CN107000253B - 分割槽形成装置及分割槽形成方法 - Google Patents

分割槽形成装置及分割槽形成方法 Download PDF

Info

Publication number
CN107000253B
CN107000253B CN201580062078.9A CN201580062078A CN107000253B CN 107000253 B CN107000253 B CN 107000253B CN 201580062078 A CN201580062078 A CN 201580062078A CN 107000253 B CN107000253 B CN 107000253B
Authority
CN
China
Prior art keywords
aforementioned
cutter
motor
slot segmentation
driving means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580062078.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN107000253A (zh
Inventor
岛村哲也
百鬼和广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoda Noriko Trans Ltd By Share Ltd
Original Assignee
Shoda Noriko Trans Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoda Noriko Trans Ltd By Share Ltd filed Critical Shoda Noriko Trans Ltd By Share Ltd
Publication of CN107000253A publication Critical patent/CN107000253A/zh
Application granted granted Critical
Publication of CN107000253B publication Critical patent/CN107000253B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/10—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades
    • B23D45/105—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades operating within the same plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/048—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with a plurality of saw blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Milling Processes (AREA)
CN201580062078.9A 2015-01-16 2015-11-26 分割槽形成装置及分割槽形成方法 Active CN107000253B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015006401A JP6545468B2 (ja) 2015-01-16 2015-01-16 分割溝形成装置および分割溝形成方法
JP2015-006401 2015-01-16
PCT/JP2015/083185 WO2016114013A1 (ja) 2015-01-16 2015-11-26 分割溝形成装置および分割溝形成方法

Publications (2)

Publication Number Publication Date
CN107000253A CN107000253A (zh) 2017-08-01
CN107000253B true CN107000253B (zh) 2019-10-01

Family

ID=56405570

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580062078.9A Active CN107000253B (zh) 2015-01-16 2015-11-26 分割槽形成装置及分割槽形成方法

Country Status (6)

Country Link
US (1) US10195677B2 (OSRAM)
JP (1) JP6545468B2 (OSRAM)
CN (1) CN107000253B (OSRAM)
DE (1) DE112015005977T5 (OSRAM)
TW (1) TWI658889B (OSRAM)
WO (1) WO2016114013A1 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018181908A (ja) * 2017-04-04 2018-11-15 株式会社ディスコ 加工方法
JP2018181902A (ja) 2017-04-04 2018-11-15 株式会社ディスコ 加工方法
JP7759612B2 (ja) * 2021-09-24 2025-10-24 ショーダテクトロン株式会社 板材切削装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1453332C3 (de) * 1961-04-05 1974-06-06 Vyzkumny A Vyvojovy Ustav Drevarsky, Prag Verfahren zum Längsschneiden von Holzklötzen bzw. Prismen
DE3737868A1 (de) 1987-11-07 1989-05-18 Loehr & Herrmann Gmbh Vorrichtung zum trennen und besaeumen von leiterplatten
JPH02109630A (ja) * 1988-10-20 1990-04-23 Mitsubishi Heavy Ind Ltd 移相装置
DE4035792C1 (en) * 1990-11-10 1992-04-23 Loehr & Herrmann Gmbh, 7531 Neuhausen, De Printed circuit board panel de-edging device - has two saw-blades mounted in bearingblockings which can be positionally adjusted
JP4338982B2 (ja) 2003-01-27 2009-10-07 ユニ・チャーム株式会社 ロータリーカッターおよびこれを用いた繊維製品の製造方法
US20080028902A1 (en) * 2006-08-03 2008-02-07 Kimberly-Clark Worldwide, Inc. Dual roll, variable sheet-length, perforation system
JP5305108B2 (ja) 2010-10-15 2013-10-02 修 小林 回転工具
JPWO2012053488A1 (ja) * 2010-10-20 2014-02-24 旭硝子株式会社 マザーガラス基板孔あけ加工方法及びマザーガラス基板
US9993932B2 (en) 2011-09-09 2018-06-12 Vits International, Inc. Rotary cutter

Also Published As

Publication number Publication date
TWI658889B (zh) 2019-05-11
CN107000253A (zh) 2017-08-01
JP6545468B2 (ja) 2019-07-17
DE112015005977T5 (de) 2018-01-04
JP2016132107A (ja) 2016-07-25
US20170368619A1 (en) 2017-12-28
WO2016114013A1 (ja) 2016-07-21
US10195677B2 (en) 2019-02-05
TW201627092A (zh) 2016-08-01

Similar Documents

Publication Publication Date Title
CN110065104B (zh) 片材加工装置、方法及存储有计算机程序的存储介质
CN107000253B (zh) 分割槽形成装置及分割槽形成方法
JP6093650B2 (ja) ウェーハの加工方法
JP2016035965A (ja) 板状部材の分割装置および板状部材の分割方法
CN114102717B (zh) 印制电路板钻孔加工控制装置、方法及钻孔设备
EP2687325A1 (en) Lathe control system
TWI673782B (zh) 基板切斷裝置及基板切斷方法
JP2013058653A (ja) 板状物の分割方法
CN116897100A (zh) 用于加工板状的工件的方法以及加工装置
CN214351258U (zh) 对位装置
KR100826274B1 (ko) 반도체 웨이퍼 쏘잉 장치를 이용한 부채꼴 패턴의 홈 가공방법
JP5089994B2 (ja) 板材加工装置
KR102148100B1 (ko) 하이브리드 다이싱 장치 및 이를 사용한 커팅 방법
KR101616770B1 (ko) 절삭가공기구 및 절삭가공방법
JP3768297B2 (ja) 電子部品実装基板加工装置
KR102629811B1 (ko) 클램핑 지그부재의 회전이동에 의해 양면이 동일 조건으로 가공되는 인쇄회로기판 제조용 가이드장치
CN104057547B (zh) 加工夹具、加工装置及加工方法
JP4685560B2 (ja) 回転刃の研磨装置
JP2795364B2 (ja) プリント配線板の溝加工方法
KR20040092196A (ko) 반도체 제조공정의 소잉장치
JP2002170789A (ja) ダイシング装置及びダイシング方法
JP2017100231A (ja) 被加工物の分割方法
JP2007276023A (ja) 面取り装置および面取り方法
JP2001001206A (ja) ディスク部品加工装置
JP2007245411A (ja) パラメトリック加工装置およびパラメトリック加工方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant