CN106976051B - 在减压后的空间对被加工物进行处理的处理装置 - Google Patents

在减压后的空间对被加工物进行处理的处理装置 Download PDF

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Publication number
CN106976051B
CN106976051B CN201611095507.5A CN201611095507A CN106976051B CN 106976051 B CN106976051 B CN 106976051B CN 201611095507 A CN201611095507 A CN 201611095507A CN 106976051 B CN106976051 B CN 106976051B
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China
Prior art keywords
mounting table
lift pins
spline shaft
processing
processing apparatus
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CN201611095507.5A
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English (en)
Chinese (zh)
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CN106976051A (zh
Inventor
海濑拓也
曾根浩
铃木直行
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
    • B25H1/14—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top
    • B25H1/16—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top in height
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
    • B25H1/08—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for attachment of work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
CN201611095507.5A 2015-12-02 2016-12-02 在减压后的空间对被加工物进行处理的处理装置 Active CN106976051B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-235652 2015-12-02
JP2015235652 2015-12-02
JP2016042020A JP6596362B2 (ja) 2015-12-02 2016-03-04 減圧された空間において被加工物を処理する処理装置
JP2016-042020 2016-03-04

Publications (2)

Publication Number Publication Date
CN106976051A CN106976051A (zh) 2017-07-25
CN106976051B true CN106976051B (zh) 2020-03-06

Family

ID=59060052

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611095507.5A Active CN106976051B (zh) 2015-12-02 2016-12-02 在减压后的空间对被加工物进行处理的处理装置

Country Status (3)

Country Link
JP (1) JP6596362B2 (ko)
KR (1) KR101871064B1 (ko)
CN (1) CN106976051B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6650841B2 (ja) * 2016-06-27 2020-02-19 東京エレクトロン株式会社 基板昇降機構、基板載置台および基板処理装置
KR101856689B1 (ko) * 2017-10-23 2018-05-14 주식회사 기가레인 승강하는 유도부를 포함하는 기판 처리 장치
CN110216632A (zh) * 2019-07-03 2019-09-10 中船动力研究院有限公司 一种固定机构及试验台
JP7197739B2 (ja) * 2021-05-10 2022-12-27 ピコサン オーワイ 基板処理装置及び方法
CN118497695A (zh) * 2024-07-22 2024-08-16 内蒙古工业大学 具有可升降加热台的离子束溅射设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040177813A1 (en) * 2003-03-12 2004-09-16 Applied Materials, Inc. Substrate support lift mechanism
CN100367485C (zh) * 2003-04-21 2008-02-06 东京毅力科创株式会社 对被处理基板进行半导体处理的装置
KR101117188B1 (ko) 2009-10-26 2012-03-09 주식회사 테스 기판 처리 장치
KR101146150B1 (ko) 2009-12-28 2012-05-16 엘아이지에이디피 주식회사 기판처리장치
US8757603B2 (en) * 2010-10-22 2014-06-24 Applied Materials, Inc. Low force substrate lift
KR101287831B1 (ko) 2010-10-26 2013-07-18 주성엔지니어링(주) 기판 승강 장치
US8899992B2 (en) 2012-04-09 2014-12-02 Asustek Computer Inc. Connector
US9668373B2 (en) * 2013-03-15 2017-05-30 Applied Materials, Inc. Substrate support chuck cooling for deposition chamber

Also Published As

Publication number Publication date
JP2017108095A (ja) 2017-06-15
CN106976051A (zh) 2017-07-25
KR20170064999A (ko) 2017-06-12
KR101871064B1 (ko) 2018-06-25
JP6596362B2 (ja) 2019-10-23

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