CN107004651B - 导热片的制造方法、导热片和半导体装置 - Google Patents

导热片的制造方法、导热片和半导体装置 Download PDF

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Publication number
CN107004651B
CN107004651B CN201580067250.XA CN201580067250A CN107004651B CN 107004651 B CN107004651 B CN 107004651B CN 201580067250 A CN201580067250 A CN 201580067250A CN 107004651 B CN107004651 B CN 107004651B
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CN
China
Prior art keywords
thermally conductive
sheet
mentioned
conductive sheet
molded body
Prior art date
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CN201580067250.XA
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English (en)
Chinese (zh)
Other versions
CN107004651A (zh
Inventor
荒卷庆辅
菅原麻纱子
内田俊介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority claimed from PCT/JP2015/084665 external-priority patent/WO2016104169A1/ja
Publication of CN107004651A publication Critical patent/CN107004651A/zh
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201580067250.XA 2014-12-25 2015-12-10 导热片的制造方法、导热片和半导体装置 Active CN107004651B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014-262740 2014-12-25
JP2014262740 2014-12-25
JP2015239317A JP6178389B2 (ja) 2014-12-25 2015-12-08 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP2015-239317 2015-12-08
PCT/JP2015/084665 WO2016104169A1 (ja) 2014-12-25 2015-12-10 熱伝導シートの製造方法、熱伝導シート、及び半導体装置

Publications (2)

Publication Number Publication Date
CN107004651A CN107004651A (zh) 2017-08-01
CN107004651B true CN107004651B (zh) 2019-07-12

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CN201580067250.XA Active CN107004651B (zh) 2014-12-25 2015-12-10 导热片的制造方法、导热片和半导体装置

Country Status (2)

Country Link
JP (1) JP6178389B2 (enExample)
CN (1) CN107004651B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6294951B2 (ja) 2016-01-26 2018-03-14 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
KR102449343B1 (ko) * 2016-01-26 2022-10-04 데쿠세리아루즈 가부시키가이샤 열전도 시트, 열전도 시트의 제조 방법, 방열 부재 및 반도체 장치
JP6753745B2 (ja) * 2016-09-12 2020-09-09 デクセリアルズ株式会社 熱伝導シート、及び半導体装置
CN111480014B (zh) * 2017-12-15 2022-04-29 千住金属工业株式会社 滑动构件和轴承
EP3813104B1 (en) 2018-06-22 2023-08-16 Sekisui Polymatech Co., Ltd. Thermally conductive sheet
JP6807355B2 (ja) * 2018-07-18 2021-01-06 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
JP6739478B2 (ja) * 2018-07-18 2020-08-12 デクセリアルズ株式会社 熱伝導性シートの製造方法
US11987687B2 (en) 2018-09-26 2024-05-21 Sekisui Polymatech Co., Ltd. Heat conductive sheet
JP2020116873A (ja) * 2019-01-25 2020-08-06 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP7384560B2 (ja) * 2019-02-09 2023-11-21 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの実装方法、電子機器の製造方法
CN116209727A (zh) * 2020-10-20 2023-06-02 电化株式会社 片材的制造方法
JP2021050350A (ja) * 2020-12-07 2021-04-01 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
JP6999054B1 (ja) * 2021-02-10 2022-01-18 デクセリアルズ株式会社 熱伝導シートの供給形態及び熱伝導シート
JPWO2023189776A1 (enExample) * 2022-03-29 2023-10-05
US11615999B1 (en) 2022-07-22 2023-03-28 GuangDong Suqun New Material Co., Ltd Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011074303A (ja) * 2009-10-01 2011-04-14 Hitachi Chem Co Ltd 樹脂シート、その製造方法およびこれを用いたサーマルモジュール
JP2012038763A (ja) * 2010-08-03 2012-02-23 Hitachi Chem Co Ltd 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
CN102971365A (zh) * 2010-06-17 2013-03-13 迪睿合电子材料有限公司 导热性片和其制造方法
CN103748146A (zh) * 2012-07-07 2014-04-23 迪睿合电子材料有限公司 导热性片材的制备方法
CN103975429A (zh) * 2011-12-20 2014-08-06 迪睿合电子材料有限公司 导热性片以及导热性片的制造方法
CN105408996A (zh) * 2013-07-01 2016-03-16 迪睿合电子材料有限公司 导热片的制造方法、导热片及散热部件

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3182257B2 (ja) * 1993-02-02 2001-07-03 電気化学工業株式会社 放熱シート
JP3092699B2 (ja) * 1996-04-30 2000-09-25 電気化学工業株式会社 放熱スペーサーとその用途およびシリコーン組成物
JP3434678B2 (ja) * 1997-09-12 2003-08-11 電気化学工業株式会社 ゴムシートの製造方法
JP4101391B2 (ja) * 1999-03-31 2008-06-18 電気化学工業株式会社 電子部品の放熱部材
JP6069112B2 (ja) * 2013-06-19 2017-02-01 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011074303A (ja) * 2009-10-01 2011-04-14 Hitachi Chem Co Ltd 樹脂シート、その製造方法およびこれを用いたサーマルモジュール
CN102971365A (zh) * 2010-06-17 2013-03-13 迪睿合电子材料有限公司 导热性片和其制造方法
JP2012038763A (ja) * 2010-08-03 2012-02-23 Hitachi Chem Co Ltd 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
CN103975429A (zh) * 2011-12-20 2014-08-06 迪睿合电子材料有限公司 导热性片以及导热性片的制造方法
CN103748146A (zh) * 2012-07-07 2014-04-23 迪睿合电子材料有限公司 导热性片材的制备方法
CN105408996A (zh) * 2013-07-01 2016-03-16 迪睿合电子材料有限公司 导热片的制造方法、导热片及散热部件

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Publication number Publication date
JP6178389B2 (ja) 2017-08-09
CN107004651A (zh) 2017-08-01
JP2016121341A (ja) 2016-07-07

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Address after: Maple County, Japan

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Effective date of registration: 20250926

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