surface to suspend the dirt particles, adsorption chambers 312 adsorbing the dirt particles blown up on the substrate are disposed on two sides of the purging chamber 311, and the suspended dirt particles may be adsorbed and removed by the adsorption chambers 312. The top of the purging cavity 311 is provided with an air inlet 313 for introducing high-pressure gas, the air inlet 313 is connected with a booster fan through an air inlet pipeline, the air inlet pipeline is wound on the support frame 8, an ultrasonic generator 32 is installed at a position in the purging cavity 311 opposite to the air inlet 313, the high-pressure gas is vibrated under the action of the ultrasonic generator 32 to purge and vibrate dirty particles on the surface of a substrate film layer, so that the dirty particles on the surface of the substrate can be quickly in a suspension state, the bottom of the purging cavity 311 is provided with a conical air blowing port 314, and the aperture of one end, close to the substrate, of the conical air blowing port 314 is larger than that of the other end, so that purging and ultrasonic vibration of the high-pressure gas are facilitated; the outside of absorption cavity 312 is provided with suction opening 315, and suction opening 315 passes through the suction line and links to each other with the vacuum pump, to absorption cavity 312 convulsions, makes to produce the malleation in the absorption cavity 312, makes the dirty granule of outside suspension inhale automatically, and the bottom of absorption cavity 312 is provided with the back taper and adsorbs mouth 316, and the aperture that this back taper adsorbs mouth 316 is close to the one end of base plate is less than the aperture of the other end, is favorable to the absorption of the dirty granule of base plate surface.
In addition, but above-mentioned clean-up room 1 is provided with the automatically induction sealing door, and the sealing door is provided with the platform of bearing the weight of the base plate outward and is used for sending the base plate into the last unloading manipulator of clean-up room 1 through the sealing door that opens, can realize the pay-off of base plate and get the material through last unloading manipulator.
The use method of the cleaning system comprises the following steps:
step 1: and positioning and adsorbing the substrate.
1) The telescopic driving part I51 at the bottom of the vacuum adsorption platform 4 acts to drive the thimble 52 to extend out of the upper end face of the vacuum adsorption platform 4.
2) The substrate to be cleaned on the grabbing platform of the loading and unloading manipulator is sent into the cleaning chamber 1 through a sealing door and is placed on a plurality of thimbles 52 between two lifting clamping heads 61.
3) The ejector pins 52 are returned by the telescopic driving means i 51, and the substrate is gradually bonded to the surface of the vacuum chuck table 4.
4) The second telescopic driving component 612 drives the clamping head bodies 611 to extend out of the surface of the vacuum adsorption table 4 for a certain distance, the two clamping head bodies 611 are driven by the driving motor i 621 to move towards the center of the substrate, the position of the substrate is adjusted, and the substrate is aligned.
5) The vacuum adsorption table 4 works to adsorb and position the substrate through the vacuum adsorption holes.
Step 2: and removing the electrostatic adsorption on the dirt particles on the substrate film layer.
And electrifying the electrostatic ion bar to charge the tungsten tip of the ion needle in the ion bar to form an area electric field, ionizing the air to form ion wind to neutralize the charges on the surface of the substrate, and removing the electrostatic adsorption effect of the dirt particles and the substrate.
And step 3: and cleaning dirt particles on the substrate film layer.
1) Starting a booster fan, an ultrasonic generator 32 and a vacuum pump to enable the cleaning head 31 to start a working mode;
2) the driving motor II 93 is started to drive the ball screw mechanism I91 to rotate, so that the support frame 8 on the ball screw mechanism I91 acts, meanwhile, the driving motor II 93 drives the ball screw mechanism II 92 to rotate through the belt transmission mechanism 94, so that the support frame 8 on the ball screw mechanism II 92 acts synchronously, and the cleaning head 31 is driven to reciprocate along the length direction of the vacuum adsorption platform 4.
In the reciprocating motion process of the cleaning head 31, the booster fan introduces high-pressure gas into the purging chamber 311, and the ultrasonic generator 32 generates ultrasonic oscillation on the high-pressure gas flow, so that the oscillated high-pressure gas is blown to the surface of the substrate film layer through the tapered blowing port 314, and dirt particles on the substrate film layer are in a suspension state; the vacuum pump draws air into the two adsorption chambers 312, so that positive pressure is generated in the two adsorption chambers 312, and the externally suspended dirt particles are automatically sucked.
After the cleaning is finished, the cleaning head 31 resets and stops working, the vacuum adsorption platform 4 no longer adsorbs the substrate, the two lifting clamping heads 61 move in opposite directions under the driving of the driving mechanism I62 and descend below the vacuum adsorption platform 4 to realize resetting.
And 4, step 4: and taking out the substrate with the dirt particles removed.
1) The telescopic driving part I51 at the bottom of the vacuum adsorption platform 4 acts to drive the thimble 52 to extend out of the upper end face of the vacuum adsorption platform 4, and the bearing substrate is separated from the surface of the vacuum adsorption platform 4.
2) The loading and unloading manipulator enters the cleaning chamber 1 through the sealing door, the substrate is taken out, and the ejector pins 52 are reset under the action of the telescopic driving part I51.
In conclusion, the invention removes the dirt adsorption through static removal, adopts the modes of high-pressure gas blowing and ultrasonic oscillation to blow the dirt particles, and then absorbs the dirt particles in vacuum, thereby realizing the effect of removing the dirt particles by a non-wet method, avoiding the damage to the film layer and improving the product yield.
While the foregoing is directed to the principles of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (10)
1. The utility model provides a dirty clearance system of micro-display device substrate membrane layer which characterized in that: the cleaning device comprises a cleaning chamber, wherein a carrying platform for adsorbing and positioning a substrate is arranged in the cleaning chamber, and an electrostatic elimination device for separating dirt particles and a blowing adsorption device for removing the dirt particles are arranged above the carrying platform.
2. A microdisplay assembly substrate film smudge cleaning system according to claim 1 wherein: the carrying platform comprises a vacuum adsorption platform, and a plurality of jacking devices for bearing the substrate are arranged in the vacuum adsorption platform.
3. A microdisplay assembly substrate film smudge cleaning system according to claim 2 wherein: the jacking device comprises a telescopic driving part I and a thimble connected with the telescopic driving part I, and a through hole matched with the thimble is formed in the vacuum adsorption platform.
4. A microdisplay assembly substrate film smudge cleaning system according to claim 2 wherein: the vacuum adsorption platform is further provided with an alignment device for adjusting the position of the substrate, the alignment device comprises lifting clamping heads respectively arranged on two sides of the vacuum adsorption platform, and the bottoms of the two lifting clamping heads are connected with the driving mechanism I to enable the two lifting clamping heads to move oppositely or relatively.
5. A microdisplay assembly substrate film smudge cleaning system according to claim 4 wherein: the lifting clamping head comprises a clamping head body and a telescopic driving part II connected with the clamping head body, and the bottoms of the two telescopic driving parts II are connected with the driving mechanism I.
6. A microdisplay assembly substrate film smudge cleaning system according to claim 4 wherein: the driving mechanism I comprises a driving motor I, an output shaft of the driving motor I is connected with a bidirectional screw rod, the bidirectional screw rod comprises an orthodontic screw rod section and a reversed orthodontic screw rod section, the orthodontic screw rod section is in threaded connection with the bottom of one of the lifting clamping heads, and the reversed orthodontic screw rod section is in threaded connection with the bottom of the other lifting clamping head.
7. A microdisplay assembly substrate film smudge cleaning system according to claim 1 wherein: the static electricity eliminating device comprises a plurality of static ion bars which are arranged right above the carrying platform in a covering mode.
8. A microdisplay assembly substrate film smudge cleaning system according to claim 1 wherein: the blowing adsorption device slides in a reciprocating mode along the length direction of the carrying platform, the blowing adsorption device comprises a cleaning head, a blowing cavity which is used for blowing and sweeping towards the surface of the substrate in a vibrating mode is arranged in the cleaning head, and adsorption cavities which are used for adsorbing dirt particles blown up from the substrate are arranged on two sides of the blowing cavity.
9. A microdisplay assembly substrate film smudge cleaning system according to claim 8 wherein: the top of the purging cavity is provided with an air inlet for introducing high-pressure gas, an ultrasonic generator is arranged in the purging cavity at a position opposite to the air inlet, and the bottom of the purging cavity is provided with a conical air blowing port; the outside of adsorbing the cavity is provided with the suction opening, the bottom of adsorbing the cavity is provided with the back taper and adsorbs the mouth.
10. A microdisplay assembly substrate film smudge cleaning system according to claim 8 wherein: two sides of the carrying platform are respectively provided with a sliding rail along the length direction of the carrying platform, the two sliding rails are respectively connected with a supporting frame in a sliding manner, and the two supporting frames are fixedly connected with two ends of the cleaning head; the two sliding rails are connected with the two supporting frames through the driving mechanism II so as to drive the two supporting frames to reciprocate in the sliding rails.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111368447.0A CN113921431A (en) | 2021-11-18 | 2021-11-18 | Dirty clearance system of micro-display device substrate film layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111368447.0A CN113921431A (en) | 2021-11-18 | 2021-11-18 | Dirty clearance system of micro-display device substrate film layer |
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| Publication Number | Publication Date |
|---|---|
| CN113921431A true CN113921431A (en) | 2022-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111368447.0A Pending CN113921431A (en) | 2021-11-18 | 2021-11-18 | Dirty clearance system of micro-display device substrate film layer |
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| Country | Link |
|---|---|
| CN (1) | CN113921431A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030037456A1 (en) * | 2001-08-27 | 2003-02-27 | Applied Materials, Inc. | Processing platform with integrated particle removal system |
| CN107020285A (en) * | 2017-04-19 | 2017-08-08 | 京东方科技集团股份有限公司 | A kind of ultrasonic cleaning equipment and base plate processing system |
| CN206997245U (en) * | 2017-07-28 | 2018-02-13 | 京东方科技集团股份有限公司 | A kind of base plate cleaning device |
-
2021
- 2021-11-18 CN CN202111368447.0A patent/CN113921431A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030037456A1 (en) * | 2001-08-27 | 2003-02-27 | Applied Materials, Inc. | Processing platform with integrated particle removal system |
| CN107020285A (en) * | 2017-04-19 | 2017-08-08 | 京东方科技集团股份有限公司 | A kind of ultrasonic cleaning equipment and base plate processing system |
| CN206997245U (en) * | 2017-07-28 | 2018-02-13 | 京东方科技集团股份有限公司 | A kind of base plate cleaning device |
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