CN107000085B - 基板切断装置及基板切断方法 - Google Patents

基板切断装置及基板切断方法 Download PDF

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Publication number
CN107000085B
CN107000085B CN201580062063.2A CN201580062063A CN107000085B CN 107000085 B CN107000085 B CN 107000085B CN 201580062063 A CN201580062063 A CN 201580062063A CN 107000085 B CN107000085 B CN 107000085B
Authority
CN
China
Prior art keywords
cutter
aforementioned
substrate
cutting
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580062063.2A
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English (en)
Chinese (zh)
Other versions
CN107000085A (zh
Inventor
岛村哲也
百鬼和广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoda Noriko Trans Ltd By Share Ltd
Original Assignee
Shoda Noriko Trans Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoda Noriko Trans Ltd By Share Ltd filed Critical Shoda Noriko Trans Ltd By Share Ltd
Publication of CN107000085A publication Critical patent/CN107000085A/zh
Application granted granted Critical
Publication of CN107000085B publication Critical patent/CN107000085B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/10—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades
    • B23D45/105—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades operating within the same plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/12—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of drives for circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/048—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with a plurality of saw blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Milling Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Control Of Cutting Processes (AREA)
CN201580062063.2A 2015-01-16 2015-11-26 基板切断装置及基板切断方法 Active CN107000085B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015006405A JP7045126B2 (ja) 2015-01-16 2015-01-16 基板切断装置および基板切断方法
JP2015-006405 2015-01-16
PCT/JP2015/083190 WO2016114014A1 (ja) 2015-01-16 2015-11-26 基板切断装置および基板切断方法

Publications (2)

Publication Number Publication Date
CN107000085A CN107000085A (zh) 2017-08-01
CN107000085B true CN107000085B (zh) 2019-06-07

Family

ID=56405571

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580062063.2A Active CN107000085B (zh) 2015-01-16 2015-11-26 基板切断装置及基板切断方法

Country Status (6)

Country Link
US (1) US10195678B2 (enExample)
JP (1) JP7045126B2 (enExample)
CN (1) CN107000085B (enExample)
DE (1) DE112015005959T8 (enExample)
TW (1) TWI673782B (enExample)
WO (1) WO2016114014A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116511609B (zh) * 2023-06-19 2023-09-01 江苏古彦铝业有限公司 一种铝合金门窗制造用切割机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985982A (en) * 1987-11-07 1991-01-22 Lohr & Herrmann Gmbh Process and apparatus for cutting and trimming printed circuit board workpieces
JPH07100790A (ja) * 1990-11-10 1995-04-18 Loehr & Herrmann Gmbh プリント回路基板の切断装置と方法
US5931075A (en) * 1994-08-31 1999-08-03 Nippondenso Co., Ltd. Method and apparatus for cutting flat tube

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1453332C3 (de) * 1961-04-05 1974-06-06 Vyzkumny A Vyvojovy Ustav Drevarsky, Prag Verfahren zum Längsschneiden von Holzklötzen bzw. Prismen
JPH02109630A (ja) * 1988-10-20 1990-04-23 Mitsubishi Heavy Ind Ltd 移相装置
JP4338982B2 (ja) 2003-01-27 2009-10-07 ユニ・チャーム株式会社 ロータリーカッターおよびこれを用いた繊維製品の製造方法
US20080028902A1 (en) * 2006-08-03 2008-02-07 Kimberly-Clark Worldwide, Inc. Dual roll, variable sheet-length, perforation system
JP5305108B2 (ja) 2010-10-15 2013-10-02 修 小林 回転工具
US9993932B2 (en) 2011-09-09 2018-06-12 Vits International, Inc. Rotary cutter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985982A (en) * 1987-11-07 1991-01-22 Lohr & Herrmann Gmbh Process and apparatus for cutting and trimming printed circuit board workpieces
JPH07100790A (ja) * 1990-11-10 1995-04-18 Loehr & Herrmann Gmbh プリント回路基板の切断装置と方法
US5931075A (en) * 1994-08-31 1999-08-03 Nippondenso Co., Ltd. Method and apparatus for cutting flat tube

Also Published As

Publication number Publication date
TW201628074A (zh) 2016-08-01
TWI673782B (zh) 2019-10-01
US20180009046A1 (en) 2018-01-11
DE112015005959T5 (de) 2017-10-19
CN107000085A (zh) 2017-08-01
DE112015005959T8 (de) 2018-01-11
WO2016114014A1 (ja) 2016-07-21
US10195678B2 (en) 2019-02-05
JP7045126B2 (ja) 2022-03-31
JP2016132042A (ja) 2016-07-25

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