CN106977760A - 超柔软高回弹树脂发泡材料及其制备方法 - Google Patents

超柔软高回弹树脂发泡材料及其制备方法 Download PDF

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CN106977760A
CN106977760A CN201710261333.3A CN201710261333A CN106977760A CN 106977760 A CN106977760 A CN 106977760A CN 201710261333 A CN201710261333 A CN 201710261333A CN 106977760 A CN106977760 A CN 106977760A
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high resilience
resin foamed
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程飞
魏琼
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Suzhou Good New Material Technology Co Ltd
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Abstract

本发明揭示了一种超柔软高回弹树脂发泡材料，所述发泡材料的原料按重量份数比计包括100份的热塑性弹性体、10～50份聚烯烃树脂。本发明还揭示了一种超柔软高回弹树脂发泡材料的制备方法。本发明占比较多的主料为热塑性弹性体，发泡材料泡孔致密细腻，具有柔软性和回弹性能高的优点，单位厚度能起到更好的缓冲作用。

Description

超柔软高回弹树脂发泡材料及其制备方法
技术领域
本发明涉及聚合物材料制造技术领域，具体涉及一种超柔软高回弹树脂发泡材料及其制备方法。
背景技术
树脂发泡材料因其显著的柔软性和高回弹性而用于各种领域的产品中，例如缓冲材料、绝热材料、包装材料、建筑材料，以及电子设备的密封材料等。现有的发泡材料分为闭孔发泡材料和开孔发泡材料两大类。相对开孔发泡材料，闭孔发泡材料内部泡孔与泡孔之间有壁膜隔开，不互相连通，为独立泡孔结构，并且主要为较小的泡孔状或及其细小的微孔，发泡体的柔软性和高回弹性受损。
发明内容
本发明的目的在于提供一种超柔软高回弹树脂发泡材料及其制备方法。
为实现上述发明目的之一，本发明采用如下技术方案：
一种超柔软高回弹树脂发泡材料，所述发泡材料的原料按重量份数比计包括100份的热塑性弹性体、10～50份聚烯烃树脂。
作为本发明进一步改进的技术方案，所述热塑性弹性体的拉伸强度为10～40MPa、断裂伸长率为1000～2000％、熔融指数为0.5～8g/10min。
作为本发明进一步改进的技术方案，所述热塑性弹性体为乙烯-醋酸乙烯共聚物、POE、EPDM、硅橡胶中的任意一种或多种。
作为本发明进一步改进的技术方案，所述聚烯烃树脂为聚乙烯和/或聚异丁烯。
作为本发明进一步改进的技术方案，所述发泡材料厚度为0.05～10mm、发泡倍率为3～50、硬度C小于27。
作为本发明进一步改进的技术方案，所述发泡材料25％压缩变形下的应力≤0.05MPa，50％压缩变形下的应力≤0.15MPa，75％压缩变形下的应力≤0.33MPa。
作为本发明进一步改进的技术方案，所述发泡材料最大压缩比≥0.70，压缩永久变形≤20％。
作为本发明进一步改进的技术方案，所述发泡材料具有闭孔结构。
为实现上述另一发明目的，本发明采用如下技术方案：
一种超柔软高回弹树脂发泡材料的制备方法，包括以下步骤：
S1、按以下重量份数比：100份的热塑性弹性体、10～50份聚烯烃树脂、2～15份发泡剂、0.1～4份润滑剂、0.1～4份抗氧剂、0.5～5份成核剂，称取发泡材料的原料；
S2、将步骤S1中所称取的原料中的热塑性弹性体、聚烯烃树脂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得基础母粒；
S3、将步骤S2中获得的基础母粒与发泡剂、润滑剂、抗氧剂、成核剂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得发泡母粒；
S4、将步骤S3中获得的发泡母粒使用挤出机挤出成片，以获得发泡体基片；
S5、将步骤S4中获得的发泡体基片进行电子辐照交联，以获得发泡体母片；
S6、将步骤S5中获得的发泡体母片自由式发泡，即得发泡材料。
作为本发明进一步改进的技术方案，步骤S5中，电子辐照交联的电子能量为0.5～3.0MeV，辐照剂量为3～50兆拉德，进行电子辐照交联的发泡体基片片材层数为4～8层，扫面宽度为800～1000mm。
相对于现有技术，本发明的技术效果在于：
本发明占比较多的主料为热塑性弹性体，发泡材料泡孔致密细腻，具有柔软性和回弹性能高的优点，单位厚度能起到更好的缓冲作用。
具体实施方式
以下将结合具体实施方式对本发明进行详细描述。但这些实施方式并不限制本发明，本领域的普通技术人员根据这些实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。
本发明提供了一种超柔软高回弹树脂发泡材料，所述发泡材料的原料按重量份数比计包括100份的热塑性弹性体、10～50份聚烯烃树脂。
需要说明的是，发泡材料的原料按重量份数比计还包括2～15份发泡剂、0.1～4份润滑剂、0.1～4份抗氧剂、0.5～5份成核剂。
以100份热塑性弹性体为基准，10-50份聚烯烃树脂用于调整发泡材料的机械性能，2-15份发泡剂用于调整发泡材料的发泡倍率，0.1-4份的润滑剂用于调整发泡材料的加工性能，0.1-4份的抗氧剂用于控制发泡材料的老化性能和电子辐照剂量，0.5-5份的成核剂用于控制发泡材料泡孔的均匀性和孔径大小。
以热塑性弹性体作为主料，最后制得的发泡材料泡孔致密细腻，具有柔软性和回弹性能高的优点。
进一步的，所述热塑性弹性体的拉伸强度为10～40MPa、断裂伸长率为1000～2000％、熔融指数为0.5～8g/10min。
上述参数的热塑性弹性体熔体强度高，分子在熔融状态下的纠缠度高，可以提高泡孔孔壁强度，防止发泡过程中泡孔合并，进而提高泡孔的致密性，同时，上述参数的热塑性弹性体也具有优秀的加工性能。
进一步的，所述热塑性弹性体为乙烯-醋酸乙烯共聚物、POE、EPDM、硅橡胶中的任意一种或多种。
POE(乙烯辛烯共聚物)分子链段的柔顺性很好，且POE作为一种弹性体，可以增强发泡材料的回弹性；乙烯-醋酸乙烯共聚物(EVA)能够有效防止粉料的析出，同时乙烯-醋酸乙烯共聚物作为一种弹性体树脂，可以增强发泡材料的柔软度；EPDM(三元乙丙橡胶)自身会充油，可以降低原料粘度，易于加工，同时油会有少量析出，在一定程度上可以防止发泡材料粘片，而且EPDM材料具有很好的弹性，可以增强发泡材料的回弹性，还能起到防滑的作用；硅橡胶分子链具有多种官能团，经过辐照交联后制得的发泡材料耐热性更好，更耐磨损，且在一定程度上可以防止粘片。
进一步的，所述聚烯烃树脂为聚乙烯和/或聚异丁烯。
进一步的，所述发泡材料厚度为0.05～10mm、发泡倍率为3～50、硬度C小于27。
进一步的，所述发泡材料25％压缩变形下的应力≤0.05MPa，50％压缩变形下的应力≤0.15MPa，75％压缩变形下的应力≤0.33MPa。
进一步的，所述发泡材料最大压缩比≥0.70，压缩永久变形≤20％。
进一步的，所述发泡材料具有闭孔结构。
进一步的，所述发泡剂为偶氮二甲酰胺、偶氮二甲酸酯、1,3-苯二磺酰肼、对甲苯磺酰肼中的一种或多种，所述抗氧剂为抗氧剂1010、抗氧剂1098、抗氧剂626中的一种或多种，所述润滑剂为硬脂酸钙和硬脂酸锌中的一种或多种，所述成核剂为碳酸钙、二氧化硅、柠檬酸钠中的一种或多种。
本发明还提供了一种超柔软高回弹树脂发泡材料的制备方法，包括以下步骤：
S1、按以下重量份数比：100份的热塑性弹性体、10～50份聚烯烃树脂、2～15份发泡剂、0.1～4份润滑剂、0.1～4份抗氧剂、0.5～5份成核剂，称取发泡材料的原料；
S2、将步骤S1中所称取的原料中的热塑性弹性体、聚烯烃树脂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得基础母粒；
S3、将步骤S2中获得的基础母粒与发泡剂、润滑剂、抗氧剂、成核剂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得发泡母粒；
S4、将步骤S3中获得的发泡母粒使用挤出机挤出成片，以获得发泡体基片；
S5、将步骤S4中获得的发泡体基片进行电子辐照交联，以获得发泡体母片；
S6、将步骤S5中获得的发泡体母片自由式发泡，即得发泡材料。
步骤S2中将热塑性弹性体和聚烯烃树脂先进行捏合，能够起到改性的作用，使所得的混合物拥有它们两者共同的属性。
步骤S3中将基础母粒与发泡剂、润滑剂、抗氧剂、成核剂进行捏合，可以使发泡剂、润滑剂、抗氧剂、成核剂在基础母粒中分散地更均匀，相容性会更好。
进一步的，步骤S5中，电子辐照交联的电子能量为0.5～3.0MeV，辐照剂量为3～50兆拉德，进行电子辐照交联的发泡体基片片材层数为4～8层，扫面宽度为800～1000mm。
实施例1
一种超柔软高回弹树脂发泡材料，所述发泡材料的原料按重量份数比计包括100份的热塑性弹性体、10份聚烯烃树脂、2份发泡剂、0.1份润滑剂、0.1份抗氧剂、0.5份成核剂。
热塑性弹性体是硅橡胶材料，聚烯烃树脂为聚乙烯或聚异丁烯。
一种超柔软高回弹树脂发泡材料的制备方法，包括以下步骤：
S1、按以下重量份数比：100份的热塑性弹性体、10份聚烯烃树脂、2份发泡剂、0.1份润滑剂、0.1份抗氧剂、0.5份成核剂，称取发泡材料的原料；
S2、将步骤S1中所称取的原料中的热塑性弹性体、聚烯烃树脂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得基础母粒；
S3、将步骤S2中获得的基础母粒与发泡剂、润滑剂、抗氧剂、成核剂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得发泡母粒；
S4、将步骤S3中获得的发泡母粒使用挤出机挤出成片，以获得发泡体基片；
S5、将步骤S4中获得的发泡体基片进行电子辐照交联，以获得发泡体母片；
S6、将步骤S5中获得的发泡体母片自由式发泡，即得发泡材料。
实施例2
一种超柔软高回弹树脂发泡材料，所述发泡材料的原料按重量份数比计包括100份的热塑性弹性体、50份聚烯烃树脂、15份发泡剂、4份润滑剂、4份抗氧剂、5份成核剂。
热塑性弹性体是乙烯-醋酸乙烯共聚物、POE、EPDM、硅橡胶的混合物，聚烯烃树脂为聚乙烯和聚异丁烯的混合物。
一种超柔软高回弹树脂发泡材料的制备方法，包括以下步骤：
S1、按以下重量份数比：100份的热塑性弹性体、50份聚烯烃树脂、15份发泡剂、4份润滑剂、4份抗氧剂、5份成核剂，称取发泡材料的原料；
S2、将步骤S1中所称取的原料中的热塑性弹性体、聚烯烃树脂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得基础母粒；
S3、将步骤S2中获得的基础母粒与发泡剂、润滑剂、抗氧剂、成核剂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得发泡母粒；
S4、将步骤S3中获得的发泡母粒使用挤出机挤出成片，以获得发泡体基片；
S5、将步骤S4中获得的发泡体基片进行电子辐照交联，以获得发泡体母片；
S6、将步骤S5中获得的发泡体母片自由式发泡，即得发泡材料。
最后应说明的是：以上实施方式仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施方式对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施方式所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施方式技术方案的精神和范围。

Claims (10)

1.一种超柔软高回弹树脂发泡材料，其特征在于，所述发泡材料的原料按重量份数比计包括100份的热塑性弹性体、10～50份聚烯烃树脂。
2.根据权利要求1所述的超柔软高回弹树脂发泡材料，其特征在于，所述热塑性弹性体的拉伸强度为10～40MPa、断裂伸长率为1000～2000％、熔融指数为0.5～8g/10min。
3.根据权利要求1所述的超柔软高回弹树脂发泡材料，其特征在于，所述热塑性弹性体为乙烯-醋酸乙烯共聚物、POE、EPDM、硅橡胶中的任意一种或多种。
4.根据权利要求1所述的超柔软高回弹树脂发泡材料，其特征在于，所述聚烯烃树脂为聚乙烯和/或聚异丁烯。
5.根据权利要求1所述的超柔软高回弹树脂发泡材料，其特征在于，所述发泡材料厚度为0.05～10mm、发泡倍率为3～50、硬度C小于27。
6.根据权利要求1所述的超柔软高回弹树脂发泡材料，其特征在于，所述发泡材料25％压缩变形下的应力≤0.05MPa，50％压缩变形下的应力≤0.15MPa，75％压缩变形下的应力≤0.33MPa。
7.根据权利要求1所述的超柔软高回弹树脂发泡材料，其特征在于，所述发泡材料最大压缩比≥0.70，压缩永久变形≤20％。
8.根据权利要求1所述的超柔软高回弹树脂发泡材料，其特征在于，所述发泡材料具有闭孔结构。
9.一种超柔软高回弹树脂发泡材料的制备方法，其特征在于，包括以下步骤：
S1、按以下重量份数比：100份的热塑性弹性体、10～50份聚烯烃树脂、2～15份发泡剂、0.1～4份润滑剂、0.1～4份抗氧剂、0.5～5份成核剂，称取发泡材料的原料；
S2、将步骤S1中所称取的原料中的热塑性弹性体、聚烯烃树脂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得基础母粒；
S3、将步骤S2中获得的基础母粒与发泡剂、润滑剂、抗氧剂、成核剂在常温下捏合2～20分钟，然后排入挤出机造粒，以获得发泡母粒；
S4、将步骤S3中获得的发泡母粒使用挤出机挤出成片，以获得发泡体基片；
S5、将步骤S4中获得的发泡体基片进行电子辐照交联，以获得发泡体母片；
S6、将步骤S5中获得的发泡体母片自由式发泡，即得发泡材料。
10.根据权利要求9所述的超柔软高回弹树脂发泡材料的制备方法，其特征在于，步骤S5中，电子辐照交联的电子能量为0.5～3.0MeV，辐照剂量为3～50兆拉德，进行电子辐照交联的发泡体基片片材层数为4～8层，扫面宽度为800～1000mm。
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